CN206362014U - A kind of cold head device of the warm neck of intelligent pillow - Google Patents

A kind of cold head device of the warm neck of intelligent pillow Download PDF

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Publication number
CN206362014U
CN206362014U CN201621416041.XU CN201621416041U CN206362014U CN 206362014 U CN206362014 U CN 206362014U CN 201621416041 U CN201621416041 U CN 201621416041U CN 206362014 U CN206362014 U CN 206362014U
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module
heat
conducting substrate
cooling
pid
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卢根鑫
陈大庆
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Aiyisi (shanghai) Technology Development Co Ltd
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Aiyisi (shanghai) Technology Development Co Ltd
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Abstract

The utility model discloses a kind of cold head device of the warm neck of intelligent pillow, including cooling and warming mechanism and PID controller, cooling and warming mechanism includes upper heat-conducting substrate, lower heat-conducting substrate, condenser, semiconductor chip, heat pipe, radiator, the upper heat-conducting substrate is fixedly connected with condenser, the semiconductor chip is arranged between heat-conducting substrate and lower heat-conducting substrate, described heat pipe one end is fixed on lower heat-conducting substrate lower end, the heat pipe other end connects radiator, and the PID controller is connected with cooling and warming mechanism.The utility model structural principle is simple, and intelligence degree is high, by PID control temperature, can be kept again in Head cooling clearheaded satisfied in neck heating with warm neck rib.

Description

A kind of cold head device of the warm neck of intelligent pillow
Technical field
The utility model is related to Intelligent pillow technical field, the cold head device of warm neck of specially a kind of intelligent pillow.
Background technology
There is following subject matter including existing so-called intelligent pillow in the pillow commercially sold:
The common neck warming-up device of in the market, typically using heating wire, the mode of loading 12V dc sources is solved. In actual application, the heating to neck promotes the blood circulation of neck, can play a part of preventing soldier in brain, especially to neck Vertebra patient, acts on more obvious.It is " heat is on earth " the drawbacks of by the way of heating wire is heated to neck, is exactly once Heating circuit is opened, heating wire is by continuous firing, lasting heating, and form " heat superposition " effect.When serious, it can produce to human body Scald, it is or even on fire;Head cooling is had no in all kinds of patented technologies and commercially available prod.It can be seen that, " cold head warms up neck " be not complete Realize;Neck heating is had no in all kinds of patented technologies and commercially available prod, cooling closed-loop control system -- intelligent PID controller is controlled Temperature;The human-computer dialogue by smart mobile phone APP is had no in all kinds of patented technologies and commercially available prod, heating is set and adjust at any time Temperature, lack heating system security, adjustability, controllability;Micropower is had no in all kinds of patented technologies and commercially available prod High efficiency semiconductor heating element, heat pipe, the heating system of radiator composition, carry out " heating indirectly ", realize thermostatic control.
Utility model content
The purpose of this utility model is a kind of cold head device of the warm neck for providing intelligent pillow, to solve above-mentioned background technology The problem of middle proposition.
To achieve the above object, the utility model provides following technical scheme:A kind of cold head device of the warm neck of intelligent pillow, Including cooling and warming mechanism and PID controller, the cooling and warming mechanism include upper heat-conducting substrate, lower heat-conducting substrate, condenser, Semiconductor chip, heat pipe, radiator, the upper heat-conducting substrate are fixedly connected with condenser, and the semiconductor chip is arranged on Between upper heat-conducting substrate and lower heat-conducting substrate, described heat pipe one end is fixed on lower heat-conducting substrate lower end, and the heat pipe is another End connection radiator, the PID controller is connected with cooling and warming mechanism, and the condenser is provided with the first temperature sensor, The radiator is provided with second temperature sensor.
It is preferred that, the PID controller includes single-chip microcomputer, temperature setting module, A/D modular converters, setting value and detection Value contrast module, PID heat control module, PID coolings control module, PWM and heat output module, PWM coolings output module, system Chill block, heating module and WIFI module, the temperature setting module connect A/D modular converters, and the A/D modular converters connect Setting value and detected value contrast module are connect, the setting value is connected single-chip microcomputer, the single-chip microcomputer difference with detected value contrast module Connection PID heats control module, PID cooling control modules, and the PID heats control module, PID coolings control module and connected respectively Meet PWM and heat output module, PWM cooling output modules, the PWM heats output module, PWM cooling output modules and connected respectively Semiconductor chip, the semiconductor chip connects refrigeration module, heating module respectively, and the refrigeration module connects condenser, institute Heating module connection radiator is stated, the first temperature sensor connects respectively on second temperature sensor and condenser on the radiator Setting value and detected value contrast module are connect, the setting value is also connected smart mobile phone with detected value contrast module by WIFI module Terminal.
It is preferred that, the upper heat-conducting substrate and lower heat-conducting substrate and semiconductor chip fill thermal conductive silicon by screw locking Fat.
Compared with prior art, the beneficial effects of the utility model are:The utility model structural principle is simple, intelligent journey Degree is high, by PID control temperature, can be kept again in Head cooling clearheaded satisfied in neck heating with warm neck rib Meaning.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is PID controller control principle block diagram of the present utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belongs to the scope of the utility model protection.
Fig. 1-2 is referred to, the utility model provides a kind of technical scheme:A kind of cold head device of the warm neck of intelligent pillow, bag Cooling and warming mechanism 1 and PID controller 2 are included, the cooling and warming mechanism 1 includes upper heat-conducting substrate 3, lower heat-conducting substrate 4, condensation Device 5, semiconductor chip 6, heat pipe 7, radiator 8, the upper heat-conducting substrate 3 are fixedly connected with condenser 5, the semiconductor core Piece 6 is arranged between heat-conducting substrate 3 and lower heat-conducting substrate 4, upper heat-conducting substrate 3 and lower heat-conducting substrate 4 and semiconductor chip 6 by Screw locking, and fill heat-conducting silicone grease;Described one end of heat pipe 7 is fixed on the lower lower end of heat-conducting substrate 4, and the heat pipe 7 is another End connection radiator 8, the PID controller 2 is connected with cooling and warming mechanism 1, and the condenser 5 is provided with the first TEMP Device 9, the radiator 8 is provided with second temperature sensor 10.
In the present embodiment, PID controller 2 includes single-chip microcomputer 11, temperature setting module 12, A/D modular converters 13, setting value Control module 15, PID coolings control module 16, PWM, which are heated, with detected value contrast module 14, PID heats output module 17, PWM Cool output module 18, refrigeration module 19, heating module 20 and WIFI module 21, and the temperature setting module 12 connects A/D Modular converter 13, the connection setting value of A/D modular converters 13 and detected value contrast module 14, the setting value and detected value pair Single-chip microcomputer 11 is connected than module 14, the single-chip microcomputer 11 connects PID and heats control module 15, PID cooling control modules 16 respectively, The PID heat control module 15, PID cooling control module 16 connect respectively PWM heat output module 17, PWM cooling export Module 18, the PWM heats output module 17, PWM cooling output modules 18 and connects semiconductor chip 6, the semiconductor respectively Chip 6 connects refrigeration module 19, heating module 20 respectively, and the refrigeration module 19 connects condenser 5, and the heating module 20 connects Connect on radiator 8, the radiator 8 that first temperature sensor 9 connects setting respectively in second temperature sensor 10 and condenser 5 Value and detected value contrast module 14, the setting value are also connected smart mobile phone with detected value contrast module 14 by WIFI module 21 Terminal 22.
Operation principle:After intelligent mobile phone terminal starts " the warm cold head of neck " system, single-chip microcomputer is initialized first, according to Using the setting that heats of intelligent mobile phone terminal preliminary design, A/D digital-to-analogue conversions are carried out, single-chip microcomputer is contrasted to detected value, controlled by PID again System, controls PWM output valves, drives the work of small-power semiconductor chip, and by heating heat conducting pipe, heating amount is passed through into radiator Shed, be arranged on the second temperature sensor near radiator, collection heating value, and feed back to contrast input in real time makes to add Temperature tends to setting value.Semiconductor chip top is freezed, and bottom is heated.Chip selects small-power semiconductor chilling plate.Pass through Controls of the smart mobile phone APP to single-chip microcomputer and refrigerating chip operating current pulsewidth, can make the cooling scope of cooling piece, heat scope Control is in certain scope.Cooling scope, heat scope can also be by the quantity of the air-vent above radiator, condenser and hole Footpath, carries out the property taken into account regulation.
By the interior networking of WIFI module, communication network, recorded data is reached to the intelligent hand of user, guardian On machine APP, and reach cloud platform.And human-computer dialogue can be carried out by built-in WIFI module and " warm neck " system, to " warm neck " Keying, preliminary design value, working time etc. be configured, realize the wisdom management of " warm neck ".Neck heating temperature-adjustable be 40--50 DEG C, to ensure the effect of neck heating.When jugular temperature is more than 60 DEG C, system is automatically powered off, and improves heating system Security, adjustability, controllability.
The utility model structural principle is simple, and intelligence degree is high, by PID control temperature, can neck heating with Warm neck rib, can keep clearheaded satisfied in Head cooling again.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art, It is appreciated that these embodiments can be carried out in the case where not departing from principle of the present utility model and spirit a variety of changes, repaiies Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.

Claims (3)

  1. The head device 1. a kind of warm neck of intelligent pillow is trembled with fear, including cooling and warming mechanism (1) and PID controller (2), its feature exist In:The cooling and warming mechanism (1) includes upper heat-conducting substrate (3), lower heat-conducting substrate (4), condenser (5), semiconductor chip (6), heat pipe (7), radiator (8), the upper heat-conducting substrate (3) are fixedly connected with condenser (5), the semiconductor chip (6) it is arranged between heat-conducting substrate (3) and lower heat-conducting substrate (4), described heat pipe (7) one end is fixed on lower heat-conducting substrate (4) lower end, heat pipe (7) other end connection radiator (8), the PID controller (2) and cooling and warming mechanism (1) phase Even, the condenser (5) is provided with the first temperature sensor (9), and the radiator (8) is provided with second temperature sensor (10)。
  2. The head device 2. a kind of warm neck of intelligent pillow according to claim 1 is trembled with fear, it is characterised in that:The PID controller (2) single-chip microcomputer (11), temperature setting module (12), A/D modular converters (13), setting value and detected value contrast module are included (14), PID heats control module (15), PID cooling control modules (16), PWM and heats output module (17), PWM cooling outputs Module (18), refrigeration module (19), heating module (20) and WIFI module (21), the temperature setting module (12) connect A/ D modular converters (13), the A/D modular converters (13) connection setting value and detected value contrast module (14), the setting value with Detected value contrast module (14) connection single-chip microcomputer (11), the single-chip microcomputer (11) connect respectively PID heat control module (15), PID cooling control modules (16), the PID heats control module (15), PID cooling control modules (16) and connects PWM increasings respectively Warm output module (17), PWM cooling output modules (18), the PWM heat output module (17), PWM cooling output modules (18) semiconductor chip (6) is connected respectively, and the semiconductor chip (6) connects refrigeration module (19), heating module (20) respectively, The on the refrigeration module (19) connection condenser (5), heating module (20) the connection radiator (8), the radiator (8) The first temperature sensor (9) connects setting value and detected value contrast module respectively on two temperature sensors (10) and condenser (5) (14), the setting value is also connected intelligent mobile phone terminal (22) with detected value contrast module (14) by WIFI module (21).
  3. The head device 3. a kind of warm neck of intelligent pillow according to claim 1 is trembled with fear, it is characterised in that:The upper heat-conducting substrate (3) and lower heat-conducting substrate (4) and semiconductor chip (6) are by screw locking, and heat-conducting silicone grease is filled.
CN201621416041.XU 2016-12-22 2016-12-22 A kind of cold head device of the warm neck of intelligent pillow Active CN206362014U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621416041.XU CN206362014U (en) 2016-12-22 2016-12-22 A kind of cold head device of the warm neck of intelligent pillow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621416041.XU CN206362014U (en) 2016-12-22 2016-12-22 A kind of cold head device of the warm neck of intelligent pillow

Publications (1)

Publication Number Publication Date
CN206362014U true CN206362014U (en) 2017-07-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106524565A (en) * 2016-12-22 2017-03-22 爱义思(上海)科技发展有限公司 Neck warming and head cooling device for intelligent pillow
CN114442700A (en) * 2022-02-28 2022-05-06 东莞市皇品医疗科技有限公司 Pillow and temperature control method for pillow

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106524565A (en) * 2016-12-22 2017-03-22 爱义思(上海)科技发展有限公司 Neck warming and head cooling device for intelligent pillow
CN114442700A (en) * 2022-02-28 2022-05-06 东莞市皇品医疗科技有限公司 Pillow and temperature control method for pillow

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