CN206223084U - 用于晶圆铜层厚度多点测量的标定系统 - Google Patents
用于晶圆铜层厚度多点测量的标定系统 Download PDFInfo
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- CN206223084U CN206223084U CN201621099178.7U CN201621099178U CN206223084U CN 206223084 U CN206223084 U CN 206223084U CN 201621099178 U CN201621099178 U CN 201621099178U CN 206223084 U CN206223084 U CN 206223084U
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- calibration
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- wafer
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- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
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CN201621099178.7U CN206223084U (zh) | 2016-09-30 | 2016-09-30 | 用于晶圆铜层厚度多点测量的标定系统 |
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CN201621099178.7U CN206223084U (zh) | 2016-09-30 | 2016-09-30 | 用于晶圆铜层厚度多点测量的标定系统 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106289040A (zh) * | 2016-09-30 | 2017-01-04 | 天津华海清科机电科技有限公司 | 用于晶圆铜层厚度多点测量的标定系统 |
CN116276619A (zh) * | 2023-04-17 | 2023-06-23 | 华海清科股份有限公司 | 一种数据补偿方法和化学机械抛光设备 |
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2016
- 2016-09-30 CN CN201621099178.7U patent/CN206223084U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106289040A (zh) * | 2016-09-30 | 2017-01-04 | 天津华海清科机电科技有限公司 | 用于晶圆铜层厚度多点测量的标定系统 |
CN106289040B (zh) * | 2016-09-30 | 2019-11-22 | 清华大学 | 用于晶圆铜层厚度多点测量的标定系统 |
CN116276619A (zh) * | 2023-04-17 | 2023-06-23 | 华海清科股份有限公司 | 一种数据补偿方法和化学机械抛光设备 |
CN116276619B (zh) * | 2023-04-17 | 2023-09-29 | 华海清科股份有限公司 | 一种数据补偿方法和化学机械抛光设备 |
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GR01 | Patent grant | ||
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Calibration system for multi-point measurement of thickness of copper layer on wafer Effective date of registration: 20180206 Granted publication date: 20170606 Pledgee: Tsinghua Holdings Co.,Ltd. Pledgor: HWATSING TECHNOLOGY Co.,Ltd. Registration number: 2018120000004 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191022 Granted publication date: 20170606 Pledgee: Tsinghua Holdings Co.,Ltd. Pledgor: HWATSING TECHNOLOGY Co.,Ltd. Registration number: 2018120000004 |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee after: TSINGHUA University Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee before: TSINGHUA University Patentee before: HWATSING TECHNOLOGY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170606 Termination date: 20210930 |