CN206192094U - Tpi preheating device - Google Patents
Tpi preheating device Download PDFInfo
- Publication number
- CN206192094U CN206192094U CN201621147564.9U CN201621147564U CN206192094U CN 206192094 U CN206192094 U CN 206192094U CN 201621147564 U CN201621147564 U CN 201621147564U CN 206192094 U CN206192094 U CN 206192094U
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- Prior art keywords
- heater box
- tpi
- control
- heating part
- ceramic wafer
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Abstract
The utility model provides a TPI preheating device, preheating device include heating portion, down heating portion and with this two parts electricity control box even, go up and be equipped with the ceramic plate that can generate heat in heating portion and the heating portion down, be equipped with the control by temperature change inductor around the ceramic plate in the heating portion, the control by temperature change inductor with the control box electricity even, heating portion reciprocates for last heating portion down, be equipped with control circuit and MCU in the control box, its outside is equipped with control panel, control by temperature change sensor induction temperature data gives MCU with data transmission, MCU adjusts accuse potting porcelain plate temperature and the rising of heating portion down through computing control control circuit. The utility model provides a structure can be effectual for TPI preheats the dewatering, through the homogeneity of its heating of multi -point temperature measurement assurance, and improvement preheating effect.
Description
Technical field
The present invention relates to copper base manufacturing machine, more particularly to a kind of TPI preheating devices.
Background technology
The rate of water absorption of each manufacturer TPI is different, during without glue double-side copper substrate production, can be because TPI water swelling elastomers
Occur the phenomenons such as product plate bursting, bending during high-temperature laminating.To improve the water swelling elastomer of TPI, before by high-temperature laminating,
Need to carry out preheating water removal to TPI.Existing TPI preheating water removals are single-point control, and both sides heat energy is easy to run off, and uniform temperature is poor, adjusts
Solution temperature capability is not strong.Good effect can not be reached.
The content of the invention
The present invention proposes a kind of TPI preheating devices, solves the problems of the prior art.
The technical proposal of the invention is realized in this way：
TPI preheating devices, preheating device includes upper heating part, lower heating part and the control cabinet being electrically connected with this two parts, institute
State in heating part and lower heating part and be provided with heatable ceramic wafer；Temperature control inductor is provided with around ceramic wafer in heating part,
The temperature control inductor is electrically connected with the control cabinet；The lower heating part moves up and down relative to upper heating part, the control cabinet
Control circuit and MCU are inside provided with, control panel is provided with outside it；The temperature control inductor temperature sensor data, by data transfer
To MCU；MCU adjusts the rising of the ceramic plate temperature of control and lower heating part by calculating control control circuit.
Used as preferred scheme of the invention, the upper heating part is included for fixed upper mounted plate, fixed plate
Lower section is provided with heater box；The upper heater box is A, wherein A >=30mm with upper mounted plate vertical distance.
Used as preferred scheme of the invention, the upper heating part is connected with the fixed plate by shank of bolt, both
Between accompany heat sink, the heat sink inside includes that a fan and is used to arrange the reason line box of circuit, the fan
It is electrically connected with the control circuit, the heat sink shell body is provided with louvre.
Used as preferred scheme of the invention, the lower heating part includes a bottom plate, and the bottom plate top is provided with
Once heater box；The bottom plate front and back end is respectively equipped with some cylinders, and the cylinder drives heater box to move up and down.
Used as preferred scheme of the invention, the cylinder rod upper end of the cylinder connects a linkage board, the cylinder rod and connection
Dynamic plate is bolted；The opposite side of the linkage board connects the lower heater box by shank of bolt, is stretched in cylinder rod
Cheng Zhong, the linkage board drives lower heater box to move up and down.
Used as preferred scheme of the invention, the upper heater box is all the knot of the semiclosed one side opening in three faces with lower heater box
Structure, the ceramic wafer is all located at opening surface, that is, go up the lower surface of heater box, the upper surface of lower heater box.
Used as preferred scheme of the invention, the temperature control inductor is installed between heater box and ceramic wafer, is specifically loaded on
Left side, middle and right side in heater box.
Used as preferred scheme of the invention, ceramic wafer is arc chip architecture, and its cambered surface convex portion rushes at respective heater box direction,
The parallel longitudinal some connecting rods of arrangement of hot type, the connecting rod front and back end is fixed on heater box front-back, equidistant on the connecting rod
It is stained with some ceramic wafers.
Used as preferred scheme of the invention, the ceramic wafer on adjacent two connecting rod is staggered in the case where same level is horizontal, described
Ceramic plate thickness is B, and each ceramic wafer is with adjacent ceramic wafer all around apart from C, wherein 5mm≤B≤10mm；10mm≤C≤
30mm。
As preferred scheme of the invention, heating nickel wire, the nickel wire and control electricity are provided with inside the ceramic wafer (231)
Road is electrically connected, and the ceramic wafer that control circuit can be respectively to left part, middle part and right part is controlled respectively.
Beneficial effect
The present invention proposes a kind of TPI preheating devices, preheating device include upper heating part, lower heating part and with this two parts
Heatable ceramic wafer is provided with the control cabinet being electrically connected, upper heating part and lower heating part；It is provided with around ceramic wafer in heating part
Temperature control inductor, the temperature control inductor is electrically connected with the control cabinet；The lower heating part moves up and down relative to upper heating part,
Control circuit and MCU are provided with the control cabinet, control panel is provided with outside it；The temperature control inductor temperature sensor data,
Transfer data to MCU；MCU adjusts the rising of the ceramic plate temperature of control and lower heating part by calculating control control circuit.This
The structure of application effectively for TPI preheats water removal can ensure its uniformity for heating by multi-point temperature measurement, improve pre- thermal effect
Really.The temperature control sensing of its left, center, right can perceive more sensitive temperature change, make its temperature more balanced by branch's control heating,
The effect of preheating water removal will not be reduced because of both sides heat energy loss.Former TPI preheating devices uniform temperature can thus device by the temperature difference
5 DEG C are down to from 25 DEG C.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
Other accompanying drawings are obtained with according to these accompanying drawings.
Fig. 1 is structural representation of the invention；
Fig. 2 is the lower heating part dimensional structure diagram of the present invention shown in Fig. 1.
Upper heating part 1, upper mounted plate 11, heat sink 12, upper heater box 13, lower heating part 2, bottom plate 21, cylinder
22, cylinder rod 221, lower heater box 23, ceramic wafer 231, linkage board 24, control cabinet 3.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, the scope of protection of the invention is belonged to.
TPI preheating devices as shown in Figure 1, 2, preheating device include upper heating part 1, lower heating part 2 and with this two parts
Heatable ceramic wafer 231 is provided with the control cabinet 3 being electrically connected, upper heating part 1 and lower heating part 3；Ceramic wafer 231 in heating part
Surrounding is provided with temperature control inductor, and temperature control inductor is electrically connected with the control cabinet 3；Lower heating part 2 on upper heating part 1 relative to moving down
It is dynamic, control circuit and MCU are provided with control cabinet 3, control panel is provided with outside it；Temperature control inductor temperature sensor data, by number
According to being transferred to MCU；MCU adjusts the rising of the control temperature of ceramic wafer 231 and lower heating part 2 by calculating control control circuit.This
Control cabinet internal component in product is prior art and known technology, its control cabinet model such as W700-M-2661 etc., its
Internal control circuit is similarly part disclosed in prior art with MCU, be will not be described here.
Upper heating part 1 includes that, for fixed upper mounted plate 11, the lower section of upper mounted plate 11 is provided with heater box 13；Upper heating
Case 13 is A, wherein A >=30mm with the vertical distance of upper mounted plate 11.Wherein distance preferably 30mm, but it is not to be exceeded 200mm.
Upper heating part 1 is connected with fixed plate 11 by shank of bolt, and heat sink 12, heat sink are accompanied between the two
12 inside include a fan and one is used to arrange the reason line box of circuit, and fan is electrically connected with control circuit, on heat sink shell body
It is provided with louvre.
Lower heating part includes a bottom plate 21, and the top of bottom plate 21 is provided with heater box 23；Before bottom plate 21
Rear end is respectively equipped with some cylinders 22, and cylinder 22 drives heater box 23 to move up and down.
The upper end of cylinder rod 221 of cylinder 22 connects a linkage board 24, and cylinder rod 221 is bolted with linkage board 24；
The opposite side of linkage board connects the lower heater box 23 by shank of bolt, in the telescopic process of cylinder rod 221, under linkage board drives
Heater box 23 is moved up and down.
Upper heater box 13 is all the structure of the semiclosed one side opening in three faces with lower heater box 23, and ceramic wafer 231 is all located at and opens
Mouth face, that is, go up the lower surface of heater box 13, the upper surface of lower heater box 23.
Temperature control inductor is installed between heater box and ceramic wafer, the specific left side loaded in heater box, middle and right side.
Ceramic wafer 231 is arc chip architecture, and its cambered surface convex portion rushes at respective heater box direction, the parallel longitudinal arrangement of hot type
Some connecting rods, connecting rod front and back end is fixed on heater box front-back, and some ceramic wafers are equidistantly stained with connecting rod.
Ceramic wafer on adjacent two connecting rod is staggered in the case where same level is horizontal, as illustrated, can interlock for tile type
Structure, the ceramic plate thickness is B, and each ceramic wafer is with adjacent ceramic wafer all around apart from C, wherein 5mm≤B≤10mm；
10mm≤C≤30mm.Wherein preferred B=13mm, C=20mm.
Heating nickel wire is provided with inside ceramic wafer 231, the nickel wire is electrically connected with control circuit, and control circuit can respectively to a left side
The ceramic wafer of portion, middle part and right part is controlled respectively.It is described to control circuit structure for published technology, not described here any more.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (10)
1.TPI preheating devices, preheating device includes upper heating part (1), lower heating part (2) and the control cabinet being electrically connected with this two parts
(3), it is characterised in that be provided with heatable ceramic wafer (231) in the upper heating part (1) and lower heating part (3)；In heating part
Ceramic wafer (231) around be provided with temperature control inductor, the temperature control inductor is electrically connected with the control cabinet (3)；The lower heating
Portion (2) is moved up and down relative to upper heating part (1), and control circuit and MCU are provided with the control cabinet (3), and control is provided with outside it
Panel processed；The temperature control inductor temperature sensor data, transfer data to MCU；MCU is by calculating control control circuit regulation
Control ceramic wafer (231) temperature and the rising of lower heating part (2).
2. TPI preheating devices according to claim 1, it is characterised in that the upper heating part (1) is including for fixed
Upper mounted plate (11), fixed plate (11) lower section is provided with heater box (13)；The upper heater box (13) and upper mounted plate
(11) vertical distance is A, wherein A >=30mm.
3. TPI preheating devices according to claim 2, it is characterised in that the upper heating part (1) and the fixed plate
(11) it is connected by shank of bolt, heat sink (12) is accompanied between the two, a wind is included inside the heat sink (12)
The reason line box that fan is used to arrange circuit with one, the fan is electrically connected with the control circuit, is set on the heat sink shell body
There is louvre.
4. TPI preheating devices according to claim 1, it is characterised in that the lower heating part includes a bottom plate
(21), bottom plate (21) top is provided with heater box (23)；The bottom plate (21) is if front and back end is respectively equipped with
Dry gas cylinder (22), the cylinder (22) drives heater box (23) to move up and down.
5. TPI preheating devices according to claim 4, its feature is being, on the cylinder rod (221) of the cylinder (22)
End one linkage board of connection (24), the cylinder rod (221) is bolted with linkage board (24)；The opposite side of the linkage board
The lower heater box (23) is connected by shank of bolt, in cylinder rod (221) telescopic process, the linkage board drives lower heater box
(23) move up and down.
6. TPI preheating devices according to claim 1, it is characterised in that the upper heater box (13) and lower heater box
(23) structure of the semiclosed one side opening in three faces is all, the ceramic wafer (231) is all located at opening surface, that is, goes up heater box (13)
Lower surface, the upper surface of lower heater box (23).
7. TPI preheating devices according to claim 6, it is characterised in that the temperature control inductor be installed on heater box with
Between ceramic wafer, the specific left side loaded in heater box, middle and right side.
8. TPI preheating devices according to claim 1, it is characterised in that ceramic wafer (231) is arc chip architecture, its arc
Face convex portion rushes at respective heater box direction, and hot type is parallel longitudinal to arrange some connecting rods, and heating is fixed in the connecting rod front and back end
On case front-back, some ceramic wafers are equidistantly stained with the connecting rod.
9. TPI preheating devices according to claim 8, it is characterised in that the ceramic wafer on adjacent two connecting rod is in same water
It is flat it is horizontal under be staggered, the ceramic plate thickness is B, and each ceramic wafer is with adjacent ceramic wafer all around apart from C, wherein 5mm
≤B≤10mm；10mm≤C≤30mm.
10. TPI preheating devices according to claim 1, it is characterised in that is provided with heating inside the ceramic wafer (231)
Nickel wire, the nickel wire is electrically connected with control circuit, and the ceramic wafer that control circuit can be respectively to left part, middle part and right part is controlled respectively
System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621147564.9U CN206192094U (en) | 2016-10-21 | 2016-10-21 | Tpi preheating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621147564.9U CN206192094U (en) | 2016-10-21 | 2016-10-21 | Tpi preheating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206192094U true CN206192094U (en) | 2017-05-24 |
Family
ID=58731880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621147564.9U Active CN206192094U (en) | 2016-10-21 | 2016-10-21 | Tpi preheating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206192094U (en) |
-
2016
- 2016-10-21 CN CN201621147564.9U patent/CN206192094U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: TPI preheating device Effective date of registration: 20180905 Granted publication date: 20170524 Pledgee: Huang Mingan Pledgor: Zhuhai Yatai Electronic Technology Co., Ltd. Registration number: 2018440000254 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191012 Granted publication date: 20170524 Pledgee: Huang Mingan Pledgor: Zhuhai Yatai Electronic Technology Co., Ltd. Registration number: 2018440000254 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210113 Address after: 519000 Zone E, 1st and 2nd floor, phase II plant, No. 36, Jinfeng West Road, high tech Zone, Zhuhai City, Guangdong Province Patentee after: Wuxi Youtai New Material Technology Co., Ltd. Zhuhai branch Address before: 519000 area a and B on the first floor and area B on the second floor of No.23 Jinfeng West Road, Jinding Science and Technology Industrial Park, Zhuhai City, Guangdong Province Patentee before: ZHUHAI YATAI ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220307 Address after: 330899 south of Yong'an Avenue and west of Youxun Road, Gao'an hi tech Industrial Park, Yichun City, Jiangxi Province Patentee after: Jiangxi Youti New Material Technology Co.,Ltd. Address before: 519000 Zone E, 1st and 2nd floor, phase II plant, No. 36, Jinfeng West Road, high tech Zone, Zhuhai City, Guangdong Province Patentee before: Wuxi Youtai New Material Technology Co.,Ltd. Zhuhai branch |