CN206370425U - A kind of colourful transparent LED luminescent screens - Google Patents
A kind of colourful transparent LED luminescent screens Download PDFInfo
- Publication number
- CN206370425U CN206370425U CN201720027693.2U CN201720027693U CN206370425U CN 206370425 U CN206370425 U CN 206370425U CN 201720027693 U CN201720027693 U CN 201720027693U CN 206370425 U CN206370425 U CN 206370425U
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- led
- led wafer
- transparency carrier
- luminescent screens
- group
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- 235000012431 wafers Nutrition 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000005286 illumination Methods 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 5
- 239000003086 colorant Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002242 deionisation method Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Abstract
The utility model discloses a kind of colourful transparent LED luminescent screens, including the transparency carrier being sequentially connected from the bottom to top, ITO conductive circuit layers, LED wafer group and PU transparent film layers, LED wafer group is selected from least one of red, green, blue flip LED chip, every three LED wafers are arranged in order to form LED wafer group, LED wafer bond pads are in ITO conductive circuit layers, and LED chip group surface covers the PU transparent film layers of normal temperature cure.Due to setting the flip LED chip of three kinds of base colors to be arranged in order on the transparent substrate, it is achieved thereby that the luminous effect of multicolour, encapsulation is completed by simply welding, preparation method is simple, and illumination effect is stable.
Description
Technical field
The utility model is related to LED manufacture field, more particularly to a kind of colourful transparent LED luminescent screens.
Background technology
It is presently used for the luminous circuit substrates of LED main based on glass-fiber-plate；LED light emitting sources combined by single LEDs and
Into；Mainly by LED packaging technologies such as dispensing, die bond, routing, embeddings, LED wafer is encapsulated for LED light emitting sources manufacture method
Into special support；LED luminescent screens are exactly to be fixed to packaged single LEDs on glass circuit board by welding procedure,
Realize that plate body lights by peripheral circuit.LED flip-chip packageds technology is immature due to technique and technical merit, also only limits at present
In the white light technology for aiming at illumination.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of colourful transparent LED luminescent screens, and the luminescent screen can be realized
A variety of luminous colors, while its preparation process is simple, illumination effect is stable.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is a kind of colourful transparent LED luminescent screens, including
Transparency carrier, ITO conductive circuit layers, LED wafer group and the PU transparent film layers being sequentially connected from the bottom to top, the choosing of LED wafer group
From at least one of red, green, blue flip LED chip, every three LED wafers are arranged in order to form LED wafer group, LED wafer group
It is welded in ITO conductive circuit layers, LED chip group surface covers the PU transparent film layers of normal temperature cure.
Preferably, the thickness of ITO conductive circuit layers is 100~200nm, and the preparation method of ITO conductive circuit layers is：It is transparent
Substrate is washed through deionization, ultrasonic wave cleaning after, into ITO coating chamber magnetron sputtering ITO conductive membrane layers, then heated solidification
Annealing forms ITO conductive film layers, and ITO conductive film layers eventually pass etching and form ITO conductive circuit layers.
Preferably, magnetron sputtering condition is：Magnetic control spattering target In in ITO coating chambers2O3And SnO2Weight ratio be
90%：10%, purity is 99.99%, and target-substrate distance is 6cm, and the temperature of transparency carrier is that the vacuum in room temperature, vacuum chamber is 4.0
×10-5Pa, Ar qi leel press 1.0Pa, and Ar throughputs are 12cm3/ min, sputtering power is 50~200W, and sedimentation rate is about 0.7
~1nm/s.
Preferably, it is additionally provided with SiO between transparency carrier and ITO conductive circuit layers2Layer.
Preferably, silver-colored reflector layer is set in plane relative with ITO conductive circuit layers on transparency carrier.
Preferably, position relative with LED wafer group on transparency carrier is in inner concavity.
Using above-mentioned technical proposal, due to setting the flip LED chip of three kinds of base colors to arrange successively on the transparent substrate
Row, it is achieved thereby that the luminous effect of multicolour, encapsulation is completed by simply welding, preparation method is simple, illumination effect
It is stable.
Brief description of the drawings
Fig. 1 is a kind of structural representation of colourful transparent LED luminescent screens in embodiment.
In figure, 1- transparency carriers, 11- projections, 2-ITO conductive circuit layers, 3-LED chipset, 4-PU transparent film layers.
Embodiment
Embodiment of the present utility model is described further below in conjunction with the accompanying drawings.Herein it should be noted that
Explanation for these embodiments is used to help understand the utility model, but does not constitute to restriction of the present utility model.This
Outside, as long as technical characteristic involved in each embodiment of the utility model disclosed below does not constitute conflict each other
It can just be mutually combined.
A kind of colourful transparent LED luminescent screens, including be sequentially connected from the bottom to top transparency carrier 1, ITO conductive circuit layers 2,
LED wafer group 3 and PU transparent film layers 4, LED wafer group are selected from least one of red, green, blue flip LED chip, every three
LED wafer is arranged in order to form LED wafer group, and the present embodiment is arranged in order to form a LED wafer group as generation using red, green, blue
Table example, the color that others arrangement or the selection of red, green, blue three-color LED chip can be according to needed for daily uses is selected,
LED wafer bond pads are in ITO conductive circuit layers, and LED chip group surface covers the PU transparent film layers of normal temperature cure.Normal temperature cure
Be conducive to simplifying production technology.
And in order to improve luminous stability, reduce resistivity, the thickness of ITO conductive circuit layers is set to 100~
200nm, while the preparation method of ITO conductive circuit layers is：Transparency carrier is washed through deionization, ultrasonic wave cleaning after, into ITO
Coating chamber magnetron sputtering ITO conductive membrane layers, then heated solidification annealing form ITO conductive film layers, and ITO conductive film layers are most passed through afterwards
Overetch formation ITO conductive circuit layers.When ITO coating chambers carry out magnetron sputtering, magnetic control spattering target In2O3And SnO2Weight
Amount is than being 90%：10%, purity is 99.99%, and target-substrate distance is 6cm, and the temperature of transparency carrier is the vacuum in room temperature, vacuum chamber
For 4.0 × 10-5Pa, Ar qi leel press 1.0Pa, and Ar throughputs are 12cm3/ min, sputtering power is 50~200W, and sedimentation rate is about
For 0.7~1nm/s.
And in order to prevent the infiltration of the sodium ion in transparency carrier, so that influence is produced on whole circuit, can be in transparent base
SiO is additionally provided between plate and ITO conductive circuit layers2Layer.And in order to strengthen its illumination effect, can on the transparent substrate with ITO
Silver-colored reflector layer is set in the relative plane of conductive circuit layer, strengthens the reflecting effect of its one side with this, and by transparency carrier
The position relative with LED wafer group is in inner concavity, that is, the inside projection 11 against LED wafer is provided with, while inner concavity
Silver-colored reflector layer in spraying, inner concavity can be with triangular in shape, semicircle etc., and the part of the inner concavity can further enhance its reflection effect
Really.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (4)
1. a kind of colourful transparent LED luminescent screens, it is characterised in that transparency carrier, ITO including being sequentially connected from the bottom to top are conductive
At least one in line layer, LED wafer group and PU transparent film layers, the LED wafer of the LED wafer group selected from red, green, blue upside-down mounting
Kind, every three LED wafers are arranged in order to form LED wafer group, the LED wafer bond pads in ITO conductive circuit layers,
LED chip group surface covers the PU transparent film layers of normal temperature cure.
2. colourful transparent LED luminescent screens according to claim 1, it is characterised in that the transparency carrier and ITO conductor wires
SiO is additionally provided between the floor of road2Layer.
3. colourful transparent LED luminescent screens according to claim 1 or 2, it is characterised in that with ITO on the transparency carrier
Silver-colored reflector layer is set in the relative plane of conductive circuit layer.
4. colourful transparent LED luminescent screens according to claim 3, it is characterised in that with LED wafer on the transparency carrier
The relative position of group is in inner concavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720027693.2U CN206370425U (en) | 2017-01-10 | 2017-01-10 | A kind of colourful transparent LED luminescent screens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720027693.2U CN206370425U (en) | 2017-01-10 | 2017-01-10 | A kind of colourful transparent LED luminescent screens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206370425U true CN206370425U (en) | 2017-08-01 |
Family
ID=59390670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720027693.2U Active CN206370425U (en) | 2017-01-10 | 2017-01-10 | A kind of colourful transparent LED luminescent screens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206370425U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601726A (en) * | 2017-01-10 | 2017-04-26 | 广州市祺虹电子科技有限公司 | Color transparent LED light-emitting board |
-
2017
- 2017-01-10 CN CN201720027693.2U patent/CN206370425U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601726A (en) * | 2017-01-10 | 2017-04-26 | 广州市祺虹电子科技有限公司 | Color transparent LED light-emitting board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240427 Address after: 510000, Room 008, 1718, No. 37 Jinlong, Nansha Street, Xiangjiang Financial and Business Center, Nansha District, Guangzhou City, Guangdong Province (office only) Patentee after: Qingchi Technology (Guangzhou) Co.,Ltd. Country or region after: China Address before: 511453 4th Floor, Daligao Clothing Park, Dongyong Town, Nansha District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU QIHONG ELECTRONIC TECHNOLOGY Co.,Ltd. Country or region before: China |