CN206147490U

CN206147490U - High-speed interconnected chip heat dissipation transverse air guide device

Info

Publication number: CN206147490U
Application number: CN201620764538.4U
Authority: CN
Inventors: 郑志林; 李鹏
Original assignee: Inspur Electronic Information Industry Co Ltd
Current assignee: Inspur Electronic Information Industry Co Ltd
Priority date: 2016-07-20
Filing date: 2016-07-20
Publication date: 2017-05-03
Anticipated expiration: 2026-07-20

Abstract

The utility model discloses a high-speed interconnected chip heat dissipation transverse air guide device, wherein the front end of the whole server is provided with a CPU node and upper and lower fan modules; the middle plate is arranged in the middle; the rear end is a management module, an interconnection module and an IO module; the upper and lower fan modules at the front end extract the heat of the CPU node; the middle back plate separates the front and back end heat flow from the air duct; the heat in the rear end IO module passes through the module fan and takes out the heat dissipation in with the IO module, air ducting includes: the interconnection module is provided with ventilation holes at the left end and the right end, and a transverse air guide cover is arranged in the interconnection module and covers all heating chips of the interconnection module board card; and a fan module is arranged on the left side of the interconnection module and used for pumping cold air entering from the right side into the air guide cover. The utility model discloses an at the wind current guide structure guide wind current of interconnection chip department, be favorable to the wind current to aim at interconnection chip and fin, the heat dissipation of being convenient for has satisfied the high heat dissipation requirement to high-power consumption interconnection chip, satisfies high-end server's scalability, stability, reliability, provides the powerful guarantee for the system stability.

Description

It is a kind of to interconnect the horizontal air ducting of chip cooling at a high speed

Technical field

This utility model is related to chip cooling technical field, and in particular to a kind of to interconnect the horizontal wind-guiding dress of chip cooling at a high speed Put.

Background technology

At present high-end 8 tunnel, 16 tunnels, 32 road servers interconnect scale up and scale that chip realizes business by high speed Out fast assemblings extend；This proposes new demand to interconnecting interactive module；Traditional QPI technologies cannot meet more than 8 tunnels mutual Connection extension；For the interconnection interaction technique of 8 tunnel above servers proposes that new framework is required；With stylish framework to interconnecting chip Radiating requirement；Can ensure that the stability of its work, reliability directly affect the stable and reliable of whole frame structure.

Utility model content

The technical problems to be solved in the utility model is：This utility model in order to solve new architecture under interconnect chip at a high speed Quick, stable heat dissipation problem, there is provided a kind of horizontal air ducting of the chip cooling of interconnection at a high speed；The service of breaking traditions of new framework Longitudinal ventilation thinking before and after device, it has the advantages that environmental protection, high-low temperature resistant, wind gathering high efficiency and heat radiation, realizes left and right transversal ventilation Radiating；High efficiency and heat radiation mechanism is provided for high speed interconnection chip, left and right transversal ventilation in whole machine module is realized, interconnection core at a high speed is met The radiating requirements of piece；Reliability, stability being provided for high-end server, strong support is provided.

The technical scheme that this utility model is adopted for：

A kind of to interconnect the horizontal air ducting of chip cooling at a high speed, the whole machine front end of server is cpu node and upper and lower fan mould Block；Centre is middle plate；Rear end is management module, interconnection module, I/O module；The wherein blower module up and down of front end is by cpu node Heat take away；Intermediate back-plate separates front and back end hot-fluid and air channel；Heat in I/O module is passed through module by rear end I/O module Internal fan extracts radiating out, and the air ducting includes：The air vent at interconnection module or so two ends is arranged on, and is arranged at mutual gang mould Horizontal wind scooper inside block, wind scooper covers all euthermic chips of interconnection module board；It is provided with the left of interconnection module Blower module, the cold wind entered from right side is extracted in wind scooper.

Guide frame is provided with wind scooper, the air channel for making wind scooper is gathered at the high speed interconnection chip of interconnection module, The fin that will be concentrated through by the wind in wind scooper air channel on interconnection chip at a high speed, concentrates air quantity to interconnecting chip cooling, from And the heat being dispersed on fin on high speed interconnection chip is extracted into into the region in left side, then be discharged to heat by blower module Cabinet outside, meets the high radiating requirements of high power consumption of interconnection chip.

The blower module that the left side of the interconnection module is arranged is three 40 fans, and three fans are the setting of 2+1 redundancies.

The wind scooper bottom contacts buffering with board using high temperature resistant conductive fabric form, and adopts and be screwed, seamless The gap laminating PCA boards that at a high speed interconnection chip is located, it is to avoid gap produces, it is to avoid air quantity is excessive to affect other devices.

The beneficial effects of the utility model are：

This utility model guides distinguished and admirable by the distinguished and admirable guide frame at interconnection chip, beneficial to distinguished and admirable alignment interconnection chip And fin, it is easy to radiating, the high cooling requirements that chip is interconnected to high power consumption are met, meet the expansible of high-end server Property, stability, reliability, for system stability powerful guarantee is provided.

Description of the drawings

Fig. 1 is position view of the interconnection module in whole machine.

Specific embodiment

This utility model is further illustrated below according to specific embodiment：

Embodiment 1：

As shown in figure 1, a kind of horizontal air ducting of the chip cooling of interconnection at a high speed, the whole machine front end of server be cpu node and Upper and lower blower module；Centre is middle plate；Rear end is management module, interconnection module, I/O module；The wherein blower module up and down of front end The heat of cpu node is taken away；Intermediate back-plate separates front and back end hot-fluid and air channel；Rear end I/O module is by the heat in I/O module Extracted out by module internal fan and radiated, the air ducting includes：The air vent at interconnection module or so two ends is arranged on, and is arranged Horizontal wind scooper inside interconnection module, wind scooper covers all euthermic chips of interconnection module board；A left side for interconnection module Side is provided with blower module, and the cold wind entered from right side is extracted in wind scooper.

Embodiment 2

On the basis of embodiment 1, guide frame is provided with the present embodiment wind scooper, makes the air channel of wind scooper in interconnection Gather at the high speed interconnection chip of module, the fin that will be concentrated through by the wind in wind scooper air channel on interconnection chip at a high speed, Air quantity is concentrated to interconnecting chip cooling, so as to the heat being dispersed on fin on high speed interconnection chip to be extracted into the area in left side Domain, then heat is discharged to by cabinet outside by blower module, meet the high radiating requirements of high power consumption of interconnection chip.

Embodiment 3

On the basis of embodiment 1 or 2, the blower module that the left side of interconnection module described in the present embodiment is arranged is three 40 Fan, three fans are the setting of 2+1 redundancies.

Embodiment 4

On the basis of embodiment 1, wind scooper bottom is connect using high temperature resistant conductive fabric form and board described in the present embodiment Buffering is touched, and is adopted and is screwed, the seamless laminating PCA boards that at a high speed interconnection chip is located, it is to avoid gap produces, it is to avoid wind Excessive other devices of impact of amount.

Embodiment is merely to illustrate this utility model, and is not limitation of the utility model, relevant technical field Those of ordinary skill, in the case of without departing from spirit and scope of the present utility model, can also make a variety of changes and modification, Therefore the technical scheme of all equivalents falls within category of the present utility model, and scope of patent protection of the present utility model should be by right Require to limit.

Claims

1. it is a kind of to interconnect the horizontal air ducting of chip cooling at a high speed, it is characterised in that the air ducting includes：It is arranged on interconnection The air vent at module or so two ends, and the horizontal wind scooper being arranged inside interconnection module, wind scooper covers interconnection module board All euthermic chips；Blower module is provided with the left of interconnection module, the cold wind entered from right side is extracted in wind scooper.

2. a kind of high speed according to claim 1 interconnects the horizontal air ducting of chip cooling, it is characterised in that：In wind scooper Guide frame is provided with, the air channel for making wind scooper is gathered at the high speed interconnection chip of interconnection module, will be by wind scooper air channel The wind fin that is concentrated through at a high speed interconnection chip, air quantity is concentrated to interconnecting chip cooling, so as to will interconnection chip at a high speed On the heat that is dispersed on fin be extracted into the region in left side, then heat is discharged to by cabinet outside by blower module, meet mutual The high radiating requirements of high power consumption of connection chip.

3. a kind of high speed according to claim 1 interconnects the horizontal air ducting of chip cooling, it is characterised in that：The interconnection The blower module that the left side of module is arranged is three 40 fans, and three fans are the setting of 2+1 redundancies.

4. a kind of high speed according to claim 1 interconnects the horizontal air ducting of chip cooling, it is characterised in that：The wind-guiding Cover bottom contact buffering with board using high temperature resistant conductive fabric form, and adopts and be screwed, and seamless high speed of fitting interconnects core The PCA boards that piece is located.