CN206339897U - A kind of notebook host lower cover of high radiating - Google Patents
A kind of notebook host lower cover of high radiating Download PDFInfo
- Publication number
- CN206339897U CN206339897U CN201620912553.9U CN201620912553U CN206339897U CN 206339897 U CN206339897 U CN 206339897U CN 201620912553 U CN201620912553 U CN 201620912553U CN 206339897 U CN206339897 U CN 206339897U
- Authority
- CN
- China
- Prior art keywords
- lower cover
- jack
- neck
- heat sink
- main frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to notebook host lower cover, more particularly to a kind of notebook host lower cover of high radiating.A kind of notebook host lower cover of high radiating described in the utility model, including main frame lower cover body, heat sink, battery neck, display screen neck, semiconductor chilling plate, the jack of power-line plug, USB interface, netting twine jack, USB jack, sender, CD-ROM drive neck, earphone jack, the setting of microphone jack, heat sink and semiconductor chilling plate, enhances the radiating effect of notebook host lower casing jointly.
Description
Technical field
The utility model is related to notebook host lower cover, under more particularly to a kind of notebook host of high radiating
Lid.
Background technology
With the high speed development of information age, the continuous upgrading of notebook computer, its power consumption is also continued to increase, radiating
Just into the key issue of a relation notebook computer service life.Notebook computer small volume, current notebook computer
There are built-in fans, while being provided with heat emission hole by lower cover housing, when temperature is too high, radiator fan starts, and heat is passed through
Lower cover heat emission hole, which is spread in air, to be gone to realize the purpose of cooling.But current notebook computer drain pan is plane, pen when using
Note sheet and the space of institute's contact plane are smaller, are unfavorable for the radiating of notebook, the overheat of notebook computer can have a strong impact on computer
Operation, substantially reduce operating efficiency and the service life to notebook computer will also result in very big influence, generally require
It is mobile inconvenient by external heat abstractor, add use cost, while travelling or when going on business in addition in-convenience in use,
And existing heat abstractor service life is not long and radiating effect is also and bad.
Utility model content
The purpose of utility model：The utility model discloses a kind of notebook host lower cover of high radiating, Neng Gou great
The radiating of big improvement notebook computer, improves the speed of service of notebook computer, greatly improves making for operating efficiency and computer
Use the life-span.
Technical scheme：In order to realize the above object the utility model discloses a kind of notebook host of high radiating
Lower cover, including main frame lower cover body, heat sink, battery neck, display screen neck, semiconductor chilling plate, power-line plug insert
Hole, USB interface, netting twine jack, USB jack, sender, CD-ROM drive neck, earphone jack, microphone jack, the heat sink connects
The main frame lower cover body is connected on, the battery neck is arranged on the front end of the main frame lower cover body, the radiating front edge of board
The close battery neck simultaneously has spacing, and the two ends of the battery neck are symmetrically arranged with the display screen being connected together with display screen
Neck, there is a spacing between the battery neck and the display screen neck at two ends, the main frame lower cover body, be connected to main frame lower cover
Heat sink on body, is arranged on the battery neck of the main frame lower cover body front end, is symmetricly set on the battery neck two
The display screen neck being connected together with display screen at end is in same plane, and the semiconductor chilling plate is being arranged on the heat sink just
The centre in face, the jack of the power-line plug is arranged on the left side front end of the main frame lower cover body, is inserted in the power line
The jack side of head is sequentially provided with USB interface along away from the battery neck direction, and some senders, netting twine jack, USB is inserted
Hole, the opposite side of the main frame lower cover body is that the couple positioned opposite of the jack of the power-line plug has some senders, light
Drive neck, earphone jack, microphone jack, USB jack.
Further, the notebook host lower cover of above-mentioned a kind of high radiating, the heat sink front is additionally provided with temperature
Inductor, the inductor is arranged on the lower section of the semiconductor chilling plate.
Further, a kind of notebook host lower cover of above-mentioned high radiating, the heat sink material is aluminium alloy.
Further, the notebook host lower cover of above-mentioned a kind of high radiating, the hot face of the semiconductor chilling plate and
Fitted by heat conductive silica gel in the heat sink front.
Further, the notebook host lower cover of above-mentioned a kind of high radiating, the heat sink bottom surface is provided with some
Heat emission hole.
Further, the notebook host lower cover of above-mentioned a kind of high radiating, the positive corner of heat sink is provided with
Screen pack, the screen pack and the heat emission hole of the heat sink bottom surface are correspondingly arranged.
Further, the notebook host lower cover of above-mentioned a kind of high radiating, heat sink bottom surface corner is additionally provided with
Foot pad.
Further, a kind of notebook host lower cover of above-mentioned high radiating, the sender is circle, a diameter of
0.5-0.6cm。
Further, a kind of notebook host lower cover of above-mentioned high radiating, the USB jack has four, average mark
Cloth is in the both sides of the main frame lower cover body.
Above-mentioned technical proposal can be seen that the utility model and have the advantages that：One kind described in the utility model
Height radiating notebook host lower cover, heat sink front be provided with semiconductor chilling plate, the hot face of semiconductor chilling plate and dissipate
The front of hot plate is fitted by heat conductive silica gel, the heat of notebook computer is transmitted in air, while being set in heat sink bottom surface
Heat emission hole is put, further improves the radiating effect of main frame lower cover, while being arranged on heat sink bottom surface corner provided with foot pad, increases pen
Remember the space of this host computer lower cover bottom surface and institute's contact plane, further improve radiating effect, simple in construction, radiating effect is good
It is good.
Brief description of the drawings
Fig. 1 is a kind of notebook host lower cover Facad structure figure of high radiating described in the utility model；
Fig. 2 is a kind of notebook host lower cover bottom surface structure figure of high radiating described in the utility model.
In figure：1st, main frame lower cover body, 2, heat sink, 3, battery neck, 4, display screen neck, 5, semiconductor chilling plate,
6th, the jack of power-line plug, 7, multimedia line jack, 8, network cable jack, 9, USB jack, 10, sender, 11, CD-ROM drive neck,
12nd, earphone jack, 13, microphone jack, 14, temperature inductor, 15, screen pack, 16, heat emission hole, 17, foot pad.
Embodiment
Below in conjunction with the accompanying drawings, the utility model embodiment is described in detail.
Embodiment 1
A kind of notebook host lower cover of high radiating of the present utility model, including main frame lower cover body 1, heat sink 2,
Battery neck 3, display screen neck 4, semiconductor chilling plate 5, the jack 6 of power-line plug, USB interface 7, netting twine jack 8, USB
Jack 9, sender 11, CD-ROM drive neck 12, earphone jack 13, microphone jack 14, the heat sink 2 is connected under the main frame
Lid body 1, the material of heat sink 2 is aluminium alloy, and the battery neck 3 is arranged on the front end of the main frame lower cover body 1, institute
The front end of heat sink 2 is stated close to the battery neck 3 and has spacing, the two ends of the battery neck 3 are symmetrically arranged with and display screen
The display screen neck 4 being connected together, there is spacing, the main frame lower cover between the battery neck 3 and the display screen neck 4 at two ends
Body 1, the heat sink 2 being connected on main frame lower cover body, are arranged on the battery neck 3 of the main frame lower cover body front end, right
Claim the display screen neck 4 being connected together with display screen for being arranged on the battery neck two ends in same plane, the semiconductor
Cooling piece 5 is arranged on the positive centre of the heat sink 2, and the hot face and the front of the heat sink 2 of the semiconductor chilling plate 5 are logical
Heat conductive silica gel laminating is crossed, the jack 6 of the power-line plug is arranged on the left side front end of the main frame lower cover body 1, described
The side of jack 6 of power-line plug is sequentially provided with USB interface 7 along away from the direction of battery neck 3, some senders 10,
Netting twine jack 8, USB jack 9, the opposite side of the main frame lower cover body 1 is that the opposite side of the jack 6 of the power-line plug is set
It is equipped with some senders 10, CD-ROM drive neck 11, earphone jack 12, microphone jack 13, USB jack 9, the sender 10 is circle
Shape, a diameter of 0.5-0.6cm, the USB jack 9 has four, is evenly distributed in the both sides of the main frame lower cover body 1.
The front of heat sink 2 is additionally provided with temperature inductor 14, and the inductor 14 is arranged on the semiconductor chilling plate 5
Lower section, temperature sensor can timely the temperature of monitoring computer and timely control semiconductor chilling plate by excessive heat
It is transmitted in air, it is ensured that the low line low-heat of computer, reduce computer internal hardware burns out degree.
The positive corner of the heat sink 2 is provided with screen pack 15, and the bottom surface of heat sink 2 is provided with some heat emission holes 16,
The screen pack 15 and the heat emission hole 16 of the bottom surface of heat sink 2 are correspondingly arranged, and the setting of screen pack 15 has in absorption air and institute
Dust in the plane of contact, keeps the cleaning of notebook computer internal hardware, extends the service life of hardware and keeps computer
Prolonged normal operation.
The bottom surface corner of heat sink 2 is additionally provided with foot pad 17, and the setting of foot pad 17 ensures base under notebook host
Face has enough spaces with the contact plane, further improves radiating effect.
The above is only preferred embodiment of the present utility model, it should be noted that for the ordinary skill of the art
For personnel, on the premise of the utility model principle is not departed from, some improvement can also be made, these improvement also should be regarded as this
The protection domain of utility model.
Claims (9)
1. a kind of notebook host lower cover of high radiating, it is characterised in that including main frame lower cover body, heat sink, battery
Neck, display screen neck, semiconductor chilling plate, the jack of power-line plug, USB interface, netting twine jack, USB jack goes out sound
Hole, CD-ROM drive neck, earphone jack, microphone jack, the heat sink is connected to the main frame lower cover body, the battery neck
The front end of the main frame lower cover body is arranged on, the radiating front edge of board is close to the battery neck and has spacing, the battery
The two ends of neck are symmetrically arranged with the display screen card of the display screen neck being connected together with display screen, the battery neck and two ends
There is spacing between groove, the main frame lower cover body, the heat sink being connected on main frame lower cover body are arranged on the main frame lower cover
The battery neck of body front end, the display screen neck being connected together with display screen for being symmetricly set on the battery neck two ends exists
Same plane, the semiconductor chilling plate is arranged on the positive centre of the heat sink, and the jack of the power-line plug is set
In the left side front end of the main frame lower cover body, in the jack side of the power-line plug along away from the battery neck side
To being sequentially provided with USB interface, some senders, netting twine jack, USB jack, the opposite side of the main frame lower cover body is described
The couple positioned opposite of the jack of power-line plug has some senders, and CD-ROM drive neck, earphone jack, microphone jack, USB is inserted
Hole.
2. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the heat sink
Front is additionally provided with temperature inductor, and the inductor is arranged on the lower section of the semiconductor chilling plate.
3. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the heat sink
Material is aluminium alloy.
4. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the semiconductor
The hot face of cooling piece and heat sink front are fitted by heat conductive silica gel.
5. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the heat sink
Bottom surface is provided with some heat emission holes.
6. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the heat sink
Positive corner is provided with screen pack, and the screen pack and the heat emission hole of the heat sink bottom surface are correspondingly arranged.
7. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the heat sink
Bottom surface corner is additionally provided with foot pad.
8. a kind of notebook host lower cover of high radiating according to claim 1, it is characterised in that the sender
For circle, a diameter of 0.5-0.6cm.
9. the notebook host lower cover of a kind of high radiating according to claim 1, it is characterised in that the USB is inserted
Kong Yousi, it is evenly distributed in the both sides of the main frame lower cover body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620912553.9U CN206339897U (en) | 2016-08-22 | 2016-08-22 | A kind of notebook host lower cover of high radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620912553.9U CN206339897U (en) | 2016-08-22 | 2016-08-22 | A kind of notebook host lower cover of high radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206339897U true CN206339897U (en) | 2017-07-18 |
Family
ID=59300049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620912553.9U Expired - Fee Related CN206339897U (en) | 2016-08-22 | 2016-08-22 | A kind of notebook host lower cover of high radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206339897U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325388A (en) * | 2016-08-22 | 2017-01-11 | 太仓市微贯机电有限公司 | Host lower cover with performance of high heat dissipation for notebook computer |
| CN108773269A (en) * | 2018-06-10 | 2018-11-09 | 重庆三三电器股份有限公司 | A kind of intelligence TFT instrument |
-
2016
- 2016-08-22 CN CN201620912553.9U patent/CN206339897U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106325388A (en) * | 2016-08-22 | 2017-01-11 | 太仓市微贯机电有限公司 | Host lower cover with performance of high heat dissipation for notebook computer |
| CN108773269A (en) * | 2018-06-10 | 2018-11-09 | 重庆三三电器股份有限公司 | A kind of intelligence TFT instrument |
| CN108773269B (en) * | 2018-06-10 | 2023-06-23 | 重庆三三电器股份有限公司 | Intelligent TFT instrument |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170718 Termination date: 20180822 |