CN206349354U - Uniform-temperature plate heat dissipating device - Google Patents
Uniform-temperature plate heat dissipating device Download PDFInfo
- Publication number
- CN206349354U CN206349354U CN201621207163.8U CN201621207163U CN206349354U CN 206349354 U CN206349354 U CN 206349354U CN 201621207163 U CN201621207163 U CN 201621207163U CN 206349354 U CN206349354 U CN 206349354U
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- China
- Prior art keywords
- uniform
- heat dissipating
- dissipating device
- plate heat
- bottom plate
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Abstract
The utility model provides a kind of uniform-temperature plate heat dissipating device, the uniform-temperature plate heat dissipating device includes base, footstock and sealing plug, base is bonded cavity with footstock and cavity leaves opening, sealing plug, which is used to close, to be open, wherein, base includes bottom plate and multiple internal fins on bottom plate, and multiple internal fins are within the cavity, and footstock includes top plate and multiple outside fins on multiple top plates.The utility model provide uniform-temperature plate heat dissipating device is simple in construction, easily manufactured, radiating efficiency is good.
Description
Technical field
The utility model is related to technical field of heat dissipation, more particularly to a kind of uniform-temperature plate heat dissipating device.
Background technology
It is increasing big as the integrated level and performance of the fast development of microelectric technique, and chip are improved constantly
The heat dissipation capacity of power chip has the trend persistently increased.
If the heat that chip is produced when running can not disperse in time to influence its job stability, Mean is reduced
Time, chip will be burnt when serious.Meanwhile, the activity of the transistor of difference in functionality module can cause highly non-uniform in chip
Heat produce, and then cause to occur in chip the hot spot region with time and spatial variations, focus can come bigger to chip belt
Destruction.But chip miniaturization, integrated trend will not change, the heat dissipation problem that chip is faced also can be increasingly serious.
Therefore, how to prevent electronic installation overheat make efficiency decline more seem important in today, various electronic installations it is cold
But apparatus and method also in response to and give birth to.But the problem of there is complicated or not high radiating efficiency mostly now with cooling device.
Utility model content
The utility model provides a kind of uniform-temperature plate heat dissipating device, with solve cooling device in the prior art exist it is complicated
Or the not high technical problem of radiating efficiency.
In order to solve the above technical problems, the technical scheme that the utility model is used is:A kind of temperature-uniforming plate radiating is provided
Device, the uniform-temperature plate heat dissipating device includes base, footstock and sealing plug, and the base is bonded cavity with the footstock
And the cavity leaves opening, the sealing plug is used to close the opening, wherein, the base includes bottom plate and located at institute
Multiple internal fins on bottom plate are stated, the multiple internal fin is located in the cavity, and the footstock includes top plate and is located at
Multiple outside fins on the multiple top plate.
According to the preferred embodiment of the utility model one, the bottom plate and the multiple internal fin are structure as a whole.
According to the preferred embodiment of the utility model one, the top plate and the multiple outside fin are structure as a whole.
According to the preferred embodiment of the utility model one, the top plate is provided with depressed area, and the bottom plate is assemblied in the depression
The cavity is constituted in area and then with the top plate.
According to the preferred embodiment of the utility model one, the edge of the bottom plate is connected with the edge seal of the depressed area.
According to the preferred embodiment of the utility model one, the edge at the edge of the bottom plate and the depressed area is welded to connect.
According to the preferred embodiment of the utility model one, the edge of the top plate is provided with escape groove, the open communication to institute
The bottom land of escape groove is stated, the sealing plug is located in the escape groove.
According to the preferred embodiment of the utility model one, the periphery of the top plate is provided with multiple mounting holes.
The beneficial effects of the utility model are:The situation of prior art is different from, the temperature-uniforming plate that the utility model is provided dissipates
Thermal is simple in construction, easily manufactured, radiating efficiency is good.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the utility model embodiment
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Other accompanying drawings are obtained, wherein:
Fig. 1 is the dimensional structure diagram for the uniform-temperature plate heat dissipating device that the utility model is provided;
Fig. 2 is a configuration schematic diagram of the uniform-temperature plate heat dissipating device that the utility model is provided;
Fig. 3 is another configuration schematic diagram for the uniform-temperature plate heat dissipating device that the utility model is provided.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Also referring to Fig. 1 to Fig. 3, the utility model provides a kind of uniform-temperature plate heat dissipating device, the uniform-temperature plate heat dissipating device
Including base 110, footstock 120 and sealing plug 130, base 110 is bonded cavity with footstock 120 and cavity leaves opening
121, sealing plug 130 is used to close opening 121, wherein, base 110 includes bottom plate 111 and multiple inside on bottom plate 111
Fin 112, multiple internal fins 112 are within the cavity, and footstock 120 includes top plate 122 and multiple on multiple top plates 122
Outside fin 123.Base 110 uses the material of good heat dispersion performance, such as copper, aluminium with footstock 120.Sealing plug 130 can be with
It is copper pipe or aluminum pipe etc. material, the cavity can be vacuumized by the opening 121 and load hydraulic fluid to the cavity
(such as water), to strengthen cooling effect.
Specifically, bottom plate 111 and multiple internal fins 112 are structure as a whole, and multiple internal fins 112 can pass through shovel piece
Machine pushes away effect to the shovel of bottom plate 111 and formed, and its is easily manufactured, and multiple internal fins 112 are vertical on bottom plate 111, with bottom plate
111 associativity is preferable.
Likewise, top plate 122 and multiple outside fins 123 are structure as a whole, multiple outside fins 123 can pass through shovel piece machine
Effect formation is pushed away to the shovel of top plate 122.
Usually, the height of multiple internal fins 112 on bottom plate 111 is smaller, and arrangement comparatively dense, and on top plate 122
The height of multiple outside fins 123 can be larger, arrangement is relative can be more sparse.
In a particular embodiment, top plate 122 is provided with depressed area 124, bottom plate 111 be assemblied in depressed area 124 so that with top
Plate 122 constitutes foregoing cavity.The edge of bottom plate 111 is connected with the edge seal of depressed area 124.Preferably, the side of bottom plate 111
Edge can be connected with the edge of depressed area 124 using welding manner.Depressed area 124 and the shape of bottom plate 111 do not constitute the utility model
Limitation, the area of depressed area 124 preferably does big as far as possible in the case where the structure of bottom plate 111 allows.
In the utility model embodiment, the edge of top plate 122 is provided with escape groove 125, and opening 121 is communicated to escape groove
125 bottom land, the storage type of sealing plug 130 is assemblied in escape groove 125.
In addition, uniform-temperature plate heat dissipating device is installed for convenience, the periphery of top plate 122 is provided with multiple mounting holes 126, in order to
Assembled by fixing screws.
In summary, it should be readily apparent to one skilled in the art that the uniform-temperature plate heat dissipating device structure letter that the utility model is provided
Single, easily manufactured, radiating efficiency is good.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or be directly or indirectly used in
Other related technical fields, are similarly included in scope of patent protection of the present utility model.
Claims (8)
1. a kind of uniform-temperature plate heat dissipating device, it is characterised in that the uniform-temperature plate heat dissipating device includes base, footstock and sealing
Plug, the base is bonded cavity with the footstock and the cavity leaves opening, and the sealing plug is used to close described
Opening, wherein, the base includes bottom plate and multiple internal fins on the bottom plate, and the multiple internal fin is located at
In the cavity, the footstock includes top plate and multiple outside fins on the multiple top plate.
2. uniform-temperature plate heat dissipating device according to claim 1, it is characterised in that the bottom plate and the multiple internal fin
It is structure as a whole.
3. uniform-temperature plate heat dissipating device according to claim 2, it is characterised in that the top plate and the multiple outside fin
It is structure as a whole.
4. uniform-temperature plate heat dissipating device according to claim 3, it is characterised in that the top plate is provided with depressed area, the bottom
Plate is assemblied in the depressed area and then constitutes the cavity with the top plate.
5. uniform-temperature plate heat dissipating device according to claim 4, it is characterised in that the edge of the bottom plate and the depressed area
Edge seal connection.
6. uniform-temperature plate heat dissipating device according to claim 5, it is characterised in that the edge of the bottom plate and the depressed area
Edge be welded to connect.
7. uniform-temperature plate heat dissipating device according to claim 5, it is characterised in that the edge of the top plate is provided with escape groove,
The open communication is to the bottom land of the escape groove, and the sealing plug is in the escape groove.
8. uniform-temperature plate heat dissipating device according to claim 7, it is characterised in that installed provided with multiple on the periphery of the top plate
Hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621207163.8U CN206349354U (en) | 2016-11-07 | 2016-11-07 | Uniform-temperature plate heat dissipating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621207163.8U CN206349354U (en) | 2016-11-07 | 2016-11-07 | Uniform-temperature plate heat dissipating device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206349354U true CN206349354U (en) | 2017-07-21 |
Family
ID=59317082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621207163.8U Active CN206349354U (en) | 2016-11-07 | 2016-11-07 | Uniform-temperature plate heat dissipating device |
Country Status (1)
Country | Link |
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CN (1) | CN206349354U (en) |
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2016
- 2016-11-07 CN CN201621207163.8U patent/CN206349354U/en active Active
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