CN206370403U - A kind of stamp-mounting-paper diode quality inspection assembled tool - Google Patents
A kind of stamp-mounting-paper diode quality inspection assembled tool Download PDFInfo
- Publication number
- CN206370403U CN206370403U CN201621316565.1U CN201621316565U CN206370403U CN 206370403 U CN206370403 U CN 206370403U CN 201621316565 U CN201621316565 U CN 201621316565U CN 206370403 U CN206370403 U CN 206370403U
- Authority
- CN
- China
- Prior art keywords
- stamp
- mounting
- paper diode
- transparent carrier
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model is related to a kind of stamp-mounting-paper diode quality inspection assembled tool, including lid and bottom seat；The lid is connected with lift frame, the lift frame is connected with base, the lid is flexibly connected by rotating shaft with lift frame, the lift frame is provided with convex layer, the convex layer is provided with chip slot, transparent carrier plate is provided with below the convex layer, the transparent carrier plate is provided with locating slot, and the transparent carrier plate is flexibly connected with bottom plate.After said structure, compared with prior art, the utility model is moved up and down and stamp-mounting-paper diode is fastened in chip slot a kind of stamp-mounting-paper diode quality inspection assembled tool of the utility model using transparent carrier plate, so can select stamp-mounting-paper diode with quick and convenient.Due to transparent carrier plate permeability, can upper and lower surface by convex lens come closely to stamp-mounting-paper diode carry out quality inspection.
Description
Technical field
The utility model is related to a kind of quality inspection frock, particularly a kind of stamp-mounting-paper diode quality inspection assembled tool.
Background technology
A kind of stamp-mounting-paper diode quality inspection assembled tool is a kind of can be combined with the quality inspection of batch detection stamp-mounting-paper diode quality
Frock.
State Intellectual Property Office of the People's Republic of China discloses one on a kind of stamp-mounting-paper diode quality inspection assembled tool
Utility model, the Authorization Notice No. of the utility model is：CN 202917454U.Including a motherboard, on the plate body of the motherboard
It is evenly distributed with circular hole of some bottoms not through plate body lower surface, the upper surface side of the motherboard and limitting casing is set；One
Circular hole of some bottoms not through plate body lower surface, diameter and the mother of circular hole are evenly distributed with public plate, the plate body of the public plate
The Circularhole diameter of plate is identical, and the plate body of the public plate can be just embedded in the limitting casing of motherboard.But wherein but exist
Problem：
For the utility model is from structure, because needing that motherboard is carried out to rock sieve when having selected stamp-mounting-paper diode
Choosing, because the volume of motherboard is larger, needs to expend substantial amounts of muscle power and time when rocking, so can bring many to staff
Inconvenience, while reducing production efficiency.Observe quality inspection while, staff need closely to stamp-mounting-paper diode carry out phase
The observation answered, and can not observe same time the back side situation of stamp-mounting-paper diode, so just brings when needing to consume a large amount of
Between and energy inconvenience.
The content of the invention
The utility model technical issues that need to address there is provided a kind of a kind of efficient, easily stamp-mounting-paper diode quality inspection
Assembled tool.
To solve above-mentioned technical problem, the utility model provides a kind of stamp-mounting-paper diode quality inspection assembled tool, including
Lid and bottom plate；The lid is connected with lift frame, and the lift frame is connected with bottom plate, and the lid is flexibly connected by rotating shaft with lift frame, institute
State lift frame and be provided with convex layer, the convex layer is provided with below chip slot, the convex layer and is provided with transparent carrier plate, the transparent carrier plate
Provided with locating slot, the transparent carrier plate is flexibly connected with bottom plate.
Further, provided with movable post below the transparent carrier plate, the movable post is connected by dop with bottom plate.
Further, convex lens are designed with the lid and bottom plate.
After said structure, a kind of stamp-mounting-paper diode quality inspection assembled tool of the utility model compared with prior art,
The utility model is moved up and down using transparent carrier plate and stamp-mounting-paper diode is fastened in chip slot, can so be selected with quick and convenient
Stamp-mounting-paper diode.Due to transparent carrier plate permeability, closely stamp-mounting-paper diode can be entered by convex lens in upper and lower surface
Row quality inspection.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is a kind of structural representation of stamp-mounting-paper diode quality inspection assembled tool of the utility model.
Fig. 2 is the top view that the utility model lifts frame.
Fig. 3 is the plan of the utility model bottom plate.
Fig. 4 is the plan of the utility model lid.
In figure：1 it is lid, 2 be rotating shaft, 3 be lift frame, 4 be transparent carrier plate, 5 be movable post, 6 be locating slot, 8 is bottom plate, 9
It is chip slot for dop, 10,11 be convex layer, 12 is convex lens.
Embodiment
As depicted in figs. 1 and 2, a kind of stamp-mounting-paper diode quality inspection assembled tool, including lid and bottom plate；The lid 1 and lift frame 3
Connection, the lift frame 3 is connected with bottom plate 8, and the lid 1 is flexibly connected by rotating shaft 2 with lift frame 3, and the lift frame 3 is provided with convex layer
11, the convex layer 11 is provided with chip slot 10, and the convex lower section of layer 11 is provided with transparent carrier plate 4, and the transparent carrier plate 4 is provided with fixed
Position groove 6, the transparent carrier plate 4 is flexibly connected with bottom plate 8.Wherein, main body of the present utility model is lift frame 3, and it is one to lift frame 3
Locating slot 6 is provided with the device that can be moved with upper and lower sleeve, the lift frame 3, locating slot 6 is corresponding with chip slot 10.But positioning
Groove 6 can not be moved.So when staff lifts frame 3, some stamp-mounting-paper diode chips on lift frame 3 will be scattered in
Screens is removed in chip slot 10, then by unnecessary stamp-mounting-paper diode chip.At this moment frame 3 is lifted slightly upwards again, by paster
Diode chip for backlight unit drops on the locating slot 6 of transparent carrier plate 4.At this moment the gap between chip slot 10 and locating slot 6 is less than chip
Thickness.At this moment lift frame 3 is fallen to restoring to the original state.Final transparent carrier plate 4 is flexibly connected with bottom plate 8.It can be passed through from bottom plate 8
Transparent carrier plate 4 observes the quality of stamp-mounting-paper diode chip.
As shown in figure 1, the lower section of transparent carrier plate 4 is provided with movable post 5, the movable post 5 is connected by dop 9 with bottom plate 8
Connect.Wherein, in order that obtaining transparent carrier plate 4 can be flexibly connected with bottom plate 8, worked if being provided with below the transparent carrier plate 4
Dynamic post 5, the top of the movable post 5 is provided with dop 9.The dop 9 is connected together with bottom plate 8, can so pass through activity
The stretching of post 5 keeps transparent carrier plate 4 and the safe distance of bottom plate 8.Because, can be together with transparent carrier plate 4 one when lift frame 3 is stretched
Rise and rise, finally stamp-mounting-paper diode chip is screened.
As shown in Figure 3 and Figure 4, convex lens 12 are designed with the lid 1 and bottom plate 8.Wherein, in order to preferably to paster two
Pole pipe chip is observed.Some convex lens 12 are mounted with the lid 1 and bottom plate 8, the position of the convex lens 12 is with determining
Position groove 6 matches.It can so facilitate staff in batches and careful to the progress quality testing of stamp-mounting-paper diode chip
And observation.
To sum up, some stamp-mounting-paper diode chips are scattered on the convex layer 11 of lift frame 3, upward lifting lift frame 3 pastes part
Piece diode chip for backlight unit is positioned, then will drop down onto original position under lift frame 3.Lid 1 is covered by rotating shaft 2, can so be led to
Cross some convex lens 12 installed on lid 1 and bottom plate 8 and close-ups are carried out to stamp-mounting-paper diode chip.
Although the foregoing describing embodiment of the present utility model, those skilled in the art should manage
Solution, these are merely illustrative of, and can make various changes or modifications to present embodiment, without departing from original of the present utility model
Reason and essence, protection domain of the present utility model are only limited by the claims that follow.
Claims (3)
1. a kind of stamp-mounting-paper diode quality inspection assembled tool, including lid and bottom plate；It is characterized in that：The lid (1) connects with lift frame (3)
Connect, the lift frame (3) is connected with bottom plate (8), the lid (1) is flexibly connected by rotating shaft (2) with lift frame (3), the lift frame (3)
Convex layer (11) is provided with, the convex layer (11) is provided with below chip slot (10), the convex layer (11) and is provided with transparent carrier plate (4),
The transparent carrier plate (4) is provided with locating slot (6), and the transparent carrier plate (4) is flexibly connected with bottom plate (8).
2. a kind of stamp-mounting-paper diode quality inspection assembled tool according to claim 1, it is characterized in that：The transparent carrier plate (4)
Lower section is provided with movable post (5), and the movable post (5) is connected by dop (9) with bottom plate (8).
3. a kind of stamp-mounting-paper diode quality inspection assembled tool according to claim 1, it is characterized in that：The lid (1) and bottom plate
(8) convex lens (12) are designed with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621316565.1U CN206370403U (en) | 2016-12-02 | 2016-12-02 | A kind of stamp-mounting-paper diode quality inspection assembled tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621316565.1U CN206370403U (en) | 2016-12-02 | 2016-12-02 | A kind of stamp-mounting-paper diode quality inspection assembled tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206370403U true CN206370403U (en) | 2017-08-01 |
Family
ID=59390112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621316565.1U Expired - Fee Related CN206370403U (en) | 2016-12-02 | 2016-12-02 | A kind of stamp-mounting-paper diode quality inspection assembled tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206370403U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567826A (en) * | 2021-07-26 | 2021-10-29 | 广东钜兴电子科技有限公司 | Test equipment and test method for plastic package surface mount diode |
-
2016
- 2016-12-02 CN CN201621316565.1U patent/CN206370403U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567826A (en) * | 2021-07-26 | 2021-10-29 | 广东钜兴电子科技有限公司 | Test equipment and test method for plastic package surface mount diode |
| CN113567826B (en) * | 2021-07-26 | 2022-03-18 | 广东钜兴电子科技有限公司 | Test equipment and test method for plastic package surface mount diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170801 Termination date: 20211202 |