CN206250158U - A kind of die bonding film iron hoop adjusts microscope carrier - Google Patents
A kind of die bonding film iron hoop adjusts microscope carrier Download PDFInfo
- Publication number
- CN206250158U CN206250158U CN201621405717.5U CN201621405717U CN206250158U CN 206250158 U CN206250158 U CN 206250158U CN 201621405717 U CN201621405717 U CN 201621405717U CN 206250158 U CN206250158 U CN 206250158U
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- China
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- iron hoop
- die bonding
- bonding film
- rotating disk
- film iron
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Abstract
The utility model is related to a kind of die bonding film iron hoop to adjust microscope carrier and includes pedestal and the rotating disk above pedestal, the drive mechanism for driving rotation disc spins is provided with pedestal, at least one movable buckle portion is provided with rotating disk, rotating disk is used to carry die bonding film iron hoop, movable buckle portion is used to press on die bonding film iron hoop the card of rotating disk, wherein, movable buckle portion includes the slide rail being embedded in the mobile channels that the card of rotating disk is opened up downwards, the limit base being fixedly arranged on the sliding block on slide rail and the press part below limit base, connected by elastic component between press part and limit base.Can be brought into close contact die bonding film iron hoop in rotating disk by movable buckle portion newly by this practicality, it is to avoid the problem of visual inspection operating interruptions caused by the skew of die bonding film iron hoop；By rotating rotating disk, the fine-tuning die bonding film iron hoop anglec of rotation facilitates operator to finely tune the horizontal level of die bonding film iron hoop.
Description
Technical field
The utility model is related to a kind of chip detecting equipment, and the die bonding film iron hoop more particularly, on testing equipment is adjusted
Whole microscope carrier.
Background technology
Known chip outward appearance detects (Sorting) instrument frequently with general microscope device, in detection by product to be measured
Product are placed on microscopical microscope carrier and are observed, however, above-mentioned microscope carrier needleless is carried out to die bonding film iron hoop to be detected
Fixed fixed mechanism, therefore Chang Yin carelessly touches iron hoop and causes iron hoop to offset in visual inspection, and then cause visual inspection to work
Interrupt.Additionally, the microscope carrier of known chip appearance detecting instrument device, it is impossible to adjust horizontal level, must manual fine-tuning position repeatedly, very
Industrial operations of the inconvenience beneficial to producing line.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of die bonding film iron hoop adjustment microscope carrier, so as to overcome
The deficiencies in the prior art.
To reach above-mentioned purpose, the technical solution of the utility model is as follows：
A kind of die bonding film iron hoop adjusts microscope carrier, including pedestal and the rotating disk above the pedestal, the rotation
At least one movable buckle portion is provided with rotating disk, the rotating disk is used to carry die bonding film iron hoop, the movable button
Card division is used to press on die bonding film iron hoop the card of the rotating disk,
Wherein, the movable buckle portion includes being embedded in the mobile channels that the card of the rotating disk is opened up downwards
Limit base on slide rail, the sliding block being fixedly arranged on the slide rail and the press part below the limit base, the press part
It is connected by elastic component between the limit base, when the limit base is moved in the mobile channels along the slide rail
When at the position of side wall or second sidewall, the die bonding film iron hoop is pushed into the lower section of the press part, in the bullet
Property part elastic force effect under, the press part can elasticity compress the die bonding film iron hoop.
Preferably, two movable buckle portions for setting relatively are provided with the rotating disk, through manual switching activity
The position in formula buckle portion, uses the die bonding film iron hoop that buckle positions 12 inch and 8 inch.
Preferably, the elastic component is spring or rubber.
Preferably, several uniform air entries, the air entry and vacuum breathing apparatus are offered in the rotating disk
It is connected.
Preferably, fixed knob is provided with the pedestal, the fixed knob is used for the rotating disk that locks.
Preferably, at least one limiting section is provided with the rotating disk, the limiting section is used for positioning chip pad pasting iron
The outward flange of ring.
Compared with prior art, advantage of the present utility model at least that:
1) a kind of die bonding film iron hoop adjustment microscope carrier that the utility model is provided, can be by chip by movable buckle portion
Pad pasting iron hoop is brought into close contact in rotating disk, specifically, manually adjusting the limit base in movable buckle portion, moves the sliding block of slide rail
When dynamic, drive limit base to be moved to the first side wall and the position of second sidewall in mobile channels, die bonding film iron hoop is pushed into
The lower section of press part, under the elastic force effect of the elastic component, elasticity compresses the upper surface of die bonding film iron hoop, so that core
Piece pad pasting iron hoop is brought into close contact in rotating disk, it is to avoid visual inspection operating interruptions asks caused by the skew of die bonding film iron hoop
Topic.
2) by rotating rotating disk, the fine-tuning die bonding film iron hoop anglec of rotation facilitates operator to finely tune die bonding film iron
The horizontal level of ring.
3) air entry is provided with rotating disk, can strengthens adsorbing fixed chip pad pasting iron hoop.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the utility model embodiment, below will be to prior art and embodiment
The accompanying drawing to be used needed for description is briefly described.
Fig. 1 adjusts the structural representation of microscope carrier for die bonding film iron hoop disclosed in the utility model embodiment；
Fig. 2 is the vertical view of die bonding film iron hoop adjustment microscope carrier and die bonding film iron hoop disclosed in the utility model embodiment
Figure；
Fig. 3 is in the signal of off working state for die bonding film iron hoop adjustment microscope carrier disclosed in the utility model embodiment
Figure；
Fig. 4 is the in running order signal of die bonding film iron hoop adjustment microscope carrier disclosed in the utility model embodiment
Figure；
Fig. 5 is the in running order signal of die bonding film iron hoop adjustment microscope carrier disclosed in the utility model embodiment
Figure；
Fig. 6 adjusts the top view of microscope carrier for die bonding film iron hoop disclosed in the utility model embodiment.
Description of reference numerals：11- pedestals, 12- rotating disks, 121- mobile channels, 121a- the first side walls, the sides of 121b- second
Wall, 122- air entries, the movable buckle portions of 13-, 131a- sliding blocks, 131b- slide rails, 132- limit bases, 133- press parts, 134-
Elastic component, 14- fixed knobs, 15- limiting sections, 16- handles, K1- iron hoops, K2- pad pastings.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe.
Referring to shown in Fig. 1-6, the utility model discloses a kind of die bonding film iron hoop adjustment microscope carrier, for fixed chip patch
Together with film iron hoop K1, pad pasting K2 (blue tape) is bonded in iron hoop K1, die bonding film iron hoop adjustment microscope carrier includes pedestal 11
And located at the rotating disk 12 of the top of pedestal 11, at least one movable buckle portion 13, rotating disk 12 are provided with rotating disk 12
For carrying die bonding film iron hoop K1, movable buckle portion 13 is used to press on die bonding film iron hoop K1 the card of rotating disk 12
On；
Wherein, movable buckle portion 13 includes the cunning being embedded in the mobile channels 121 that the card of rotating disk 12 is opened up
The rail 131b and sliding block 131a being arranged on slide rail 131b, the limit base 132 that is fixedly arranged on sliding block 131a and located at limit base 132
The press part 133 of lower section, by elastic component 134, (preferred, elastic component 134 is spring between press part 133 and limit base 132
Or rubber) connection.It is shown in Figure 4, when operating personnel promote limit base 132 to be moved to mobile channels 121 along slide rail 131b
When at the position of interior the first side wall 121a, die bonding film iron hoop K1 is pushed into the lower section of press part 133, in elastic component 134
Elastic force effect under, press part 133 can elasticity compress die bonding film iron hoop K1.On the other hand, shown in Figure 5, operating personnel push away
Dynamic limit base 132 is moved in mobile channels 121 when at the position of second sidewall 121b along slide rail 131b, and press part 133 exists
In the presence of elastic component 134 can elasticity compress the die bonding film iron hoop K1 of small size, for example, movable buckle portion 13 switching first
The position of side wall 121a and second sidewall 121b, elasticity can compress 12 cun of die bonding film iron hoop K1 with 8 cun, convenient operation respectively
Person is directed to various sizes of die bonding film iron hoop K1, and switching easily is used.
Additionally, it is shown in Figure 6, at least one handle 16 is provided with rotating disk 12, the person of being convenient to operation is micro- for handle 16
Adjust the horizontal level of die bonding film iron hoop.
Preferably, two movable buckle portions 13 for setting relatively are provided with rotating disk 12, so as to die bonding film iron
Edge is fixed at the two of ring K1.
Preferably, several uniform air entries 122, air entry 122 and vacuum breathing apparatus are offered in rotating disk 12
It is connected, produces negative pressure that die bonding film iron hoop K1 is adsorbed in rotating disk 12 in air entry, is fixed such that it is able to strengthen absorption
Die bonding film iron hoop K1.
Preferably, fixed knob 14 is provided with pedestal 11, fixed knob 14 is used for the rotating disk 12 that locks, so as to rotating disk
It is fixed on the position of setting.
Preferably, at least one limiting section 15 is provided with rotating disk 12, limiting section 15 is used for positioning chip pad pasting iron hoop
Outward flange.
Operation principle of the present utility model is as follows：
First, operator is directed to various sizes of die bonding film iron hoop K1, and switching uses the position in movable buckle portion 13；
Secondly, die bonding film iron hoop is placed in the card of rotating disk 12, vacuum breathing apparatus air-breathing causes rotating disk
12 card produces larger negative pressure so that by die bonding film iron hoop adsorbed close in rotating disk 12；
Then, die bonding film iron hoop can be brought into close contact in rotating disk 12 by movable buckle portion 13.Specifically,
Die bonding film iron hoop K1 is pushed into the lower section of press part 133, under the elastic force effect of elastic component 134, the elasticity of press part 133 is supported
The upper surface of pressure die bonding film iron hoop K1, so that die bonding film iron hoop K1 is brought into close contact in rotating disk 12, it is to avoid core
The problem of visual inspection operating interruptions caused by piece pad pasting iron hoop K1 skews；By rotating rotating disk 12, fine-tuning die bonding film iron
The ring anglec of rotation, facilitates operator to finely tune the horizontal level of die bonding film iron hoop.
Various modifications to these embodiments will be apparent for those skilled in the art, herein
Defined General Principle can be real in other embodiments in the case where spirit or scope of the present utility model are not departed from
It is existing.Therefore, the utility model is not intended to be limited to the embodiments shown herein, and be to fit to it is disclosed herein
Principle and the consistent scope most wide of features of novelty.
Claims (6)
1. a kind of die bonding film iron hoop adjusts microscope carrier, it is characterised in that the rotation including pedestal and above the pedestal
Disk, is provided with the drive mechanism for driving the rotation disc spins on the pedestal, at least one is provided with the rotating disk
Individual movable buckle portion, the rotating disk is used to carry die bonding film iron hoop, and the movable buckle portion is used for die bonding film
Iron hoop is pressed in the card of the rotating disk,
Wherein, the movable buckle portion includes the cunning being embedded in the mobile channels that the card of the rotating disk is opened up downwards
Limit base on rail, the sliding block being fixedly arranged on the slide rail and the press part below the limit base, the press part with
Connected by elastic component between the limit base, when the limit base is moved to first in the mobile channels along the slide rail
When at the position of side wall or second sidewall, the die bonding film iron hoop is pushed into the lower section of the press part, in the elasticity
Part elastic force effect under, the press part can elasticity compress the die bonding film iron hoop.
2. a kind of die bonding film iron hoop according to claim 1 adjusts microscope carrier, it is characterised in that set in the rotating disk
There are two movable buckle portions for setting relatively.
3. a kind of die bonding film iron hoop according to claim 1 adjusts microscope carrier, it is characterised in that the elastic component is spring
Or rubber.
4. a kind of die bonding film iron hoop according to claim 1 adjusts microscope carrier, it is characterised in that opened up in the rotating disk
There are several uniform air entries, the air entry is connected with vacuum breathing apparatus.
5. a kind of die bonding film iron hoop according to claim 1 adjusts microscope carrier, it is characterised in that be provided with the pedestal
Fixed knob, the fixed knob is used for the rotating disk that locks.
6. a kind of die bonding film iron hoop according to claim 1 adjusts microscope carrier, it is characterised in that set in the rotating disk
There is at least one limiting section, the limiting section is used for the outward flange of positioning chip pad pasting iron hoop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621405717.5U CN206250158U (en) | 2016-12-20 | 2016-12-20 | A kind of die bonding film iron hoop adjusts microscope carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621405717.5U CN206250158U (en) | 2016-12-20 | 2016-12-20 | A kind of die bonding film iron hoop adjusts microscope carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250158U true CN206250158U (en) | 2017-06-13 |
Family
ID=59007933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621405717.5U Active CN206250158U (en) | 2016-12-20 | 2016-12-20 | A kind of die bonding film iron hoop adjusts microscope carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250158U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571160A (en) * | 2018-07-20 | 2019-12-13 | 安徽博辰电力科技有限公司 | semiconductor packaging chip bonding process |
-
2016
- 2016-12-20 CN CN201621405717.5U patent/CN206250158U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571160A (en) * | 2018-07-20 | 2019-12-13 | 安徽博辰电力科技有限公司 | semiconductor packaging chip bonding process |
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