CN206273834U - A kind of multi-source co-evaporates the soaking plate of equipment evaporation source - Google Patents

A kind of multi-source co-evaporates the soaking plate of equipment evaporation source Download PDF

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Publication number
CN206273834U
CN206273834U CN201621466828.7U CN201621466828U CN206273834U CN 206273834 U CN206273834 U CN 206273834U CN 201621466828 U CN201621466828 U CN 201621466828U CN 206273834 U CN206273834 U CN 206273834U
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China
Prior art keywords
source
nozzle
evaporates
plate
evaporation source
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CN201621466828.7U
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Inventor
罗明新
任宇航
詹华昭
林峰
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Zhejiang Shang Yue New Energy Development Co Ltd
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Zhejiang Shang Yue New Energy Development Co Ltd
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Abstract

The utility model includes even heat plate and nozzle, and described even heat plate includes obverse and reverse upward;Described front is provided with the groove coordinated with heater strip, and at least one is provided with the middle of described groove is used to evaporate the nozzle of line;The Way out of described nozzle is upward.Devising a kind of makes evaporation source liquid level thermal field without gradient, the more optimal soaking plate that equipment evaporation source is co-evaporated for multi-source of evaporation line distribution stable and uniform, coating effects.

Description

A kind of multi-source co-evaporates the soaking plate of equipment evaporation source
Technical field
The soaking plate of equipment evaporation source is co-evaporated the present invention relates to technical field of vacuum plating, more particularly to a kind of multi-source.
Background technology
Vacuum coating technology is that one kind is in a vacuum evaporated metal, alloy or compound(Or sputtering), it is sunk Product is in coated object(Claim substrate, substrate or matrix)On technology.Plated film side employed in current vacuum coating technology Method mainly has vacuum evaporation coating, vacuum sputtering plating, vacuum ion plating, the plating of line deposition and molecular beam epitaxy and chemical vapor heavy Product plating etc. is various.Vacuum evaporation, sputtering plating, ion plating are generally called physical vapour deposition (PVD)(Physical Vapor Deposition)Technology, abbreviation PVD technologies.Correspondingly be chemical vapor deposition(Chemical Vapor Deposition)Technology, abbreviation CVD technology.
Vacuum evaporation coating is using membrane material heater(Claim evaporation source)Heat energy, under vacuum, make membrane material atom Depend on warm-up movement to escape membrane material surface, and deposit to a kind of deposition technique that substrate surface gets on.Evaporation source presses its mode of heating Electric resistor heating type, electron beam heated type, LASER HEATING formula, hollow hot cathode plasma electric beamlet formula and induction heating type can be divided into Deng.Evaporation coating, with sedimentation rate higher, can be coated with simple substance and be difficult thermal decomposition compared with other vacuum coating methods Compound film, can operate with photovoltaic cell, LED or OLED show, the field such as optical element.
At present, existing evaporation source is general loads in crucible evaporation material, by the electricity for surrounding or being fitted in crucible periphery Resistance heater strip is heated to the evaporation material in crucible, and at high temperature, the atom or molecule of material gasify from coating materials surface evaporation And escape, steam is formed in a vacuum chamber and is spread to space, uniformly evaporated by the single or multiple evaporation apertures on crucible top On substrate surface on the upside of to crucible, substrate surface is finally deposited to, attachment condenses or occurs chemical reaction and is grown to serve as film. Thus, temperature is influence evaporation source line, further a key factor of influence thin film deposition;However, in heating process Because in the prior art, the heat fluctuation and temperature distributing disproportionation of resistance heating wire are even, make evaporation source that heat is produced on same liquid level Field gradient, influence evaporation line distribution, causes deposited uneven film thickness even.In multi-source coevaporation system, also Elemental constituent can be caused not meet stoichiometric proportion, functional film layer is lost due property.How in evaporation coating techniques Evaporation source liquid level thermal field is kept without gradient, evaporation line distribution stable and uniform, there is presently no reliable technical scheme.
The content of the invention
The present invention in order to solve the above-mentioned problems in the prior art, devise one kind can make evaporation source liquid level thermal field without Gradient, evaporation line distribution stable and uniform, the more optimal soaking plate that equipment evaporation source is co-evaporated for multi-source of coating effects.
The present invention includes even heat plate and nozzle, and described even heat plate includes obverse and reverse upward;Described front sets There is the groove coordinated with heater strip, at least one is provided with the middle of described groove is used to evaporate the nozzle of line;Described nozzle Way out upward.
Preferably, described bottom portion of groove is smooth.
Preferably, described even heat plate reverse side is provided with spacing raised line.Described spacing raised line is near oval so that with Crucible inward flange is brought into close contact.
Preferably, described even heat plate, nozzle and spacing raised line are integrally formed by Heat Conduction Material.
Preferably, the number of described even heat plate top nozzle is one.
Preferably, the number of described even heat plate top nozzle is multiple.
Preferably, described even heat plate top nozzle is in uniform arrangement.
Prior art is compared to, the present invention sets soaking plate between heater strip and crucible so that the temperature of heater strip Uniformly conducted by soaking plate.Front of the invention is provided with the groove with nozzle, and described groove is used to heater strip, just Fitted with heater strip in the present invention.Reverse side of the invention is provided with nearly oval spacing raised line.Described spacing raised line is not only For limiting displacement of the present invention relative to crucible, and play a part of stabilization thermal field.After after the present invention, evaporation can be made Liquid level thermal field is distributed stable and uniform without gradient, evaporation line, and coating film thickness uniformity and component uniformity are more preferable.
Brief description of the drawings
Fig. 1 is the structural representation of single hole even heat plate of the present invention.
Fig. 2 is the rearview of single hole even heat plate reverse side of the present invention.
Fig. 3 is the structure principle chart of the single hole heater strip matched with Fig. 1 of the present invention.
Fig. 4 is the explosive view that is combined with heater strip of three hole soaking plates of the embodiment of the present invention two.
Fig. 5 is the structure principle chart for holding evaporation material crucible.
1st, even heat plate, 2, groove, 3, nozzle, 4, spacing raised line.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and examples, but protection scope of the present invention is not limited to This.
Reference picture 1-5, the present invention includes even heat plate 1 and nozzle 3, and described even heat plate 1 includes front upward and down Reverse side;Described front is provided with the groove 2 coordinated with heater strip, and at least one is provided with the middle of described groove 2 for evaporating The nozzle 3 of line;The Way out of described nozzle 3 is upward.The described bottom of groove 2 is smooth.The described reverse side of even heat plate 1 sets Limited location raised line 4.Described even heat plate 1, nozzle 3 and spacing raised line 4 are integrally formed by Heat Conduction Material.On described even heat plate 1 The number of nozzle 3 is one.The number of the described top nozzle 3 of even heat plate 1 is multiple.The described top nozzle 3 of even heat plate 1 is in uniform Arrangement.
The present invention provides two kinds of embodiments, is used to be illustrated technology contents, but be not limited only to this kind of form.
Embodiment one, Fig. 1 is the structural representation of single hole even heat plate of the present invention.Fig. 2 is single hole even heat plate reverse side of the present invention Rearview.Fig. 3 is the structure principle chart of the single hole heater strip matched with Fig. 1 of the present invention.It is the described top nozzle 3 of even heat plate 1 Number be the situation of, it is adaptable to situation when dry pot size is smaller.
Embodiment two, Fig. 4 is the explosive view that is combined with heater strip of three hole soaking plates of the embodiment of the present invention two.Described is even The number of the top nozzle 3 of hot plate 1 is multiple, in evenly distributed between three nozzles 3, so that the molecule or atom that are escaped from nozzle 3 Reach uniform effect.
The implementation method of embodiment one and embodiment two:Evaporation material is loaded in crucible, by the present invention installed in crucible At opening, described spacing raised line 4 is brought into close contact with the opening inward flange of crucible.Allow nozzle 3 to pass through the hole of heater strip, will heat Silk is snugly placed on described groove 2, and heater strip is transferred thermal energy in described even heat plate 1 by groove 2, described Even heat plate 1 is uniformly heated up to the evaporation material in crucible.At a certain temperature, the original on surface is expected in evaporation in a vacuum chamber Son or molecule gasify and escape, and are evaporated on the substrate surface on the upside of crucible by the nozzle 3 on even heat plate 1, last uniform heavy To substrate surface, attachment condenses product or generation chemical reaction grows into functional film layer.
The heating electrode on the top of the soaking plate 1(Soaking plate upper diagram 4)Can ensure that heating source is heated evenly in crucible.
It is all not add special instruction in described above, using technological means of the prior art.

Claims (7)

1. a kind of multi-source co-evaporates the soaking plate of equipment evaporation source, including even heat plate(1), described even heat plate(1)Including upward Front and reverse side directed downwardly;Characterized in that, described front is provided with the groove coordinated with heater strip(2), described groove (2)Centre is provided with least one is used to evaporate the nozzle of line(3);Described nozzle(3)Way out upward.
2. a kind of multi-source according to claim 1 co-evaporates the soaking plate of equipment evaporation source, it is characterised in that:Described is recessed Groove(2)Bottom is smooth.
3. a kind of multi-source according to claim 1 co-evaporates the soaking plate of equipment evaporation source, it is characterised in that:Described is even Hot plate(1)Reverse side is provided with spacing raised line(4).
4. a kind of multi-source according to claim 1 co-evaporates the soaking plate of equipment evaporation source, it is characterised in that:Described is even Hot plate(1), nozzle(3)With spacing raised line(4)It is integrally formed by Heat Conduction Material.
5. a kind of multi-source according to claim 1 co-evaporates the soaking plate of equipment evaporation source, it is characterised in that:Described is even Hot plate(1)Top nozzle(3)Number be one.
6. a kind of multi-source according to claim 1 co-evaporates the soaking plate of equipment evaporation source, it is characterised in that:Described is even Hot plate(1)Top nozzle(3)Number be multiple.
7. a kind of multi-source according to claim 6 co-evaporates the soaking plate of equipment evaporation source, it is characterised in that:Described is even Hot plate(1)Top nozzle(3)In uniform arrangement.
CN201621466828.7U 2016-12-29 2016-12-29 A kind of multi-source co-evaporates the soaking plate of equipment evaporation source Active CN206273834U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621466828.7U CN206273834U (en) 2016-12-29 2016-12-29 A kind of multi-source co-evaporates the soaking plate of equipment evaporation source

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CN201621466828.7U CN206273834U (en) 2016-12-29 2016-12-29 A kind of multi-source co-evaporates the soaking plate of equipment evaporation source

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CN206273834U true CN206273834U (en) 2017-06-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112609160A (en) * 2020-12-29 2021-04-06 尚越光电科技股份有限公司 Evaporation source heating structure of CIGS co-evaporation method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112609160A (en) * 2020-12-29 2021-04-06 尚越光电科技股份有限公司 Evaporation source heating structure of CIGS co-evaporation method

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