CN206282300U - A kind of fingerprint cover plate module - Google Patents
A kind of fingerprint cover plate module Download PDFInfo
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- CN206282300U CN206282300U CN201620827272.3U CN201620827272U CN206282300U CN 206282300 U CN206282300 U CN 206282300U CN 201620827272 U CN201620827272 U CN 201620827272U CN 206282300 U CN206282300 U CN 206282300U
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- fingerprint
- cover plate
- layer
- grating
- plate module
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Abstract
The utility model discloses a kind of fingerprint cover plate module, is related to technical field of semiconductor encapsulation.The fingerprint cover plate module includes Grating glass and the fingerprint chip for recognizing fingerprint, and wherein Grating glass includes glass cover-plate, and the one side of glass cover-plate is provided with grating layer, and another side is fitted by glue layer with fingerprint chip；Grating layer includes lighttight non-metal optical gate layer, and the back side of fingerprint chip is provided with silicon hole and reroutes layer.The utility model has greatly enriched the color selection space of grating layer, the matching of fingerprint cover plate module and mobile phone faceplate is effectively increased, while simplifying the manufacturing process of fingerprint cover plate module.
Description
Technical field
The utility model is related to technical field of semiconductor encapsulation, more particularly to a kind of fingerprint cover plate module.
Background technology
With the development of science and technology fingerprint identification function is increasingly paid close attention to by people, and it is widely used in mobile phone, shooting
The fields such as head, display device.Grating glass in existing fingerprint cover plate module, is typically kept off using lighttight metal as grating
Photosphere, then etches aperture using photoetching process.Grating glass color is relatively simple obtained in this mode, causes to produce
The fingerprint cover plate color preference for coming is few, and the matching with mobile phone faceplate is poor.In addition, the preparation method of existing fingerprint cover plate module
It is：Done on full wafer chip wafer and swelled or protection ring, afterwards by single single attaching (or embedding attached) of Grating glass in chip
Above.For this kind of mode, swelled or protection ring due to needing to be done on chip wafer, and need to carry out cutting twice
(Grating glass being cut into single for the first time, the full wafer wafer that Grating glass will be posted for the second time cuts into single module), its
Processing step is cumbersome, and cost of manufacture is higher.
Utility model content
Based on the above, the purpose of this utility model is to propose a kind of fingerprint cover plate module, to solve existing fingerprint
Cover plate module color is single, the problem poor with mobile phone matching.
It is that, up to this purpose, the utility model is adopted the following technical scheme that：
A kind of fingerprint cover plate module, including Grating glass and the fingerprint chip for recognizing fingerprint, the Grating glass bag
Glass cover-plate is included, the one side of the glass cover-plate is provided with grating layer, and another side is fitted by glue layer with the fingerprint chip；
The grating layer includes lighttight non-metal optical gate layer, and the back side of the fingerprint chip is provided with silicon hole and reroutes layer.
Used as a kind of preferred scheme of fingerprint cover plate module, the non-metal optical gate layer is photoetching ink or photoresist.
Used as a kind of preferred scheme of fingerprint cover plate module, the grating layer also includes metal grating layer, the metal light
Gate layer is located between the glass cover-plate and the non-metal optical gate layer.
As a kind of preferred scheme of fingerprint cover plate module, the color of the non-metal optical gate layer and the color of mobile phone faceplate
It is adapted.
As a kind of preferred scheme of fingerprint cover plate module, grating aperture is offered on the grating layer, the grating is small
Being shaped as hole be circular, square or ellipse.
Used as a kind of preferred scheme of fingerprint cover plate module, being shaped as the fingerprint cover plate module is circular, square or ellipse
It is circular.
The beneficial effects of the utility model are：
The utility model has greatly enriched grating layer by setting lighttight non-metal optical gate layer on glass cover-plate
Color selects space, effectively increases the matching of fingerprint cover plate module and mobile phone faceplate；Referred to by being fitted on Grating glass
Line chip, and silicon hole is set on fingerprint chip and layer is rerouted, the packaging technology of fingerprint cover plate module is simplified, save significantly
About manpower and materials, improve production efficiency, reduce manufacturing cost.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the utility model embodiment, below will be to the utility model embodiment
The accompanying drawing to be used needed for description is briefly described, it should be apparent that, drawings in the following description are only new this practicality
Some embodiments of type, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other accompanying drawings are obtained according to the content and these accompanying drawings of the utility model embodiment.
Fig. 1 is the structural representation of the fingerprint cover plate module that the utility model embodiment one is provided；
Fig. 2 is the preparation method flow chart of the fingerprint cover plate module that the utility model embodiment two is provided.
In figure：
1st, glass cover-plate；2nd, fingerprint chip；3rd, non-metal optical gate layer；4th, glue layer；5th, silicon hole and rewiring layer；6th, gold
Category grating layer.
Specific embodiment
It is that the technical problem for solving the utility model, the technical scheme for using and the technique effect for reaching are clearer,
The technical scheme of the utility model embodiment is described in further detail below in conjunction with accompanying drawing, it is clear that described reality
Example only a part of embodiment of the utility model is applied, rather than whole embodiments.Based on the embodiment in the utility model,
The every other embodiment that those skilled in the art are obtained under the premise of creative work is not made, belongs to this practicality new
The scope of type protection.
Embodiment one
Present embodiments provide a kind of preferred fingerprint cover plate module, with solve existing fingerprint cover plate module color it is single,
The problem poor with mobile phone faceplate matching.As shown in figure 1, the fingerprint cover plate module includes glass cover-plate 1, the one of glass cover-plate 1
Face is disposed with metal grating layer 6 and non-metal optical gate layer 3, and another side is coated with glue layer 4, finger is pasted with glue layer 4
Line chip 2, the back side of fingerprint chip 2 is provided with silicon hole and reroutes layer 5.Herein, lighttight metal grating layer 6 is by splashing
The method penetrated is coated uniformly on glass cover-plate 1, and then lighttight non-metal optical gate layer 3 is coated by the technique of surface spin coating
In metal grating layer 6.Grating aperture is etched with by photoetching process in metal grating layer 6 and non-metal optical gate layer 3, is used for
The identification function of fingerprint cover plate module is realized by optical principle.Here metal grating layer 6 is collectively formed with non-metal optical gate layer 3
The fingerprint cover plate module grating layer, wherein the non-transparency of metal grating layer 6 is good, structural strength is high, easy to process, is conducive to
Improve the total quality of fingerprint cover plate module；Rather than the material of metal grating layer 3 can for photoetching ink, photoresist etc., due to
The various colors of nonmetallic materials are various, impart the bigger color selection space of fingerprint cover plate module, substantially improve fingerprint lid
Template die group and the matching degree of mobile phone faceplate color, make the outward appearance of mobile phone more attractive, generous.Certainly, grating layer of the present utility model
Non-metal optical gate layer 3 can also be only set, and be not provided with metal grating layer 6, so its structure is simpler, can equally improve and refer to
The matching degree of line cover plate module and mobile phone faceplate, but structural strength is lower slightly compared with the former.
The utility model just forms Grating glass after the one side of glass cover-plate 1 makes grating layer, then in grating
The another side of glass uniformly coats transparent glue layer 4, and will be used to recognize that the fingerprint chip 2 of fingerprint affixes to glue layer 4,
The fingerprint cover plate module has just been obtained after glue is dry.The back of above-mentioned fingerprint chip 2 is provided with silicon hole and reroutes layer, with
Realize that the front weld pad of fingerprint chip 2 is rerouted to the back side；Meanwhile, the back of fingerprint chip 2 has also made and pcb board weld pad size
The salient point for matching, in order to and connection mutually compatible with pcb board.
Further, the shape of the grating aperture opened on above-mentioned grating layer can be circular, square, oval or other
Shape, the present embodiment preferably using circular aperture, circular aperture relative to the square aperture on common grating, with more preferable
Imaging effect, improves the recognition capability of fingerprint cover plate module.
Embodiment two
As shown in Fig. 2 the present embodiment proposes a kind of preparation method of preferred fingerprint cover plate module, the method includes following
Step：
A, making full wafer Grating glass：Prepare full wafer glass cover-plate, and full wafer glass cover-plate one side uniformly coat not
The non-metallic layer of printing opacity, the non-metallic layer that then will need transmission region using photoetching process is etched away, so as in full wafer glass
Grating layer is made on cover plate；
Preferably, the grating layer of the present embodiment also includes the metal light being arranged between non-metal optical gate layer and glass cover-plate
Gate layer, therefore the step specifically includes three below sub-step：
A1, preparation full wafer glass cover-plate, sputter or one layer of lighttight metal level of evaporation on full wafer glass cover-plate；
A2, the one layer of lighttight non-metallic layer of surface spin coating or spraying in metal level；
Here, the equipment that spin coating proceeding is used is spin coating instrument sol evenning machine, and the spin coating instrument sol evenning machine is revolved by the high speed of board
Turn, nonmetallic materials can be evenly distributed on the surface of full wafer glass cover-plate.Non-metallic layer in uniform thickness, substantially improves finger
The laminating effect of line chip, improves the flatness of fingerprint cover plate module.
A3, the non-metallic layer and metal level of transmission region will be needed to etch away using photoetching process, so as in full wafer glass
Grating layer is made on cover plate.
B, laminating full wafer wafer：Glue layer is uniformly coated in the another side of full wafer Grating glass, and by full wafer wafer alignment
Fit on full wafer Grating glass, while slightly being pressed；
C, the pressing of full wafer wafer：Above-mentioned full wafer wafer and full wafer Grating glass are pressed, makes full wafer wafer and full wafer
Grating glass is forever bonded together；
Herein, by the way of the conjunction of whole face pressure, press equipment is greatlyd save, improves the assembling effect of fingerprint cover plate module
Rate.
D, wafer level packaging：The back side of full wafer wafer is packaged using silicon hole and rewiring technique, forms full wafer lid
Template die group；
E, cutting：According to the shape and size of customer requirement, using laser or mechanical cutting techniques to full wafer cover plate mould
Group is cut, and obtains single fingerprint cover plate module.Preferably, single cover plate module is shaped as circle in the present embodiment, when
Can also be so square, oval etc. in the case of other.
Further, step F and step G is additionally provided with after step E, it is as follows：
F, the edge to single fingerprint cover plate module are ground, rebuild；
G, SMT flows are carried out to single fingerprint cover plate module.
Here SMT flows refer to surface installation technique, and it includes silk-screen, attachment, reflow soldering, cleaning, detects and return
The step such as repair.
The present embodiment is for existing fingerprint cover plate module processing step is complicated, high cost and design, full wafer is brilliant in the method
Need not be done on circle and swelled or protection ring, but full wafer Grating glass and full wafer wafer glue are forever bonded together,
After doing the packaging technology of complete slice wafer, it is only necessary to once cut and can just obtain single fingerprint cover plate module.The present embodiment is operated
Simply, conveniently, the processing step of fingerprint cover plate module is greatlyd save, the cost of manufacture of product is reduced, is conducive to promoting and is answered
With.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Those skilled in the art's meeting
Understand, the utility model is not limited to specific embodiment described here, can carry out for a person skilled in the art various bright
Aobvious change, readjust and substitute without departing from protection domain of the present utility model.Therefore, although by above example
The utility model is described in further detail, but the utility model is not limited only to above example, is not departing from
In the case that the utility model is conceived, more other Equivalent embodiments can also be included, and scope of the present utility model is by appended
Right determine.
Claims (6)
1. a kind of fingerprint cover plate module, including Grating glass and the fingerprint chip (2) for recognizing fingerprint, it is characterised in that institute
Stating Grating glass includes glass cover-plate (1), and the one side of the glass cover-plate (1) is provided with grating layer, and another side passes through glue layer (4)
Fitted with the fingerprint chip (2)；The grating layer includes lighttight non-metal optical gate layer (3), the fingerprint chip (2)
The back side be provided with silicon hole and reroute layer (5).
2. fingerprint cover plate module according to claim 1, it is characterised in that the non-metal optical gate layer (3) is photoetching oil
Ink or photoresist.
3. fingerprint cover plate module according to claim 2, it is characterised in that the grating layer also includes metal grating layer
(6), the metal grating layer (6) is between the glass cover-plate (1) and the non-metal optical gate layer (3).
4. the fingerprint cover plate module according to any one of claims 1 to 3, it is characterised in that the non-metal optical gate layer (3)
Color be adapted with the color of mobile phone faceplate.
5. fingerprint cover plate module according to claim 1, it is characterised in that grating aperture is offered on the grating layer,
The grating aperture is shaped as circular, square or ellipse.
6. fingerprint cover plate module according to claim 1, it is characterised in that the fingerprint cover plate module is shaped as circle
Shape, square or ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620827272.3U CN206282300U (en) | 2016-08-02 | 2016-08-02 | A kind of fingerprint cover plate module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620827272.3U CN206282300U (en) | 2016-08-02 | 2016-08-02 | A kind of fingerprint cover plate module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206282300U true CN206282300U (en) | 2017-06-27 |
Family
ID=59084236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620827272.3U Withdrawn - After Issue CN206282300U (en) | 2016-08-02 | 2016-08-02 | A kind of fingerprint cover plate module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206282300U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106096594A (en) * | 2016-08-02 | 2016-11-09 | 苏州科阳光电科技有限公司 | A kind of fingerprint cover plate module and preparation method thereof |
-
2016
- 2016-08-02 CN CN201620827272.3U patent/CN206282300U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106096594A (en) * | 2016-08-02 | 2016-11-09 | 苏州科阳光电科技有限公司 | A kind of fingerprint cover plate module and preparation method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215131, No. 568, Fang Qiao Road, Lake Industrial Park, Xiangcheng Economic Development Zone, Jiangsu, Suzhou Patentee after: Suzhou Keyang Semiconductor Co.,Ltd. Address before: 215131, No. 568, Fang Qiao Road, Lake Industrial Park, Xiangcheng Economic Development Zone, Jiangsu, Suzhou Patentee before: SUZHOU KEYANG PHOTOELECTRIC SCIENCE & TECHNOLOGY Co.,Ltd. |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170627 Effective date of abandoning: 20221021 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20170627 Effective date of abandoning: 20221021 |