CN206116375U - A metal soleplate for hybrid integrated circuit encapsulation - Google Patents
A metal soleplate for hybrid integrated circuit encapsulation Download PDFInfo
- Publication number
- CN206116375U CN206116375U CN201620918329.0U CN201620918329U CN206116375U CN 206116375 U CN206116375 U CN 206116375U CN 201620918329 U CN201620918329 U CN 201620918329U CN 206116375 U CN206116375 U CN 206116375U
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- CN
- China
- Prior art keywords
- base plate
- plate body
- bottom plate
- muscle
- integrated circuit
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Abstract
The utility model discloses a metal soleplate for hybrid integrated circuit encapsulation, its characterized in that: including bottom plate body, bottom plate step, circular recess, footnote note, pin hole, interior muscle, outer muscle, the bottom plate step below the bottom plate body, bottom plate body bottom surface be equipped with the circular recess more than 2, the axis of circular recess at the bottom plate body around on the neutral surface, bottom plate body top surface be equipped with the footnote note, the bottom plate body on be equipped with the pin hole of a plurality of symmetric distribution, the axis of bottom plate pin hole keep away from bottom plate body neutral surface around, the bottom plate step on be equipped with interior muscle, interior muscle highly be not more than 1mm, the bottom plate step on be equipped with outer muscle, outer muscle the same with interior muscle shape. The utility model discloses simple structure, mechanical strength is good, and electric signal transmission is stable, and the thermal energy is little, and the gas tightness is good, and performance is stable, and the reliability is high, can be used to hybrid integrated circuit's at different levels encapsulation.
Description
Technical field
The utility model belongs to integrated antenna package technical field, and in particular to it is a kind of for hydrid integrated circuit encapsulation
Metal base plate.
Background technology
Mixing microelectric technique is to realize the effective way that high-reliability electrical subsystem is miniaturized.Hybrid microcircuit adopts high gas
Close property material is packaged, and is to realize the necessary means that hybrid microcircuit is effectively applied under various environmental conditions.With bonding die
With the rapid raising of the maturation of Wire Bonding and chip yield, hybrid microcircuit rear portion encapsulation cost account for whole component cost
Proportion be gradually increasing.The encapsulation of hybrid microcircuit requires to avoid being contacted with extraneous air, to reduce air in steam, impurity
With pollution and corrosion of the various chemical atmospheres to chip, it is desirable to which integrated circuit package structure should have certain mechanical strength, good
Outside electric property well, heat dispersion and chemical stability, and well packaged air-tightness.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of for mixing for above-mentioned the deficiencies in the prior art
The metal base plate of integrated antenna package, its simple structure, mechanical strength is good, and electric signal transmission is stable, and thermal expansion is little, air-tightness
Good, performance is stable, and reliability is high.
To realize above-mentioned technical purpose, the technical scheme that the utility model is taken is：
A kind of metal base plate for hydrid integrated circuit encapsulation, including base plate body, base plate step, circular trough, footnote
Note, fairlead, interior muscle, outer muscle, below base plate body, described base plate body bottom surface is provided with 2 to described base plate step
More than circular trough, on neutral surface before and after base plate body, described base plate body top surface sets the axis of described circular trough
There is footnote to remember, described base plate body is provided with several symmetrical fairleads, the axis of described base plate fairlead is remote
The neutral surface before and after base plate body, described base plate step is provided with interior muscle, and the height of described interior muscle is not more than 1mm, institute
The base plate step stated is provided with outer muscle, and described outer muscle is identical with interior muscle shape.
To optimize above-mentioned technical proposal, the concrete measure taken also includes：
The material of above-mentioned base plate body adopts 4J29 alloys, in cube structure.
Above-mentioned circular trough is that notch diameter is big, the little trapezoidal shape of groover rot diameter.
Above-mentioned interior muscle and outer muscle is in isosceles triangle shape, and vertex angle is not less than 60 °.
Optional vitreum or ceramics are fixed on lead-foot-line in fairlead, and circular trough is designed for determining for base plate body
Position, contributes to the encapsulation of electronic devices and components and the seam final with supporting framework or pipe cap on base plate body, and interior muscle outer muscle sets
Meter can improve the air-tightness of encapsulation, the pollution and corrosion that prevent steam, impurity and various chemical atmospheres that can be permanently effective, carry
Reliability in high long-time use, increases the service life.
The utility model its simple structure, mechanical strength is good, and electric signal transmission is stable, and thermal expansion is little, and air-tightness is good, uses
Stable performance, reliability is high.
Description of the drawings
Fig. 1 is front view of the present utility model.
Fig. 2 is top view of the present utility model.
Fig. 3 is the enlarged drawing of local I of the utility model Fig. 1.
Reference therein is：It is base plate body 1, base plate step 2, circular trough 3, footnote note 4, fairlead 5, interior muscle 6, outer
Muscle 7.
Specific embodiment
Specific embodiment of the present utility model is further illustrated below in conjunction with the accompanying drawings：
A kind of metal base plate for hydrid integrated circuit encapsulation, wherein：Including base plate body 1, base plate step 2, circle
Groove 3, footnote note 4, fairlead 5, interior muscle 6, outer muscle 7, described base plate step 2 below base plate body 1, described base plate sheet
The bottom surface of body 1 is provided with the circular trough 3 of more than 2, and the axis of described circular trough 3 is described on neutral surface before and after base plate body 1
The top surface of base plate body 1 be provided with footnote note 4, described base plate body 1 is provided with several symmetrical fairleads 5, described
Base plate fairlead 5 axis away from neutral surface before and after base plate body 1, described base plate step 2 is provided with interior muscle 6, described
The height of interior muscle 6 be not more than 1mm, described base plate step 2 is provided with outer muscle 7, and described outer muscle 7 is identical with the shape of interior muscle 6.
In embodiment, the material of base plate body 1 adopts 4J29 alloys, in cube structure.
In embodiment, circular trough 3 is that notch diameter is big, the little trapezoidal shape of groover rot diameter.
In embodiment, interior muscle 6 and outer muscle 7 are in isosceles triangle shape, and vertex angle is not less than 60 °.
The size of base plate body, thickness can be set according to actual conditions, and the size of circular trough and fairlead, spacing can
According to circumstances change, the position of the outer muscle of interior muscle is changed also dependent on situation.
The above is only preferred embodiment of the present utility model, protection domain of the present utility model is not limited merely to above-mentioned
Embodiment, all technical schemes belonged under the utility model thinking belong to protection domain of the present utility model.It should be pointed out that right
For those skilled in the art, some improvements and modifications under the premise of without departing from the utility model principle,
Should be regarded as protection domain of the present utility model.
Claims (4)
1. it is a kind of for hydrid integrated circuit encapsulation metal base plate, it is characterised in that：Including base plate body (1), base plate step
(2), circular trough (3), footnote note (4), fairlead (5), interior muscle (6), outer muscle (7), described base plate step (2) is in base plate body
(1) below, described base plate body (1) bottom surface is provided with the circular trough (3) of more than 2, and the axis of described circular trough (3) exists
Before and after base plate body (1) on neutral surface, described base plate body (1) top surface is provided with footnote note (4), described base plate body
(1) several symmetrical fairleads (5) are provided with, the axis of described base plate fairlead (5) is away from base plate body (1)
Neutral surface in front and back, described base plate step (2) is provided with interior muscle (6), and the height of described interior muscle (6) is not more than 1mm, described
Base plate step (2) is provided with outer muscle (7), and described outer muscle (7) is identical with interior muscle (6) shape.
2. it is according to claim 1 it is a kind of for hydrid integrated circuit encapsulation metal base plate, it is characterised in that：Described
The material of base plate body (1) adopts 4J29 alloys, in cube structure.
3. it is according to claim 1 and 2 it is a kind of for hydrid integrated circuit encapsulation metal base plate, it is characterised in that：Institute
The circular trough (3) stated is big for notch diameter, the little trapezoidal shape of groover rot diameter.
4. it is according to claim 1 and 2 it is a kind of for hydrid integrated circuit encapsulation metal base plate, it is characterised in that：Institute
The interior muscle (6) stated and outer muscle (7) are in isosceles triangle shape, and vertex angle is not less than 60 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620918329.0U CN206116375U (en) | 2016-08-23 | 2016-08-23 | A metal soleplate for hybrid integrated circuit encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620918329.0U CN206116375U (en) | 2016-08-23 | 2016-08-23 | A metal soleplate for hybrid integrated circuit encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206116375U true CN206116375U (en) | 2017-04-19 |
Family
ID=58511390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620918329.0U Expired - Fee Related CN206116375U (en) | 2016-08-23 | 2016-08-23 | A metal soleplate for hybrid integrated circuit encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206116375U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252296A (en) * | 2016-08-23 | 2016-12-21 | 太仓市威士达电子有限公司 | A kind of metal base plate for hydrid integrated circuit encapsulation |
-
2016
- 2016-08-23 CN CN201620918329.0U patent/CN206116375U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106252296A (en) * | 2016-08-23 | 2016-12-21 | 太仓市威士达电子有限公司 | A kind of metal base plate for hydrid integrated circuit encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170419 Termination date: 20200823 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |