CN206162580U - Module is discerned to fan -out formula fingerprint - Google Patents
Module is discerned to fan -out formula fingerprint Download PDFInfo
- Publication number
- CN206162580U CN206162580U CN201620978965.2U CN201620978965U CN206162580U CN 206162580 U CN206162580 U CN 206162580U CN 201620978965 U CN201620978965 U CN 201620978965U CN 206162580 U CN206162580 U CN 206162580U
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- CN
- China
- Prior art keywords
- fingerprint
- identification
- insulated substrate
- panel
- fanned out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The utility model relates to a module is discerned to fan -out formula fingerprint, contain an insulation base layer, the chip is discerned to the fingerprint, the electric contact component, wire and panel, the interface channel who runs through about an insulation base layer has, the fingerprint is discerned the chip and is buried underground in an insulation base layer, the upper surface that front and this an insulation base layer were discerned to the line flushes, the electric contact component sets up discernes openly and discernes the upper surface that openly extends to an insulation base layer along the fingerprint in the fingerprint, the wire sets up in interface channel and the electric contact component is connected to the one end electricity of wire, the other end extends along an insulation base layer's lower surface, the panel adheres the upper surface of discerning front and an insulation base layer in the fingerprint, so that the chip is discerned to the fingerprint listens through what the panel carried on that the fingerprint discernes.
Description
Technical field
The utility model is related to a kind of identification of fingerprint module, and more particularly to one kind can reduce identification of fingerprint front to panel
Distance be fanned out to formula identification of fingerprint module with guarantee the degree of accuracy.
Background technology
The identification of fingerprint chip of traditional identification of fingerprint module is divided at the two ends of metal wire rod by way of routing engagement
The electric contact portion of circuit board and identification of fingerprint chip is not welded in, makes identification of fingerprint chip be electrically connected at circuit board.Then, referring to
Insulating barrier and on the insulating layer side, by bonding gluing conjunction panel, makes the identification of fingerprint chip can be every on the outside cloth of line identification chip
The finger print that panel recognizes opposite side.
However, above-mentioned identification of fingerprint chip has identification of fingerprint front to the blocked up problem of the distance between panel, and
It is easily caused identification of fingerprint unsuccessful.Also, by the identification of fingerprint module manufactured by said method, there is identification of fingerprint front
To there is sandwich construction between panel, therefore encapsulate that formality is complex, the distance between each identification of fingerprint front to panel has
No small individual difference, causes identification of fingerprint module yield not good.
Utility model content
Therefore, to solve the above problems, the purpose of this utility model i.e. provide it is a kind of can ensure that the degree of accuracy be fanned out to formula
Identification of fingerprint module.
The utility model provides one kind and is fanned out to formula identification of fingerprint for the technological means that solution problem of the prior art is adopted
Module, comprising：Insulated substrate, with the interface channel for running through up and down；Identification of fingerprint chip, is embedded in the insulated substrate, and this refers to
The identification of fingerprint front of line identification chip and the upper surface flush of the insulated substrate；Electric contact element, is arranged at the identification of fingerprint
Front simultaneously extends to the upper surface of the insulated substrate along the identification of fingerprint front；Wire, is arranged in the interface channel and this is led
One end of line electrically connects the electric contact element, and the other end of the wire extends along the lower surface of the insulated substrate；And panel, stick
The upper surface in the identification of fingerprint front and the insulated substrate, so as to the identification of fingerprint chip carries out fingerprint by the panel distinguish
The detecting of knowledge.
One kind is provided in an embodiment of the present utility model and is fanned out to formula identification of fingerprint module, the panel is sticked together by insulation
Layer is attached to the identification of fingerprint front and the upper surface of the insulated substrate.
One kind is provided in an embodiment of the present utility model and is fanned out to formula identification of fingerprint module, the thickness of the insulation adhesion layer
Less than 20 microns.
One kind is provided in an embodiment of the present utility model and is fanned out to formula identification of fingerprint module, the insulated substrate is insulating cement
Layer.
In an embodiment of the present utility model provide one kind be fanned out to formula identification of fingerprint module, cleaved shaping and have flat
The profile of sliding curve.
One kind is provided in an embodiment of the present utility model and is fanned out to formula identification of fingerprint module, interface channel Jing laser drillings
The mode in hole is formed.
One kind is provided in an embodiment of the present utility model and is fanned out to formula identification of fingerprint module, the wire is electroplated lead,
It is formed in the interface channel in chemical process method.
The technological means adopted via the utility model, the outside of identification of fingerprint chip does not need extra insulating barrier,
The distance between panel and identification of fingerprint front are significantly shortened, it can be ensured that the success of identification of fingerprint and precision, and in
During a large amount of production can the distance between stability contorting identification of fingerprint chip and fingerprint, lift the yield of volume production.
Description of the drawings
The specific embodiment that the utility model is adopted, will be further described by below example and accompanying drawing.
Fig. 1 is to show the schematic diagram for being fanned out to formula identification of fingerprint module according to the embodiment of the utility model one.
Fig. 2 a to Fig. 2 g are to show the making step for being fanned out to formula identification of fingerprint module according to embodiment of the present utility model
Schematic diagram.
Reference
100 are fanned out to formula identification of fingerprint module
1 temporary substrate
2 identification of fingerprint chips
21 identification of fingerprint fronts
The 22 identification of fingerprint back sides
3 insulated substrates
31 interface channels
4 electric contact elements
5 wires
6 panels
7 insulation adhesion layers
Specific embodiment
Below according to Fig. 1 to Fig. 2 g, and illustrate embodiment of the present utility model.The explanation is not new to limit this practicality
The embodiment of type, and it is one kind of embodiment of the present utility model.
As shown in figure 1, being fanned out to formula identification of fingerprint module 100 comprising insulated substrate 3, identification of fingerprint chip 2, electric contact element
4th, wire 5 and panel 6.
Insulated substrate 3 has the interface channel 31 for running through up and down, and in the present embodiment insulated substrate 3 is insulation glue-line hardening
Form, the effect with insulation protection identification of fingerprint chip 2.And the mode of the Jing laser drill of interface channel 31 is formed, these
Interface channel 31 is formed at the periphery of identification of fingerprint chip 2, and a plurality of electric contact elements 4 of correspondence.
Identification of fingerprint chip 2 is embedded in insulated substrate 3, identification of fingerprint front 21 and the insulated substrate 3 of identification of fingerprint chip 2
Upper surface flush.This means, the identification of fingerprint back side 22 and outer peripheral edge of the insulating wrapped identification of fingerprint chip 2 of insulated substrate 3.
Electric contact element 4 is arranged at identification of fingerprint front 21 and extends to the upper of insulated substrate 3 along identification of fingerprint front 21
Surface.Electric contact element 4 is conductive material, can be arranged by modes such as bracing wire or plating.
Wire 5 is arranged in interface channel 31 and one end of wire 5 electrically connects electric contact element 4, and the other end of wire 5 is certainly
Interface channel 31 and along insulated substrate 3 lower surface extend.In the present embodiment, wire 5 is electroplated lead, with chemical process side
Method is formed in interface channel 31.
Panel 6 is attached to the upper surface of identification of fingerprint front 21 and insulated substrate 3 by insulation adhesion layer 7, so that fingerprint
Identification chip 2 carries out the detecting of identification of fingerprint by panel 6.In the present embodiment, the thickness of insulation adhesion layer 7 is micro- less than 20
Rice.Insulation adhesion layer 7 have concurrently by panel 6 be attached to identification of fingerprint chip 2 top stick together function and by identification of fingerprint just
The function of the insulation protection of face 21 a, it is only necessary to Rotating fields and once encapsulate, not only saves the manufacturing cost of encapsulation procedure, and energy
The distance in identification of fingerprint front 21 to panel 6 is greatly reduced, makes the detecting of identification of fingerprint more accurate.
Because the outer peripheral edge of identification of fingerprint chip 2 is subject to the insulation protection of insulated substrate 3, and identification of fingerprint chip 2
Insulation adhesion layer 7 (as the binder for panel 6) insulation protection is received in identification of fingerprint front 21, therefore, identification of fingerprint chip 2
Outside does not need extra insulating barrier, and the distance between panel 6 and identification of fingerprint front 21 are significantly shortened, it can be ensured that fingerprint is distinguished
The success of knowledge and precision.
Next it will be described for being fanned out to the making step of formula identification of fingerprint module 100.
As shown in Figure 2 a, the identification of fingerprint front 21 of a plurality of identification of fingerprint chips 2 is fitted in down first temporary
Substrate 1, between a plurality of identification of fingerprint chips 2 predetermined distance is separated by.So-called identification of fingerprint front 21 refers to identification of fingerprint core
Piece 2 it is etched, plating etc. manufacture of semiconductor and there is the surface of identification of fingerprint circuit.The surface of one temporary substrate 1 can
Fit substantial amounts of identification of fingerprint chip 2.
As shown in Figure 2 b, then by insulating cement encapsulating (molding) in a plurality of identification of fingerprint chips 2 and temporary substrate
On 1, and controlling its thickness makes surfacing uniform.After insulating cement hardening, that is, form insulated substrate 3 and distinguish in a plurality of fingerprints
Know on the identification of fingerprint back side 22 and the temporary substrate 1 of chip 2, temporary substrate 1, a plurality of identification of fingerprint chips 2 and absolutely
Edge basic unit 3 forms transient structures body.
As shown in Figure 2 c, then spin upside down the transient structures body and make identification of fingerprint front 21 upward, and remove temporarily
Property substrate 1 is appearing identification of fingerprint front 21.
As shown in Figure 2 d, then a plurality of electric contact elements 4 are respectively provided with into a plurality of identification of fingerprint fronts 21 and edge to refer to
Line identification front 21 extends to the upper surface of insulated substrate 3.A plurality of electric contact elements 4, a plurality of identification of fingerprint chips 2 and absolutely
Edge basic unit 3 forms and treats wiring structure.
As shown in Figure 2 e, then spin upside down this and treat wiring structure, and drill to form a plurality of points in insulated substrate 3
Do not connect the interface channel 31 for running through up and down of a plurality of electric contact elements 4.
As shown in figure 2f, then in a plurality of interface channels 31 leading for a plurality of electrical connection electric contact elements 4 is formed respectively
Line 5 and make this treat that wiring structure becomes integrated circuit structure body.
As shown in Figure 2 g, the integrated circuit structure body is then spun upside down so that identification of fingerprint front 21 upward, and is sticked together
Panel 6 is in identification of fingerprint front 21 and the upper surface of insulated substrate 3.
Finally, the integrated circuit is cut with predetermined scope and shape with identification of fingerprint chip 2 to cut scope center
Structure and on panel 6, insulation adhesion layer 7, with formed it is a plurality of as shown in Figure 1 be fanned out to formula identification of fingerprint module
100.Due to arranging a plurality of identification of fingerprint chips 2 in insulated substrate 3, therefore can cut out and a plurality of be fanned out to formula identification of fingerprint module
100.The specification for being fanned out to formula identification of fingerprint module 100 so produced can easily be uniformly controlled in certain standard and
Without individual difference, yield is greatly improved.And the formula identification of fingerprint module 100 that is fanned out to of the present utility model can be circular, oval
Deng the profile with smoothed curve, can apply, coordinate a variety of devices, such as home on mobile phone to press part.
In sum, the formula identification of fingerprint module 100 that is fanned out to of the present utility model has the characteristics that relative to prior art：
Identification of fingerprint chip 2 is embedded in insulated substrate 3, and the upper surface flush of identification of fingerprint front 21 and insulated substrate 3, electric contact unit
Part 4 extends to the upper surface of insulated substrate 3 along identification of fingerprint front 21, panel 6 can directly be attached to identification of fingerprint front 21 and
The upper surface of insulated substrate 3.Therefore the outside of identification of fingerprint chip 2 does not need extra insulating barrier, and panel 6 is with identification of fingerprint just
Significantly shorten in the distance between face 21, it can be ensured that the success of identification of fingerprint and precision.In addition, each is fanned out to formula and refers to
Individual difference between line identification module 100 also can be reduced, improving product yield.
Narration above and explanation are only the explanation of preferred embodiment of the present utility model, for those skilled in the art
When making other modifications according to claim defined above and above-mentioned explanation, only this little modification still fall within this practicality
New creation spirit and in interest field of the present utility model.
Claims (6)
1. one kind is fanned out to formula identification of fingerprint module, comprising：
Insulated substrate, with the interface channel for running through up and down；
Identification of fingerprint chip, is embedded in described insulated substrate, the identification of fingerprint front of described identification of fingerprint chip with it is described
Insulated substrate upper surface flush；
Electric contact element, is arranged at described identification of fingerprint front and extends to described insulation along described identification of fingerprint front
The upper surface of basic unit；
Wire, is arranged in described interface channel and one end of described wire electrically connects described electric contact element, described
Wire the other end along described insulated substrate lower surface extend；And
Panel, is attached to the upper surface of described identification of fingerprint front and described insulated substrate, so that described identification of fingerprint
Chip carries out the detecting of identification of fingerprint by described panel.
2. formula identification of fingerprint module is fanned out to as claimed in claim 1, it is characterised in that described panel is by the adhesion layer that insulate
The upper surface in identification of fingerprint front and described insulated substrate described in being attached to.
3. formula identification of fingerprint module is fanned out to as claimed in claim 2, it is characterised in that the thickness of described insulation adhesion layer is little
In 20 microns.
4. formula identification of fingerprint module is fanned out to as claimed in claim 1, it is characterised in that described insulated substrate is insulating cement
Layer.
5. be fanned out to formula identification of fingerprint module as claimed in claim 1, it is characterised in that cleaved shaping and there is smoothed curve
Profile.
6. formula identification of fingerprint module is fanned out to as claimed in claim 1, it is characterised in that described wire is electroplated lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620978965.2U CN206162580U (en) | 2016-08-30 | 2016-08-30 | Module is discerned to fan -out formula fingerprint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620978965.2U CN206162580U (en) | 2016-08-30 | 2016-08-30 | Module is discerned to fan -out formula fingerprint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206162580U true CN206162580U (en) | 2017-05-10 |
Family
ID=58648608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620978965.2U Expired - Fee Related CN206162580U (en) | 2016-08-30 | 2016-08-30 | Module is discerned to fan -out formula fingerprint |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206162580U (en) |
-
2016
- 2016-08-30 CN CN201620978965.2U patent/CN206162580U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |