CN206165080U - On -vehicle player with high heat dissipating ability - Google Patents
On -vehicle player with high heat dissipating ability Download PDFInfo
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- CN206165080U CN206165080U CN201621182086.5U CN201621182086U CN206165080U CN 206165080 U CN206165080 U CN 206165080U CN 201621182086 U CN201621182086 U CN 201621182086U CN 206165080 U CN206165080 U CN 206165080U
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- plate
- installation region
- heat
- high heat
- mainboard
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Abstract
The utility model discloses an on -vehicle player with high heat dissipating ability, including control panel and quick -witted case, the machine case has hollow accommodation space, installs mainboard PCB in the accommodation space, and the rear end of quick -witted case is connected with the heating panel, be provided with power installation region, nuclear core plate installation region and power board installation region on the mainboard PCB, be provided with a plurality of support piece in the nuclear core plate installation region, a plurality of support piece's upper end is connected with the heat -dissipating frame body, and the lower extreme of the heat -dissipating frame body has nuclear core plate mounting panel, and heat -dissipating frame body upper end can be dismantled to be connected with to seal and to be held open -ended heat dissipation apron. It has changed traditional heat radiation structure thinking, carries out each source that generates heat on the mainboard PCB rational arrangement of and for it designs relatively independent heat dissipation channel, can accelerate the radiating efficiency in each source that generates heat, improves the stability of entire system operation.
Description
Technical field
The utility model is related to in-vehicle player technical field, more particularly, to the vehicle-mounted broadcasting with high heat dispersion
Device.
Background technology
In-vehicle player is mounted in automobile, for the multimedia play system that in-car passenger provides audio-visual amusement,
It generally includes control panel and host machine part, and control panel is used to operating and showing effect that host machine part to be then by each
The setting of functional part and circuit board is realizing the functions such as power amplifier, energy supply.Each functional part and circuit board are mounted in mostly
It is to reduce the impact to whole system operation stability because they are all pyrotoxins in cabinet, need to be also provided with cabinet
Radiator structure is reducing the temperature in cabinet.At present, in-vehicle player is to accelerate the radiating of cabinet by arranging fin mostly,
Due in cabinet and it is unallocated have relatively independent installation region to arrange each functional module, thus, each functional module according to
Can so there is interactional situation, and then, substantially reduce radiating effect.
Utility model content
The purpose of this utility model is the problems referred to above for overcoming prior art, there is provided the vehicle-mounted broadcasting with high heat dispersion
Device, it changes traditional radiator structure thinking, and each pyrotoxin on mainboard PCB is carried out into reasonable Arrangement and phase is designed for it
To independent heat dissipation channel, the radiating efficiency of each pyrotoxin can be accelerated, improve the stability of whole system operation.
The purpose of this utility model is achieved through the following technical solutions：
In-vehicle player with high heat dispersion, including control panel and be connected with control panel and positioned at control panel
The cabinet of rear end；
Cabinet has hollow receiving space, and mainboard PCB is provided with receiving space, and the rear end of cabinet is connected with radiating
Plate；
Power supply installing zone domain, core board installation region and power board installation region, power supply installing zone are provided with mainboard PCB
Domain and core board installation region are located at respectively left part and the rear portion of mainboard PCB, and both of which is located at before power board installation region
Side；
Several support members are provided with core board installation region, the upper end of several support members is connected with radiating frame,
The lower end of radiating frame has core board installing plate, and radiating frame upper end is removably connected with the dissipating cover that can close the end opening
Plate.
In the utility model, circuit board and input button of display function etc. are provided with control panel, it is mainly used in
Input operation and display；Cabinet is used to install the functional module for realizing the functions such as power amplifier and energy supply.In traditional in-vehicle player,
On the premise of arranging louvre on cabinet, or being to carry out radiating treatment by adding heat sink, or being by adding
Fan carries out radiating treatment, for the former, radiating effect can be reduced if a number of cooling plate structure is not provided with, but dissipates
Hot plate quantity is more and can affect the weight of whole machine；For the latter, though there is preferable radiating effect, during air draught
The foreign matters such as more dust, impurity can be brought into, so, the performance of main frame will certainly be affected, meanwhile, shorten the components and parts life-span.For this purpose,
The utility model changes traditional thinking, each pyrotoxin on mainboard PCB is carried out into reasonable Arrangement and is designed relatively for it
Independent heat dissipation channel, can accelerate the radiating efficiency of each pyrotoxin, improve the stability of whole system operation.
Using when, power amplifier module, power module and CPU module are main pyrotoxin, for this purpose, this practicality is new
Type is spatially staggeredly arranged this three big heating module, wherein, power amplifier module is installed on power board installation region, it
Positioned at the tail end of mainboard PCB, the quick heat radiating for directly carrying out backward by heat sink.CPU module is installed on radiating frame
In vivo, because radiating frame is arranged in core board installation region by support member, thus, when CPU module is installed
When in radiating frame, its height and position is higher than power module and power amplifier module, and so, it can be by the resistance of radiating frame
Disconnected effect forms an independent heat-dissipating space, can not only reduce the impact to other heating modules, moreover it is possible to which carry out upwards is fast
Speed radiating.Power module is positioned over power supply installing zone domain, and it is located at the left part of mainboard PCB, and power supply installing zone domain should be left enough
Space.Due to the impact without other pyrotoxins, power supply installing zone domain can be provided with auxiliary-radiating structure and can also make power supply
Module self radiates.
It can be seen that, the utility model can reduce each by carrying out the appropriate design in the arrangement of space to each pyrotoxin
Influencing each other between thermal source, and accelerate the radiating efficiency of each functional area, with excellent in heat dissipation effect, pollute little, low cost
Honest and clean and stable advantage.
To realize the connection between cabinet and control panel and heat sink, further, the cabinet includes mounting frame
With cabinet cover plate, mounting frame has mainboard installing plate, and the left end of mainboard installing plate is upwardly extended and is provided with left plate, mainboard peace
The right-hand member of dress plate is upwardly extended and is provided with right plate, the top of left plate and right plate respectively with the left and right two ends phase of cabinet cover plate
Even, the rear end of left plate and right plate is connected respectively with the left and right two ends of the heat sink, and the front end of left plate and right plate is equal
It is connected with the rear end of the control panel.Mainboard installing plate is used to install mainboard PCB.
Further, several are provided with through its upper and lower end face on the core board installing plate and the heat-dissipating cover plate
The first louvre；
The mainboard installing plate is provided with several through its upper and lower end face and corresponding with the first louvre second radiates
Hole；
The cabinet cover plate is arranged in the region of the correspondence core board installation region and the power board installation region
There are several the 3rd louvres through its upper and lower end face.
In the utility model, the second louvre is located in the region corresponding to core board installation region.Core board installing plate
With the heat dissipation channel that the first louvre on heat-dissipating cover plate can form upper and lower drainage, add the second louvre and the 3rd louvre with
Between the former cross-ventilation effect, can OverDrive CPU module radiating efficiency.
Further, correspondence is offered and through the 4th louvre for arranging on the left plate and the right plate.The
The setting of four louvres, can accelerate the air convection efficiency in region between left plate and right plate, and then accelerate power supply installing zone
Domain and the radiating efficiency of power board installation region.
To further speed up the radiating efficiency of power amplifier installation region, further, on the heat sink several are offered
Through the 5th louvre of its front/rear end.
Further, the radiating frame periphery is provided with heat-insulated framework, is connected between radiating frame and heat-insulated framework
Several first fin.Heat-insulated framework can stop that the heat in core board installation region spreads to surrounding, and dissipate by first
The setting of backing is by the heat drainage upwards conducted by radiating frame.
For the heat quickly drainage upwards for CPU module is produced, further, two adjacent described first
Fin is formed with the first guiding gutter of upper and lower drainage.First fin plays radiating and water conservancy diversion.
To accelerate the radiating efficiency of power amplifier module, further, power board peace is provided with the power board installation region
Dress plate, is provided with several the second fin on power board installing plate, one end of the second fin is connected with power board installing plate,
Its other end is connected with the medial surface of the heat sink.
For the heat quickly drainage backward for power amplifier module is produced, further, two adjacent second fin
It is formed with the second guiding gutter of before and after drainage.
The utility model has the advantages that：The utility model is spatially staggered three big heating modules
Arrangement, wherein, power amplifier module is installed on power board installation region, and it is located at the tail end of mainboard PCB, is directly carried out by heat sink
Quick heat radiating backward.CPU module is installed in radiating frame, because radiating frame is arranged at by support member
In core board installation region, thus, when CPU module is installed in radiating frame, its height and position is higher than electricity
Source module and power amplifier module, so, it can form an independent heat-dissipating space by the blocking effect of radiating frame, can not only
Reduce the impact to other heating modules, moreover it is possible to carry out quick heat radiating upwards.Power module is positioned over power supply installing zone domain, it
Positioned at the left part of mainboard PCB, power supply installing zone domain should leave enough spaces.Due to the impact without other pyrotoxins, power supply peace
Dress region can be provided with auxiliary-radiating structure can also make power module auto-radiating.It can be seen that, the utility model is by each
Individual pyrotoxin carries out the appropriate design in the arrangement of space, can reduce influencing each other between each pyrotoxin, and accelerates each work(
The radiating efficiency in energy region, has the advantages that excellent in heat dissipation effect, pollutes little, with low cost and stable.
Description of the drawings
In order to be illustrated more clearly that embodiment of the present utility model, below will be to describing needed for the utility model embodiment
The accompanying drawing to be used is briefly described.It will be apparent that drawings in the following description are only described in the utility model
Some embodiments, for a person skilled in the art, in the case where creative work is not paid, can be with according to following
Accompanying drawing, obtain other accompanying drawings.
Fig. 1 is that the structure of one specific embodiment of in-vehicle player with high heat dispersion described in the utility model is shown
It is intended to；
Fig. 2 is that mainboard PCB mono- is embodied as in the in-vehicle player with high heat dispersion described in the utility model
The structural representation of example；
Fig. 3 is that mainboard PCB mono- is embodied as in the in-vehicle player with high heat dispersion described in the utility model
The structural representation of example；
Fig. 4 is that mounting frame one is embodied as in the in-vehicle player with high heat dispersion described in the utility model
The structural representation of example；
Fig. 5 is that radiating frame one is embodied as in the in-vehicle player with high heat dispersion described in the utility model
The structural representation of example；
Fig. 6 is radiating frame and heat-dissipating cover plate one in the in-vehicle player with high heat dispersion described in the utility model
The structural representation of individual specific embodiment；
Fig. 7 is heat sink and power board installing plate in the in-vehicle player with high heat dispersion described in the utility model
The structural representation of one specific embodiment.
Wherein, the corresponding parts title of reference is as follows：1st, control panel, 2, cabinet, 3, receiving space, 4, mainboard
PCB, 5, heat sink, 6, power supply installing zone domain, 7, core board installation region, 8, power board installation region, 9, power board installing plate,
10th, the second fin, 11, support member, 12, radiating frame, 13, core board installing plate, 14, mainboard installing plate, 15, chassis lid
Plate, 16, left plate, 17, right plate, the 18, first louvre, the 19, second louvre, the 20, the 3rd louvre, the 21, the 4th radiating
Hole, the 22, the 5th louvre, 23, heat-insulated framework, the 24, first fin, the 25, first guiding gutter, 26, heat-dissipating cover plate, 27, second
Guiding gutter, the 28, the 6th louvre.
Specific embodiment
In order that those skilled in the art more fully understands the utility model, below in conjunction with the utility model embodiment
In accompanying drawing clear, complete description is carried out to the technical scheme in the utility model embodiment.It will be apparent that described below
Embodiment be only a part in the utility model embodiment, rather than all.Based on the enforcement that the utility model is recorded
Example, other all embodiments that those skilled in the art obtain in the case where creative work is not paid are new in this practicality
In the range of type protection.
Embodiment 1
As shown in Figures 1 to 7, the in-vehicle player with high heat dispersion, including control panel 1 and with control panel 1
It is connected and positioned at the cabinet 2 of the rear end of control panel 1；
Cabinet 2 has hollow receiving space 3, and receiving space 3 is interior to be provided with mainboard PCB4, and the rear end of cabinet 2 is connected with
Heat sink 5；
Power supply installing zone domain 6, core board installation region 7 and power board installation region 8, power supply peace are provided with mainboard PCB4
Dress region 6 and core board installation region 7 are located at respectively left part and the rear portion of mainboard PCB4, and both of which is located at power board installing zone
The front in domain 8；
Several support members 11 are provided with core board installation region 7, the upper end of several support members 11 is connected with radiating
Framework 12, the lower end of radiating frame 12 has core board installing plate 13, and the upper end of radiating frame 12 is removably connected with and can close this
The heat-dissipating cover plate 26 of end opening.
In the present embodiment, circuit board and input button of display function etc. are provided with control panel 1, it is mainly used in defeated
Enter operation and show；Cabinet 2 is used to install the functional module for realizing the functions such as power amplifier and energy supply.In traditional in-vehicle player,
On the premise of arranging louvre on cabinet 2, or being to carry out radiating treatment by adding heat sink, or being by adding
Fan carries out radiating treatment, for the former, radiating effect can be reduced if a number of cooling plate structure is not provided with, but dissipates
Hot plate quantity is more and can affect the weight of whole machine；For the latter, though there is preferable radiating effect, during air draught
The foreign matters such as more dust, impurity can be brought into, so, the performance of main frame will certainly be affected, meanwhile, shorten the components and parts life-span.For this purpose,
The present embodiment changes traditional thinking, each pyrotoxin on mainboard PCB4 is carried out into reasonable Arrangement and designs relatively only for it
Vertical heat dissipation channel, can accelerate the radiating efficiency of each pyrotoxin, improve the stability of whole system operation.
Using when, power amplifier module, power module and CPU module are main pyrotoxin, for this purpose, the present embodiment
This three big heating module is spatially staggeredly arranged, wherein, power amplifier module is installed on power board installation region, its position
In the tail end of mainboard PCB4, the direct quick heat radiating for being carried out by heat sink 5 backward.CPU module is installed on radiating frame
In body 12, because radiating frame 12 is arranged in core board installation region 7 by support member 11, thus, work as central processing unit
When module is installed in radiating frame 12, its height and position is higher than power module and power amplifier module, and so, it can be by dissipating
The blocking effect of hot framework 12 forms an independent heat-dissipating space, can not only reduce the impact to other heating modules, moreover it is possible to
Carry out quick heat radiating upwards.Power module is positioned over power supply installing zone domain 6, and it is located at the left part of mainboard PCB4, and power supply is installed
Region 6 should leave enough spaces.Due to the impact without other pyrotoxins, power supply installing zone domain 6 can be provided with auxiliary and dissipate
Heat structure can also make power module auto-radiating.
It can be seen that, the present embodiment can reduce each heating by carrying out the appropriate design in the arrangement of space to each pyrotoxin
Influencing each other between source, and accelerate the radiating efficiency of each functional area, with excellent in heat dissipation effect, pollute little, with low cost
And stable advantage.
To realize the connection between cabinet 2 and control panel 1 and heat sink 5, it is preferable that the cabinet 2 includes installing frame
Body and cabinet cover plate 15, mounting frame has mainboard installing plate 14, and the left end of mainboard installing plate 14 is upwardly extended and is provided with left side
Plate 16, the right-hand member of mainboard installing plate 14 upwardly extend be provided with the top of right plate 17, left plate 16 and right plate 17 respectively with
The left and right two ends of cabinet cover plate 15 are connected, the rear end of left plate 16 and right plate 17 respectively with the left and right two ends of the heat sink 5
It is connected, the front end of left plate 16 and right plate 17 is connected with the rear end of the control panel 1.Mainboard installing plate 14 is used to install
Mainboard PCB4.
Preferably, several are provided with through its upper and lower side on the core board installing plate 13 and the heat-dissipating cover plate 26
First louvre 18 in face；
The mainboard installing plate 14 be provided with several through its upper and lower end face and with the first louvre 18 corresponding second
Louvre 19；
The cabinet cover plate 15 is in the region of the correspondence core board installation region 7 and the power board installation region 8
It is provided with several the 3rd louvres 20 through its upper and lower end face.
In the present embodiment, several sixth louvres 28 corresponding with the first louvre 18 are also provided with mainboard PCB.
Second louvre 19 is located in the region corresponding to core board installation region 7.On core board installing plate 13 and heat-dissipating cover plate 26
First louvre 18 can form the heat dissipation channel of upper and lower drainage, add the second louvre 19 and the 3rd louvre 20 and the former between
Cross-ventilation effect, can OverDrive CPU module radiating efficiency.Wherein, the first radiating on core board installing plate 13
The section in hole 18 may be designed as circle, and the section of the first louvre 18 on heat-dissipating cover plate 26 may be designed as strip；Second dissipates
The section of hot hole 19 may be designed as circle；The section of the 3rd louvre 20 may be designed as strip.Heat-dissipating cover plate 26 and radiating frame
Being detachably connected between body 12 can be attached from trip bolt.
Preferably, correspondence is offered and through the 4th louvre for arranging on the left plate 16 and the right plate 17
22.The setting of the 4th louvre 22, can accelerate the air convection efficiency in region between left plate 16 and right plate 17, and then accelerate
Power supply installing zone domain 6 and the radiating efficiency of power board installation region 8.Wherein, the section of the 4th louvre 22 may be designed as strip
Shape.
To further speed up the radiating efficiency of power amplifier installation region 8, it is preferable that offer several on the heat sink 5
Through the 5th louvre 21 of its front/rear end.Wherein, the section of the 5th louvre may be designed as strip.
Preferably, the periphery of the radiating frame 12 is provided with heat-insulated framework 23, between radiating frame 12 and heat-insulated framework 23
It is connected with several the first fin 24.Heat-insulated framework 23 can stop that the heat in core board installation region 7 spreads to surrounding, and
By the setting of the first fin 24 by the heat drainage upwards conducted by radiating frame 12.
For the heat quickly drainage upwards for CPU module is produced, it is preferable that two adjacent described first dissipate
Backing 24 is formed with the first guiding gutter 25 of upper and lower drainage.First fin 24 plays radiating and water conservancy diversion.
To accelerate the radiating efficiency of power amplifier module, it is preferable that be provided with power board installation in the power board installation region 8
Plate 9, is provided with several the second fin 10, one end and the power board installing plate 9 of the second fin 10 on power board installing plate 9
It is connected, its other end is connected with the medial surface of the heat sink 5.
For the heat quickly drainage backward for power amplifier module is produced, it is preferable that two adjacent second fin 10
It is formed with the second guiding gutter 27 of before and after drainage.
Above content is to combine the further description that specific preferred embodiment is made to the utility model, it is impossible to recognized
Fixed specific embodiment of the present utility model is confined to these explanations.For the common skill of the utility model art
For art personnel, the other embodiment drawn under without departing from the technical solution of the utility model should be included in this practicality
In new protection domain.
Claims (9)
1. there is the in-vehicle player of high heat dispersion, it is characterised in that：Including control panel（1）And with control panel（1）Phase
Even and positioned at control panel（1）The cabinet of rear end（2）；
Cabinet（2）With hollow receiving space（3）, receiving space（3）Mainboard PCB is inside installed（4）, cabinet（2）Rear end
It is connected with heat sink（5）；
Mainboard PCB（4）On be provided with power supply installing zone domain（6）, core board installation region（7）And power board installation region（8）, electricity
Source installation region（6）With core board installation region（7）Mainboard PCB is located at respectively（4）Left part and rear portion, and both of which be located at work(
Put plate installation region（8）Front；
Core board installation region（7 ）Inside it is provided with several support members（11）, several support members（11）Upper end be connected with it is scattered
Hot framework（12）, radiating frame（12）Lower end there is core board installing plate（13）, radiating frame（12）Upper end is detachably connected
Having can close the heat-dissipating cover plate of the end opening（26）.
2. the in-vehicle player with high heat dispersion according to claim 1, it is characterised in that：The cabinet（2）Bag
Include mounting frame and cabinet cover plate（15）, mounting frame has mainboard installing plate（14）, mainboard installing plate（14）Left end upwards
Being extended has left plate（16）, mainboard installing plate（14）Right-hand member upwardly extend and be provided with right plate（17）, left plate（16）
And right plate（17）Top respectively with cabinet cover plate（15）Left and right two ends be connected, left plate（16）And right plate（17）After
End respectively with the heat sink（5）Left and right two ends be connected, left plate（16）And right plate（17）Front end with the control
Panel（1）Rear end be connected.
3. the in-vehicle player with high heat dispersion according to claim 2, it is characterised in that：The core board is installed
Plate（13）With the heat-dissipating cover plate（26）On be provided with several the first louvres through its upper and lower end face（18）；
The mainboard installing plate（14）Be provided with several through its upper and lower end face and with the first louvre（18）Corresponding second
Louvre（19）；
The cabinet cover plate（15）In the correspondence core board installation region（7）With the power board installation region（8）Region
Inside it is provided with several the 3rd louvres through its upper and lower end face（20）.
4. the in-vehicle player with high heat dispersion according to claim 2, it is characterised in that：The left plate（16）
With the right plate（17）On offer correspondence and through arrange the 4th louvre（22）.
5. the in-vehicle player with high heat dispersion according to claim 1, it is characterised in that：The heat sink（5）
On offer several the 5th louvres through its front/rear end（21）.
6. the in-vehicle player with high heat dispersion according to any one in claim 1 ~ 5, it is characterised in that：Institute
State radiating frame（12）Periphery is provided with heat-insulated framework（23）, radiating frame（12）With heat-insulated framework（23）Between be connected with it is some
Individual first fin（24）.
7. the in-vehicle player with high heat dispersion according to claim 6, it is characterised in that：Two adjacent described first
Fin（24）It is formed with the first guiding gutter of upper and lower drainage（25）.
8. the in-vehicle player with high heat dispersion according to claim 6, it is characterised in that：The power board is installed
Region（8）Inside it is provided with power board installing plate（9）, power board installing plate（9）On several the second fin are installed（10）, the
Two fin（10）One end and power board installing plate（9）It is connected, its other end and the heat sink（5）Medial surface phase
Even.
9. the in-vehicle player with high heat dispersion according to claim 8, it is characterised in that：Two adjacent described second
Fin（10）It is formed with the second guiding gutter of before and after drainage（27）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621182086.5U CN206165080U (en) | 2016-11-03 | 2016-11-03 | On -vehicle player with high heat dissipating ability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621182086.5U CN206165080U (en) | 2016-11-03 | 2016-11-03 | On -vehicle player with high heat dissipating ability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206165080U true CN206165080U (en) | 2017-05-10 |
Family
ID=58657334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621182086.5U Active CN206165080U (en) | 2016-11-03 | 2016-11-03 | On -vehicle player with high heat dissipating ability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206165080U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306114A (en) * | 2017-12-08 | 2018-07-20 | 佛吉亚好帮手电子科技有限公司 | The structure of Multi-Function Antenna built in vehicle entertainment system |
-
2016
- 2016-11-03 CN CN201621182086.5U patent/CN206165080U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306114A (en) * | 2017-12-08 | 2018-07-20 | 佛吉亚好帮手电子科技有限公司 | The structure of Multi-Function Antenna built in vehicle entertainment system |
| CN108306114B (en) * | 2017-12-08 | 2020-10-23 | 佛吉亚歌乐电子(丰城)有限公司 | Structure of built-in multifunctional antenna of vehicle-mounted entertainment system |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 401120 Chongqing Yubei District Hui Xing Street Garment City Avenue, No. 83 1 building Patentee after: Beidou star Tong (Chongqing) Automotive Electronics Co., Ltd. Address before: 401120 Chongqing Yubei District Hui Xing Street Garment City Avenue, No. 83 1 building Patentee before: Chongqing Shenyu Beidou Automobile Electronic Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220623 Address after: 401120 No.3, Tonggui Avenue, Yufengshan Town, Yubei District, Chongqing Patentee after: Beidou Xingtong Zhilian Technology Co.,Ltd. Address before: 401120 the whole building of Building 1, No. 83, clothing City Avenue, Huixing street, Yubei District, Chongqing Patentee before: BDSTAR (CHONGQING) AUTO ELECTRONIC CO.,LTD. |