CN109093948A - LED panel injection forming mold and the Shooting Technique for manufacturing LED panel - Google Patents
LED panel injection forming mold and the Shooting Technique for manufacturing LED panel Download PDFInfo
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- CN109093948A CN109093948A CN201810875504.6A CN201810875504A CN109093948A CN 109093948 A CN109093948 A CN 109093948A CN 201810875504 A CN201810875504 A CN 201810875504A CN 109093948 A CN109093948 A CN 109093948A
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- 238000002347 injection Methods 0.000 title claims abstract description 68
- 239000007924 injection Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000000498 cooling water Substances 0.000 claims abstract description 31
- 238000005192 partition Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims description 28
- 238000001746 injection moulding Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000004513 sizing Methods 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 235000013372 meat Nutrition 0.000 claims description 3
- 238000000048 melt cooling Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims 1
- 239000000047 product Substances 0.000 abstract description 21
- 238000005336 cracking Methods 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000012467 final product Substances 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of LED panel injection forming mold and the Shooting Techniques of manufacture LED panel, including the male die seat and female die seat being used in conjunction with each other；Female die seat includes panel, water gap plate, caster and mother module core, and male die seat includes bottom plate, support block, male template and male die core, and the type chamber of LED panel is formed between mother module core and male die core；Male model cooling water flow conduits are equipped in male die seat；Master mold cooling water flow conduits are equipped in female die seat；Further include into glue runner, be glue-feeder into one end of glue runner, the other end into glue runner is gum-injecting port；The upper end of glue-feeder is equipped with " people " font partition, and glue-feeder is horn mouth, is unidirectionally into glue runner into glue runner.The present invention is reduced by improving the shape of glue-feeder into glue laminated power, solves the problems such as product surface gas line, spraying glue-feeder surface gas line, cracking；And Shooting Technique implementation steps are simple, effectively reduce molding cycle and production cost, while optimizing the final product quality that corresponding technological parameter effectively improves the product.
Description
Technical field
The invention belongs to technical field of mold, more particularly to a kind of LED panel injection forming mold.
Background technique
With the continuous improvement of people's living standards, plastic products have become indispensable a kind of synthesis in the modern life
Material.Plastics have excellent light-weight, stable chemical performance, electrical insulation capability, sound deadening shock absorption function well, specific strength height, machine
The advantages that tool intensity distribution is wide.Injection molding technology is that polymer barrel is added in graininess or powdered polymer raw material,
Heating or mechanical shearing effect under be plasticized, finally under the promotion of plunger or screw rod enter mold in, cooling and solidifying formed with
The consistent polymer product of mold cavity.Injection molding technology is one of main machining method of plastic products and can be primary
The moulded products of production and manufacture complexity are the important methods of shaping thermoplastics processing.
With the continuous development of plastics industry, the requirement of the mechanical property and dimensional accuracy of product in plastic products is more next
It is higher, existing injection mold usually because design it is unreasonable, make finished product occur air pocket, weld mark or even buckling deformation at
The defects of, the problems such as production efficiency is low and product qualification rate is low is caused, and the unreasonable design of mold also results in mold
The shortening of service life.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of LED panel injection forming mold and manufacture LED panel
Shooting Technique, the shape by improving glue-feeder reduce into glue laminated power, solve product surface gas line, spraying glue-feeder surface gas
The problems such as line, cracking, it ensure that product quality；And Shooting Technique implementation steps are simple, effectively reduce molding cycle and production
Cost, while optimizing the final product quality that corresponding technological parameter effectively improves the product.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of LED panel injection mould
Tool, including the male die seat and female die seat being used in conjunction with each other；The female die seat includes panel, water gap plate, caster and mother module core,
The panel, the water gap plate and the caster three are detachably connectable, and the mother module core is fixed on the inside of caster；Institute
Stating male die seat includes bottom plate, support block, male template and male die core, and the bottom plate, support block are fixedly connected with male template three, the public affairs
Mode is fixed on the inside of male template；The type chamber of LED panel is formed between the mother module core and the male die core；The male die seat
It is upper that there is the ejecting structure for ejecting LED panel；
Male model cooling water flow conduits are equipped in the male die seat, the male model cooling water flow conduits enter from the side of male template,
And then in the inner loop of male die core around after a week from the outflow of the side of male template, the inlet port of the male model cooling water flow conduits and institute
The outflux for stating male model cooling water flow conduits is all located at the same side of the male template；The cooling water flow of master mold is equipped in the female die seat
Road, the master mold cooling water flow conduits enter from the side of caster, and then in the inner loop of mother module core around after a week from caster
Side outflow, the outflux of the inlet port of the master mold cooling water flow conduits and the master mold cooling water flow conduits is all located at the mother
The same side of template；
There is ejector retainner plate between the bottom plate and the male template, the ejector retainner plate include the upper ejector retainner plate that is fixedly connected and
Lower ejector retainner plate, the upper ejector retainner plate is close to male template, and the lower ejector retainner plate is close to bottom plate；The ejecting structure and the upper thimble
Plate is fixedly connected；
It further include into glue runner, described one end into glue runner is glue-feeder, and the other end into glue runner is described
Gum-injecting port, the glue-feeder are located on panel, and the gum-injecting port is located on mother module core；The upper end of the glue-feeder is equipped with one " people "
Glue-feeder is divided into three parts by font partition, the partition, and glue-feeder and the partition form 3 glue feeding openings；
The glue-feeder is horn mouth, and the upper end of the glue-feeder is less than the lower end of the glue-feeder, the glue-feeder
The diameter ratio 1:2-3 of the lower end of the diameter of upper end and the glue-feeder；
It is described into glue runner be unidirectionally into glue runner.
It further says, through there is support column, the support column is opposite for both the upper ejector retainner plate and the lower ejector retainner plate
There is slightly nail hole, screw bolt passes bottom plate and slightly nail hole to be simultaneously fixedly connected with the bottom plate for one end of bottom plate.
Further say that also there is dustproof construction between the bottom plate and the lower ejector retainner plate, the dustproof construction includes
It is fixed on the rubbish nail of lower ejector retainner plate lower surface.
Further say there is release link, one end of the release link is worn between the upper ejector retainner plate and the male template
It crosses male template and the other end is fixedly connected with the upper ejector retainner plate, there is elastic in the release link.
It further says, the area ratio of 3 glue feeding openings is 1:2:3.
It further says, the ejecting structure is thimble.
The present invention is that further technical solution is used by solving its technical problem:
Utilize the Shooting Technique of LED panel injection forming mold manufacture LED panel, comprising the following steps:
The installation of S1, injection forming mold；
The inspection of S2, injection raw material: injection raw material mainly has good impact, mechanical property and good insulation preformance, makes
Extensive with temperature, dimensional stability is high；The injection raw material is ABSFR-500；
The drying of S3, injection raw material: by injection raw material 78-82 DEG C at a temperature of be dried, drying time 2-3h；
The melting of S4, injection raw material: injection raw material is delivered in upper barrel, and heating makes it at molten condition；
The injection of S5, injection raw material: the injection raw material of molten condition is squeezed through pressure ram to the hot flow path to mold
In mold after nozzle injection to heating, the temperature at nozzle is 193-197 DEG C；Injection process is divided into 4 stages:
First segment injection pressure is 88-92MPa, and injection moulding speed 38-42mm/s, position of the pressure ram apart from glue-feeder is
67-71mm；
Second segment injection pressure is 78-82MPa, and injection moulding speed 48-52mm/s, position of the pressure ram apart from glue-feeder is
65-69mm；
Third section injection pressure is 78-82MPa, and injection moulding speed 36-40mm/s, position of the pressure ram apart from glue-feeder is
54-58mm；
4th section of injection pressure is 68-72MPa, and injection moulding speed 13-17mm/s, position of the pressure ram apart from glue-feeder is
45-49mm；
The total duration of the injection molding is 2.5s；
S6, pressure maintaining: in a mold when melt cooling meat, continue that pressurized state is kept to force melt near glue-feeder not
It is disconnected to be added in mold, so that the plastics of type chamber is molded the complete and fine and close plastic of shape；Pressure maintaining period is divided into 3 sections:
First segment dwell pressure is 50-54MPa, and pressure maintaining speed is 18-22mm/s, time 1s；
Second segment dwell pressure is 83-87MPa, and pressure maintaining speed is 23-27mm/s, time 2s；
Third section dwell pressure is 43-47MPa, and pressure maintaining speed is 8-12mm/s, time 1s；
S7, cooling: cooling water being passed through in mold and is cooled down, and the temperature of male die seat and female die seat is made to maintain 55-65
DEG C, cooling time 15s；
S8, demoulding sizing: molded part is ejected by the thimble of mold, and molded part is put into carrier, places 2-3h at room temperature；
The ejection pressure of the thimble is 43-47MPa, and ejection speed is 23-27mm/s, ejection position 3-7mm；The rollback pressure of thimble
Power is 38-42MPa, and rollback speed is 28-32mm/s；
S9, test package.
Further say, the heating temperature of the upper barrel is divided into 3 sections: the heating temperature of first segment is 168-172 DEG C, the
Two sections of heating temperature is 173-177 DEG C and the heating temperature of third section is 183-187 DEG C.
Further to say, penetrating for pressure ram moves back pressure as 48-52MPa after injection molding, and penetrating back speed degree is 23-27mm/s,
Position of the pressure ram apart from glue-feeder is 4-8mm.
It further says, the storing process of upper barrel is divided into 3 sections after injection molding:
First segment stock pressure is 118-122MPa, and storing speed is 73-77mm/s, position of the pressure ram apart from glue-feeder
For 23-27mm；
Second segment stock pressure is 118-122MPa, and storing speed is 73-77mm/s, position of the pressure ram apart from glue-feeder
For 28-32mm；
The stock pressure of third section is 118-122MPa, and storing speed is 73-77mm/s, position of the pressure ram apart from glue-feeder
It is set to 68-72mm.
Beneficial effects of the present invention at least have the following:
1, the structure of injection mold of the present invention is simplified, and the shape by improving glue-feeder reduces into glue laminated power, solves
The problems such as product surface gas line, spraying glue-feeder surface gas line, cracking, it ensure that product quality；
2, the present invention to the heating temperature of injection molding material and injection molding, pressure maintaining, cooling, die sinking, the pressure of storing, speed and when
Between etc. parameters optimize, not only effectively reduce molding cycle and production cost, also LED panel made to reach technological design
It is required that.
Detailed description of the invention
Fig. 1 is whole structural schematic diagram of the invention；
Fig. 2 is the portion the A enlarged drawing of Fig. 1；
Fig. 3 is the structural schematic diagram of glue-feeder of the present invention；
Each section label is as follows in attached drawing:
Panel 1, water gap plate 2, caster 3, mother module core 4, bottom plate 5, support block 6, male template 7, male model cooling water flow conduits into
Entrance 10, the outflux 11 of male model cooling water flow conduits, master mold cooling water flow conduits inlet port 13, master mold cooling water flow conduits outflow
Mouthfuls 14, upper ejector retainner plate 15, lower ejector retainner plate 16, into glue runner 17, glue-feeder 18, gum-injecting port 19, partition 20, support column 21 and elasticity
Column 22.
Specific embodiment
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Embodiment: a kind of LED panel injection forming mold and the Shooting Technique for manufacturing LED panel, as shown in Figure 1-Figure 3,
Including the male die seat and female die seat being used in conjunction with each other；The female die seat includes panel 1, water gap plate 2, caster 3 and mother module core
4, the panel 1, the water gap plate 2 and 3 three of caster are detachably connectable, and the mother module core 3 is fixed on the interior of caster 2
Side；The male die seat includes bottom plate 5, support block 6, male template 7 and male die core, and the bottom plate, support block and male template three are fixed to be connected
It connects, the male die core is fixed on the inside of male template 7；The type of LED panel is formed between the mother module core 4 and the male die core
Chamber；There is the ejecting structure for ejecting LED panel in the male die seat；
Male model cooling water flow conduits are equipped in the male die seat, the male model cooling water flow conduits enter from the side of male template,
And then in the inner loop of male die core around after a week from the outflow of the side of male template, 10 He of inlet port of the male model cooling water flow conduits
The outflux 11 of the male model cooling water flow conduits is all located at the same side of the male template；It is cooling that master mold is equipped in the female die seat
Water flow passage, the master mold cooling water flow conduits enter from the side of caster, and then in the inner loop of mother module core around after a week from mother
The side of template is flowed out, all positions of outflux 14 of the inlet port 13 of the master mold cooling water flow conduits and the master mold cooling water flow conduits
In the same side of the caster；
There is ejector retainner plate, the ejector retainner plate includes the upper ejector retainner plate 15 being fixedly connected between the bottom plate and the male template
With lower ejector retainner plate 16, the upper ejector retainner plate 15 is close to male template, and the lower ejector retainner plate 16 is close to bottom plate；The ejecting structure and institute
Ejector retainner plate is stated to be fixedly connected；
It further include into glue runner 17, described one end into glue runner is glue-feeder 18, and the other end into glue runner is
The gum-injecting port 19, the glue-feeder are located on panel, and the gum-injecting port is located on mother module core；The upper end of the glue-feeder is equipped with
Glue-feeder is divided into three parts by one " people " font partition 20, the partition, and glue-feeder and the partition form 3 glue feeding openings；It is real
Shunting when existing sizing material enters, reduces into glue laminated power, solves product surface gas line, spraying glue-feeder surface gas line, cracking etc.
Problem ensure that product quality.
The glue-feeder is horn mouth, and the upper end of the glue-feeder is less than the lower end of the glue-feeder, the glue-feeder
The diameter ratio 1:2-3 of the lower end of the diameter of upper end and the glue-feeder；
Described into glue runner is unidirectionally that compared to bidirectional glue feeding runner, can avoid product surface generation and connects line into glue runner,
Influence the appearance of product.
Both the upper ejector retainner plate and the lower ejector retainner plate, which run through, support column 21, one end of the support column opposed bottom
With slightly nail hole, screw bolt passes bottom plate and slightly nail hole are simultaneously fixedly connected with the bottom plate；When the knock-pin of equipment is by male model
When product on seat ejects, upper ejector retainner plate and lower ejector retainner plate can be moved along support column same horizontal line simultaneously, guarantee that thimble will not
Phenomena such as top is inclined, top is oblique occurs.
Also there is dustproof construction, the dustproof construction includes being fixed on lower thimble between the bottom plate and the lower ejector retainner plate
The rubbish of plate lower surface is followed closely.When preventing from having rubbish between bottom plate and lower ejector retainner plate, ejector retainner plate is not capable of resetting, and then thimble cannot answer
Position, causes the yield of product to reduce.
There is release link, one end of the release link passes through male template and another between the upper ejector retainner plate and the male template
One end is fixedly connected with the upper ejector retainner plate, has elastic 22 in the release link.
The area ratio of 3 glue feeding openings is 1:2:3.
The ejecting structure is thimble.
Utilize the Shooting Technique of LED panel injection forming mold manufacture LED panel, comprising the following steps:
The installation of S1, injection forming mold；
The inspection of S2, injection raw material: injection raw material mainly has good impact, mechanical property and good insulation preformance, makes
Extensive with temperature, dimensional stability is high；The injection raw material is ABSFR-500；
The drying of S3, injection raw material: by injection raw material 78-82 DEG C at a temperature of be dried, drying time 2-3h；
The melting of S4, injection raw material: injection raw material is delivered in upper barrel, and heating makes it at molten condition；
The injection of S5, injection raw material: the injection raw material of molten condition is squeezed through pressure ram to the hot flow path to mold
In mold after nozzle injection to heating, the temperature at nozzle is 193-197 DEG C；Injection process is divided into 4 stages:
First segment injection pressure is 88-92MPa, and injection moulding speed 38-42mm/s, position of the pressure ram apart from glue-feeder is
67-71mm；
Second segment injection pressure is 78-82MPa, and injection moulding speed 48-52mm/s, position of the pressure ram apart from glue-feeder is
65-69mm；
Third section injection pressure is 78-82MPa, and injection moulding speed 36-40mm/s, position of the pressure ram apart from glue-feeder is
54-58mm；
4th section of injection pressure is 68-72MPa, and injection moulding speed 13-17mm/s, position of the pressure ram apart from glue-feeder is
45-49mm；
The total duration of the injection molding is 2.5s；
S6, pressure maintaining: in a mold when melt cooling meat, continue that pressurized state is kept to force melt near glue-feeder not
It is disconnected to be added in mold, so that the plastics of type chamber is molded the complete and fine and close plastic of shape；Pressure maintaining period is divided into 3 sections:
First segment dwell pressure is 50-54MPa, and pressure maintaining speed is 18-22mm/s, time 1s；
Second segment dwell pressure is 83-87MPa, and pressure maintaining speed is 23-27mm/s, time 2s；
Third section dwell pressure is 43-47MPa, and pressure maintaining speed is 8-12mm/s, time 1s；
S7, cooling: cooling water being passed through in mold and is cooled down, and the temperature of male die seat and female die seat is made to maintain 55-65
DEG C, cooling time 15s；
S8, demoulding sizing: molded part is ejected by the thimble of mold, and molded part is put into carrier, places 2-3h at room temperature；
The ejection pressure of the thimble is 43-47MPa, and ejection speed is 23-27mm/s, ejection position 3-7mm；The rollback pressure of thimble
Power is 38-42MPa, and rollback speed is 28-32mm/s；
S9, test package.
The heating temperature of the upper barrel is divided into 3 sections: the heating temperature of first segment is the heating of 168-172 DEG C, second segment
Temperature is 173-177 DEG C and the heating temperature of third section is 183-187 DEG C.
After injection molding pressure ram penetrate move back pressure be 48-52MPa, penetrate back speed degree be 23-27mm/s, pressure ram distance into
The position of Jiao Kou is 4-8mm.
The storing process of upper barrel is divided into 3 sections after injection molding:
First segment stock pressure is 118-122MPa, and storing speed is 73-77mm/s, position of the pressure ram apart from glue-feeder
For 23-27mm；
Second segment stock pressure is 118-122MPa, and storing speed is 73-77mm/s, position of the pressure ram apart from glue-feeder
For 28-32mm；
The stock pressure of third section is 118-122MPa, and storing speed is 73-77mm/s, position of the pressure ram apart from glue-feeder
It is set to 68-72mm.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure transformation made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields,
Similarly it is included within the scope of the present invention.
Claims (10)
1. a kind of LED panel injection forming mold, it is characterised in that: including the male die seat and female die seat being used in conjunction with each other；Institute
Stating female die seat includes panel (1), water gap plate (2), caster (3) and mother module core (4), the panel, the water gap plate with it is described
Caster three is detachably connectable, and the mother module core is fixed on the inside of caster；The male die seat includes bottom plate (5), support block
(6), male template (7) and male die core, the bottom plate, support block are fixedly connected with male template three, and the male die core is fixed on male model
The inside of plate；The type chamber of LED panel is formed between the mother module core and the male die core；Have in the male die seat by the face LED
The ejecting structure of plate ejection；
Male model cooling water flow conduits are equipped in the male die seat, the male model cooling water flow conduits enter from the side of male template, in turn
In the inner loop of male die core around being flowed out after a week from the side of male template, the inlet port (10) of the male model cooling water flow conduits and institute
The outflux (11) for stating male model cooling water flow conduits is all located at the same side of the male template；It is cooling that master mold is equipped in the female die seat
Water flow passage, the master mold cooling water flow conduits enter from the side of caster, and then in the inner loop of mother module core around after a week from mother
The side of template is flowed out, the inlet port (13) of the master mold cooling water flow conduits and the outflux (14) of the master mold cooling water flow conduits
All it is located at the same side of the caster；
Between the bottom plate and the male template have ejector retainner plate, the ejector retainner plate include the upper ejector retainner plate (15) being fixedly connected and
Lower ejector retainner plate (16), the upper ejector retainner plate is close to male template, and the lower ejector retainner plate is close to bottom plate；The ejecting structure and it is described on
Ejector retainner plate is fixedly connected；
It further include into glue runner (17), described one end into glue runner is glue-feeder (18), and the other end into glue runner is
The gum-injecting port (19), the glue-feeder are located on panel, and the gum-injecting port is located on mother module core；The upper end of the glue-feeder is set
There is " people " font partition (20), glue-feeder is divided into three parts by the partition, and glue-feeder and the partition form 3 into glue
Hole；
The glue-feeder is horn mouth, and the upper end of the glue-feeder is less than the lower end of the glue-feeder, the upper end of the glue-feeder
Diameter and the glue-feeder lower end diameter ratio 1:2-3；
It is described into glue runner be unidirectionally into glue runner.
2. LED panel injection forming mold according to claim 1, it is characterised in that: the upper ejector retainner plate and it is described under
For both ejector retainner plates through having support column (21), one end of the support column opposed bottom has slightly nail hole, screw bolt passes bottom
Plate and slightly nail hole are simultaneously fixedly connected with the bottom plate.
3. LED panel injection forming mold according to claim 1, it is characterised in that: the bottom plate and the lower thimble
Also there is dustproof construction, the dustproof construction includes the rubbish nail for being fixed on lower ejector retainner plate lower surface between plate.
4. LED panel injection forming mold according to claim 1, it is characterised in that: the upper ejector retainner plate and the public affairs
There is release link between template, one end of the release link passes through male template and the other end is fixedly connected with the upper ejector retainner plate,
There are elastic (22) in the release link.
5. LED panel injection forming mold according to claim 1, it is characterised in that: the area ratio of 3 glue feeding openings
For 1:2:3.
6. LED panel injection forming mold according to claim 1, it is characterised in that: the ejecting structure is thimble.
7. using the Shooting Technique of LED panel injection forming mold as described in claim 1 manufacture LED panel, feature exists
In: the following steps are included:
The installation of S1, injection forming mold；
The inspection of S2, injection raw material: injection raw material mainly has good impact, mechanical property and good insulation preformance, uses temperature
Extensively, dimensional stability is high for degree；The injection raw material is ABSFR-500；
The drying of S3, injection raw material: by injection raw material 78-82 DEG C at a temperature of be dried, drying time 2-3h；
The melting of S4, injection raw material: injection raw material is delivered in upper barrel, and heating makes it at molten condition；
The injection of S5, injection raw material: the injection raw material of molten condition is squeezed through pressure ram to the nozzle of the hot flow path to mold
In mold after being injected into heating, the temperature at nozzle is 193-197 DEG C；Injection process is divided into 4 stages:
First segment injection pressure is 88-92MPa, and injection moulding speed 38-42mm/s, position of the pressure ram apart from glue-feeder is 67-
71mm；
Second segment injection pressure is 78-82MPa, and injection moulding speed 48-52mm/s, position of the pressure ram apart from glue-feeder is 65-
69mm；
Third section injection pressure is 78-82MPa, and injection moulding speed 36-40mm/s, position of the pressure ram apart from glue-feeder is 54-
58mm；
4th section of injection pressure is 68-72MPa, and injection moulding speed 13-17mm/s, position of the pressure ram apart from glue-feeder is 45-
49mm；
The total duration of the injection molding is 2.5s；
S6, pressure maintaining: in a mold when melt cooling meat, continue to keep pressurized state that the melt near glue-feeder is forced constantly to be mended
It is filled in mold, the plastics of type chamber is enable to mold the complete and fine and close plastic of shape；Pressure maintaining period is divided into 3 sections:
First segment dwell pressure is 50-54MPa, and pressure maintaining speed is 18-22mm/s, time 1s；
Second segment dwell pressure is 83-87MPa, and pressure maintaining speed is 23-27mm/s, time 2s；
Third section dwell pressure is 43-47MPa, and pressure maintaining speed is 8-12mm/s, time 1s；
S7, cooling: cooling water being passed through in mold and is cooled down, and the temperature of male die seat and female die seat is made to maintain 55-65 DEG C, cold
But the time is 15s；
S8, demoulding sizing: molded part is ejected by the thimble of mold, and molded part is put into carrier, places 2-3h at room temperature；It is described
The ejection pressure of thimble is 43-47MPa, and ejection speed is 23-27mm/s, ejection position 3-7mm；The back pressure of thimble is
38-42MPa, rollback speed are 28-32mm/s；
S9, test package.
8. the Shooting Technique of manufacture LED panel according to claim 7, it is characterised in that: the heating temperature of the upper barrel
Degree be divided into 3 sections: the heating temperature of first segment is 168-172 DEG C, the heating temperature of second segment is 173-177 DEG C and third section plus
Hot temperature is 183-187 DEG C.
9. the Shooting Technique of manufacture LED panel according to claim 7, it is characterised in that: pressure ram after injection molding
Penetrating and moving back pressure is 48-52MPa, and penetrating back speed degree is 23-27mm/s, and position of the pressure ram apart from glue-feeder is 4-8mm.
10. the Shooting Technique of manufacture LED panel according to claim 7, it is characterised in that: upper barrel after injection molding
Storing process is divided into 3 sections:
First segment stock pressure is 118-122MPa, and storing speed is 73-77mm/s, and position of the pressure ram apart from glue-feeder is
23-27mm；
Second segment stock pressure is 118-122MPa, and storing speed is 73-77mm/s, and position of the pressure ram apart from glue-feeder is
28-32mm；
The stock pressure of third section is 118-122MPa, and storing speed is 73-77mm/s, and position of the pressure ram apart from glue-feeder is
68-72mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810875504.6A CN109093948A (en) | 2018-08-03 | 2018-08-03 | LED panel injection forming mold and the Shooting Technique for manufacturing LED panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810875504.6A CN109093948A (en) | 2018-08-03 | 2018-08-03 | LED panel injection forming mold and the Shooting Technique for manufacturing LED panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109093948A true CN109093948A (en) | 2018-12-28 |
Family
ID=64848313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810875504.6A Pending CN109093948A (en) | 2018-08-03 | 2018-08-03 | LED panel injection forming mold and the Shooting Technique for manufacturing LED panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109093948A (en) |
Cited By (3)
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| CN112936745A (en) * | 2021-04-09 | 2021-06-11 | 无锡安森源通讯科技有限公司 | Feeding device with screening function for injection molding machine and using method |
| CN113071069A (en) * | 2021-05-12 | 2021-07-06 | 东莞宏骆模具塑胶制品有限公司 | Multi-station high-efficiency injection mold for LED panel production |
| CN113927804A (en) * | 2021-09-18 | 2022-01-14 | 东莞阿尔泰显示技术有限公司 | Glue filling mold of LED display module |
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