CN206341545U - A kind of direct copper ceramic substrate with water-cooling channel - Google Patents
A kind of direct copper ceramic substrate with water-cooling channel Download PDFInfo
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- CN206341545U CN206341545U CN201621478278.0U CN201621478278U CN206341545U CN 206341545 U CN206341545 U CN 206341545U CN 201621478278 U CN201621478278 U CN 201621478278U CN 206341545 U CN206341545 U CN 206341545U
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- cooling channel
- copper plate
- fine copper
- liquid cooling
- liquid
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Abstract
The utility model belongs to ceramic surface metallization and Functionalization field, and in particular to a kind of direct copper ceramic substrate with water-cooling channel.It includes fine copper plate, and the side concave surface of the fine copper plate is provided with liquid cooling channel, and the depth of the liquid cooling channel is less than the thickness of the fine copper plate；Offered on another side surface of the fine copper plate or end face and be respectively connected with logical liquid-inlet and liquid outlet with the liquid cooling channel；The surface that the fine copper plate is located at the liquid cooling channel side is formed with oxidation surface layer；The oxidation surface layer of the fine copper plate is sintered with ceramic wafer one side, the another side sintering copper sheet of the ceramic wafer.This substrate radiating efficiency is high, low cost so that power electronic devices lighter, the smaller, cost of this direct copper ceramic substrate with liquid cooling channel of application is lower.
Description
Technical field
The utility model belongs to ceramic surface metallization and Functionalization field, and in particular to one kind carries water-cooling channel
Direct copper ceramic substrate.
Background technology
Direct copper technology is a kind of ceramic surface metallization technology grown up based on aluminium oxide ceramic substrate, with
The development and requirement of high power module and power electronic devices, direct copper ceramic substrate application are increasingly extensive, by directly deposited
Copper ceramic substrate contacts the heat to metal material or composite is heat sink.
In the prior art, chip is welded on to the picture surface side of direct copper ceramic substrate, then again by direct copper
Ceramic substrate be welded on metal material or composite it is heat sink on, the heat that chip can be sent pass through direct copper ceramics
Substrate, heat sink conduction are into external environment condition.
It is currently, there are following technological deficiency：It is heat sink with the power electronic devices that metal material or composite are heat sink
Heavier, possessive volume is larger (needing big with air contact area), so seeming heavy, in the case where power density is higher
This radiating mode even has little time to disperse the heat produced by chip, has a strong impact on the service life of component.
Utility model content
In order to solve the above-mentioned technical problem, the purpose of this utility model is to provide one kind to be beneficial to improve radiating efficiency, subtract
The direct copper ceramic substrate with water-cooling channel of small power electronic devices volume.
To realize above-mentioned technical purpose, the utility model uses following technical scheme：
Direct copper ceramic substrate with water-cooling channel, including fine copper plate, the side concave surface of the fine copper plate are set
Liquid cooling channel is equipped with, the depth of the liquid cooling channel is less than the thickness of the fine copper plate；The fine copper plate it is another
Offered on side surface or end face and be respectively connected with logical liquid-inlet and liquid outlet with the liquid cooling channel；
The surface that the fine copper plate is located at the liquid cooling channel side is formed with oxidation surface layer；The oxidation of the fine copper plate
Surface layer is sintered with ceramic wafer one side, the another side sintering copper sheet of the ceramic wafer.
Preferably, being seamlessly transitted at the flex point of the liquid cooling channel, it is impossible to there is right angle or wedge angle to appear in passage
It is interior.
Preferably, the liquid cooling channel is serpentine-like or S types or spirality, it can also be added according to actual conditions certainly
Work is into other forms, and the form of passage can variation；Processing mode can be using chemical etching or machining mode.
Preferably, the thickness of the fine copper plate is 0.2~2mm, it is ensured that liquid is circulated in copper coin Inner Constitution.
Due to using above-mentioned technical proposal, the utility model has at least following beneficial effect：By rationally designing, make band
The direct copper ceramic substrate for having liquid cooling channel is made pottery in cooling effect with not containing the direct copper of water-cooling channel commonly
Porcelain substrate or the effect of other metallized ceramic substrates are suitable or more efficient, beneficial to the radiating efficiency for improving power electronic devices,
And cost is lower, the metal heat sink of heaviness can be substituted, weight and volume is reduced so that application is this to carry liquid cooling channel
Direct copper ceramic substrate power electronic devices is lighter, smaller, cost is lower.
Brief description of the drawings
The following drawings is only intended to, in doing the utility model schematic illustration and explanation, not limit model of the present utility model
Enclose.Wherein：
Fig. 1 is the cross section structure schematic diagram of the utility model embodiment；
Fig. 2 is the structural representation of fine copper plate in the utility model embodiment.
In figure：1- fine copper plates；2- liquid cooling channels；3- liquid-inlets；4- liquid outlets；5- ceramic wafers；6- copper sheets.
Embodiment
With reference to the accompanying drawings and examples, the utility model is expanded on further.In the following detailed description, only by saying
Bright mode describes some one exemplary embodiments of the present utility model.Undoubtedly, one of ordinary skill in the art can be with
Recognize, can be with a variety of modes to described in the case of without departing from spirit and scope of the present utility model
Embodiment is modified.Therefore, accompanying drawing and description are inherently illustrative, rather than for limiting the protection of claim
Scope.
As depicted in figs. 1 and 2, the direct copper ceramic substrate with water-cooling channel, including fine copper plate 1, the fine copper plate 1
A side surface liquid cooling channel 2, the depth of the liquid cooling channel 2 are machined with by chemical etching or machining mode
Less than the thickness of the fine copper plate 1, the thickness of the fine copper plate is 0.2~2mm, to ensure liquid in copper coin inner loop；Institute
State to offer on another side surface of fine copper plate 1 and be respectively connected with logical liquid-inlet 3 and liquid discharge with the liquid cooling channel 2
Mouth 4, certain liquid-inlet 3 and liquid outlet 4 can also be arranged on the end face of fine copper plate, to ensure liquid and outside progress heat
Exchange；
The surface that the fine copper plate 1 is located at the side of liquid cooling channel 2 is uniform by low-level oxidation formation oxidation of annealing
Surface layer is aoxidized, to improve its surface stability；The oxidation surface layer of the fine copper plate 1 and the one side of ceramic wafer 5 are superimposed height
(1065~1083 DEG C) sintering under warm environment, copper sheet 6 of the another side sintering with line pattern face of the ceramic wafer；Specifically
During processed and applied, first the oxide side stacking of ceramic wafer 5 and fine copper plate can be added together under high temperature and sintered, then again will be complete
Copper sheet 6 be sintered in the another side of ceramic wafer 5, or complete copper sheet 6 is first sintered in the one side of ceramic wafer 5, then again will
Fine copper plate 1 containing liquid cooling channel is sintered in the another side of ceramic wafer 5, then passes through pad pasting, exposure, development, chemical etching
Figure is processed etc. mode, unnecessary part is finally dismissed with laser cutting mode.
Wherein, to ensure to seamlessly transit at the flex point of the liquid cooling channel, it is impossible to there is right angle or wedge angle to appear in logical
In road.
In the present embodiment, the liquid cooling channel is serpentine-like, certainly according to actual conditions can also be processed into S types or its
The form of his form, i.e. passage can variation；Processing mode can be using chemical etching or machining mode.
The preparation method of this direct copper ceramic substrate, step is as follows：
Step one, fine copper plate 1 and copper sheet 6 are passed through into roughening treatment, a side surface of fine copper plate 1 by chemical etching or
Machining mode processes liquid cooling channel 2, and following two aspect is should be noted in this procedure：
(1) during liquid cooling channel on design copper coin, form can be with various but must be smooth, and channel depth is less than copper coin
Thickness；
(2) need to etch liquid entrance at the two ends of passage, in etching, liquid entrance etching need to be worn；
Step 2, the fine copper plate 1 that step one is obtained (500~1000 DEG C) anneal oxidation in the case of a high temperature, in ceramics
The two sides of plate 5 sinters a piece of fine copper plate 1 containing liquid cooling channel and a piece of complete copper sheet 6 respectively；
Step 3, is processed direct copper ceramic substrate picture surface by the etching mode of pad pasting, exposure, development,
Redundance is cut by laser, as shown in Figure 2.
When the chip being welded on picture surface gives off heat, after certain temperature range, liquid-cooling system starts work
Make, then cooling liquid is in path flows of the channel interior according to design, using forcing the type of cooling to strengthen radiating, by heat from
Take external environment condition inside substrate to, complete to recycle after heat exchange, so as to realize the radiating of power electronic devices well
Effect.
The schematical embodiment of the utility model is the foregoing is only, model of the present utility model is not limited to
Enclose.Any those skilled in the art, it is made on the premise of design of the present utility model and principle is not departed to be equal
Change and modification, all should belong to the scope of the utility model protection.
Claims (4)
1. a kind of direct copper ceramic substrate with water-cooling channel, it is characterised in that：Including fine copper plate (1), the fine copper plate
(1) side concave surface is provided with liquid cooling channel (2), and the depth of the liquid cooling channel (2) is less than the fine copper
The thickness of plate (1)；Offered on another side surface of the fine copper plate (1) or end face with the liquid cooling channel (2) respectively
The liquid-inlet (3) and liquid outlet (4) being connected
The surface that the fine copper plate (1) is located at the liquid cooling channel (2) side is formed with oxidation surface layer；The fine copper plate (1)
Oxidation surface layer and ceramic wafer (5) one side sinter, the another side sintering copper sheet (6) of the ceramic wafer (5).
2. the direct copper ceramic substrate of water-cooling channel is carried as claimed in claim 1, it is characterised in that：The liquid cooling
Seamlessly transitted at the flex point of passage (2).
3. the direct copper ceramic substrate of water-cooling channel is carried as claimed in claim 2, it is characterised in that：The liquid cooling
Passage (2) is serpentine-like or S types or spirality.
4. the direct copper ceramic substrate with water-cooling channel as described in claim 1,2 or 3, it is characterised in that：It is described pure
The thickness of copper coin (1) is 0.2~2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621478278.0U CN206341545U (en) | 2016-12-30 | 2016-12-30 | A kind of direct copper ceramic substrate with water-cooling channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621478278.0U CN206341545U (en) | 2016-12-30 | 2016-12-30 | A kind of direct copper ceramic substrate with water-cooling channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206341545U true CN206341545U (en) | 2017-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621478278.0U Active CN206341545U (en) | 2016-12-30 | 2016-12-30 | A kind of direct copper ceramic substrate with water-cooling channel |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231604A (en) * | 2018-01-24 | 2018-06-29 | 韩德军 | A kind of manufacturing method of power semiconductor device |
| CN108598042A (en) * | 2018-01-24 | 2018-09-28 | 韩德军 | A kind of power inverter |
| CN111085765A (en) * | 2019-12-27 | 2020-05-01 | 哈尔滨工业大学 | Flat NiTi alloy electron beam welding anisotropic heat dissipation cooling device and welding method thereof |
| CN112913008A (en) * | 2018-05-18 | 2021-06-04 | 罗杰斯德国有限公司 | System for cooling a cermet substrate, cermet substrate and method of manufacturing a system |
-
2016
- 2016-12-30 CN CN201621478278.0U patent/CN206341545U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231604A (en) * | 2018-01-24 | 2018-06-29 | 韩德军 | A kind of manufacturing method of power semiconductor device |
| CN108598042A (en) * | 2018-01-24 | 2018-09-28 | 韩德军 | A kind of power inverter |
| CN112913008A (en) * | 2018-05-18 | 2021-06-04 | 罗杰斯德国有限公司 | System for cooling a cermet substrate, cermet substrate and method of manufacturing a system |
| CN111085765A (en) * | 2019-12-27 | 2020-05-01 | 哈尔滨工业大学 | Flat NiTi alloy electron beam welding anisotropic heat dissipation cooling device and welding method thereof |
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