CN206328475U - The high-precision lead frame plating line of ultra-wide row - Google Patents
The high-precision lead frame plating line of ultra-wide row Download PDFInfo
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- CN206328475U CN206328475U CN201621257703.3U CN201621257703U CN206328475U CN 206328475 U CN206328475 U CN 206328475U CN 201621257703 U CN201621257703 U CN 201621257703U CN 206328475 U CN206328475 U CN 206328475U
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Abstract
The high-precision lead frame plating line of a kind of ultra-wide row that the utility model is related to, it includes front and rear the first electroplanting device arranged successively after（1）And second electroplanting device（2）；First covers pressure belt（1.7）It is close to the first electroplating mold（1.2）Half section of the right side, second covers pressure belt（2.7）It is close to the second electroplating mold（2.2）Half section of a left side.Traditional ultra-wide is arranged high-precision lead frame overall operation and is improved to left and right sides difference hydrojet by the utility model, and narrowing due to covering pressure belt make it that belt both sides uniform force, electroplating effect is good, will not produce Lou silver phenomenon.
Description
Technical field
The utility model is related to a kind of high-precision lead frame plating line of ultra-wide row.
Background technology
Traditional lead frame plating line may be only available for the plating of the lead frame less than the wide rows of 70mm, and reason is
The main material of belt is silica gel, and secondary material is non-rigid, and when pressure is covered in concentration progress above belt, belt both sides occur
Unbalance stress phenomenon, causes belt and product contact position fold（Such as Fig. 1）There is leakage silver so as to cause the position.Therefore seek
A kind of electroplating effect is good, and the high-precision lead frame plating line of ultra-wide row that will not produce Lou silver-colored phenomenon is particularly important.
The content of the invention
The purpose of this utility model is to overcome above-mentioned deficiency good there is provided a kind of electroplating effect, will not produce Lou silver-colored phenomenon
The high-precision lead frame plating line of ultra-wide row.
What the purpose of this utility model was realized in：
A kind of high-precision lead frame plating line of ultra-wide row, it is characterised in that what it arranged successively before and after including after
First electroplanting device and the second electroplanting device；
First electroplanting device from front to back successively include the first electroplanting device bit preamble wheel, the first electroplating mold and
Support roller and first before position wheel, the first electroplating mold that the first electroplating mold bottom is arranged before and after setting is led after first electroplanting device
Fixed the first electroplating mold anode and the first medical liquid spraying dress is provided with support roller after electroplating mold, the first electroplating mold
Put, the upper semisection of the first electroplating mold is provided with first and covers pressure belt, and first, which covers pressure belt, passes through on the first electroplating mold
Three the first belt pulleys tensioning of side, front and rear, wherein first covers half section of the right side that pressure belt is close to the first electroplating mold,
First liquid medicine ejection device is located at half section of the right side in the first electroplating mold,
Second electroplanting device from front to back successively include the second electroplanting device bit preamble wheel, the second electroplating mold and
Support roller and second before position wheel, the second electroplating mold that the second electroplating mold bottom is arranged before and after setting is led after second electroplanting device
Fixed the second electroplating mold anode and the second medical liquid spraying dress is provided with support roller after electroplating mold, the second electroplating mold
Put, the upper semisection of the second electroplating mold is provided with second and covers pressure belt, and second, which covers pressure belt, passes through on the second electroplating mold
Three the second belt pulleys tensioning of side, front and rear, wherein second covers half section of the left side that pressure belt is close to the second electroplating mold.
Second liquid medicine ejection device is located at half section of a left side in the second electroplating mold.
One the first belt pulley of top connects the first hinge bar, and the first hinge bar outer end is linked with the first balancing weight.
The stage casing of first hinge bar, which is provided with the first hanger plate, the first hanger plate, is provided with multiple first hook holes.
One the second belt pulley of top connects the second hinge bar, and the second hinge bar outer end is linked with the second balancing weight.
The stage casing of second hinge bar, which is provided with the second hanger plate, the second hanger plate, is provided with multiple second hook holes, the
Two hook holes are used to hang the second standby balancing weight.
Compared with prior art, the beneficial effects of the utility model are：
Traditional ultra-wide is arranged high-precision lead frame overall operation and is improved to left and right sides difference hydrojet by the utility model,
Due to cover pressure belt narrow cause belt both sides uniform force, electroplating effect is good, will not produce Lou silver phenomenon.
Brief description of the drawings
Fig. 1 is the side schematic view of conventional lead frame plating line.
Fig. 2 is that ultra-wide arranges high-precision lead frame plating line.
Fig. 3 is left view at Fig. 2 A.
Fig. 4 is left view at Fig. 2 B.
Wherein：
After first electroplanting device 1, the first electroplanting device bit preamble wheel 1.1, the first electroplating mold 1.2, the first electroplanting device
Lead position and take turns before the 1.3, first electroplating mold support roller 1.5 after support roller 1.4, the first electroplating mold, the first electroplating mold anode 1.6, the
One covers pressure belt 1.7, the first belt pulley 1.8, the first hinge bar 1.9, the first balancing weight 1.10, the first liquid medicine ejection device
1.11st, the first hanger plate 1.12
After second electroplanting device 2, the second electroplanting device bit preamble wheel 2.1, the second electroplating mold 2.2, the second electroplanting device
Lead position and take turns before the 2.3, second electroplating mold support roller 2.5 after support roller 2.4, the second electroplating mold, the second electroplating mold anode 2.6, the
Two cover pressure belt 2.7, the second belt pulley 2.8, the second hinge bar 2.9, the second balancing weight 2.10, the second liquid medicine ejection device
2.11st, the second hanger plate 2.12
The high-precision lead frame 3 of ultra-wide row.
Embodiment
Referring to Fig. 2-Fig. 4, the high-precision lead frame plating line of a kind of ultra-wide row that the utility model is related to, it includes
Front and rear the first electroplanting device 1 and the second electroplanting device 2 arranged successively after；
First electroplanting device 1 includes the first electroplanting device bit preamble wheel 1.1, the first electroplating mold successively from front to back
1.2 and first lead position wheel 1.3 after electroplanting device, the bottom of the first electroplating mold 1.2 set before and after arrangement the first electroplating mold
The first fixed electroplating mold is provided with support roller 1.5 after the preceding electroplating mold of support roller 1.4 and first, the first electroplating mold 1.2
The liquid medicine ejection device 1.11 of anode 1.6 and first, the upper semisection of the first electroplating mold 1.2 is provided with first and covers pressure belt 1.7,
First, which covers pressure belt 1.7, passes through three the first belt pulleys 1.8 positioned at the top of the first electroplating mold 1.2, front and rear
Tightly, first belt pulley 1.8 of top connects the first hinge bar 1.9, and the outer end of the first hinge bar 1.9 is linked with the first balancing weight
1.10, the stage casing of the first hinge bar 1.9, which is provided with the first hanger plate 1.12, the first hanger plate, is provided with multiple first hooks
Hole, the first hook hole is used to hang the first standby balancing weight 1.10.Wherein first, which covers pressure belt 1.7, is close to the first electroplating mold
Half section of 1.2 right side.First liquid medicine ejection device 1.11 is located at half section of the right side in the first electroplating mold 1.2.
Second electroplanting device 2 includes the second electroplanting device bit preamble wheel 2.1, the second electroplating mold successively from front to back
2.2 and second lead position wheel 2.3 after electroplanting device, the bottom of the second electroplating mold 2.2 set before and after arrangement the second electroplating mold
The second fixed electroplating mold is provided with support roller 2.5 after the preceding electroplating mold of support roller 2.4 and second, the second electroplating mold 2.2
The liquid medicine ejection device 2.11 of anode 2.6 and second, the upper semisection of the second electroplating mold 2.2 is provided with second and covers pressure belt 2.7,
Second, which covers pressure belt 2.7, passes through three the second belt pulleys 2.8 positioned at the top of the second electroplating mold 2.2, front and rear
Tightly, second belt pulley 2.8 of top connects the second hinge bar 2.9, and the outer end of the second hinge bar 2.9 is linked with the second balancing weight
2.10, the stage casing of the second hinge bar 2.9, which is provided with the second hanger plate 2.12, the second hanger plate, is provided with multiple second hooks
Hole, the second hook hole is used to hang the second standby balancing weight 2.10.Wherein second, which covers pressure belt 2.7, is close to the second electroplating mold
Half section of 2.2 left side.Second liquid medicine ejection device 2.11 is located at half section of a left side in the second electroplating mold 2.2.
A kind of production technology of the high-precision lead frame plating line of ultra-wide row：
The high-precision lead frame 3 of ultra-wide row enters passes sequentially through the first electroplanting device 1 and the second plating dress from front to back
Put 2；
The high-precision lead frame of ultra-wide row is first by 1 pair of right section of progress spray drug operation of the first electroplanting device, and ultra-wide row is high
Precision lead frame is when by the first electroplanting device 1, the lower surface and the first electroplating mold of the high-precision lead frame of ultra-wide row
1.2 surfaces are contacted, and right section of the upper surface of the high-precision lead frame of ultra-wide row is covered pressure belt 1.7 with first and contacted so that ultra-wide is arranged
Right section of high-precision lead frame can be covered the suitable pressure of pressure belt 1.7 to compression by the first electroplating mold 1.2 and first,
So as to which ultra-wide arranges right section of uniform force of high-precision lead frame, right section of product is not in leakage silver, while the first medical liquid spraying
Device 1.11 arranges ultra-wide right section of progress spray drug operation of lower surface of high-precision lead frame；
The high-precision lead frame of ultra-wide row is then by 2 pairs of left section of progress spray drug operations of the second electroplanting device, and ultra-wide row is high
Precision lead frame is when by the second electroplanting device 2, the lower surface and the second electroplating mold of the high-precision lead frame of ultra-wide row
2.2 surfaces are contacted, and left section of the upper surface of the high-precision lead frame of ultra-wide row is covered pressure belt 2.7 with second and contacted so that ultra-wide is arranged
Left section of high-precision lead frame can be covered the suitable pressure of pressure belt 2.7 to compression by the second electroplating mold 2.2 and second,
So as to which ultra-wide arranges left section of uniform force of high-precision lead frame, left section of product is not in leakage silver, while the second medical liquid spraying
Device 2.11 arranges ultra-wide left section of progress spray drug operation of lower surface of high-precision lead frame；
The high-precision lead frame of the ultra-wide row spray drug operation overall by having completed product after the second electroplanting device 2.
The parameters of the production technology of the above-mentioned high-precision lead frame plating line of ultra-wide row are as follows：
Ultra-wide row high-precision lead frame gait of march 2.2-3m/min, first covers pressure belt 1.7 and second covers pressure skin
It is 150-160N with 2.7 pressure, the medical liquid spraying amount of the liquid medicine ejection device 2.11 of liquid medicine ejection device 1.11 and second is
120-200L/min。
Claims (5)
1. a kind of high-precision lead frame plating line of ultra-wide row, it is characterised in that it include it is front and rear arranged successively after the
One electroplanting device（1）And second electroplanting device（2）；
First electroplanting device（1）Include the first electroplanting device bit preamble wheel successively from front to back（1.1）, the first electroplating mold
（1.2）And first lead position wheel after electroplanting device（1.3）, the first electroplating mold（1.2）The first electricity that bottom is arranged before and after setting
Plate support roller before mould（1.4）And first support roller after electroplating mold（1.5）, the first electroplating mold（1.2）Inside it is provided with fixed
First electroplating mold anode（1.6）And first liquid medicine ejection device（1.11）, the first electroplating mold（1.2）Upper semisection set
There is first to cover pressure belt（1.7）, first covers pressure belt（1.7）By positioned at the first electroplating mold（1.2）Top, front and after
Three the first belt pulleys of side（1.8）Tensioning, wherein first covers pressure belt（1.7）It is close to the first electroplating mold（1.2）Right half
Section, the first liquid medicine ejection device（1.11）Positioned at the first electroplating mold（1.2）Half section of the interior right side,
Second electroplanting device（2）Include the second electroplanting device bit preamble wheel successively from front to back（2.1）, the second electroplating mold
（2.2）And second lead position wheel after electroplanting device（2.3）, the second electroplating mold（2.2）The second electricity that bottom is arranged before and after setting
Plate support roller before mould（2.4）And second support roller after electroplating mold（2.5）, the second electroplating mold（2.2）Inside it is provided with fixed
Second electroplating mold anode（2.6）And second liquid medicine ejection device（2.11）, the second electroplating mold（2.2）Upper semisection set
There is second to cover pressure belt（2.7）, second covers pressure belt（2.7）By positioned at the second electroplating mold（2.2）Top, front and after
Three the second belt pulleys of side（2.8）Tensioning, wherein second covers pressure belt（2.7）It is close to the second electroplating mold（2.2）Left half
Section, the second liquid medicine ejection device（2.11）Positioned at the second electroplating mold（2.2）Half section of an interior left side.
2. a kind of high-precision lead frame plating line of ultra-wide row according to claim 1, it is characterised in that top
One the first belt pulley（1.8）Connect the first hinge bar（1.9）, the first hinge bar（1.9）Outer end is linked with the first balancing weight
（1.10）.
3. a kind of high-precision lead frame plating line of ultra-wide row according to claim 2, it is characterised in that the first hinge
Extension bar（1.9）Stage casing be provided with the first hanger plate（1.12）, multiple first hook holes are provided with the first hanger plate.
4. a kind of high-precision lead frame plating line of ultra-wide row according to claim 1, it is characterised in that top
One the second belt pulley（2.8）Connect the second hinge bar（2.9）, the second hinge bar（2.9）Outer end is linked with the second balancing weight
（2.10）.
5. a kind of high-precision lead frame plating line of ultra-wide row according to claim 4, it is characterised in that the second hinge
Extension bar（2.9）Stage casing be provided with the second hanger plate（2.12）, multiple second hook holes are provided with the second hanger plate, second hangs
Dog hole is used to hang the second standby balancing weight（2.10）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621257703.3U CN206328475U (en) | 2016-11-23 | 2016-11-23 | The high-precision lead frame plating line of ultra-wide row |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621257703.3U CN206328475U (en) | 2016-11-23 | 2016-11-23 | The high-precision lead frame plating line of ultra-wide row |
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| Publication Number | Publication Date |
|---|---|
| CN206328475U true CN206328475U (en) | 2017-07-14 |
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ID=59287970
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621257703.3U Active CN206328475U (en) | 2016-11-23 | 2016-11-23 | The high-precision lead frame plating line of ultra-wide row |
Country Status (1)
| Country | Link |
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| CN (1) | CN206328475U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106400091A (en) * | 2016-11-23 | 2017-02-15 | 江阴康强电子有限公司 | Ultra-wide-row and high-precision lead frame electroplating assembly line and production technology thereof |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
-
2016
- 2016-11-23 CN CN201621257703.3U patent/CN206328475U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106400091A (en) * | 2016-11-23 | 2017-02-15 | 江阴康强电子有限公司 | Ultra-wide-row and high-precision lead frame electroplating assembly line and production technology thereof |
| CN108385145A (en) * | 2018-05-24 | 2018-08-10 | 中山品高电子材料有限公司 | Multi-row lead frame frame electroplating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211009 Address after: No. 988, Jinyuan Road, Yinzhou investment and entrepreneurship center, Ningbo City, Zhejiang Province, 315105 Patentee after: NINGBO KANGQIANG ELECTRONICS Co.,Ltd. Address before: 214434 No. 3, Dongding Road, Jiangyin Economic Development Zone, Wuxi City, Jiangsu Province Patentee before: JIANGYIN KANGQIANG ELECTRONIC Co.,Ltd. |
|
| TR01 | Transfer of patent right |