CN206201123U - A kind of bamboo flooring of top layer end face splicing - Google Patents
A kind of bamboo flooring of top layer end face splicing Download PDFInfo
- Publication number
- CN206201123U CN206201123U CN201620457093.5U CN201620457093U CN206201123U CN 206201123 U CN206201123 U CN 206201123U CN 201620457093 U CN201620457093 U CN 201620457093U CN 206201123 U CN206201123 U CN 206201123U
- Authority
- CN
- China
- Prior art keywords
- top layer
- bamboo chip
- splicing
- bamboo
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000017166 Bambusa arundinacea Nutrition 0.000 title claims abstract description 67
- 235000017491 Bambusa tulda Nutrition 0.000 title claims abstract description 67
- 241001330002 Bambuseae Species 0.000 title claims abstract description 67
- 235000015334 Phyllostachys viridis Nutrition 0.000 title claims abstract description 67
- 239000011425 bamboo Substances 0.000 title claims abstract description 67
- 238000009408 flooring Methods 0.000 title claims abstract description 28
- 238000004061 bleaching Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 229920001807 Urea-formaldehyde Polymers 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 19
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
Landscapes
- Floor Finish (AREA)
Abstract
The utility model discloses a kind of bamboo flooring of top layer end face splicing, including end face splicing top layer, sandwich layer and bottom, behind the top layer and bottom coating urea-formaldehyde resin adhesive, sandwich layer both sides are placed in hot-forming.End face splicing top layer is bamboo chip after assembly is pressed into square bar according to certain rules, then is obtained by end face sawing.To carbonize and bleaching bamboo chip, width is 8 12mm to the bamboo chip, and thickness is 3 6mm.The arrangement mode of the end face splicing top layer bamboo chip is the charing bamboo chip splicing of charing bamboo chip or the bleaching bamboo chip splicing of bleaching bamboo chip or the alternate splicing of charing bamboo chip bleaching bamboo chip.The utility model is a kind of simple structure, top layer resistance to compression, on-deformable end face splicing bamboo flooring.
Description
Technical field
The utility model is related to a kind of floor, more particularly to a kind of end face splicing top layer floor.
Background technology
The outward appearance of bamboo flooring is fine and smooth, and it is pure and fresh sensation free from vulgarity to give people, its high resilience, good stability, is old and young
It is suitable, it is deeply welcome for house decoration.Bamboo flooring can be divided into concora crush bamboo flooring, side pressure bamboo flooring and restructuring by surface texture
Bamboo flooring three major types.True qualities bamboo flooring and charing bamboo flooring can be divided into again by the working process mode of bamboo flooring, mainly using bamboo
Piece different directions gluing is formed.Panel is expanding with heat and contract with cold, be easier cracking in the wet drying shrinkage process that rises, and warpage is easier to after humidity
Deformation.
The content of the invention
The purpose of this utility model is to provide a kind of simple structure, and top layer resistance to compression and on-deformable end face splice bamboo ground
Plate.
It is certainly solution above technical problem, a kind of top layer end face splicing bamboo flooring of the utility model offer, including end face splicing
Top layer, sandwich layer and bottom, sandwich layer and bottom are side pressure bamboo wood, behind top layer and bottom coating urea-formaldehyde resin adhesive, point
It is hot-forming that sandwich layer top and bottom are not placed in.
Preferably, end face splicing top layer is bamboo chip after assembly is pressed into square bar according to certain rules, then by end face sawing
It is obtained.
Preferably, bamboo chip is to carbonize and bleaching bamboo chip, width is 8-12mm, and thickness is 3-6mm.
Preferably, the arrangement mode of end face splicing top layer bamboo chip for the splicing of charing bamboo chip-charing bamboo chip or bleach bamboo chip-
The splicing of bleaching bamboo chip or charing bamboo chip-alternate splicing of bleaching bamboo chip.
The utility model beneficial effect is mainly reflected in:The method for product is simple, because bamboo chip end face compression strength is big,
Top layer end face splicing bamboo flooring compression strength is spelled better than other sides, flat spelling bamboo flooring, and is unlikely to deform, and substantially increases bamboo flooring
Service life.Meanwhile, by the splicing of the bamboo chip of different charing colors, a kind of stereo perception is given, greatly enrich bamboo ground
Plate species, can be widely applied to house decoration.
Brief description of the drawings
The bamboo flooring structural representation of Fig. 1 top layers end face splicing;
The bamboo flooring schematic diagram of Fig. 2 top layers transverse end surface splicing;
In figure, 1- end faces splicing top layer, 2- sandwich layers, 3- bottoms, 4- transverse end surfaces splicing top layer
Specific embodiment
The utility model is described in further detail below by combination figure and specific embodiment:
A kind of top layer end face splicing bamboo flooring shown in Fig. 1, by charing bamboo chip width 12mm, thickness 5mm four sides coating gluings
After being pressed into square bar by its length direction and bamboo flooring parallel direction after agent, then floor surface is made by end face sawing, with core
Layer, bottom side are spelled bamboo wood and are combined into bamboo flooring.
A kind of top layer end face splicing bamboo flooring shown in Fig. 2, by charing bamboo chip width 12mm, thickness 6mm four sides coating gluings
After being pressed into square bar by its length direction and bamboo flooring vertical direction after agent, then floor surface is made by end face sawing, with core
Layer, bottom side are spelled bamboo wood hot pressing and are combined into bamboo flooring.
Claims (4)
1. a kind of top layer end face splicing bamboo flooring, including end face splicing top layer, sandwich layer and bottom, the top layer and bottom coating urea
After urea formaldehyde adhesive, sandwich layer top and bottom are respectively placed in hot-forming.
2. a kind of top layer end face according to claim 1 splices bamboo flooring, it is characterised in that the end face splicing top layer is
Bamboo chip is obtained after assembly is pressed into square bar according to certain rules, then by end face sawing.
3. a kind of top layer end face according to claim 1 splices bamboo flooring, it is characterised in that the end face splices top layer bamboo
The arrangement mode of piece is charing bamboo chip-charing bamboo chip splicing or bleaching bamboo chip-bleaching bamboo chip splicing or charing bamboo chip-bleaching bamboo chip
Alternate splicing.
4. a kind of top layer end face according to claim 3 splices bamboo flooring, it is characterised in that the charing and bleaching bamboo chip,
Width is 8-12mm, and thickness is 3-6mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620457093.5U CN206201123U (en) | 2016-05-13 | 2016-05-13 | A kind of bamboo flooring of top layer end face splicing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620457093.5U CN206201123U (en) | 2016-05-13 | 2016-05-13 | A kind of bamboo flooring of top layer end face splicing |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206201123U true CN206201123U (en) | 2017-05-31 |
Family
ID=58755044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620457093.5U Expired - Fee Related CN206201123U (en) | 2016-05-13 | 2016-05-13 | A kind of bamboo flooring of top layer end face splicing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206201123U (en) |
-
2016
- 2016-05-13 CN CN201620457093.5U patent/CN206201123U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170531 Termination date: 20180513 |
|
CF01 | Termination of patent right due to non-payment of annual fee |