CN206379331U

CN206379331U - BGA ball-planting devices

Info

Publication number: CN206379331U
Application number: CN201720033195.9U
Authority: CN
Inventors: 张志衡
Original assignee: Hou Haiting
Current assignee: Hou Haiting
Priority date: 2017-01-11
Filing date: 2017-01-11
Publication date: 2017-08-04
Anticipated expiration: 2027-01-11

Abstract

The BGA ball-planting devices that the utility model is provided, including：Fixed mount and the plant ball plate for being capable of heat conduction, the upper surface of the fixed mount are provided with multiple locating dowels, and ball placement plate is provided with the locating slot being adapted to the locating dowel, and the fixed mount and ball placement plate are detachably connected by the locating dowel and locating slot；The neck for fixed chip is additionally provided with the fixed mount, the lower surface of ball placement plate plants ball impression groove provided with multiple size identicals.The BGA ball-planting devices that the utility model is provided, the ball size of formation is uniform, it is to avoid rosin joint, short circuit caused by ball size is not up to standard, and is unlikely to deform, and success rate is high.

Description

BGA ball-planting devices

Technical field

The utility model is related to chip package field, more particularly to a kind of BGA ball-planting devices.

Background technology

It is BGA Package technology that BGA, which plants ball, and the technology is the high density such as electronic product, high-performance, many pin packages Optimal selection.

BGA plants ball, it is necessary to use steel mesh, is provided with steel mesh and plants ball with the one-to-one circle of pad, will when planting ball Steel mesh is positioned on chip, and tin ball is placed in each plant ball, dissolves tin ball by heating or other welding techniques solid It is scheduled on chip, steel mesh is removed after cooling, so that completing BGA plants ball.

But, previously prepared tin ball is needed using above-mentioned technique, because ball size is different, easily makes the amount of tin on same pad Difference, profile is not regular enough, and rosin joint, short circuit occur after being welded on chip, and when steel mesh area is very big, steel mesh easily becomes Shape, causes to plant ball failure.

Utility model content

For defect of the prior art, the utility model provides a kind of BGA ball-planting devices, and the ball size of formation is equal It is even, it is to avoid rosin joint, short circuit caused by ball size is not up to standard, and be unlikely to deform, success rate is high.

The BGA ball-planting devices that the utility model is provided, including：Fixed mount and the plant ball plate for being capable of heat conduction, the fixed mount Upper surface be provided with multiple locating dowels, ball placement plate is provided with the locating slot that is adapted to the locating dowel, the fixed mount and institute Plant ball plate is stated to be detachably connected by the locating dowel and locating slot；The card for fixed chip is additionally provided with the fixed mount Groove, the lower surface of ball placement plate plants ball impression groove provided with multiple size identicals.

Further, ball placement groove is cheated for hemisphere.

Further, ball placement groove is polygon.

Further, ball placement groove is quadrangle, pentagon or hexagon.

Further, inclined-plane of the inwall of the neck for from top to bottom to extend out.

Further, ball placement plate is provided with heater.

Further, the heater is electric hot plate.

The BGA ball-planting devices that the utility model is provided include fixed mount and plant ball plate.In use, first bga chip is fixed In the neck of fixed mount, prefabricated tin slurry is filled in plant ball impression groove, the locating slot alignment fixed mount of ball plate is then planted Locating dowel, moves down plant ball plate, it is linked together with fixed mount；Ball plate is planted in heating, because the plant ball plate of the application is led Heat, heated plant ball plate passes to tin slurry by even heat, melts tin slurry for liquid, and in the effect of surface tension of liquid Under, tin ball is formed, is connected with solder joint.Because the size for planting ball impression groove is identical, the volume for forming tin ball is also identical, it is to avoid tin ball Rosin joint, short circuit caused by size is not up to standard, and because the plant ball impression groove of the application is arranged on plant ball plate, compared to steel mesh, structure Intensity is larger, is unlikely to deform, and plants ball success rate high.

Brief description of the drawings

, below will be right in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art The accompanying drawing used required in embodiment or description of the prior art is briefly described.In all of the figs, it is similar Element or part are general by similar reference mark.In accompanying drawing, each element or part might not be according to actual ratios Draw.

The structural representation for the BGA ball-planting device overlook directions that Fig. 1 provides for an embodiment；

Fig. 2 is the structural representation of the overlook direction of fixed mount in an embodiment；

Fig. 3 is the structural representation in the left view direction of fixed mount in an embodiment.

Embodiment

The embodiment of technical solutions of the utility model is described in detail below in conjunction with accompanying drawing.Following examples are only For clearly illustrating the technical solution of the utility model, therefore example is only used as, and this practicality can not be limited with this New protection domain.

It should be noted that unless otherwise indicated, technical term or scientific terminology used in this application should be this reality The ordinary meaning understood with new one of ordinary skill in the art.

Referring to figs. 1 to Fig. 3, in an embodiment, the BGA ball-planting devices that the utility model is provided, including：Fixed mount 20 and energy The plant ball plate 10 of enough heat conduction, the upper surface of the fixed mount 20 is provided with multiple locating dowels 22, ball placement plate 10 be provided with it is described The locating slot 12 that locating dowel 22 is adapted to, the fixed mount 20 and ball placement plate 10 can by the locating dowel 22 and locating slot 12 Dismounting connection；The neck 21 for fixed chip is additionally provided with the fixed mount 20, the lower surface of ball placement plate 10 is provided with more Individual size identical plants ball impression groove 11.Specifically, inclined-plane of the inwall of the neck 21 for from top to bottom to extend out.

The BGA ball-planting devices of the present embodiment include fixed mount 20 and plant ball plate 10, and it is aluminium sheet to plant ball plate 10, is rushed on aluminium sheet Swaging can also use the techniques such as engraving, etching, laser certainly into multiple hemispheric plant ball impression grooves 11.In use, first will Bga chip is fixed in the neck 21 of fixed mount 20, and prefabricated tin slurry is filled in plant ball impression groove 11, ball plate 10 is then planted Locating slot 12 is directed at the locating dowel 22 of fixed mount 20, moves down plant ball plate 10, it is linked together with fixed mount 20；Heating Ball plate 10 is planted, due to planting the heat conduction of ball plate 10, even heat is passed to tin slurry, tin slurry is melted for liquid by heated plant ball plate 10 State, and in the presence of surface tension of liquid, form tin ball.Because the size for planting ball impression groove 11 is identical, the volume of tin ball is formed Also it is identical, it is to avoid rosin joint, short circuit caused by ball size is not up to standard, and be arranged on due to planting ball impression groove 11 on plant ball plate 10, Compared to steel mesh, structural strength is larger, is unlikely to deform, and plants ball success rate high.

Because the present embodiment is heated by planting ball plate 10 to tin slurry, it is to avoid directly chip is heated in conventional method Mode, it is therefore prevented that the damage that heating for multiple times is caused to chip.

In another embodiment, ball placement plate is also associated with electric hot plate, directly heats plant ball plate by electric hot plate, is not required to Heating furnace is put into, it is convenient to use, also electrical heating wire directly can be set in ball plate is planted certainly.

In the present embodiment, ball placement groove is quadrangle, and tin slurry forms spheroid during liquefied, positioned at square The tin at four angles is starched to central reduction, space is formed at four angles, inwall and the tin ball of the plant ball impression groove of final square are point Contact, is not contacted even, compared to spherical plant ball impression groove, and contact surface is small, plants ball plate and is easily separated with bga chip, so as to reduce Fault rate.

It should be understood that ball placement groove can also be other polygons such as pentagon, hexagon.

In the description of the present application, it is to be understood that term " on ", " under ", "front", "rear", "left", "right", " water It is flat ", " interior ", the orientation of the instruction such as " outer " or position relationship for based on orientation shown in the drawings or position relationship, merely to just Described in description the utility model with simplified, rather than indicate or imply that the device or element of meaning must be with specific sides Position, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.

In addition, term " first ", " second " etc. are only used for describing purpose, and it is not intended that indicating or implying relatively important Property or the implicit quantity for indicating indicated technical characteristic.In description of the present utility model, " multiple " are meant that two More than, unless otherwise specifically defined.

In specification of the present utility model, numerous specific details are set forth.It is to be appreciated, however, that reality of the present utility model Applying example can put into practice in the case of these no details.In some instances, known method, knot is not been shown in detail Structure and technology, so as not to obscure the understanding of this description.

In the description of this specification, specific features, structure, material or feature can be in any one or more embodiments Or combined in an appropriate manner in example.In addition, in the case of not conflicting, those skilled in the art can say this The feature of not be the same as Example or example and non-be the same as Example or example described in bright book is combined and combined.

Finally it should be noted that：Various embodiments above is only limited to illustrate the technical solution of the utility model, rather than to it System；Although the utility model is described in detail with reference to foregoing embodiments, one of ordinary skill in the art should Understand：It can still modify to the technical scheme described in foregoing embodiments, or to which part or whole Technical characteristic carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from this practicality newly The scope of each embodiment technical scheme of type, it all should cover among claim of the present utility model and the scope of specification.

Claims

1. a kind of BGA ball-planting devices, it is characterised in that including：Fixed mount and the plant ball plate for being capable of heat conduction, the fixed mount it is upper Surface is provided with multiple locating dowels, and ball placement plate is provided with the locating slot being adapted to the locating dowel, the fixed mount and the plant Ball plate is detachably connected by the locating dowel and locating slot；The neck for fixed chip, institute are additionally provided with the fixed mount The lower surface for planting ball plate is stated provided with multiple size identicals plant ball impression groove.

2. BGA ball-planting devices according to claim 1, it is characterised in that ball placement groove is cheated for hemisphere.

3. BGA ball-planting devices according to claim 1, it is characterised in that ball placement groove is cheated for polygon.

4. BGA ball-planting devices according to claim 3, it is characterised in that ball placement groove be quadrangle, pentagon or Hexagon.

5. BGA ball-planting devices according to claim 1, it is characterised in that it is outer from top to bottom that the inwall of the neck, which is, The inclined-plane of expansion.

6. BGA ball-planting devices according to claim 1, it is characterised in that ball placement plate is provided with heater.

7. BGA ball-planting devices according to claim 6, it is characterised in that the heater is electric hot plate.