CN206349392U - One kind is based on interior connection chip high voltage light emitting diode - Google Patents
One kind is based on interior connection chip high voltage light emitting diode Download PDFInfo
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- CN206349392U CN206349392U CN201720014011.4U CN201720014011U CN206349392U CN 206349392 U CN206349392 U CN 206349392U CN 201720014011 U CN201720014011 U CN 201720014011U CN 206349392 U CN206349392 U CN 206349392U
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- chip
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- light emitting
- emitting diode
- high voltage
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Abstract
The utility model is related to a kind of light emitting diode, is particularly based on interior connection chip high voltage light emitting diode.One kind is based on interior connection chip high voltage light emitting diode, including support, the LED chip being assemblied on support, the gold thread for carrying out chip interconnection to LED core plate electrode, the fluorescent glue encapsulated to LED chip and gold thread, connection chip is connected integrated in wafer level in the LED, internal insulation is carried out to integrated chip using deep etching ICP technologies, adjacent LED chip chamber opens up fluted.The utility model has the following advantages that:1st, simplify packaging technology, reduce cost.2nd, open up groove and add light-emitting area, improve luminous efficiency.3rd, line loss is low, and cost is low.
Description
Technical field
The utility model is related to a kind of light emitting diode, is particularly based on interior connection chip high voltage light emitting diode.
Background technology
The features such as light emitting diode has luminous efficiency height, energy-saving and environmental protection, long lifespan, is referred to as " green illumination light
Source ".High-voltage LED has preferable prospect, and it not only can be applied to traditional outdoor lighting market, glare light electric torch
Market, also progressively permeates, global high-voltage LED city to emerging fields such as automobile headlamp, mobile phone flashlight, ultraviolet LED lamps
Field scale rises year after year, LED general illumination light fixture products is developed using high-voltage LED, overall power consumption can drop significantly
It is low, so that the design requirement to heat-dissipating casing is greatly reduced, it can be seen that high-voltage LED can bring LED illumination lamp
Effective reduction of cost and weight, but its prior meaning is to significantly reduce the design requirement to cooling system, so as to have
Power has cleared away the maximum technology barrier that LED illumination lamp gets in illumination market, and high-voltage LED will be leading following
LED general illumination light fixtures market.
High-voltage LED is according to use requirements such as LED street lamp, LED daylight lamp, LEDbulb lamps, and one kind of exploitation is high
The light emitting diode of die mould(Fig. 1), mainly comprising support, three LED luminescence chips, gold thread, fluorescent glues, high-voltage LED
It is generally that three chips collocation support carries out assembled in series using integrated encapsulation structure, chip only has 6 light-emitting areas, luminous efficiency
It is low, and current density is uneven.Although it can increase high-voltage LED luminous efficiency by improving chip brightness, but
The cost of LED illumination light source is added, the popularization and application of LED illumination light source are hindered.
The content of the invention
The purpose of this utility model is that there is provided a kind of many light-emitting areas, light efficiency occurred frequently for solution problems of the prior art
Rate, low line loss, low cost based on it is interior connection chip high voltage light emitting diode.
To achieve the above object, the utility model is adopted the following technical scheme that:One kind is lighted based on interior connection chip high voltage
Diode, including support, be assemblied on support LED chip, to LED core plate electrode carry out chip interconnection gold thread, to LED
The fluorescent glue that chip and gold thread are encapsulated, in the LED connection chip connected in wafer level it is integrated, using deep etching
ICP technologies carry out internal insulation to integrated chip, and adjacent LED chip chamber opens up fluted.
It is preferred that, the LED chip is one, realizes in ten light-emitting areas and connects chip high voltage light emitting diode.
It is preferred that, the groove runs through the opposing end surface of chip.
It is preferred that, the cross sectional shape of the groove is inverted trapezoidal.
The utility model has the following advantages that:
1st, simplify packaging technology, reduce cost.
2nd, open up groove and add light-emitting area, improve luminous efficiency.
3rd, line loss is low, and cost is low.
Brief description of the drawings
Fig. 1 is the utility model background technology structural representation;
Fig. 2 is the utility model example structure schematic diagram;
Fig. 3 is Fig. 2 side view.
Embodiment
Below in conjunction with the accompanying drawings 2,3 pairs of the utility model are further described:One kind is based on interior connection chip high voltage luminous two
Pole pipe, including support 1, be assemblied in by adhesive glue on support LED chip 2, by ultra-sonic welded LED core plate electrode is carried out
The gold thread 3 of chip interconnection, the fluorescent glue 4 encapsulated to LED chip and gold thread, wherein LED chip are one, in wafer level
Upper progress multi-chip series connection is integrated, and carries out internal insulation, adjacent LED chip to integrated chip using deep etching ICP technologies
Between open up fluted 5, the groove is through the groove that chip opposing end surface and cross sectional shape are inverted trapezoidal.Chip light emitting face from
Six increase to ten, improve the light extraction efficiency of chip, improve the luminous efficiency of high-voltage LED.
Claims (4)
1. one kind based on it is interior connection chip high voltage light emitting diode, including support, be assemblied on support LED chip, to LED core
The gold thread of plate electrode progress chip interconnection, the fluorescent glue encapsulated to LED chip and gold thread, it is characterised in that:The LED
It is interior connection chip wafer level on connect it is integrated, using deep etching ICP technologies to integrated chip carry out internal insulation, it is adjacent
Opened up between LED chip fluted.
2. it is according to claim 1 based on interior connection chip high voltage light emitting diode, it is characterised in that:The LED chip
For one.
3. it is according to claim 1 based on interior connection chip high voltage light emitting diode, it is characterised in that:The groove runs through
The opposing end surface of chip.
4. connect chip high voltage light emitting diode based on interior according to any of the above-described claim, it is characterised in that:It is described
The cross sectional shape of groove is inverted trapezoidal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720014011.4U CN206349392U (en) | 2017-01-06 | 2017-01-06 | One kind is based on interior connection chip high voltage light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720014011.4U CN206349392U (en) | 2017-01-06 | 2017-01-06 | One kind is based on interior connection chip high voltage light emitting diode |
Publications (1)
Publication Number | Publication Date |
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CN206349392U true CN206349392U (en) | 2017-07-21 |
Family
ID=59324305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201720014011.4U Expired - Fee Related CN206349392U (en) | 2017-01-06 | 2017-01-06 | One kind is based on interior connection chip high voltage light emitting diode |
Country Status (1)
Country | Link |
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CN (1) | CN206349392U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108666406A (en) * | 2018-06-19 | 2018-10-16 | 江西联创光电科技股份有限公司 | High pressure white light-emitting diode |
-
2017
- 2017-01-06 CN CN201720014011.4U patent/CN206349392U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108666406A (en) * | 2018-06-19 | 2018-10-16 | 江西联创光电科技股份有限公司 | High pressure white light-emitting diode |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170721 Termination date: 20220106 |
|
CF01 | Termination of patent right due to non-payment of annual fee |