CN206163486U - Adopt flip -chip LED filament slide of eutectic mode - Google Patents

Abstract

The utility model discloses an adopt flip -chip LED filament slide of eutectic mode, including the carrier support of the hard material of texture, upward electrically conductive printed wire, electrically conductive printed wire, multi -disc LED wafer and coating fluorescent layer down, it is parallel to each other with down electrically conductive printed wire to go up electrically conductive printed wire, all set up a plurality of archs at last electrically conductive printed wire in printed wire's the opposite with electrically conducting down, go up the protruding one -to -one on the protruding and down electrically conductive printed wire on the electrically conductive printed wire, the both ends of every LED wafer all through the tin cream welding last electrically conductive printed wire with electrically conduct down in a pair of arch of on printed wire constitution, multi -disc LED wafer is a straight line row and opens, still set up the coating fluorescent layer on the carrier support between arbitrary two adjacent LED wafers, the interval size that the width and the last electrically conductive printed wire of coating fluorescent layer and the printed wire that electrically conducts down went up between the relative a pair of arch equals. By adopting the above structure, the utility model, LED filament slide hardness is high, be difficult for buckling, can not appear the blue light and electric conductivity is good, and the illuminating effect improves greatly.

Description

Using the flip LED filament mating plate of eutectic mode

Technical field

This utility model is related to field of light fittings, in particular it relates to using the flip LED filament mating plate of eutectic mode.

Background technology

LED illumination, also known as LED lighting, is by the use of solid semiconductor chip as luminescent material, in the semiconductors By carrier occur it is compound release superfluous energy and cause photon to launch, directly send it is red, yellow, blue, green, blue or green, orange, purple, The light of white.As ordinary incandescent lamp progressively exits illumination market, LED type lighting source is capturing rapidly whole illumination city .Existing LED light source welds carrier using aluminium base as LED, and aluminium base has hardness due to the material behavior of itself It is not good, the easy defect of bending, easily occur during in addition existing LED light source is welded using welding wire solder joint do not glue, Pulling force is not enough, stick together between bonding wire and bonding wire, solder joint is partially welded the situation for causing to bridge, and conforming product rate is low.In addition, existing LED illumination electric conductivity is not good, easily separates out blue light, and illuminating effect is not good.

Utility model content

This utility model overcomes the deficiencies in the prior art, there is provided using the flip LED filament mating plate of eutectic mode, should LED filament mating plate hardness is high, not pliable, will not separate out blue light and good conductivity, and illuminating effect is greatly improved.

The technical scheme in the invention for solving the above technical problem is：Using the flip LED filament light of eutectic mode Piece, including the carrier bracket of quality stiff materials, upper conductive printed wire road, lower conductive printed wire road, plurality of LED chip and coating Fluorescence coating, the upper conductive printed wire road and lower conductive printed wire road are parallel to each other, in upper conductive printed wire road and lower conductive print Multiple projections are respectively provided with the opposite of brush circuit, the projection on raised and lower conductive printed wire road on upper conductive printed wire road Correspond, the two ends of every LED wafer are welded on group on upper conductive printed wire road and lower conductive printed wire road by tin cream Into a pair of projections on, plurality of LED chip is arranged in straight line, the carrier bracket between arbitrary neighborhood two panels LED wafer On also set up coating fluorescence coating, coat the width of fluorescence coating it is relative with upper conductive printed wire road and lower conductive printed wire road one It is equal in magnitude to the spacing between projection.

Using aluminium base as carrier bracket, LED is welded on aluminium base and is integrally formed knot existing LED lighting source Structure, although aluminium base low price, difference of hardness is easily bent in use deformation, and fixed effect is not good, very not It is adapted to used in fluorescent tube, panel light.This programme adopts the carrier bracket of quality stiff materials, and hardness is high, is unlikely to deform, more suitable Conjunction needs to make the fluorescent tube of solid shape or panel light is used.Pass through bonding wire between existing LED wafer and printed wire It is attached, bonding wire is typically all thinner, arranges between LED wafer than comparatively dense, during being attached by bonding wire Easily occur that solder joint does not glue, pulling force is not enough, stick together between bonding wire and bonding wire, solder joint is partially welded the situation for causing to bridge, we LED wafer two ends in case are directly to be welded in the projection on upper conductive printed wire road and lower conductive printed wire road by tin cream, No longer need to connect by bonding wire, LED wafer is bigger with the contact area on upper conductive printed wire road and lower conductive printed wire road, weldering Connect easily, be less prone to solder joint be partially welded, the situation of bonding wire adhesion, the LED filament qualification rate produced is higher.This programme exists Coating fluorescence coating is respectively provided between two LED wafers of arbitrary neighborhood on carrier bracket, it is to avoid LED wafer has blue light when lighting Separate out, be unfavorable for that LED wafer is conductive due to coating fluorescence coating, therefore do not have in the region that covers on carrier bracket of LED wafer Coating fluorescence coating is set, it is ensured that LED wafer keeps optimal electric conductivity, while will not also separate out blue light.

Preferably, multi-disc fin is also set up on the back side of carrier bracket.Because LED wafer is to be directly installed on conductive print On brush circuit, if the heat in LED wafer is lost not in time can also quickly be delivered on conductive printed wire road, affect conductive The service life of printed wire, and the setting of fin, can quickly lose the heat in LED wafer, it is to avoid its transmission To on conductive printed wire road, it is ensured that its service life.

Preferably, the two ends of the carrier bracket are respectively provided with reflector, and reflector can be rotated around connection end.Due to we Case uses the carrier bracket of quality stiff materials, although but hardness is good, it is also not good to be unlikely to deform motility, this programme Add reflector, the not good defect of the carrier bracket motility for making up quality stiff materials, by the angle for adjusting reflector Degree is the light emission direction of adjustable light source, while also retains the advantage of the carrier bracket itself of quality stiff materials, function is more Plus it is superior.

Preferably, the carrier bracket of the quality stiff materials be safety glass, high-boron-silicon glass, sapphire, ceramics or The carrier bracket of metal.The carrier bracket hardness of this type is big, is unlikely to deform, and easy to process obtains.

Preferably, the mode of printing on upper conductive printed wire road or lower conductive printed wire road is M and the mode of N strings, and M and N is Natural number more than or equal to 1.Because each businessman is different to the mode of printing on conductive printed wire road, this programme arranges various The mode of printing of mode is selected for businessman oneself, and motility is higher, can further improve the competitiveness of manufacturer.

To sum up, the beneficial effects of the utility model are：

1st, this programme adopts the carrier bracket of quality stiff materials, and hardness is high, is unlikely to deform, and is more suitable for needs and makes fixation The fluorescent tube or panel light of shape is used.

2nd, the LED wafer two ends in this programme are directly to be welded on upper conductive printed wire road and lower conductive printing by tin cream In the projection of circuit, it is no longer necessary to connected by bonding wire, LED wafer and upper conductive printed wire road and lower conductive printed wire road connect Contacting surface product is bigger, and welding is easier, be less prone to solder joint be partially welded, the situation of bonding wire adhesion, the LED filament qualification rate produced It is higher, substantially increase the market competitiveness of manufacturer.

3rd, it is respectively provided with coating fluorescence coating between two LED wafers of arbitrary neighborhood of this programme on carrier bracket, it is to avoid LED Chip has blue light to separate out when lighting, and is unfavorable for that LED wafer is conductive due to coating fluorescence coating, therefore LED wafer is in carrier bracket It is not provided with coating fluorescence coating in the region of upper covering, it is ensured that LED wafer keeps optimal electric conductivity, while will not also separate out Blue light, illuminating effect is greatly improved.

4th, this programme adds reflector, the not good defect of the carrier bracket motility for making up quality stiff materials to lead to The angle i.e. light emission direction of adjustable light source of adjustment reflector is crossed, while also retains the carrier bracket of quality stiff materials certainly The advantage of body, function is more superior.

5th, the setting of fin, can quickly lose the heat in LED wafer, it is to avoid it is delivered to conductive printed wire Lu Shang, it is ensured that its service life.

Description of the drawings

Fig. 1 is structural representation of the present utility model.

Labelling and corresponding parts title in accompanying drawing：1st, carrier bracket；2nd, upper conductive printed wire road；3rd, lower conductive printing Circuit；4th, LED wafer；5th, tin cream；6th, fluorescence coating is coated；7th, reflector；8th, fin.

Specific embodiment

With reference to embodiment and accompanying drawing, detailed description further is made to this utility model, but it is of the present utility model Embodiment not limited to this.

Embodiment 1：

As shown in figure 1, this utility model is included using the flip LED filament mating plate of eutectic mode, including the hard material of quality The carrier bracket 1 of material, upper conductive printed wire road 2, lower conductive printed wire road 3, plurality of LED chip 4 and coating fluorescence coating 6, it is described Upper conductive printed wire road 2 and lower conductive printed wire road 3 are parallel to each other, on upper conductive printed wire road 2 and lower conductive printed wire road 3 Multiple projections are respectively provided with opposite, a pair of the projection 1 on raised and lower conductive printed wire road 3 on upper conductive printed wire road 2 Should, the two ends of every LED wafer 4 are welded on conductive printed wire road 2 and lower conductive printed wire road 3 by tin cream 5 and are constituted A pair of projections on, plurality of LED chip 4 is arranged in straight line, the carrier bracket 1 between arbitrary neighborhood two panels LED wafer 4 On also set up coating fluorescence coating 6, coat fluorescence coating 6 width it is relative with upper conductive printed wire road 2 and lower conductive printed wire road 3 A pair of projections between spacing it is equal in magnitude, the electrode of tin cream and LED wafer combines together, formed turning circuit.Quality is hard The carrier bracket 1 of hard material is the carrier bracket of safety glass, high-boron-silicon glass, sapphire, ceramics or metal.

Using aluminium base as carrier bracket, LED is welded on aluminium base and is integrally formed knot existing LED lighting source Structure, although aluminium base low price, difference of hardness is easily bent in use deformation, and fixed effect is not good, very not It is adapted to used in fluorescent tube, panel light.This programme adopts the carrier bracket of quality stiff materials, and hardness is high, is unlikely to deform, more suitable Conjunction needs to make the fluorescent tube of solid shape or panel light is used.Pass through bonding wire between existing LED wafer and printed wire It is attached, bonding wire is typically all thinner, arranges between LED wafer than comparatively dense, during being attached by bonding wire Easily occur that solder joint does not glue, pulling force is not enough, stick together between bonding wire and bonding wire, solder joint is partially welded the situation for causing to bridge, we LED wafer two ends in case are directly to be welded in the projection on upper conductive printed wire road and lower conductive printed wire road by tin cream, No longer need to connect by bonding wire, LED wafer is bigger with the contact area on upper conductive printed wire road and lower conductive printed wire road, weldering Connect easily, be less prone to solder joint be partially welded, the situation of bonding wire adhesion, the LED filament qualification rate produced is higher.This programme exists Coating fluorescence coating is respectively provided between two LED wafers of arbitrary neighborhood on carrier bracket, it is to avoid LED wafer has blue light when lighting Separate out, be unfavorable for that LED wafer is conductive due to coating fluorescence coating, therefore do not have in the region that covers on carrier bracket of LED wafer Coating fluorescence coating is set, it is ensured that LED wafer keeps optimal electric conductivity, while will not also separate out blue light, illuminating effect is significantly Improve.

Embodiment 2：

The present embodiment is preferably as follows on the basis of embodiment 1：Multi-disc fin 8 is also set up on the back side of carrier bracket 1. Because LED wafer is directly installed on conductive printed wire road, if lose not in time can also be quick for the heat in LED wafer It is delivered on conductive printed wire road, the service life on impact conductive printed wire road, and the setting of fin, can quickly scatter and disappear Fall the heat in LED wafer, it is to avoid it is delivered on conductive printed wire road, it is ensured that its service life.

The two ends of the carrier bracket 1 are respectively provided with reflector 7, and reflector 7 can be rotated around connection end.Because this programme is adopted It is the carrier bracket of quality stiff materials, although but hardness is good, it is also not good to be unlikely to deform motility, and this programme is added Reflector, the not good defect of the carrier bracket motility for making up quality stiff materials, by adjust reflector angle be The light emission direction of adjustable light source, while also retains the advantage of the carrier bracket itself of quality stiff materials, function is more It is superior.

The mode of printing on upper conductive printed wire road or lower conductive printed wire road be M and N string mode, M and N be more than or equal to 1 natural number.Because each businessman is different to the mode of printing on conductive printed wire road, this programme arranges the print of various ways Brush mode is selected for businessman oneself, and motility is higher.

The above, is only preferred embodiment of the present utility model, and any pro forma limit is not done to this utility model System, every any simple modification, equivalent variations made to above example according to technical spirit of the present utility model each fall within Within protection domain of the present utility model.

Claims (5)

1. using the flip LED filament mating plate of eutectic mode, it is characterised in that including the carrier bracket of quality stiff materials（1）、 Upper conductive printed wire road（2）, lower conductive printed wire road（3）, plurality of LED chip（4）With coating fluorescence coating（6）, the upper conduction Printed wire（2）With lower conductive printed wire road（3）It is parallel to each other, on upper conductive printed wire road（2）With lower conductive printed wire road（3） Opposite on be respectively provided with multiple projections, upper conductive printed wire road（2）On raised and lower conductive printed wire road（3）On projection Correspond, every LED wafer（4）Two ends pass through tin cream（5）It is welded on conductive printed wire road（2）With lower conductive printing Circuit（3）In a pair of projections of upper composition, plurality of LED chip（4）Arrange in straight line, in arbitrary neighborhood two panels LED wafer （4）Between carrier bracket（1）On also set up coating fluorescence coating（6）, coat fluorescence coating（6）Width and upper conductive printed wire road （2）With lower conductive printed wire road（3）Spacing between upper a pair of relative projections is equal in magnitude.

2. the flip LED filament mating plate of employing eutectic mode according to claim 1, it is characterised in that carrier bracket（1） The back side on also set up multi-disc fin（8）.

3. the flip LED filament mating plate of employing eutectic mode according to claim 1, it is characterised in that the carrier Frame（1）Two ends be respectively provided with reflector（7）, reflector（7）Can rotate around connection end.

4. the flip LED filament mating plate of employing eutectic mode according to claim 1, it is characterised in that the quality is hard The carrier bracket of hard material（1）For the carrier bracket of safety glass, high-boron-silicon glass, sapphire, ceramics or metal.

5. the flip LED filament mating plate of employing eutectic mode according to claim 1, it is characterised in that upper conductive printing The mode of printing on circuit or lower conductive printed wire road is M and the mode of N strings, and M and N is the natural number more than or equal to 1.