CN206196145U - Printed circuit board resin consent processing component - Google Patents
Printed circuit board resin consent processing component Download PDFInfo
- Publication number
- CN206196145U CN206196145U CN201621200840.3U CN201621200840U CN206196145U CN 206196145 U CN206196145 U CN 206196145U CN 201621200840 U CN201621200840 U CN 201621200840U CN 206196145 U CN206196145 U CN 206196145U
- Authority
- CN
- China
- Prior art keywords
- resin
- opening
- circuit board
- printed circuit
- copper base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model provides a printed circuit board resin consent processing component, including the copper base plate that is equipped with a plurality of electrically conductive holes, the copper base plate include the internal surface and with the relative surface that sets up of internal surface, be equipped with between the electrically conductive hole and run through the copper base plate is used for physics to keep apart adjacent two the logical groove in electrically conductive hole, lead to the groove including being located the first opening of internal surface, be located the second opening and the intercommunication of surface first opening with the second opening is used for filling resin's packing portion, the internal surface subsides are equipped with the high temperature membrane just the high temperature membrane covers first opening, the second opening be used for to packing portion pours into the resin into. Compare with the correlation technique, the utility model provides a printed circuit board resin consent processing component can realize that the resin consent preparation of jumbo size slotted hole and the roughness behind the resin curing are good.
Description
Technical field
The utility model is related to print circuit plates making technical field, more particularly to a kind of printed circuit board (PCB) filling holes with resin
Tooling member.
Background technology
With electronic product increasingly microminaturization, multifunction, highly integrated development, it is desirable to which pcb board part has more
Wiring density high.In order to ensure the interconnection of signal and prevent the generation of copper-based short circuit, it is necessary to the position between corresponding conductive hole
Put and open groove to insulate.But in order to ensure the planarization of copper-based plate surface, groove must be filled and led up using filling holes with resin, make holding good
Good flatness.
In correlation technique, because the inside groove of copper base is relatively large sized, using traditional filling holes with resin method, on the one hand meeting
Dilution and gravity because of resin, make groove to clog；On the other hand, it is easily caused resin sagging so that copper-based plate surface
Resin depression, it is impossible to meet the requirement of the flatness on surface.
Therefore, it is necessary to provide a kind of new printed circuit board (PCB) filling holes with resin tooling member solve the above problems.
Utility model content
The filling holes with resin that the utility model technical issues that need to address are to provide a kind of achievable large scale slotted eye makes
Printed circuit board (PCB) filling holes with resin tooling member.
In order to solve the above technical problems, the utility model provides a kind of printed circuit board (PCB) filling holes with resin tooling member, including
The copper base of multiple conductive holes is provided with, the copper base includes inner surface and the outer surface being oppositely arranged with the inner surface, institute
State and be provided between conductive hole through the copper base and for the groove of conductive hole described in physical isolation adjacent two, the groove bag
Include to be open positioned at the first opening of the inner surface, positioned at the second of the outer surface and connect described first and be open and described
Second is open and for the filling part of potting resin, and the inner surface is sticked high temperature membrane and high temperature membrane covering described first
Opening, described second is open for the filling part resin by injection.
Preferably, the conductive hole is circular port or square opening.
Preferably, the conductive hole arrangement mode include side by side, parallel or staggering sets.
Preferably, the resin is epoxy resin.
Preferably, the thickness of the high temperature membrane is 30-50 μm.
Compared with correlation technique, printed circuit board (PCB) filling holes with resin tooling member of the present utility model is by the copper base
The one side high temperature membrane that is sticked protect, then simultaneously carry out the resin by injection plug into the groove in addition from the copper base
Hole, makes the sagging of the high temperature membrane barrier resin ink, so that the surface smoothness after resin solidification is good, is capable of achieving large scale groove
The filling holes with resin in hole makes.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model printed circuit board (PCB) filling holes with resin tooling member.
Specific embodiment
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
Fig. 1 is refer to, is the structural representation of the utility model printed circuit board (PCB) filling holes with resin tooling member.The printing
Circuit board resin consent tooling member 200 includes copper base 1 and the multiple conductive holes 2 through the copper base 1 and located at institute
State the groove 3 between conductive hole 2.
The copper base 1 includes inner surface 11 and the outer surface 12 being oppositely arranged with the inner surface.
The groove 3 is through the copper base 1 and for conductive hole 2 described in physical isolation insulation adjacent two.The groove 3
Including positioned at the first opening 31 of the inner surface 11, positioned at the second opening 32 of the outer surface 12 and connection described first
Opening 31 and second opening 32 are used for the filling part 32 of potting resin.The inner surface 11 is sticked high temperature membrane 4 and described
High temperature membrane 4 covers first opening 31, and second opening 32 of the groove 3 is used to be injected to the filling part 32 sets
Fat, wherein, the resin is epoxy resin.
Specifically, paste the high temperature membrane 4 in the inner surface 11 of copper base 1 by laminator, then from the groove 3
Second opening, 32 resin by injection, after after resin solidification, and the resin on surface are polished, and make to realize the tree in the groove 3
Fat is filled and led up.The thickness of the high temperature membrane 4 is 30-50 μm.Compared to traditional filling holes with resin method, by the list in the copper base 1
Face is pasted the high temperature membrane 4 and is protected, then simultaneously carries out filling holes with resin in addition from the copper base 1, because there is the high temperature membrane 4
Barrier effect, can prevent resin sagging, and surfacing effect is reached after solidification.
In present embodiment, the conductive hole 2 is circular port or square opening.The arrangement mode of the conductive hole 2 include side by side,
Parallel or staggering is set.
Compared with correlation technique, printed circuit board (PCB) filling holes with resin tooling member of the present utility model is by the copper base
The one side high temperature membrane that is sticked protect, then simultaneously carry out the resin by injection plug into the groove in addition from the copper base
Hole, makes the sagging of the high temperature membrane barrier resin ink, so that the surface smoothness after resin solidification is good, is capable of achieving large scale groove
The filling holes with resin in hole makes.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or be directly or indirectly used in
Other related technical fields, are similarly included in scope of patent protection of the present utility model.
Claims (5)
1. a kind of printed circuit board (PCB) filling holes with resin tooling member, including it is provided with the copper base of multiple conductive holes, the copper base bag
Inner surface and the outer surface being oppositely arranged with the inner surface are included, is provided between the conductive hole through the copper base and is used for
The groove of conductive hole described in physical isolation adjacent two, the groove is included positioned at the first opening of the inner surface, positioned at described
Second opening of outer surface and connect first opening and described second be open and for the filling part of potting resin, it is special
Levy and be, the inner surface be sticked have high temperature membrane and the high temperature membrane covering it is described first opening, described second be open for
The filling part resin by injection.
2. printed circuit board (PCB) filling holes with resin tooling member according to claim 1, it is characterised in that the conductive hole is circle
Shape hole or square opening.
3. printed circuit board (PCB) filling holes with resin tooling member according to claim 1, it is characterised in that the conductive hole arrangement
Mode include side by side, parallel or staggering sets.
4. printed circuit board (PCB) filling holes with resin tooling member according to claim 1, it is characterised in that the resin is epoxy
Resin.
5. printed circuit board (PCB) filling holes with resin tooling member according to claim 1, it is characterised in that the thickness of the high temperature membrane
Spend is 30-50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621200840.3U CN206196145U (en) | 2016-11-04 | 2016-11-04 | Printed circuit board resin consent processing component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621200840.3U CN206196145U (en) | 2016-11-04 | 2016-11-04 | Printed circuit board resin consent processing component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206196145U true CN206196145U (en) | 2017-05-24 |
Family
ID=58733947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621200840.3U Active CN206196145U (en) | 2016-11-04 | 2016-11-04 | Printed circuit board resin consent processing component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206196145U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493960A (en) * | 2019-08-12 | 2019-11-22 | 珠海杰赛科技有限公司 | A kind of method and its machining tool of macroporous plate filling holes with resin |
| CN113543488A (en) * | 2021-06-30 | 2021-10-22 | 景旺电子科技(龙川)有限公司 | Resin hole plugging method of circuit board and circuit board |
-
2016
- 2016-11-04 CN CN201621200840.3U patent/CN206196145U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493960A (en) * | 2019-08-12 | 2019-11-22 | 珠海杰赛科技有限公司 | A kind of method and its machining tool of macroporous plate filling holes with resin |
| CN113543488A (en) * | 2021-06-30 | 2021-10-22 | 景旺电子科技(龙川)有限公司 | Resin hole plugging method of circuit board and circuit board |
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| GR01 | Patent grant |