CN206364019U - A kind of diode with vibration damping lead - Google Patents
A kind of diode with vibration damping lead Download PDFInfo
- Publication number
- CN206364019U CN206364019U CN201621471503.8U CN201621471503U CN206364019U CN 206364019 U CN206364019 U CN 206364019U CN 201621471503 U CN201621471503 U CN 201621471503U CN 206364019 U CN206364019 U CN 206364019U
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- China
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- section
- lead
- vibration damping
- diode
- encapsulation
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Abstract
The utility model is related to diode field, and in particular to a kind of diode with vibration damping lead, including packaging body, chip and vibration damping lead；The connected mode of lead and packaging body is improved, to improve attachment force；Lead is set to spring, buffering vibration impact；Increase the connection area of lead and circuit board, ensure that stable connection is reliable.Conducting function and vibration-damping function are integrated into lead assemblies by the utility model, substantially increase the anti-vibrating and impact ability of diode, make the more efficient safe work of diode, so as to improve diode service life.
Description
Technical field
The utility model is related to diode field, and in particular to a kind of diode with vibration damping lead.
Background technology
Diode belongs to rectification circuit technical equipment, is widely used in all kinds of rectification circuits, detecting circuit, mu balanced circuit
Deng meeting the production requirement and human lives' demand of all types of industries equipment.In face of the severe work such as high frequency, vibratory impulse of high intensity
Condition, the stability of diode operation is severely impacted.Therefore, it is necessary to provide a kind of diode of vibration damping lead, satisfaction is shaken
Application demand under dynamic impact operating mode.
Utility model content
To solve the above problems, the utility model provides a kind of two with vibration damping lead with anti-vibrating and impact ability
Pole pipe.
The technical scheme that the utility model is used is：Include the vibration damping lead of chip, connection circuit board and chip both sides,
And cover sets the packaging body of chip；Vibration damping lead is from top to bottom followed successively by encapsulation section, S types spring section and linkage section；The encapsulation section
Include the first encapsulation section connected vertically, the second encapsulation section, the 3rd encapsulation section and the 4th encapsulation section successively；Second encapsulation section and
Four encapsulation sections are located at the homonymy of the 3rd encapsulation section, and the first encapsulation section and the 3rd encapsulation section are located at the heteropleural of the second encapsulation section, the 4th
Encapsulation section is longer than the second encapsulation section.
To being further improved to for above-mentioned technical proposal, the compression direction of S types spring section with connecting plate is at an acute angle sets
Put.
To being further improved to for above-mentioned technical proposal, the arc radius of the S types spring section is 5-10 times of thickness of slab.
To being further improved to for above-mentioned technical proposal, the vibration damping lead is that elastic steel are integrally formed, Elastic Steel
The thickness of material is 0.5mm.
To being further improved to for above-mentioned technical proposal, the linkage section center opens up circular hole.
The beneficial effects of the utility model are：
1st, on the one hand, the stage casing of lead is set to S types spring section, helps to absorb the energy vibrated, reduction vibration pair
The influence of diode.Second aspect, the encapsulation section of lead is set to orthogonal complex-curved, contributes to packaging body with drawing
Line is preferably fitted, it is to avoid lead comes off with packaging body caused by vibration, is further conducive to improving vibration damping of the present utility model
Effect.
2nd, the compression direction of the S types spring section and connecting plate setting at an acute angle.In vibration processes, the S types spring section
The vibratory impulse of the spring force with connecting plate setting at an acute angle, buffer circuit plate vertical direction and parallel direction is produced, further
Be conducive to improving effectiveness in vibration suppression of the present utility model.
3rd, the arc radius of S types spring section is 5-10 times of thickness of slab.Larger arc radius contributes to reduction to vibrate
During S types springs section circular arc stress concentration, be further conducive to improving effectiveness in vibration suppression of the present utility model.
4th, the vibration damping lead is that elastic steel are integrally formed, and the thickness of elastic steel is 0.5mm.On the one hand, one
The vibration damping lead of shaping is easy to manufacture.On the other hand, the thickness of elastic steel is 0.5mm, be further conducive to improving this practicality
New effectiveness in vibration suppression.
5th, the linkage section center opens up circular hole.On the one hand, contribute to reduce the weight of lead；On the other hand, contribute to
Increase the welding bead length of lead and circuit board, realize that diode is reliably connected with circuit board, be further conducive to improving this reality
With new effectiveness in vibration suppression.
Brief description of the drawings
Fig. 1 is stereogram of the present utility model；
Fig. 2 is top view of the present utility model；
Fig. 3 is the A-A sectional views of the utility model front view；
Fig. 4 is the stereogram of vibration damping lead of the present utility model；
Fig. 5 is the stereogram at another visual angle of vibration damping lead of the present utility model.
Embodiment
The utility model is further described below in conjunction with accompanying drawing.
As shown in FIG. 1 to 3, the A-A sectional views of front view respectively of the present utility model, top view and front view.
A kind of diode with vibration damping lead, it is characterised in that：Including chip 100, connection circuit board 400 and chip
The vibration damping lead 300 of 100 both sides, and cover set the packaging body 200 of chip；Vibration damping lead 300 is from top to bottom followed successively by encapsulation section
310th, S types spring section 320 and linkage section 330；The encapsulation section 310 includes the first encapsulation section 311, second connected vertically successively
Encapsulation section 312, the 3rd encapsulation section 313 and the 4th encapsulation section 314；314 sections of second encapsulation section 312 and the 4th encapsulation are located at the 3rd envelope
The homonymy of section 313 is filled, the first encapsulation section 311 and the 3rd encapsulation section 313 are located at the heteropleural of the second encapsulation section 312, the 4th encapsulation section
314 are longer than the second encapsulation section 312.On the one hand, vibration damping lead 300 is included into S types spring section 320, helps to absorb the energy vibrated
Amount, influence of the reduction vibration to diode.Second aspect, the encapsulation section 310 of vibration damping lead 300 is set to orthogonal
It is complex-curved, contribute to packaging body 310 preferably to be fitted with vibration damping lead 300, it is to avoid vibration damping lead 300 and envelope caused by vibration
Dress body 310 comes off, and is further conducive to improving effectiveness in vibration suppression of the present utility model.The compression direction of S types spring section 320 with
Connecting plate 400 is at an acute angle to be set.In vibration processes, the S types spring section 320 and the spring force of the setting at an acute angle of connecting plate 400,
The vibratory impulse of the vertical direction of buffer circuit plate 400 and parallel direction, is further conducive to improving vibration damping effect of the present utility model
Really
As shown in Fig. 4~Fig. 5, the stereogram of vibration damping lead respectively of the present utility model and the stereogram at another visual angle.
The arc radius of the S types spring section 320 is 5-10 times of thickness of slab.Larger arc radius contributes to reduction to vibrate
During S types springs section circular arc stress concentration, be further conducive to improving effectiveness in vibration suppression of the present utility model.
The vibration damping lead 300 is that elastic steel are integrally formed, and the thickness of elastic steel is 0.5mm.On the one hand, one
The vibration damping lead of shaping is easy to manufacture.On the other hand, the thickness of elastic steel is 0.5mm, is further conducive to improving this practicality
New effectiveness in vibration suppression.
The center of linkage section 330 opens up circular hole 331.On the one hand, contribute to reduce the weight of vibration damping lead 300；It is another
Aspect, helps to increase the welding bead length of vibration damping lead 300 and circuit board 400, realizes that diode reliably connects with circuit board 400
Connect, be further conducive to improving effectiveness in vibration suppression of the present utility model.
Operation principle of the present utility model is：
To avoid vibrating caused diode fails, it is designed in terms of three.First, improve lead and packaging body
Connected mode, improves attachment force；Second, lead is set to elastic construction, buffering vibration impact；3rd increase lead and circuit board
Connection area, ensure stable connection it is reliable.
Embodiment described above only expresses a kind of embodiment of the present utility model, and it describes more specific and detailed,
But therefore it can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. a kind of diode with vibration damping lead, it is characterised in that：Include the vibration damping of chip, connection circuit board and chip both sides
Lead, and cover set the packaging body of chip；Vibration damping lead is from top to bottom followed successively by encapsulation section, S types spring section and linkage section；The envelope
Fill section and include the first encapsulation section connected vertically, the second encapsulation section, the 3rd encapsulation section and the 4th encapsulation section successively；Second encapsulation section
It is located at the homonymy of the 3rd encapsulation section with the 4th encapsulation section, the first encapsulation section and the 3rd encapsulation section are located at the heteropleural of the second encapsulation section,
4th encapsulation section is longer than the second encapsulation section.
2. the diode according to claim 1 with vibration damping lead, it is characterised in that：The compression of the S types spring section
Direction and connecting plate setting at an acute angle.
3. the diode according to claim 2 with vibration damping lead, it is characterised in that：The circular arc of the S types spring section
Radius is 5-10 times of thickness of slab.
4. the diode according to claim 3 with vibration damping lead, it is characterised in that：The vibration damping lead is elasticity
Steel are integrally formed, and the thickness of elastic steel is 0.5mm.
5. the diode according to claim 4 with vibration damping lead, it is characterised in that：The linkage section center opens up circle
Hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621471503.8U CN206364019U (en) | 2016-12-30 | 2016-12-30 | A kind of diode with vibration damping lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621471503.8U CN206364019U (en) | 2016-12-30 | 2016-12-30 | A kind of diode with vibration damping lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206364019U true CN206364019U (en) | 2017-07-28 |
Family
ID=59377718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621471503.8U Expired - Fee Related CN206364019U (en) | 2016-12-30 | 2016-12-30 | A kind of diode with vibration damping lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206364019U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108999922A (en) * | 2017-10-24 | 2018-12-14 | 北京航空航天大学 | A kind of whole cantilever design spring for multidimensional buffer shock-absorbing |
-
2016
- 2016-12-30 CN CN201621471503.8U patent/CN206364019U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108999922A (en) * | 2017-10-24 | 2018-12-14 | 北京航空航天大学 | A kind of whole cantilever design spring for multidimensional buffer shock-absorbing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523000 1203, C District, Tianan Digital City, 1 Golden Road, Nancheng street, Dongguan, Guangdong, 1 Patentee after: Guangdong Hui Xin Electronic Technology Co., Ltd. Address before: 523000 1203, C District, Tianan Digital City, 1 Golden Road, Nancheng street, Dongguan, Guangdong, 1 Patentee before: Dongguan Hui Hui Electronic Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170728 Termination date: 20201230 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |