A kind of PLC light back boards
Technical field
The utility model is related to optical communication field, more particularly, to a kind of light back board.
Background technology
With the increasingly popularization of optical communication network and the 4G communication technologys, when network transmission speed marches toward Gbps by Mbps
Generation, the transmission rate of core network even will march toward the Tbps epoch.But the interchanger as network core is with high-performance simultaneously
Row computer, its internal chip is interconnected but still in " copper interconnection " epoch.Although in recent years, the treatment of the chip such as microprocessor
Ability is greatly improved, but the hump speed of " copper interconnection " only has 100Gbps, for the Terahertz net that can be looked forward to,
" copper interconnection " certainly will turn into bottleneck therein, and the exactly light back board interconnection technique for thus arising at the historic moment.
Early in May, 2011, Hewlett-Packard Corporation just discloses a light back board concept product in InterOp exhibitions, and its core is
The transmission array of 12 road plastic light conduit compositions, R-T unit is constituted by 4 road 850nm 6.25Gbps VCSEL, realizes each board
Between interconnection, this product is successfully applied on HP8212 interchangers.Because electricity interconnection at that time is fully able to meet user's
Most of demand, and the product is not yet ripe, and light back board technology does not have significantly breakthrough so far.
Nearly 2 years, especially domestic, with the further popularization and the downward of network rate of fiber optic network, resident was to net
Substantially, the growth of the market demand have stimulated the quickening of technological innovation for the demand growth of network bandwidth.Current increasing scientific research machine
Structure and enterprise have carried out positive concern to light back board technology.
The light back board system for using at present, its major way has two kinds:
One kind is fixed on substrate using optical fiber, realizes that light back board is interconnected by the fibre system on substrate, its essence
On still fall within optical fiber interconnection, the program implements complicated, and optical fiber is various, there is security risk, and optical-fiber type device size compared with
Greatly, it is difficult to integrated.
Another kind uses integrated-type planar light wave circuit (PLC) light back board, although this kind of mode has compact, integrated
Degree is high, can design the advantages of realizing various functions by rational, but still there are some shortcomings:
, it is necessary to use fiber array in PLC light back boards, it is that the fiber waveguides such as one optical fiber are arranged on using V-shaped groove
On array substrate.End face is arranged in numerous optical fiber the geometry of needs in sequence, constitutes fiber array, optical fiber array
The optical fiber arrangement position for arranging two ends is corresponded.Fiber array relies primarily on the V grooves of precision ruling to realize positioning, optical fiber spacing
Most important detection project, fibre core spacing include two Testing index, i.e. lateral separation between fibre core and fibre core and they
Between fore-and-aft distance.
The PLC light back boards for designing at present, its primary structure is two-dimensional structure, can again be specifically divided into two kinds of embodiments:
The first scheme is as shown in figure 1, light back board 9 is set by input end fiber array 2 and output end fiber array 3 with input respectively
Connected for 6 and apparatus of output terminal 7, all function elements are integrated in one plane, to the size of function element in light back board 9
It is required that higher, process allowance is smaller, and as the complexity of light back board 9 increases, the size of light back board 9 or light loss can also increase;The
Two kinds of schemes are as shown in Fig. 2 be to realize that function is separated by the way of the cascade of many light back boards, the program is needed with multiple optical fiber arrays
Row and the fine multiple light back boards 9 of 10 connection of band, then respectively by input end fiber array 2 and output end fiber array 3 and input
End equipment 6 and apparatus of output terminal 7 are connected, system architecture dispersion, and cascade increased the loss of optical transport and coupling.
The content of the invention
The purpose of this utility model is exactly to provide a kind of PLC light for the defect for overcoming above-mentioned prior art to exist to carry on the back
Plate, compact conformation and also can realize signal parallel transmission, treatment.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of PLC light back boards, including PLC light back boards array and input, output end fiber array, wherein,
PLC light back boards array includes N number of PLC chip, N >=2;
Input, the port input respectively with PLC light back board arrays of output end fiber array, a pair of output optical waveguide 1
Should.
Preferably, the PLC light back boards array is sequentially overlapped by N number of PLC chip and constituted, lead between adjacent PLC chip
Cross the perfectly aligned bonding of adhesive.
Preferably, described adhesive is heat-curable glue or uv-curable glue.
Preferably, the thickness degree of described adhesive is 0.5~100 μm.
Preferably, the input of the PLC light back boards array and/or output end have the optical waveguide array that N × N1 is distributed,
Wherein N is line number, and N1 is columns, N1 >=1.
Preferably, the thickness of the PLC chip is determined by the line-spacing of equipment connectivity port, it is equal to input, output end
Fibre core spacing in fiber array same row subtracts the thickness degree of adhesive.
Preferably, in the input, same a line of output end fiber array fibre core spacing by equipment connectivity port row
Away from decision.
Preferably, the PLC light back boards can be carried out along 90 ° of axial-rotation in two equipment air line distances with equipment
Assembling.Now PLC chip and adhesive are arranged such also therewith along 90 ° of axial-rotation in two equipment air line distances, described
PLC light back boards can adjust the position for coordinating installing space.
Preferably, the fiber waveguide in the PLC chip is silicon substrate fiber waveguide, silicon dioxide optical waveguide, GaAs light wave
Lead, the one kind in lithium niobate fiber waveguide, polymer optical wave guide and glass-based ion exchange optical waveguide.
Preferably, the core diameter or sandwich layer of fiber waveguide in the PLC chip are wide a height of 10~200 μm.
Compared with prior art, the utility model has advantages below:
1st, compact conformation, size is small.Parallel form is bonded using many plates reduce the space increasing that light back board cascade causes
It is long.
2nd, veneer complexity is reduced.Many plate parallel forms simplify the integrated functional complexity of veneer, and different light are passed
Transmission function can respectively be realized on different backboard units.
3rd, signal parallel transmission, treatment can be realized.Many plates can split signal into different light back board units parallel
It is middle to process respectively, then by light back board array output end parallel output.
Brief description of the drawings
Fig. 1 is the first scheme of PLC light back boards in the prior art;
Fig. 2 is the second scheme of PLC light back boards in the prior art;
Fig. 3 is the front view of the structural representation of embodiment 1;
Fig. 4 is the top view of the structural representation of embodiment 1;
Fig. 5 is the cross-sectional view of the output end according to Fig. 3;
Fig. 6 is the front view of the structural representation of embodiment 2;
Fig. 7 is the top view of the structural representation of embodiment 2;
Fig. 8 is the cross-sectional view of the output end according to Fig. 6;
In accompanying drawing:1-PLC light back board arrays, 2- input end fiber arrays, 3- output end fiber arrays, 4-PLC chips, 5-
Adhesive, 6- head-end equipments, 7- apparatus of output terminal, 8- fiber waveguides, 9- light back boards, 10- bands are fine.
Specific embodiment
The utility model is described in detail with specific embodiment below in conjunction with the accompanying drawings.The present embodiment is with the utility model
Implemented premised on technical scheme, given detailed implementation method and specific operating process, but guarantor of the present utility model
Shield scope is not limited to following embodiments.
Embodiment 1:
As shown in Fig. 3,4,5, a kind of PLC light back boards, by PLC light back boards array 1, input end fiber array 2 and output
End fiber array 3 is constituted.Wherein, PLC light back boards array 1 is made up of two PLC chips 4 successively longitudinal direction superposition, in PLC chip 4
Fiber waveguide 8 structure be straight wave guide.The port of input end fiber array 2 and output end fiber array 3 respectively with PLC light back boards
The input of array 1, the fiber waveguide 8 of output end are corresponded.
The substrate of PLC chip 4 passes through the perfectly aligned bonding of adhesive 5 with another upper surface of PLC chip 4.
The input of PLC light back boards array 1 has the optical waveguide array of 2 × 1 distributions, wherein 2 is line number, 1 is columns.
Head-end equipment 6 is 250 μm, corresponding input end fiber array 2 with the connectivity port line space of apparatus of output terminal 7
It it is 250 μm with the line space of output end fiber array 3, the thickness degree of adhesive 5 is 100 μm, therefore the thickness of PLC chip 4 is
150μm。
Fiber waveguide 8 in PLC chip 4 is silicon substrate fiber waveguide.
The sandwich layer of the fiber waveguide 8 in PLC chip 4 is wide a height of 10 μm.
Adhesive 5 is heat-curable glue.
The thickness degree of adhesive 5 is 100 μm.
Embodiment 2:
As shown in Fig. 6,7,8, the present embodiment provides another kind PLC light back boards, by PLC light back boards array 1, input end fiber
Array 2 and output end fiber array 3 are constituted.Wherein, PLC light back boards array 1 is by six PLC chips 4 successively lateral stacking group
Into the structure of the fiber waveguide 8 in PLC chip 4 is 1 × 8 optical branching device.Input end fiber array 2, output end fiber array 3
Port corresponds with the input of PLC light back boards array 1, the fiber waveguide 8 of output end.
Because of equipment matching requirements, PLC light back boards 1 are along the axial direction rotation on head-end equipment 6 and the air line distance of apparatus of output terminal 7
Turn 90 ° to be assembled, its front view is as indicated with 6.
The substrate of PLC chip 4 passes through the perfectly aligned bonding of adhesive 5 with another upper surface of PLC chip 4.
The input of PLC light back boards array 1 has the optical waveguide array of 1 × 6 distribution, wherein 1 is line number, 6 is columns, defeated
Going out end has the optical waveguide array of 8 × 6 distributions, wherein 8 is line number, 6 is columns.
Head-end equipment 6 is 127 μm, corresponding input end fiber array 2 with the connectivity port column pitch of apparatus of output terminal 7
It it is 127 μm with the column pitch of output end fiber array 3, the thickness degree of adhesive 5 is 0.5 μm, therefore the thickness of PLC chip 4 is
126.5μm。
The row of fibre core spacing and equipment connectivity port in the same row of input end fiber array 2 and output end fiber array 3
Away from consistent for 250 μm, in the structure design of PLC chip 4, the output end line space design of 1 × 8 optical branching device is 250 μm.
Fiber waveguide 8 in PLC chip 4 is glass-based ion exchange optical waveguide.
The core diameter of the fiber waveguide 8 in PLC chip 4 is 200 μm.
Adhesive 5 is uv-curable glue.
The thickness degree of adhesive 5 is 0.5 μm.
Embodiment 3:
The structure of the PLC light back boards that the present embodiment is provided is same as Example 1, and difference is:In PLC chip 4
Fiber waveguide 8 is silicon dioxide optical waveguide.
Embodiment 4:
The structure of the PLC light back boards that the present embodiment is provided is same as Example 1, and difference is:In PLC chip 4
Fiber waveguide 8 is GaAs fiber waveguide.
Embodiment 5:
The structure of the PLC light back boards that the present embodiment is provided is same as Example 1, and difference is:In PLC chip 4
Fiber waveguide 8 is lithium niobate fiber waveguide.
Embodiment 6:
The structure of the PLC light back boards that the present embodiment is provided is same as Example 1, and difference is:In PLC chip 4
Fiber waveguide 8 is polymer optical wave guide.