CN206380167U - A kind of false dual platen with via hole - Google Patents
A kind of false dual platen with via hole Download PDFInfo
- Publication number
- CN206380167U CN206380167U CN201720039920.3U CN201720039920U CN206380167U CN 206380167 U CN206380167 U CN 206380167U CN 201720039920 U CN201720039920 U CN 201720039920U CN 206380167 U CN206380167 U CN 206380167U
- Authority
- CN
- China
- Prior art keywords
- via hole
- post
- plate body
- rivet
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A kind of false dual platen with via hole, including plate body, copper foil and line layer are covered provided with front in the front of the plate body, copper foil and line layer are covered provided with the back side in the back side of the plate body, the plate body is provided with via hole, rivet is fitted with the via hole, the rivet has the head of a nail being connected and post, head of a nail diameter is more than conducting bore dia, the diameter of post is less than the diameter of via hole, the exposed front in plate body of the head of a nail, the exposed back side in plate body in post lower end, after rivet is pressed, the head of a nail of the rivet is pressed the front for being diffused in plate body and covers copper foil with front and line layer is connected, the lower end of post is pressed the back side bottle that is diffused in plate body and covers copper foil with the back side and line layer is connected, so that front is covered, copper foil and line layer cover copper foil by rivet and the back side and line layer is electrically connected, in post salient point is provided with along side face annular, the bump surface is mat surface, the salient point is clamped on via hole inwall when rivet is pressed.The utility model realizes that the conducting of front and back line layer is connected using rivet, saves the copper-coating to via hole, saves cost.
Description
Technical field
The utility model is related to a kind of false double-sided PCB with via hole.
Background technology
The application of false dual platen is very universal, but there is wiring on the two sides of false dual platen, designs complex.In order that
Front circuit figure layer and the back side circuit figure layer connection conducting of false dual platen, it will usually conducting connecting hole is opened up on plate body, is led to
Cross and conductive copper layer is being formed in its inner surface to the conducting connecting hole copper-coating, so as to realize front circuit figure layer and back side line
The connection conducting of road figure layer.Due to needing to carry out copper-coating, it is therefore desirable to expend more time and process, and increase life
Produce cost.
The content of the invention
The technical problems to be solved in the utility model is to provide a kind of false dual platen with via hole, is realized just using rivet
Face and the conducting connection for covering copper foil and line layer at the back side, save process and production cost.
In order to solve the above-mentioned technical problem, the utility model takes following technical scheme：
Copper foil and line layer are covered in a kind of false dual platen with via hole, including plate body, the front of the plate body provided with front, should
Copper foil and line layer are covered in the back side of plate body provided with the back side, and the plate body is provided with via hole, the via hole and is fitted with rivet, should
Rivet has the head of a nail being connected and post, and head of a nail diameter is more than conducting bore dia, and the diameter of post is less than the diameter of via hole,
The exposed front in plate body of the head of a nail, the exposed back side in plate body in post lower end, after rivet is pressed, the head of a nail of the rivet is pressed
It is diffused in the front of plate body and covers copper foil with front and line layer is connected, the lower end of post is pressed the back side for being diffused in plate body
Bottle covers copper foil with the back side and line layer is connected so that covers copper foil and line layer and covers copper foil and line layer by rivet and the back side in front
Salient point is provided with along side face annular in electrical connection, post, the bump surface is mat surface, and the salient point, which is clamped on, when rivet is pressed leads
Through-hole wall.
The lower end of the post is provided with projection, and it is exposed at the plate body back side that post inserts the projection after via hole.
The head of a nail is provided with groove.
There is center end face, the area of the center end face is more than the area of via hole, and groove is by the center on the head of a nail
The edge of end face stretches out.
The post is provided with least one circle salient point.
The lower end of the post is located on the inclination elongated end provided with elongated end, projection is tilted.
The a diameter of 1.6-2.5mm of post, the end face diameter for tilting extension is 1.2-2.0mm, and the length of post is
2.5mm, a diameter of 3-4mm of the head of a nail, the thickness of the head of a nail is 0.3-0.5mm.
The utility model realizes that the conducting for covering copper foil and line layer of front and back is connected using rivet, without to conducting
Hole carries out copper-coating, saves process and production cost, saves the use of liquid medicine, play environmental-protection function.
Brief description of the drawings
Accompanying drawing 1 is the utility model cross-sectional view.
Embodiment
For the ease of the understanding of those skilled in the art, the utility model will be further described below in conjunction with the accompanying drawings.
As shown in Figure 1, the utility model discloses a kind of false dual platen with via hole, including plate body 1, the plate body 1
Front cover copper foil and line layer provided with front, the back side of the plate body is covered provided with the back side to be set on copper foil and line layer, the plate body
There is via hole 2, rivet is fitted with the via hole 2, the rivet has the head of a nail 4 being connected and post 3, the diameter of the head of a nail 4 is more than
The diameter of via hole 2, the diameter of post 3 is less than the diameter of via hole 2, and the exposed front in plate body 1 of the head of a nail 4, the lower end of post 3 is exposed
At the back side of plate body 1, after rivet is pressed, the head of a nail 4 of the rivet is diffused in the front of plate body 1 by pressing and covers copper with front
Paper tinsel and line layer connection, the lower end of post 3 is pressed, and the back side bottle that is diffused in plate body 1 covers copper foil with the back side and line layer is connected,
So that front is covered, copper foil and line layer cover copper foil by rivet and the back side and line layer is electrically connected, and are set in post 3 along side face annular
There is salient point 5, the bump surface is mat surface, increases adhesive force, the salient point is clamped on via hole inwall when rivet is pressed.
The lower end of the post 3 is provided with projection 6, and it is exposed at the back side of plate body 1 that post 3 inserts the projection 6 after via hole 2.
When being pressed, rivet two ends on the basis of rivet diffusion is bloomed, are further added by setting by relative pressure force, projection 6 to external diffusion
Projection is put, increase rivet covers the contact area of copper foil and line layer with the back side, while making assembling more firm firm.
The head of a nail 4 is provided with groove 42.There is center end face 41, the area of the center end face 31, which is more than, leads on the head of a nail 4
The area of through hole, groove is stretched out by the edge of the center end face.By setting groove so that the head of a nail is more prone to spread apart
Flower is mounted on plate body front.
The post is provided with least one circle salient point.Salient point is in close contact with the pressing of rivet with via hole inwall to be blocked
Close.
The lower end of the post is located on the inclination elongated end 7 provided with elongated end 7, projection 6 is tilted.The a diameter of 1.6- of post
2.5mm, the end face diameter for tilting extension is 1.2-2.0mm, and the length of post is 2.5mm, a diameter of 3-4mm of the head of a nail, nail
The thickness of cap is 0.3-0.5mm.
In the utility model, via hole need not carry out copper-coating, utilize rivet interlacement.The head of a nail is bloomed by pressing diffusion
In plate body front and cover copper foil with front and line layer be connected, post the plate body back side by pressing diffusion and the back side cover copper foil and
Line layer is connected.Salient point insertion is fastened on via hole inwall, realizes the higher engaging of intensity.The projection set in post is with pressure
Conjunction, which is squeezed, is forced to external diffusion, so as to add the contact area that copper foil and line layer are covered in the back side.
It should be noted that described above is not the restriction to technical solutions of the utility model, this practicality is not being departed from
On the premise of new creation design, any obvious replacement is within protection domain of the present utility model.
Claims (7)
1. copper foil and line layer are covered in a kind of false dual platen with via hole, including plate body, the front of the plate body provided with front, the plate
Copper foil and line layer are covered provided with the back side in the back side of body, it is characterised in that the plate body is provided with via hole, the via hole and inserted
There is rivet, the rivet has the head of a nail being connected and post, head of a nail diameter is more than conducting bore dia, and the diameter of post is less than conducting
The diameter in hole, the exposed front in plate body of the head of a nail, the exposed back side in plate body in post lower end, after rivet is pressed, the rivet
The head of a nail is pressed the front for being diffused in plate body and covers copper foil with front and line layer is connected, and the lower end of post, which is pressed, to be diffused in
The back side bottle of plate body covers copper foil with the back side and line layer is connected so that covers copper foil and line layer and covers copper by rivet and the back side in front
Salient point is provided with along side face annular in paper tinsel and line layer electrical connection, post, the salient point is clamped on via hole inwall when rivet is pressed,
The bump surface is mat surface.
2. the false dual platen according to claim 1 with via hole, it is characterised in that the lower end of the post is provided with convex
Block, it is exposed at the plate body back side that post inserts the projection after via hole.
3. the false dual platen according to claim 2 with via hole, it is characterised in that the head of a nail is provided with groove.
4. the false dual platen according to claim 3 with via hole, it is characterised in that there is center-side on the head of a nail
Face, the area of the center end face is more than the area of via hole, and groove is stretched out by the edge of the center end face.
5. the false dual platen according to claim 4 with via hole, it is characterised in that the post is provided with least one circle
Salient point.
6. the false dual platen according to claim 5 with via hole, it is characterised in that the lower end of the post is provided with inclination
Elongated end, projection is located on the inclination elongated end.
7. the false dual platen according to claim 6 with via hole, it is characterised in that a diameter of 1.6- of post
2.5mm, the end face diameter for tilting extension is 1.2-2.0mm, and the length of post is 2.5mm, a diameter of 3-4mm of the head of a nail, nail
The thickness of cap is 0.3-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720039920.3U CN206380167U (en) | 2017-01-13 | 2017-01-13 | A kind of false dual platen with via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720039920.3U CN206380167U (en) | 2017-01-13 | 2017-01-13 | A kind of false dual platen with via hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206380167U true CN206380167U (en) | 2017-08-04 |
Family
ID=59404841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720039920.3U Expired - Fee Related CN206380167U (en) | 2017-01-13 | 2017-01-13 | A kind of false dual platen with via hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206380167U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
| CN110381683A (en) * | 2019-07-09 | 2019-10-25 | Oppo（重庆）智能科技有限公司 | Earthing member, shell and electronic device |
| CN112312652A (en) * | 2020-10-27 | 2021-02-02 | 惠州市特创电子科技有限公司 | Multilayer circuit board and mobile communication device |
-
2017
- 2017-01-13 CN CN201720039920.3U patent/CN206380167U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107620871A (en) * | 2017-10-30 | 2018-01-23 | 赛尔富电子有限公司 | A kind of LED light source module and its manufacture method |
| CN110381683A (en) * | 2019-07-09 | 2019-10-25 | Oppo（重庆）智能科技有限公司 | Earthing member, shell and electronic device |
| CN112312652A (en) * | 2020-10-27 | 2021-02-02 | 惠州市特创电子科技有限公司 | Multilayer circuit board and mobile communication device |
| CN112312652B (en) * | 2020-10-27 | 2022-09-02 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board and mobile communication device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170804 Termination date: 20210113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |