CN206132683U - Infrared thermographic testing device in thermal contraction area - Google Patents
Infrared thermographic testing device in thermal contraction area Download PDFInfo
- Publication number
- CN206132683U CN206132683U CN201621009369.XU CN201621009369U CN206132683U CN 206132683 U CN206132683 U CN 206132683U CN 201621009369 U CN201621009369 U CN 201621009369U CN 206132683 U CN206132683 U CN 206132683U
- Authority
- CN
- China
- Prior art keywords
- shrink belt
- defect
- area
- thermal imaging
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The utility model provides an infrared thermographic testing device in thermal contraction area. The device is applied to the defect detecting in the thermal contraction area of long distance pipeline, includes: optics driving source, infrared thermal imaging module and processing module, wherein, the optics driving source sets up the position department at a default distance of the surface apart from the thermal contraction area, or sets up in the inboard that the long distance pipeline is relative with the thermal contraction area, and the optics driving source is used for bringing into the thermal contraction goes light and encourage, the infrared thermal imaging module is connected with processing module, and the infrared thermal imaging module is used for acquireing the surperficial thermal picture of thermal contraction area after the excitation of optics driving source, processing module, it is right to be used for surface thermal picture carries out the temperature that thermal contraction area surface was acquireed in the analysis, according to the the defect information in temperature determination thermal contraction area, the defect information includes: the defect area's on thermal contraction area surface area and defect area's defect degree. The utility model discloses simple as a result, the testing result is comparatively accurate, and efficiency is higher, and operation process is simple and convenient moreover.
Description
Technical field
This utility model is related to shrink belt quality of adhesive detection technical field, more particularly to a kind of shrink belt is infrared
Thermal imaging detection means.
Background technology
It, for antiseptical component at pipeline welding, is to ensure pipeline corrosion protection system integrity that pipeline shrink belt is
Important component part.According to pertinent literature, as shrink belt hollowing causes hydrops, local corrosion and material damage etc., most
The accident of whole booster happens occasionally.Therefore shrink belt quality of adhesive detection is the important component part in conduit running safety.
In prior art, conventional detection method is, at the scene after the completion of operation, is detected by destructive stripping, note
Record peel strength to evaluate bonding quality.But said method operation is complex, and cannot accurately detect defect area
Size and defect level.
Utility model content
This utility model provides a kind of infrared thermal imaging detection means of shrink belt, so that overcome cannot be accurate in prior art
The problem of the true size and defect level that detect defect area.
This utility model provides a kind of infrared thermal imaging detection means of shrink belt, is applied to the thermal contraction of long distance pipeline
The defects detection of band, including：
Optical excitation source, infrared thermal imaging module and processing module；
Wherein, the optical excitation source is arranged on the position of the first predeterminable range of the outer surface apart from the shrink belt
Place, or the long distance pipeline inner side relative with the shrink belt is arranged on, the optical excitation source is for the heat receipts
Contracting band carries out light stimulus；
The infrared thermal imaging module is connected with the processing module, and the infrared thermal imaging module is used to obtain the heat
Shrink surface thermography of the band after the optical excitation source forcing；
The processing module, for the temperature for obtaining the shrink belt surface is analyzed to the surface thermography,
The defect information of the shrink belt is determined according to the temperature；The defect information includes：The shrink belt surface lack
The defect level of the area in sunken region and the defect area.
Alternatively, as a kind of enforceable mode, the infrared thermal imaging module includes：Infrared thermal imaging equipment.
Alternatively, as a kind of enforceable mode, the infrared thermal imaging module is arranged on apart from the shrink belt
Outer surface the second predeterminable range position at.
Alternatively, as a kind of enforceable mode, the optical excitation source includes LASER Light Source.
Alternatively, as a kind of enforceable mode, the processing module, specifically for：If the shrink belt surface
Temperature there is temperature difference, it is determined that temperature is the defect area higher than the surface region in other regions, and according to the temperature
Degree difference determines the area and defect level of the defect area.
Alternatively, as a kind of enforceable mode, the processing module, specifically for：The temperature difference is bigger, then really
The defect level of the fixed defect area is stronger.
The infrared thermal imaging detection means of this utility model shrink belt, including：Optical excitation source, infrared thermal imaging module
And processing module；Wherein, the optical excitation source is arranged on the first predeterminable range of the outer surface apart from the shrink belt
At position, or the long distance pipeline inner side relative with the shrink belt is arranged on, the optical excitation source is for described
Shrink belt carries out light stimulus；The infrared thermal imaging module is connected with the processing module, and the infrared thermal imaging module is used
In surface thermography of the acquisition shrink belt after the optical excitation source forcing；The processing module, for by right
The surface thermography of shrink belt is analyzed the temperature for obtaining shrink belt surface, is capable of determining that the heat is received according to temperature
The defect information of contracting band；The defect information includes：The area and the defect of the defect area on the shrink belt surface
The defect level in region, testing result are more accurate, and efficiency is higher, and operating process is easy.
Description of the drawings
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or accompanying drawing to be used is briefly described needed for description of the prior art, it should be apparent that, drawings in the following description are
Some embodiments of the present utility model, for those of ordinary skill in the art, in the premise for not paying creative labor
Under, can be with according to these other accompanying drawings of accompanying drawings acquisition.
Schematic flow sheets of the Fig. 1 for one embodiment of infrared thermal imaging testing method of this utility model shrink belt；
Defect schematic diagrams of the Fig. 2 for this utility model shrink belt；
Schematic flow sheets of the Fig. 3 for another embodiment of infrared thermal imaging testing method of this utility model shrink belt；
Structural representations of the Fig. 4 for one embodiment of infrared thermal imaging detection means of this utility model shrink belt；
Fig. 5 is illustrated with the position relationship of shrink belt for the infrared thermal imaging detection means of this utility model shrink belt
Figure.
Specific embodiment
It is to make purpose, technical scheme and the advantage of this utility model embodiment clearer, new below in conjunction with this practicality
Accompanying drawing in type embodiment, is clearly and completely described to the technical scheme in this utility model embodiment, it is clear that retouched
The embodiment stated is a part of embodiment of this utility model, rather than the embodiment of whole.Based on the enforcement in this utility model
Example, the every other embodiment obtained under the premise of creative work is not made by those of ordinary skill in the art are belonged to
The scope of this utility model protection.
The method of this utility model embodiment is applied to the shrink belt bonding quality of joint coating on pipeline and evaluates and defects detection
Or similar structures quality evaluation and the defects detection of other nonmetallic materials-metal material bonding.
Schematic flow sheets of the Fig. 1 for one embodiment of infrared thermal imaging testing method of this utility model shrink belt.Fig. 2 is
The defect schematic diagram of this utility model shrink belt.As shown in figure 1, the method for the present embodiment, is applied to the heat receipts of long distance pipeline
The defects detection of contracting band, the method include：
The surface thermography of step 101, the acquisition shrink belt after optical excitation source forcing；
Step 102, the temperature for obtaining the shrink belt surface is analyzed to the surface thermography, according to the temperature
Degree determines the defect information of the shrink belt；The defect information includes：The face of the defect area on the shrink belt surface
The defect level of the long-pending and defect area.
Alternatively, before step 101, can also proceed as follows：
The optical excitation source is arranged on into the top of the shrink belt, or the long distance pipeline is arranged on the heat
Shrink with relative inner side.
Specifically, the method for this utility model embodiment is the detection method based on infrared thermal imaging, even if with optical
Mode is heated to material, is detected using reflective or transmission-type infrared thermography, i.e., by the way of light stimulus
Infrared thermal imaging detection is carried out to shrink belt.Optical excitation source is arranged in into the top (on the outside of pipeline) or lower section of shrink belt
(insides of pipes), infrared thermal imaging equipment (such as thermal infrared imager) are arranged in the top (on the outside of pipeline) of shrink belt.
During detection, row energization is entered to shrink belt in optical excitation source, during obtaining excitation by infrared thermal imaging equipment
With after excitation a period of time in surface thermography, and by computer to record the thermographic data in surface in said process
In over time situation be analyzed process, obtain the temperature on shrink belt surface, thermal contraction determined according to temperature then
The area and defect level of the defect information of band, such as defect area.
Below such scheme is illustrated：
Detected object surface is subject to optical excitation, absorbs luminous energy and is converted into heat energy, causes surface temperature to rise.Due to quilt
Detection object internal temperature is not raised, and causes original thermal balance to be broken, and heat is internally passed by detected object surface
Lead.In the good region of bonding quality, shrink belt and pipeline body contact are tight, and conduction of heat is fast；Bonding quality is bad, and goes out
Existing unsticking or the region of corrosion, shrink belt and pipeline body are contacted more loose or are not directly contacted with, and conduction of heat is slow.Such as Fig. 2
Shown, long distance pipeline body is T2, is observed from detected object (i.e. shrink belt T1) outer surface S1, it is possible to find hull-skin temperature
Raise after by optical excitation, after detected object proceeds by conduction of heat, the region T3 that there is bonding defect is corresponding
Surface S11 is acted on due to the thermal resistance of T3, causes the surface temperature of S11 higher than the surface temperature of surface S12, and S12 is S1 except S11
Surface.The surface thermography (i.e. surface temperature thermal map) of whole S1 is observed by thermal infrared imager, the position of S11 can be found out
Put, the temperature difference of area size and S11 and S12, judge the area and defect level of defect area.
Further, the temperature difference of S11 and S12 is bigger, then description defect degree is stronger.
The infrared thermal imaging testing method of the shrink belt that the present embodiment is provided, by the surface thermography to shrink belt
The temperature for obtaining shrink belt surface is analyzed, the defect information of the shrink belt is capable of determining that according to temperature；It is described
Defect information includes：The defect level of the area and the defect area of the defect area on the shrink belt surface, detection
As a result more accurately, efficiency is higher, and operating process is easy.
Schematic flow sheets of the Fig. 3 for another embodiment of infrared thermal imaging testing method of this utility model shrink belt.Such as
Shown in Fig. 3, on the basis of above-described embodiment, the method for the present embodiment, including：
The surface thermography of step 101, the acquisition shrink belt after optical excitation source forcing；
Step 1021, the temperature for obtaining the shrink belt surface is analyzed to the surface thermography；
If step 1022, the shrink belt surface have temperature difference, it is determined that surface district of the temperature higher than other regions
Domain is the defect area, and the area and defect level of the defect area are determined according to the temperature difference.
Specifically, as shown in Fig. 2 observing from detected object (i.e. shrink belt) outer surface S1, it is possible to find outer surface temperature
Degree is raised after by optical excitation, and after shrink belt proceeds by conduction of heat, the region T3 that there is bonding defect is corresponding
Surface S11 is acted on due to the thermal resistance of T3, causes the surface temperature of S11 higher than the surface temperature of surface S12, and S12 is S1 except S11
Surface.The surface thermography (i.e. surface temperature thermal map) of whole S1 is observed by thermal infrared imager, the position of S11 can be found out
Put, the temperature difference of area size and S11 and S12, judge the area and defect level of defect area.
The temperature on shrink belt surface i.e. in said process, is most importantly obtained, goes to judge defect area according to temperature difference
The area and defect level in domain.
If the temperature on shrink belt surface is consistent, shrink belt zero defect is illustrated；If the temperature tool on shrink belt surface
There is temperature difference, then explanation is with defect, it is determined that temperature is defect area higher than the surface region in other regions, because the region
The relatively slow therefore temperature of conduction of heat it is higher, then the area of the defect area is can determine that according to temperature difference, and is determined and is lacked
The defect level in sunken region.
Wherein, in actual applications, the temperature difference is bigger, it is determined that the defect level of the defect area is stronger.
The method of the present embodiment, by the temperature for obtaining the shrink belt surface is analyzed to the surface thermography
Degree；If the shrink belt surface has temperature difference, it is determined that temperature is the defect area higher than the surface region in other regions
Domain, and the area and defect level of the defect area are determined according to the temperature difference, it is capable of determining that the shrink belt
Defect information, testing result is more accurate, and efficiency is higher, and operating process is easy.
Structural representations of the Fig. 4 for one embodiment of infrared thermal imaging detection means of this utility model shrink belt.Fig. 5 is
The infrared thermal imaging detection means of this utility model shrink belt and the position relationship schematic diagram of shrink belt.As shown in figure 4, this
The infrared thermal imaging detection means 40 of the shrink belt of embodiment, is applied to the defects detection of the shrink belt of long distance pipeline, bag
Include：
Optical excitation source 401, infrared thermal imaging module 402 and processing module 403；
Wherein, the optical excitation source 401 is arranged on the first predeterminable range of the outer surface apart from the shrink belt T1
At the position of L1, or the long distance pipeline inner side relative with the shrink belt is arranged on, the optical excitation source 401 is used for
Light stimulus is carried out to the shrink belt；
The infrared thermal imaging module 402 is connected with the processing module 403, and the infrared thermal imaging module 402 is used for
Obtain surface thermography of the shrink belt after the optical excitation source forcing 401；
The processing module 403, for the temperature for obtaining the shrink belt surface is analyzed to the surface thermography
Degree, determines the defect information of the shrink belt according to the temperature；The defect information includes：The shrink belt surface
The defect level of the area of defect area and the defect area.
Specifically, as shown in figure 5, optical excitation source is illustrate only in Fig. 5 is arranged on the appearance apart from the shrink belt
At the position of the first predeterminable range L1 in face, in Fig. 5, show that optical excitation source is arranged on the top of the outer surface of shrink belt,
Can also be arranged below in other embodiment of the present utility model, front, at the position such as rear, this utility model to this simultaneously
Do not limit.
Alternatively, the infrared thermal imaging module includes：Infrared thermal imaging equipment.
Alternatively, the infrared thermal imaging module is arranged on the second predeterminable range of the outer surface apart from the shrink belt
At the position of L2.
In actual applications, infrared thermal imaging module can also be arranged on the appearance apart from the shrink belt by support
At the position of the second predeterminable range L2 in face.
Alternatively, the optical excitation source includes LASER Light Source.
In actual applications, optical excitation source 401 can be arranged on the appearance apart from the shrink belt T1 by support
At the position of the first predeterminable range L1 in face, or it is arranged on the long distance pipeline inner side relative with the shrink belt.
Specifically, the device of this utility model embodiment is the detection means based on infrared thermal imaging, even if with optical
Mode is heated to material, is detected using reflective or transmission-type infrared thermography, i.e., by the way of light stimulus
Infrared thermal imaging detection is carried out to shrink belt.Optical excitation source is arranged in into the top (on the outside of pipeline) or lower section of shrink belt
(insides of pipes), infrared thermal imaging equipment (such as thermal infrared imager) are arranged in the top (on the outside of pipeline) of shrink belt.
During detection, row energization is entered to shrink belt in optical excitation source, during obtaining excitation by infrared thermal imaging module
With after excitation a period of time in surface thermography, and by processing module to record the thermographic data in surface in above-mentioned mistake
In journey, situation is analyzed process over time, obtains the temperature on shrink belt surface, then determines that heat is received according to temperature
The area and defect level of the defect information of contracting band, such as defect area.
Below such scheme is illustrated：
Detected object surface is subject to optical excitation, absorbs luminous energy and is converted into heat energy, causes surface temperature to rise.Due to quilt
Detection object internal temperature is not raised, and causes original thermal balance to be broken, and heat is internally passed by detected object surface
Lead.In the good region of bonding quality, shrink belt and pipeline body contact are tight, and conduction of heat is fast；Bonding quality is bad, and goes out
Existing unsticking or the region of corrosion, shrink belt and pipeline body are contacted more loose or are not directly contacted with, and conduction of heat is slow.Such as Fig. 2
Shown, long distance pipeline body is T2, is observed from detected object (i.e. shrink belt T1) outer surface S1, it is possible to find hull-skin temperature
Raise after by optical excitation, after detected object proceeds by conduction of heat, the region T3 that there is bonding defect is corresponding
Surface S11 is acted on due to the thermal resistance of T3, causes the surface temperature of S11 higher than the surface temperature of surface S12, and S12 is S1 except S11
Surface.The surface thermography (i.e. surface temperature thermal map) of whole S1 is observed by thermal infrared imager, the position of S11 can be found out
Put, the temperature difference of area size and S11 and S12, judge the area and defect level of defect area.
Further, the temperature difference of S11 and S12 is bigger, then description defect degree is stronger.
The infrared thermal imaging detection means of the shrink belt that the present embodiment is provided, including：Optical excitation source, infrared thermal imaging
Module and processing module；Wherein, the optical excitation source be arranged on the outer surface apart from the shrink belt first it is default away from
From position away from, or be arranged on the long distance pipeline inner side relative with the shrink belt, it is right that the optical excitation source is used for
The shrink belt carries out light stimulus；The infrared thermal imaging module is connected with the processing module, the infrared thermal imaging mould
Block is used to obtain surface thermography of the shrink belt after the optical excitation source forcing；The processing module, for leading to
Cross the surface thermography to shrink belt and be analyzed the temperature for obtaining shrink belt surface, according to temperature is capable of determining that
The defect information of shrink belt；The defect information includes：The area of the defect area on the shrink belt surface and described
The defect level of defect area, testing result are more accurate, and efficiency is higher, and operating process is easy.
Alternatively, as a kind of enforceable mode, the processing module 403, specifically for：
If the temperature on the shrink belt surface has temperature difference, it is determined that temperature is higher than that the surface region in other regions is
The defect area, and the area and defect level of the defect area are determined according to the temperature difference.
Alternatively, as a kind of enforceable mode, the processing module 403, specifically for：
The temperature difference is bigger, it is determined that the defect level of the defect area is stronger.
Processing module 403 in said apparatus can be realized by processor.
The device of the present embodiment, can be used for performing the technical scheme of embodiment of the method as shown in Figure 1, its realize principle and
Technique effect is similar to, and here is omitted.
Finally it should be noted that：Various embodiments above is only illustrating the technical solution of the utility model, rather than which is limited
System；Although being described in detail to this utility model with reference to foregoing embodiments, one of ordinary skill in the art should
Understand：Which still can be modified to the technical scheme described in foregoing embodiments, or to which part or whole
Technical characteristic carries out equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from this practicality new
The scope of each embodiment technical scheme of type.
Claims (6)
1. the infrared thermal imaging detection means of a kind of shrink belt, it is characterised in that be applied to the shrink belt of long distance pipeline
Defects detection, described device include：
Optical excitation source, infrared thermal imaging module and processing module；
Wherein, the optical excitation source is arranged at the position of the first predeterminable range of the outer surface of the shrink belt,
Or the long distance pipeline inner side relative with the shrink belt is arranged on, the optical excitation source is for the shrink belt
Carry out light stimulus；
The infrared thermal imaging module is connected with the processing module, and the infrared thermal imaging module is used to obtain the thermal contraction
Surface thermography of the band after the optical excitation source forcing；
The processing module, for the temperature for obtaining the shrink belt surface is analyzed to the surface thermography, according to
The temperature determines the defect information of the shrink belt；The defect information includes：The defect area on the shrink belt surface
The defect level of the area in domain and the defect area.
2. device according to claim 1, it is characterised in that the infrared thermal imaging module includes：Infrared thermal imaging sets
It is standby.
3. device according to claim 1, it is characterised in that the infrared thermal imaging module is arranged on to be received apart from the heat
At the position of the second predeterminable range of the outer surface of contracting band.
4. device according to claim 1, it is characterised in that the optical excitation source includes LASER Light Source.
5. the device according to any one of claim 1-4, it is characterised in that the processing module, specifically for：If described
The temperature on shrink belt surface has temperature difference, it is determined that temperature is the defect area higher than the surface region in other regions,
And the area and defect level of the defect area are determined according to the temperature difference.
6. device according to claim 5, it is characterised in that the processing module, specifically for：The temperature difference is got over
Greatly, it is determined that the defect level of the defect area is stronger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621009369.XU CN206132683U (en) | 2016-08-30 | 2016-08-30 | Infrared thermographic testing device in thermal contraction area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621009369.XU CN206132683U (en) | 2016-08-30 | 2016-08-30 | Infrared thermographic testing device in thermal contraction area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206132683U true CN206132683U (en) | 2017-04-26 |
Family
ID=58566791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621009369.XU Expired - Fee Related CN206132683U (en) | 2016-08-30 | 2016-08-30 | Infrared thermographic testing device in thermal contraction area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206132683U (en) |
-
2016
- 2016-08-30 CN CN201621009369.XU patent/CN206132683U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2351531T3 (en) | PROCEDURE FOR THE AUTOMATIC CHECK OF A UNION OF MATERIALS. | |
| Deane et al. | Application of NDT thermographic imaging of aerospace structures | |
| EP3489675B1 (en) | Thermography inspection for near-surface inconsistencies of composite structures combined with ultrasonic inspection | |
| CN102735687B (en) | Infrared sequence thermography analysis method for impact defects of carbon fiber composite material | |
| CN105181786A (en) | Weld defect magnetic detection method | |
| US11815490B2 (en) | Apparatus and method for inspecting a fusion joint | |
| CN102009474A (en) | Method for testing welding quality of electro-fusion joint and realizing automatic evaluation | |
| CN108506732A (en) | Oil pipeline anti-leak monitors system | |
| CN106932415B (en) | A kind of dedicated compound non-destructive testing device of laser weld joint and method | |
| CN206132683U (en) | Infrared thermographic testing device in thermal contraction area | |
| CN103639895B (en) | A kind of grinding temperature measuring method based on Inverse Heat Conduction Problem Analysis | |
| CN106324036A (en) | Infrared thermal imaging detection method and device for heat shrinkable tape | |
| CN108827972A (en) | Exterior wall defect method and detection system are detected using active heat source thermal infrared imaging | |
| CN105928979A (en) | Method and equipment for measuring friction stir welding holes | |
| JP2017078624A (en) | Method and device for inspecting connectability of sample | |
| CN107796853A (en) | The infrared thermal imaging testing method and device of shrink belt | |
| CN116823769A (en) | Photovoltaic module defect detection method and system | |
| US11839935B2 (en) | Method and system for weld defect detection | |
| CN206114574U (en) | Infrared thermographic testing device in thermal contraction area | |
| JPH1058170A (en) | Method and device for judging quality of laser beam welding | |
| CN110398511B (en) | Welding thermal cycle curve tester | |
| CN105259094B (en) | Immunity-chromatography test strip sample liquid flow velocity detecting system based on infrared thermal imagery and method | |
| Hu et al. | A review and preliminary experiment on application of infrared thermography in welding | |
| Pech-May et al. | Robot-assisted laser thermography: towards automatic characterization of surface defects | |
| CN205334487U (en) | Product labelling detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170426 Termination date: 20180830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |