CN206134691U - Dipolar tube packaging body - Google Patents
Dipolar tube packaging body Download PDFInfo
- Publication number
- CN206134691U CN206134691U CN201621173618.9U CN201621173618U CN206134691U CN 206134691 U CN206134691 U CN 206134691U CN 201621173618 U CN201621173618 U CN 201621173618U CN 206134691 U CN206134691 U CN 206134691U
- Authority
- CN
- China
- Prior art keywords
- electrode
- circuit board
- lead frame
- diode
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides a dipolar tube packaging body, dipolar tube packaging body includes the circuit board, set up at least a pair of first electrode and second electrode on the circuit board, first electrode and second electrode are certainly the upper and lower both sides of circuit board expose, at least one diode crystal, the diode crystal has last electrode and bottom electrode, the lead frame, the lead frame certainly the installation of circuit board a side -mounting of diode crystal, so that the lead frame respectively with last electrode and second electrode looks butt, the packaging body, the packaging body cladding the lead frame with the diode crystal is in order to incite somebody to action the lead frame with the fastening of diode crystal is in on the circuit board. The utility model discloses a dipolar tube packaging body through setting up lead frame and packaging body, utilizes the packaging body to fasten diode and lead frame on the circuit board, has reduced welding process, has shortened production cycle, has reduced the welding cost.
Description
Technical field
This utility model is related to a kind of diode package.
Background technology
Existing diode package structure, needs that gold thread is welded on electrode using SMT technologies, however, giving birth in a large number
Will seem time-consuming extremely long during product, improve production cost.
In view of this, it is necessary to which existing diode package is improved, to solve the above problems.
Utility model content
The purpose of this utility model is to provide a kind of diode package, to solve existing diode package structure manufacture
High cost, the production problem that time-consuming.
For achieving the above object, this utility model provides a kind of diode package, it is characterised in that：The diode
Packaging body includes circuit board, arranges at least one pair of first electrode and second electrode on the circuit board, the first electrode and the
Up and down exposed at both sides of two electrodes from the circuit board；
At least one diode crystal, the diode crystal has Top electrode and bottom electrode, the diode crystal edge
Thickness direction is attached on the circuit board so that the bottom electrode is abutted against with the first electrode；
Lead frame, the lead frame is installed from the side that the circuit board installs the diode crystal, so that described
Lead frame is abutted against respectively with Top electrode and second electrode；
Packaging body, lead frame described in the packaging body coats and the diode crystal are with by the lead frame and described two
Pole pipe crystal is fastened on the circuit board.
Used as further improvement of the utility model, from the circuit board, upwards projection is extended to and institute the second electrode
The Top electrode for stating diode crystal is concordant.
As further improvement of the utility model, the lead frame in tabular be overlapped at least one pair of described first
Electrode and second electrode.
Used as further improvement of the utility model, the lead frame includes in flat support body and with the support body is in
The foot body that certain angle is arranged, the support body is overlapped in some Top electrodes, and the foot body is towards the one of the circuit board
Side protrudes out to and is electrically connected with some second electrodes.
Used as further improvement of the utility model, the lead frame includes some main parts and to connect some main bodys
The connecting portion in portion, each main part is correspondingly arranged with a pair of first electrodes and second electrode.
As further improvement of the utility model, in the circuit board overcurrent protection assemble is provided with.
Used as further improvement of the utility model, the diode crystal is Zener diode.
The beneficial effects of the utility model are：Diode package of the present utility model, by arranging lead frame and encapsulation
Body, is fastened diode and lead frame on circuit boards using packaging body, is reduced welding procedure, is shortened production cycle, drop
Low welding cost.
Description of the drawings
Fig. 1 is the structural representation of the diode package of this utility model first embodiment；
Fig. 2 is the structural representation that the diode encapsulating parts for being formed are cut by diode package in Fig. 1；
Fig. 3 is the structural representation of the diode package of this utility model second embodiment；
Fig. 4 is the structural representation that the diode encapsulating parts for being formed are cut by diode package in Fig. 3；
Fig. 5 is the conducting wire frame structure schematic diagram in Fig. 1.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with the accompanying drawings and it is embodied as
Example is described in detail to this utility model.
As shown in Figure 1, Figure 2 and shown in Fig. 5, the diode package 100 of this utility model first embodiment include circuit board 1,
At least one diode crystal 2, lead frame 3 and packaging body 4.
At least one pair of first electrode 11 and second electrode 12, the first electrode 11 and second are set on the circuit board 1
Up and down exposed at both sides of the electrode 12 from the circuit board 1.In the present embodiment, it is provided with the circuit board 1 some electric to first
Upwards projection extends from the circuit board 1 for pole 11 and second electrode 12 and the second electrode 12, is provided with the circuit board 1
Overcurrent protection assemble.Certainly, in other embodiments, it is also possible to which a pair of first electrodes 11 and second electrode 12 are only set.
The diode crystal 2 has Top electrode 21 and bottom electrode 22, and the through-thickness of the diode crystal 2 is attached to
On the circuit board 1 so that the bottom electrode 22 is abutted against with the first electrode 11, the second electrode 12 is extended upwardly to
It is concordant with the Top electrode 21.The diode crystal 2 is Zener diode, to realize the diode package 100
Overvoltage protection.
In the present embodiment, the lead frame 3 includes some main parts 31 and the connecting portion to connect some main parts 31
32, each main part 31 is correspondingly arranged with a pair of first electrodes 11 and second electrode 12.The lead frame 3 is from the circuit board 1
The side for installing the diode crystal 2 is installed, so that the lead frame 3 offsets respectively with Top electrode 21 and second electrode 12
Connect.In the present embodiment, because the second electrode 12 it is concordant with Top electrode 21, if the lead frame 3 can be overlapped in tabular
In the dry Top electrode 21 and some second electrodes 12.
The packaging body 4 coats the lead frame 3 and the diode crystal 2 with by the lead frame 3 and two pole
Pipe crystal 2 is fastened on the circuit board 1.After the packaging body 4 is covered to complete, the diode package 100 is manufactured
Complete, now only need to from the connecting portion 32 cut, you can obtain diode encapsulating parts one by one（Do not mark）.
As shown in Figures 3 to 5, the diode package 200 of this utility model second embodiment, its structure is implemented with first
Diode packaging body 100 in example is substantially the same, and the structure here of same section does not do repeated description, and Main Differences are this reality
Apply not protruding out upwards for the second electrode 12 in example.And the lead frame 5 include in flat support body 51 and with the frame
The foot body 52 that body 51 is arranged at an angle, the support body 51 is overlapped in some Top electrodes 21, the direction of foot body 52
The side of the circuit board 1 protrudes out to and is electrically connected with some second electrodes 12.
The production process of diode package of the present utility model 100 is as follows：
The positive and negative diode crystal 2 for being respectively equipped with Top electrode 21 and bottom electrode 22 is provided；
Circuit board 1 is provided, and is provided with first electrode 11 and second electrode 12 thereon, and first electrode 11 and second is electric
Pole 12 is from the exposed at both sides up and down of the circuit board 1；
The through-thickness of diode crystal 2 is arranged on the circuit board 1 so that the bottom electrode 22 and described first
Electrode 11 is electrically connected with, and in order to improve intensity, will can be carried out between the bottom electrode 22 and the first electrode 11 with selectivity
It is welded to connect；
Lead frame 3 is provided, and the lead frame 3 is installed into the side peace of the diode crystal 2 from the circuit board 1
Dress, so that the lead frame 3 is abutted against respectively with Top electrode 21 and second electrode 12；
It is packaged to form packaging body 4 using insulant, the lead frame 3 and the diode crystal 2 is fastened
On the circuit board 1.
After the completion of diode package 100, can cut from the connecting portion 32 as needed, you can obtain one by one
Diode encapsulating parts, at the Self cleavage of connecting portion 32 expose.
Diode package of the present utility model 100, by arranging lead frame 3 and packaging body 4, using packaging body 4 by two
Pole pipe and lead frame 3 are fastened on the circuit card 1, are reduced welding procedure, are shortened the production cycle, reduce welding cost.
Above example is only unrestricted to illustrate the technical solution of the utility model, although with reference to preferred embodiment pair
This utility model has been described in detail, it will be understood by those within the art that, can be to technology of the present utility model
Scheme is modified or equivalent, without deviating from the spirit and scope of technical solutions of the utility model.
Claims (7)
1. a kind of diode package, it is characterised in that：The diode package includes circuit board, arranges on the circuit board
The exposed at both sides up and down of at least one pair of first electrode and second electrode, the first electrode and second electrode from the circuit board；
At least one diode crystal, the diode crystal has Top electrode and bottom electrode, and the diode crystal is along thickness
Direction is attached on the circuit board so that the bottom electrode is abutted against with the first electrode；
Lead frame, the lead frame is installed from the side that the circuit board installs the diode crystal, so that the wire
Frame is abutted against respectively with Top electrode and second electrode；
Packaging body, lead frame described in the packaging body coats and the diode crystal are with by the lead frame and the diode
Crystal is fastened on the circuit board.
2. diode package according to claim 1, it is characterised in that：The second electrode from the circuit board upwards
Projection extends to concordant with the Top electrode of the diode crystal.
3. diode package according to claim 2, it is characterised in that：The lead frame in tabular be overlapped on to
First electrode and second electrode described in few a pair.
4. diode package according to claim 1, it is characterised in that：The lead frame is included in flat support body
And the foot body arranged at an angle with the support body, the support body is overlapped in some Top electrodes, the foot body direction
The side of the circuit board protrudes out to and is electrically connected with some second electrodes.
5. diode package according to claim 1, it is characterised in that：The lead frame includes some main parts and use
To connect the connecting portion of some main parts, each main part is correspondingly arranged with a pair of first electrodes and second electrode.
6. diode package according to claim 1, it is characterised in that：Overcurrent protection group is provided with the circuit board
Part.
7. diode package according to claim 1, it is characterised in that：The diode crystal is Zener diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621173618.9U CN206134691U (en) | 2016-11-02 | 2016-11-02 | Dipolar tube packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621173618.9U CN206134691U (en) | 2016-11-02 | 2016-11-02 | Dipolar tube packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206134691U true CN206134691U (en) | 2017-04-26 |
Family
ID=58575993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621173618.9U Expired - Fee Related CN206134691U (en) | 2016-11-02 | 2016-11-02 | Dipolar tube packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206134691U (en) |
-
2016
- 2016-11-02 CN CN201621173618.9U patent/CN206134691U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170426 Termination date: 20181102 |