CN206270979U - Chip pick-up and test combined mechanism - Google Patents
Chip pick-up and test combined mechanism Download PDFInfo
- Publication number
- CN206270979U CN206270979U CN201621061784.XU CN201621061784U CN206270979U CN 206270979 U CN206270979 U CN 206270979U CN 201621061784 U CN201621061784 U CN 201621061784U CN 206270979 U CN206270979 U CN 206270979U
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- test
- valve element
- combined mechanism
- chip pick
- suction nozzle
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Abstract
The utility model discloses a kind of chip pick-up and test combined mechanism; including connecting plate, retainer ring, suction nozzle, test mould and push valve element; the connecting plate has inner chamber; the fixed ring seals ground is fixed in the inner chamber; the suction nozzle is fixed on the lower end of the retainer ring; the valve element that pushes slidably is socketed in the through hole of the retainer ring; slidably and in being placed in gap in the suction nozzle and being fixedly connected with the lower end for pushing valve element, the centre bore for pushing valve element is connected the test mould with the suction nozzle and vacuum source respectively；The cavity pushed between valve element and the connecting plate is connected with pressure gas source.The utility model chip pick-up and test combined mechanism have the advantages that automatic test, improve production efficiency, test result stabilization.
Description
Technical field
The utility model is related to a kind of suction nozzle body, more particularly to a kind of chip pick-up and test combined mechanism.
Background technology
The fingerprint identification function test that current production line is used, is carried out, its method typically all after electric performance test
Have following two：
First method is：Test bench is put into by manually inhaling single IC chip, is then surveyed using hand-held electric silica gel
Die trial block is contacted with chip upper surface, and applies certain pressure, the result that view screen shows, confirms that fingerprint tests whether to close
Lattice, certified products sort out storage, and substandard products are directly rejected.The defect that this kind of method is present is：Efficiency is low, test result is unstable, hand
Work link is excessive, is easily damaged product.
Second method is：Before chip cutting, positioned and pressed by IC material strips are manually put into an electrical measurement platform manually
Flat, test module of the surface with several electric silica gels is pushed, and each electric silica gel is touched in corresponding IC chip
Surface, and 5 seconds are kept, control system display fingerprint test result, the segment chip that fingerprint test does not pass through, by artificial
Using marking pen by substandard products material mark, so as to after chip cutting by bad part eject.The defect that this kind of method is present is：Multiple is led
The dynamics of electric silica gel test module is uneven, and test structure is unstable；The substandard products of handmarking, also need to be equipped with vision in cutting
Module read handmarking go forward side by side places product sorting, fingerprint test station is additionally arranged on a production line, increased equipment cost and
Cost of labor.In addition, this kind of method is to be tested before cutting, the substandard products that cutting process is produced will be unable to place to go, reduce
Product qualified rate.
Utility model content
The purpose of this utility model is to provide a kind of automatic test, improve production efficiency, the chip of test result stabilization
Draw and test combined mechanism.
To achieve these goals, the chip pick-up and test combined mechanism that the utility model is provided include connecting plate, consolidate
Determine ring, suction nozzle, test mould and push valve element, the connecting plate has inner chamber, the fixed ring seals ground is fixed on the inner chamber
Interior, the suction nozzle is fixed on the lower end of the retainer ring, and the valve element that pushes slidably is socketed in the through hole of the retainer ring,
The test mould slidably and in being placed in gap in the suction nozzle and be fixedly connected with the lower end for pushing valve element, it is described under
The centre bore of pressure valve core is connected with the suction nozzle and vacuum source respectively；The cavity pushed between valve element and the connecting plate
Connected with pressure gas source.
Because the utility model sets suction nozzle, and the pressure valve under setting in the retainer ring in the lower end of the retainer ring
Core, then the lower end connecting test mould of valve element is pushed described, and the test mould is built in the suction nozzle, therefore, pass through
Vacuum source is passed through in the centre bore for pushing valve element, such that it is able to make vacuum source through test mould and the suction
Gap between mouth vacuumizes, and the suction nozzle is entered vacuum adsorbed to chip, reaches the purpose of absorption chip；In addition, logical
Cross and gases at high pressure are passed through to the cavity pushed between valve element and connecting plate, such that it is able to promote the valve element that pushes to moving down
It is dynamic, and then the test mould is stretched out the suction nozzle, chip is tested.The application is positioned over electrical property when chip is drawn
After test bench is tested, fingerprint test can be rapidly carried out in situ by testing mould, without the extra test step of needs, pole
The earth improves production efficiency, and test without manual hand manipulation, automatic test, good test effect.
It is preferred that the valve element that pushes is socketed with the first return unit, so that the test mold shrinkage enters in the suction nozzle and answers
Position.
It is preferred that the upper and lower end for pushing valve element is respectively equipped with the first sealing ring, the second sealing ring, so that under described
The upper end of pressure valve core is connected with the bore seal, and lower end is tightly connected with the through hole.
It is preferred that the upper end of the inner chamber is provided with the 3rd sealing ring, so that it is tightly connected with the external world, the retainer ring
Lower end is socketed with the 4th sealing ring, so that it is connected with the bore seal.
It is preferred that the valve element middle part that pushes is arranged with air rammer envelope.
It is preferred that the chip pick-up and test combined mechanism also include limiting plate, the limiting plate is fixed on the company
Fishplate bar is supporting the retainer ring.
Specifically, the second return unit is provided between the retainer ring and the connecting plate.
It is preferred that the connecting plate is provided with rapid latch.
It is preferred that the connecting plate is provided with guide-localization set.
It is preferred that the connecting plate is provided with clip connecting seat.
Brief description of the drawings
Fig. 1 is the structure chart of the utility model chip pick-up and test combined mechanism.
Fig. 2 is the exploded view of the utility model chip pick-up and test combined mechanism.
Fig. 3 is the structure chart of the suction nozzle in the utility model chip pick-up and test combined mechanism and test mould.
Specific embodiment
It is the effect for describing technology contents of the present utility model, structural feature in detail, realized, below in conjunction with implementation method
And coordinate accompanying drawing to be explained in detail.
As shown in Figure 1, Figure 2 and Figure 3, the utility model chip pick-up and test combined mechanism 100 include connecting plate 1, consolidate
Determine ring 2, suction nozzle 3, test mould 4 and push valve element 5, the connecting plate 1 has inner chamber 11, and the retainer ring 2 is sealingly fixed to
In the inner chamber 11, the suction nozzle 3 is fixed on the lower end of the retainer ring 2；It is described push valve element 5 be slidably socketed on it is described solid
Determine in the through hole 21 of ring 2, the middle part of valve element 5 that pushes is arranged with air rammer envelope 51, and the air rammer envelope 51 is logical with described
Hole 21 is tightly connected；The test mould 4 slidably and in being placed in the suction nozzle 3 and push under valve element 5 with described with gap
End is fixedly connected, and the test mould 4 is fingerprint mould, for fingerprint test, itself and the material of chip finger print contact is to lead
Electric silica gel, material is soft, will not lose product, and its shape can be square or strip, only need to be according to the selection of the shape of chip not
Same module；The centre bore 52 for pushing valve element 5 is connected with the suction nozzle 3 and vacuum source respectively；The lower pressure valve
The through hole 21 is stretched out in the upper end of core 5 so that described pushing forms cavity between valve element 5 and the connecting plate 1, the cavity with
Pressure gas source is connected.The valve element 5 that pushes is socketed with the first return unit 53, and first return unit 53 is compression spring, so that
Resetted in suction nozzle 3 described in the test retraction of mould 4.
Again as shown in Fig. 2 the upper and lower end for pushing valve element 5 is respectively equipped with the first sealing ring 54, the second sealing ring 55,
So that the upper end for pushing valve element 5 is hermetically connected with the inner chamber 11, lower end is tightly connected with the through hole 21, so that shape
Into the cavity.The upper end of the inner chamber 11 is additionally provided with the 3rd sealing ring 12, so that the inner chamber 11 is tightly connected with the external world, institute
The lower end for stating retainer ring 2 is socketed with the 4th sealing ring 22 by annular groove, so that it is tightly connected with the inner chamber 11.By setting
Multiple sealing rings, it is ensured that valve element 5 and the retainer ring 2 of pushing can be tightly connected with the connecting plate 1, so as to be
Vacuum source and pressure gas source provide reliable guarantee as power.
The chip pick-up and test combined mechanism 100 also include limiting plate 6, and the limiting plate 6 is fixed on the connection
Plate 1 is supporting the retainer ring 2.The second return unit 23 is provided between the retainer ring 2 and the connecting plate 1.
The connecting plate 1 is provided with rapid latch 13, guide-localization and covers 14 and clip connecting seat 15.The rapid latch
13 are arranged on the clip connecting seat 15.
Summary, the utility model chip pick-up and test combined mechanism 100 draw fingerprint chip when, the vacuum
Source of the gas is described from the gap 31 that the centre bore 52 for pushing valve element 5 is entered between the suction nozzle 3 and the test mould 4
Suction nozzle 3 moves down into the upper surface of the chip, forms a closed vacuum cavity, produces -75kPa vacuums；Chip is inhaled
Rise and move and be put into chip test base and carry out classical electrical and can test.After the completion of electric performance test, the vacuum source disconnects, institute
Pressure gas source supply is stated, compressed air is entered into the inner chamber 11 of the connecting plate 1 by gas joint 7, enters back into the connection
In plate 1 and the cavity pushed between valve element 5, so as to push valve element 5 described in driving move down, the valve element 5 that pushes drives institute
State test mould 4 to move down and stretch out the suction nozzle 3, at this moment, the fingerprint that the test mould 4 is depressed into chip knows functional test region,
And kept for 3 seconds, device software just can automatically read and store the result of fingerprint identification function test, complete the fingerprint of chip
Identification function test step.
Because the utility model sets suction nozzle 3 in the lower end of the retainer ring 2, and under setting in the retainer ring 2
Pressure valve core 5, then in the lower end connecting test mould 4 for pushing valve element 5, and the test mould 4 is built in the suction nozzle 3,
Therefore, vacuum source is passed through by the centre bore 52 for pushing valve element 5, such that it is able to make vacuum source pass through the survey
Gap between die trial 4 and the suction nozzle 3 vacuumizes, and the suction nozzle 3 is entered vacuum adsorbed to chip, reaches absorption chip
Purpose；In addition, push the cavity between valve element 5 and connecting plate 1 and be passed through gases at high pressure by described, such that it is able to promote
State and push valve element 5 and move down, and then the test mould 4 is stretched out the suction nozzle 3, chip is tested.The application works as core
Piece be drawn be positioned over electric performance test seat tested after, can rapidly carry out fingerprint test, nothing in situ by testing mould 4
Extra test step is needed, production efficiency, and test is drastically increased without manual hand manipulation, automatic test is surveyed
Examination effect is good.
Above disclosed is only preferred embodiments of the present utility model, can not limit this practicality with this certainly new
The interest field of type, therefore the equivalent variations made according to present utility model application the scope of the claims, still fall within the utility model and are contained
The scope of lid.
Claims (10)
1. a kind of chip pick-up and test combined mechanism, it is characterised in that：Including connecting plate, retainer ring, suction nozzle, test mould and under
Pressure valve core, the connecting plate has inner chamber, and the fixed ring seals ground is fixed in the inner chamber, and the suction nozzle is fixed on described
The lower end of retainer ring, the valve element that pushes slidably is socketed in the through hole of the retainer ring, described to test mould slidably and be in
Be placed in gap in the suction nozzle and be fixedly connected with the lower end for pushing valve element, the centre bore for pushing valve element respectively with
The suction nozzle and vacuum source are connected；The cavity pushed between valve element and the connecting plate is connected with pressure gas source.
2. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The valve element that pushes is socketed with
One return unit, so that the test mold shrinkage enters in the suction nozzle and resets.
3. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：It is described to push the upper and lower of valve element
End is respectively equipped with the first sealing ring, the second sealing ring, so that the upper end for pushing valve element is connected with the bore seal, under
End is tightly connected with the through hole.
4. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The upper end of the inner chamber is provided with
Three sealing rings, so that it is tightly connected with the external world, the lower end of the retainer ring is socketed with the 4th sealing ring, so that it is interior with described
Chamber is tightly connected.
5. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The valve element middle part that pushes is arranged
There is air rammer to seal.
6. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The chip pick-up and test group
Closing mechanism also includes limiting plate, and the limiting plate is fixed on the connecting plate to support the retainer ring.
7. chip pick-up as claimed in claim 6 and test combined mechanism, it is characterised in that：The retainer ring and the connection
The second return unit is provided between plate.
8. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The connecting plate is provided with quickly
Lock.
9. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The connecting plate is provided with guiding
Positioning sleeve.
10. chip pick-up as claimed in claim 1 and test combined mechanism, it is characterised in that：The connecting plate is provided with solid
Surely connecting seat is detained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621061784.XU CN206270979U (en) | 2016-09-18 | 2016-09-18 | Chip pick-up and test combined mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621061784.XU CN206270979U (en) | 2016-09-18 | 2016-09-18 | Chip pick-up and test combined mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206270979U true CN206270979U (en) | 2017-06-20 |
Family
ID=59037187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621061784.XU Active CN206270979U (en) | 2016-09-18 | 2016-09-18 | Chip pick-up and test combined mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206270979U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107168385A (en) * | 2017-06-23 | 2017-09-15 | 浙江捷昌线性驱动科技股份有限公司 | A kind of electric pushrod |
| CN107453534A (en) * | 2017-06-23 | 2017-12-08 | 浙江捷昌线性驱动科技股份有限公司 | A kind of solar light-heat power-generation electric pushrod |
| CN115980401A (en) * | 2022-12-22 | 2023-04-18 | 杭州朗迅科技股份有限公司 | Automatic testing device based on down-pressure SOP test seat |
-
2016
- 2016-09-18 CN CN201621061784.XU patent/CN206270979U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107168385A (en) * | 2017-06-23 | 2017-09-15 | 浙江捷昌线性驱动科技股份有限公司 | A kind of electric pushrod |
| CN107453534A (en) * | 2017-06-23 | 2017-12-08 | 浙江捷昌线性驱动科技股份有限公司 | A kind of solar light-heat power-generation electric pushrod |
| CN107168385B (en) * | 2017-06-23 | 2023-10-03 | 浙江捷昌线性驱动科技股份有限公司 | Electric push rod |
| CN107453534B (en) * | 2017-06-23 | 2024-04-02 | 浙江捷昌线性驱动科技股份有限公司 | Electric push rod for solar photo-thermal power generation |
| CN115980401A (en) * | 2022-12-22 | 2023-04-18 | 杭州朗迅科技股份有限公司 | Automatic testing device based on down-pressure SOP test seat |
| CN115980401B (en) * | 2022-12-22 | 2023-08-29 | 杭州朗迅科技股份有限公司 | Automatic testing device based on down-pressure SOP test seat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220310 Address after: 518000 1st to 3rd floors of phase II plant of Granda equipment Industrial Park, 33 Cuijing Road, Zhukeng community, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Gexin integrated circuit equipment Co.,Ltd. Address before: Granda equipment Industrial Park, 33 Cuijing Road, Pingshan new area, Shenzhen City, Guangdong Province Patentee before: SHENZHEN GRAND INTELLIGENT EQUIPMENT Co.,Ltd. |
|
| TR01 | Transfer of patent right |