CN206163238U - Inductance packaging structure - Google Patents
Inductance packaging structure Download PDFInfo
- Publication number
- CN206163238U CN206163238U CN201621165770.2U CN201621165770U CN206163238U CN 206163238 U CN206163238 U CN 206163238U CN 201621165770 U CN201621165770 U CN 201621165770U CN 206163238 U CN206163238 U CN 206163238U
- Authority
- CN
- China
- Prior art keywords
- inductance
- main casing
- pcb board
- casing body
- seal groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The utility model provides an inductance packaging structure, include: the main casing body, inductance, PCB board, inductance fixed mounting is on the PCB board, and the inductance is installed at the main casing internally, and the PCB board sets up the opening part at the main casing body, and it has the encapsulation filling layer to fill between inductance and the main casing body, and two electrodes of inductance are connected with the copper double -screw bolt, and two electrode welded of copper double -screw bolt and inductance fix, and the copper double -screw bolt passes through screw fixed mounting on the PCB board, the main casing body is including the main casing body cavity body, and it is internal at the main casing body cavity that the inductance is encapsulated the filling layer embedment, and main casing body cavity body upper end opening part is equipped with PCB board fixed orifices, and the PCB board fixed orifices outside is equipped with the seal groove, is equipped with main casing body fixed orifices on the seal groove, and the PCB board is fixed at PCB board fixed orifices, arrange the sealing washer in seal groove in, the reuse screw passes main casing body fixed orifices. The utility model has the advantages of reasonable design, the novelty not only has waterproof function, moreover in inductance heat dissipation, have fine effect in the aspect of reducing the inductance noise.
Description
Technical field
The utility model is related to inductance encapsulating structure technical field, specially a kind of inductance encapsulating structure.
Background technology
In the design process of power source products, inductance is requisite component part, inductance due to the characteristic of itself,
Substantial amounts of thermal source and noise can operationally be produced.
At present power source products profile is done less and less, and the radiating of inductance becomes a great problem.Inductance belongs to coil class unit device
Part, can bear in theory the temperature spent 100, if placed in the inside of product, hence it is evident that less suitable more.And it is placed in product
Outside, considers again the barrier propterty of product.
The noise of inductance other components and parts can be interfered to surrounding, and inductance embedding is got up, and contribute to reducing noise.Cause
This, what the utility model was directed to is exactly a kind of inductance encapsulating structure.
Utility model content
The technical problem that the utility model is solved is to provide a kind of inductance encapsulating structure, to solve above-mentioned background technology
The problem of middle proposition.
The technical problem that the utility model is solved employs the following technical solutions to realize：A kind of inductance encapsulating structure, bag
Include：Main casing, inductance, pcb board, the inductance is fixedly mounted on pcb board, and inductance is arranged in main casing body, and pcb board is arranged on
At the opening of main casing, filled with encapsulation packed layer between inductance and main casing, two electrodes of inductance are connected with copper stud, copper
Stud is fixed with two electrode weldings of inductance, and copper stud is fixedly mounted on pcb board by screw, and the main casing includes master
Shell cavity, the packed packed layer of inductance is potted in main casing cavity, is provided with pcb board at main casing cavity upper end open and is fixed
Hole, pcb board fixing hole outside is provided with seal groove, and seal groove is provided with main casing fixing hole, and pcb board is fixed on pcb board
Fixing hole, sealing ring is placed in seal groove, then passes through main casing fixing hole with screw, and described inductance encapsulating structure is consolidated
In target body.
Junction is provided with sealing ring at the opening of the pcb board and main casing.
The main casing cavity outside is provided with main casing fin.
Compared with prior art, the beneficial effects of the utility model are：The utility model reasonable in design, novelty, no
Only there is the function of waterproof, and have good effect in inductance radiating, in terms of reducing inductance noise.
Description of the drawings
Fig. 1 is explosive view schematic diagram of the present utility model.
Fig. 2 is main shell structure schematic diagram of the present utility model.
Fig. 3 is structural representation of the present utility model.
Specific embodiment
In order that of the present utility model realize that technological means, creation characteristic, reached purpose and effect are easy to understand, under
Face combines and is specifically illustrating, and the utility model is expanded on further.
As shown in Figures 1 to 3, a kind of inductance encapsulating structure, including：Main casing 11, inductance 12, pcb board 14, the inductance 12
It is fixedly mounted on pcb board 14, inductance 12 is arranged in main casing 11, and pcb board 14 is arranged at the opening of main casing 11, inductance
Filled with encapsulation packed layer 16 between 12 and main casing 11, two electrodes of inductance 12 are connected with copper stud 15, copper stud 15 with
Two electrode weldings of inductance 12 are fixed, and copper stud 15 is fixedly mounted on pcb board 14 by screw, and the main casing 11 includes
Main casing cavity 111, the packed packed layer 16 of inductance is potted in main casing cavity 111, at the upper end open of main casing cavity 111
Pcb board fixing hole 114 is provided with, the outside of pcb board fixing hole 114 is provided with seal groove 113, and seal groove 113 is provided with main casing
Fixing hole 115, pcb board is fixed on pcb board fixing hole 114, and sealing ring 13 is placed in seal groove, then with screw through master
Housing fixing hole 115, described inductance encapsulating structure is fixed in target body.
Junction is provided with sealing ring 13 at the opening of the pcb board 14 and main casing 11.
The outside of the main casing cavity 111 is provided with main casing fin 112.
The quantity of the inductance needs to determine by design, can for 1,2,3, n.The size of corresponding main casing is by inductance quantity
And size is determined.The effect of copper stud is extreme as two of inductance, is connected in target part, the quantity of corresponding copper stud
For 2,4,6,2n.
The packed material of the inductance is potted in main casing cavity 111, volume of the main casing cavity volume more than inductance.
The main casing fin 112 of similar muscle is evenly equipped with main casing, reinforcement main casing intensity is played, main casing and air contact is improved
Face, improves radiating effect.Main casing is provided with pcb board fixing hole 114, and pcb board is exactly to be screwed in main casing by the hole
On body, because the fitting surface of main casing is very smooth, so can be very smooth after pcb board is fixed, after raising
With the assembly precision of target part.Main casing is provided with seal groove 113, and sealing ring 13 is placed in seal groove, then uses screw
Through main casing fixing hole 115, described inductance encapsulating structure is fixed in target body, just can reach the effect of dustproof and waterproof
Really.
By embedding in main casing body, the packed material 16 of surrounding is wrapped up the utility model inductance, and encapsulating material has heat conduction exhausted
The performance of edge, the heat that inductance is produced can be transmitted to the surface of main casing, and main casing is again by heat by way of radiation
In being delivered to air, this ensure that the temperature of inductance within tolerance band.Two of inductance are extremely welded on pcb board 14
On, then be connected with copper stud by the wiring on pcb board, copper stud is equivalent to two terminals of inductance, the position of copper stud
Put on demand design can.The height of copper stud is higher than the height of pcb board solder joint.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.One's own profession
The technical staff of industry it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Simply illustrate principle of the present utility model, on the premise of without departing from the utility model spirit and scope, the utility model is also
Various changes and modifications are had, these changes and improvements are both fallen within the range of claimed the utility model.The utility model
Claimed scope by appending claims and its equivalent thereof.
Claims (3)
1. a kind of inductance encapsulating structure, including：Main casing, inductance, pcb board, it is characterised in that：The inductance is fixedly mounted on
On pcb board, inductance is arranged in main casing body, and pcb board is arranged at the opening of main casing, filled with envelope between inductance and main casing
Dress packed layer, two electrodes of inductance are connected with copper stud, and copper stud is fixed with two electrode weldings of inductance, and copper stud passes through
Screw is fixedly mounted on pcb board, and the main casing includes main casing cavity, and the packed packed layer of inductance is potted in main casing body cavity
In vivo, pcb board fixing hole is provided with main casing cavity upper end open, pcb board fixing hole outside is provided with seal groove, seal groove
Main casing fixing hole is provided with, pcb board is fixed on pcb board fixing hole, sealing ring is placed in seal groove, then is worn with screw
Main casing fixing hole is crossed, described inductance encapsulating structure is fixed in target body.
2. a kind of inductance encapsulating structure according to claim 1, it is characterised in that：The opening of the pcb board and main casing
Place junction is provided with sealing ring.
3. a kind of inductance encapsulating structure according to claim 1, it is characterised in that：The main casing cavity outside is provided with master
Housing fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621165770.2U CN206163238U (en) | 2016-11-02 | 2016-11-02 | Inductance packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621165770.2U CN206163238U (en) | 2016-11-02 | 2016-11-02 | Inductance packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206163238U true CN206163238U (en) | 2017-05-10 |
Family
ID=58656280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621165770.2U Expired - Fee Related CN206163238U (en) | 2016-11-02 | 2016-11-02 | Inductance packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206163238U (en) |
-
2016
- 2016-11-02 CN CN201621165770.2U patent/CN206163238U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 Termination date: 20191102 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |