CN206098393U - Array baseplate and display device - Google Patents
Array baseplate and display device Download PDFInfo
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- CN206098393U CN206098393U CN201621167964.6U CN201621167964U CN206098393U CN 206098393 U CN206098393 U CN 206098393U CN 201621167964 U CN201621167964 U CN 201621167964U CN 206098393 U CN206098393 U CN 206098393U
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- pattern
- holding wire
- array base
- base palte
- binding
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Abstract
An embodiment of the utility model provides an array baseplate and display device relates to and shows technical field for solve the easy problem of breaking of pressing of insulating layer of signal line main part top. This array substrate is including setting gradually the first insulation layer on the substrate base plate, first conducting layer, second insulating layer and second conducting layer, first conducting layer includes the regional many barss line of binding that is located the substrate base plate, and the signal line includes main part and connecting portion, regional a plurality of patterns of binding are bound including being located to the second conducting layer, bind the via hole that the pattern runs through on the second insulating layer and are connected with the connecting portion of signal line, the first insulation layer is provided with the recess in the position of the main part of corresponding signal line, and the main part of signal line is arranged in the recess.
Description
Technical field
The utility model is related to display technology field, more particularly to a kind of array base palte and display device.
Background technology
With the increasingly rising for showing product resolution ratio, in binding (Bonding) the region A of array base palte, such as Fig. 1 a
Shown, when one end of every signal line 100 is connected with data wire, the other end is connected with binding pattern (Bonding Pin) 200
When, the spacing between holding wire 100 is less and less.In addition, above-mentioned binding pattern (Bonding Pin) 200 is used for and drives IC
(integrated circuit, integrated circuit) is bound, general to adopt connect adjacent holding wire in prior art
Binding pattern 200 staggers and is arranged in different rows, to reduce the length of driving IC chip, realizes integrated control.
However, the reduction of the length of the offer and driving IC chip due to showing product resolution ratio, such as Fig. 1 b (Fig. 1 a edges
The profile in O-O ' directions) shown in, insulating barrier is coated with holding wire 100, pass through with binding pattern 200 in driving IC chip
When conducting resinl (Anisotropic Conductive film, AFC) carries out extruding binding, when the situation for producing slight skew
Under, easily the insulating barrier of holding wire 100 top adjacent with binding pattern 200 is crushed, so that holding wire 100 is weather-proof
Property reduce, or even occur binding pattern 200 be short-circuited by AFC with holding wire 100, in turn resulting in the display product, with
There are the phenomenons such as concealed wire in the viewing area of the short-circuit connection of holding wire 100, and cannot normally show.In particular in having
The display product of high-resolution low temperature polycrystalline silicon (Low Temperature Poly-silicon, LTPS), drawbacks described above is outstanding
For obvious.
Utility model content
Embodiment of the present utility model provides a kind of array base palte and display device, to solve holding wire main part top
The problem that easily crushes of insulating barrier.
To reach above-mentioned purpose, embodiment of the present utility model is adopted the following technical scheme that：
On the one hand the utility model embodiment provides a kind of array base palte, including first be set in turn on underlay substrate
Insulating barrier, the first conductive layer, the second insulating barrier and the second conductive layer；First conductive layer includes being located at the substrate base
Many signal lines of the binding region of plate, the holding wire includes main part and connecting portion；Second conductive layer includes being located at
Multiple binding patterns of the binding region, via and the holding wire of the binding pattern on second insulating barrier
Connecting portion connection；First insulating barrier arranges fluted, the signal in the position of the main part of the correspondence holding wire
The main body section of line is in the groove.
Further, the binding pattern is distributed at least two rows, and the binding figure of the adjacent holding wire connection
Case is distributed in different rows.
Further, projection of the connecting portion of the holding wire on the underlay substrate with it is described binding pattern described
Projection on underlay substrate overlaps.
Further, depth of the thickness of the main part of the holding wire less than or equal to the groove.
Further, the array base palte is also included positioned at padded between the underlay substrate and first insulating barrier
Pattern, and projection of projection of the padded pattern on the underlay substrate with the binding pattern on the underlay substrate
Overlap.
Further, the padded pattern is constructed from a material that be electrically conducting, and the padded pattern passes through first insulating barrier
On via be connected with the connecting portion of the holding wire.
Further, the padded pattern be located at viewing area grid line with the same material of layer.
Further, first conductive layer also includes being located at the data wire of viewing area and the source and drain of thin film transistor (TFT)
Pattern.
Further, second conductive layer also includes being located at the transparency electrode of viewing area.
On the other hand the utility model also provides a kind of display device, including any of the above-described kind of array base palte.
The utility model embodiment provides a kind of array base palte and display device, and the array base palte includes being set in turn in lining
The first insulating barrier, the first conductive layer, the second insulating barrier and the second conductive layer on substrate.Wherein, the first conductive layer includes
Positioned at many signal lines of the binding region of underlay substrate, holding wire includes main part and connecting portion；Second conductive layer includes position
In multiple binding patterns of binding region, bind via of the pattern on the second insulating barrier and be connected with the connecting portion of holding wire；
First insulating barrier correspondence holding wire main part position arrange it is fluted, the main part of holding wire in the grooves, so as to
So that the upper surface of the main part of the holding wire has certain drop relative to the upper surface of connecting portion, and then cause binding figure
Case when the via on the second insulating barrier is connected with the connecting portion of holding wire, the main part of the binding pattern and the holding wire
Between vertical range increase, namely binding pattern and the holding wire main part above the second insulating barrier upper surface between
Vertical range increase so that when bind pattern with drive IC carry out extruding binding when, even if drive IC produce it is slight
Skew, the extruding force that the second insulating barrier above the main part of the holding wire is subject to is obviously reduced, it is ensured that holding wire main part
Second insulating barrier of top is difficult to be crushed.
Description of the drawings
In order to be illustrated more clearly that the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, in the premise for not paying creative work
Under, can be with according to these other accompanying drawings of accompanying drawings acquisition.
A kind of distribution schematic diagram of binding pattern that Fig. 1 a are carried for prior art；
Fig. 1 b are generalized sections of Fig. 1 a along O-O ' directions；
The distribution schematic diagram of pattern is bound on a kind of array base palte that Fig. 2 a are provided for the utility model embodiment；
Fig. 2 b are generalized sections of Fig. 2 a along B-B ' directions；
The distribution schematic diagram of pattern is bound on another kind of array base palte that Fig. 3 is provided for the utility model embodiment；
A kind of cross-section structure of array base palte binding region that Fig. 4 a are provided for the utility model embodiment is illustrated；
The cross-section structure of another kind of array base palte binding region that Fig. 4 b are provided for the utility model embodiment is illustrated；
The cross-section structure of another array base palte binding region that Fig. 5 a are provided for the utility model embodiment is illustrated；
The cross-section structure of another array base palte binding region that Fig. 5 b are provided for the utility model embodiment is illustrated.
Reference：
10- underlay substrates；The insulating barriers of 11- first；The insulating barriers of 12- second；100- holding wires；101- main parts；102- connects
Socket part；110- grooves；200- binds pattern；The padded patterns of 300-.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
The utility model embodiment provides a kind of array base palte, such as Fig. 2 a and Fig. 2 b (profiles of Fig. 2 a along B-B ' directions)
Shown, the array base palte includes the first insulating barrier 11, the first conductive layer, the second insulating barrier being set in turn on underlay substrate 10
12 and second conductive layer.Wherein, the first conductive layer includes many signal lines of binding region A for being located at underlay substrate 10
100, the holding wire 100 includes main part 101 and connecting portion 102.Second conductive layer includes being located at multiple bindings of binding region A
Pattern 200, binds via of the pattern 200 on the second insulating barrier 12 and is connected with the connecting portion 102 of holding wire, the first insulating barrier
11 arrange fluted 110 in the position of the main part 101 of correspondence holding wire, and the main part 101 of holding wire is located in groove 110.
Due to above-mentioned holding wire main part in the grooves so that the upper surface of the main part of the holding wire is relative
There is certain drop in the upper surface of connecting portion, and then cause binding pattern in the via and signal on the second insulating barrier
When the connecting portion of line connects, vertical range H1 between the binding pattern and the main part of the holding wire increases, namely binding figure
Vertical range H2 between the upper surface of the second insulating barrier above the main part of case and the holding wire increases, so that work as tying up
When determining pattern with driving IC to carry out extruding binding, even if driving IC to produce slight skew, above the main part of the holding wire
The extruding force that second insulating barrier is subject to is obviously reduced, it is ensured that the second insulating barrier above holding wire main part is difficult to be crushed.
Herein it should be noted that being arranged the main part 101 of holding wire and the scheme in groove 110 using above-mentioned, one
Aspect, goes for the situation that binding pattern 200 as shown in Figure 3 is distributed in a row, can avoid because driving IC to tie up on edge
Determine the length direction of pattern 200 to shift, and easily crush the second insulating barrier 12 of the top of main part 101 of holding wire 100, from
And improve holding wire 100 weatherability of itself.On the other hand, can be applicable to, 200 points of binding pattern as shown in Figure 2 a
Cloth is at least two rows, and the binding pattern 200 of adjacent signals line connection is distributed in the situation of different rows, no matter drives IC to tie up on edge
Determine the length of pattern 200 or width skew, the second insulating barrier 12 that can reduce the top of main part 101 of holding wire is received
The extruding force for arriving, it is ensured that the second insulating barrier 12 of the top of main part 101 of holding wire is difficult to be crushed, and then reduces adjacent
Holding wire 100 between be short-circuited and cause to show bad phenomenon, while also improving the weather-proof of holding wire 100 itself
Property.
Certainly, the distribution mode of binding pattern 200 of the scheme of the present utility model for Fig. 2 a, effect becomes apparent from, especially
It is to show product with high-resolution low temperature polycrystalline silicon for existing.Following examples are with the distribution shown in Fig. 2 a
As a example by mode, the utility model is described further.
On this basis, when carrying out extruding binding with driving IC in order to avoid binding pattern 200, pattern 200 is bound with drive
There is loose contact in dynamic IC, while loose contact also occur between pattern 200 and the connecting portion 102 of holding wire in order to avoid binding
Phenomenon, the utility model is preferred, and as shown in Figure 2 a, the width of connecting portion 102 is more than main part 101 in holding wire 100
Only illustrate by taking the binding pattern 200 for illustrating as an example in width, wherein Fig. 2 a, the connecting portion 102 is in underlay substrate
Projection of the projection on 10 with binding pattern 200 on underlay substrate 10 overlaps, so, due to binding pattern 200 and connecting
The shape of socket part 102, size are consistent, on the one hand, ensure that binding pattern 200 upper surface is more smooth so that binding pattern
200 is bigger with driving IC contacts area, and contact resistance is reduced；On the other hand, the width of connecting portion 102 is more than main part 101
Width, so that the binding lower surface of pattern 200 increases with the contact area of connecting portion 102, binds pattern 200 and connecting portion
Contact resistance between 102 is reduced, therefore, binding pattern 200 and connecting portion 102 are reduced on the whole and are driven between IC
Contact resistance, reduce by drive IC put on binding pattern 200 and holding wire 100 on signal impact, for example believe
Number decay.
Hereinafter the concrete facilities of groove 110 are located to the main part 101 of above-mentioned holding wire, are described further.
For example, can as shown in Figure 2 b, the thickness of holding wire main part 101 is more than the depth of groove 110, main part 101
Upper surface protrude from the upper surface of the first insulating barrier 11.
Again for example, can as shown in fig. 4 a, the thickness of holding wire main part 101 is equal to the depth of groove 110, main part
101 upper surface is concordant with the upper surface of the first insulating barrier 11.
Again for example, can as shown in Figure 4 b, the thickness of holding wire main part 101 is less than the depth of groove 110, main part
101 upper surface is depressed in the upper surface of the first insulating barrier 11, in this case it is desirable to ensure that the thickness of the first insulating barrier 11 is big
In the thickness of holding wire main part 101.
The utility model is not limited for the main part 101 of holding wire in the facilities of groove 110, can be according to reality
The needs on border are configured.Certainly, in order that the of the top of main part 101 of upper surface and the holding wire of binding pattern 200
Vertical range H2 between the upper surface of two insulating barriers 12 increases as far as possible, and then farthest reduces the main body of holding wire
The extruding force that second insulating barrier 12 of the top of portion 101 is subject to, it is ensured that the second insulating barrier 12 of the top of main part 101 of holding wire is not
It is crushed, the utility model is preferred, as shown in Figs. 4a and 4b, the thickness of the main part 102 of holding wire is less than or equal to groove
110 depth.
On this basis, it is exhausted with the second of the top of main part 102 of holding wire in order to further improve binding pattern 200
Vertical range H2 between the upper surface of edge layer 12, as shown in Figure 5 a, wherein Fig. 5 a are only with the upper surface of main part 101 and the
Illustrate as a example by the upper surface of one insulating barrier 11 is concordant, the array base palte also includes being insulated positioned at underlay substrate 10 and first
Padded pattern 300 between layer 11, and projection of the padded pattern 300 on underlay substrate 10 and binding pattern 200 are in substrate base
Projection on plate 10 overlaps, and so, in the case where ensureing that binding pattern 200 is normally electrically connected, further raising is tied up
Vertical range between the upper surface of the second insulating barrier 12 for determining the upper surface of pattern 200 and the top of main part 101 of holding wire
H2, so as to further reduce the extruding force that second insulating barrier 12 of the top of main part 101 of holding wire 100 is subject to.
Further, in order to reduce bind pattern 200 binding position contact resistance, as shown in Figure 5 b, the padded figure
Case 300 can be constructed from a material that be electrically conducting, and padded pattern 300 is by the via on the first insulating barrier 11 and the connecting portion of holding wire
102 are connected, and now, while padded effect is played to binding pattern 200, also correspond at binding pattern 200 position
A resistance in parallel, so as to further reduce contact resistance of the binding pattern 200 in binding position, and then reduces to applying
The impact of the signal on the binding pattern 200 and holding wire 100, such as signal attenuation.
In the case, in order to simplify manufacture craft, cost of manufacture is reduced, there should be the padded pattern 300 of conducting function
Can with the grid line positioned at viewing area with the same material of layer, i.e., padded pattern 300 with grid line with the same material of layer, by with a structure
Figure technique is formed.
Herein it should be noted that in the utility model, patterning processes can refer to including photoetching process, or, including photoetching
Technique and etch step, while other technique for forming predetermined pattern can also to be used for including printing, ink-jet etc.；Photoetching work
Skill, refers to the work that utilization photoresist, mask plate, exposure machine of the technical process such as film forming, exposure, development etc. form figure
Skill.Can be according to the corresponding patterning processes of structure choice formed in the present invention.
On this basis, simplify manufacture craft in order to further, reduce cost of manufacture, above-mentioned first conductive layer also includes
Positioned at the data wire and the source and drain pattern of thin film transistor (TFT), i.e. holding wire 100 and data wire, the same layer of source and drain pattern of viewing area
Same material, by being formed with a patterning processes.
Equally, in order to simplify manufacture craft, cost of manufacture is reduced, above-mentioned second conductive layer 12 also includes being located at viewing area
Transparency electrode, that is, pattern 200 and transparency electrode are bound with the same material of layer, by being formed with a patterning processes.
Herein it should be noted that above-mentioned transparency electrode can be pixel electrode, or public electrode.Such as battle array
When row substrate is TN (Twist Nematic, twisted-nematic) type array base palte, the transparency electrode is pixel electrode；The array base
Plate is ADS (Advanced-Super Dimensional Switching, senior super dimension field switch) types or IPS (In Plane
Switch, transverse electric field effect) type array base palte when, the transparency electrode is pixel electrode or public electrode, the utility model pair
This is not construed as limiting.
Herein also, it should be noted that above-mentioned transparency electrode is made using transparent conductive material, existing electrically conducting transparent material
Material mostly typically is metal oxide, such as indium zinc oxide (IGO), tin indium oxide (ITO) etc..Compared to common metal material,
The metal oxide materials are difficult oxidation by air, so that above-mentioned binding pattern 200 sets with layer with transparency electrode with material
When putting, the contact effect between the binding pattern 200 and driving IC can keep prolonged stability.
The utility model also provides a kind of display device, including any of the above-described kind of array base palte, with aforementioned enforcement
Array base palte identical structure and beneficial effect that example is provided.Because previous embodiment to the structure of the array base palte and has
Beneficial effect is described in detail, and here is omitted.
It should be noted that in the utility model embodiment, display device specifically can at least include LCD
Plate and organic LED display panel, such as display floater can be applied to liquid crystal display, LCD TV, digital phase
In any product with display function such as frame, mobile phone or panel computer or part.
The above, specific embodiment only of the present utility model, but protection domain of the present utility model do not limit to
In this, any those familiar with the art can readily occur in change in the technical scope that the utility model is disclosed
Or replace, all should cover within protection domain of the present utility model.Therefore, protection domain of the present utility model should be with the power
The protection domain that profit is required is defined.
Claims (10)
1. a kind of array base palte, it is characterised in that including the first insulating barrier being set in turn on underlay substrate, first conductive
Layer, the second insulating barrier and the second conductive layer；
First conductive layer includes many signal lines of the binding region for being located at the underlay substrate, and the holding wire includes master
Body portion and connecting portion；
Second conductive layer includes being located at multiple binding patterns of the binding region, and the binding pattern runs through described second
Via on insulating barrier is connected with the connecting portion of the holding wire；
First insulating barrier arranges fluted, the main part of the holding wire in the position of the main part of the correspondence holding wire
In the groove.
2. array base palte according to claim 1, it is characterised in that the binding pattern is distributed at least two rows, and phase
The binding pattern of the adjacent holding wire connection is distributed in different rows.
3. array base palte according to claim 1, it is characterised in that the connecting portion of the holding wire is in the underlay substrate
On projection overlap with the binding projection of the pattern on the underlay substrate.
4. the array base palte according to any one of claim 1-3, it is characterised in that the thickness of the main part of the holding wire
Less than or equal to the depth of the groove.
5. array base palte according to claim 1, it is characterised in that the array base palte also includes being located at the substrate base
Padded pattern between plate and first insulating barrier, and projection of the padded pattern on the underlay substrate tie up with described
Determine projection of the pattern on the underlay substrate to overlap.
6. array base palte according to claim 5, it is characterised in that the padded pattern is constructed from a material that be electrically conducting, and institute
State padded pattern to be connected with the connecting portion of the holding wire by the via on first insulating barrier.
7. array base palte according to claim 6, it is characterised in that the padded pattern and the grid line for being located at viewing area
With the same material of layer.
8. array base palte according to claim 1, it is characterised in that first conductive layer also includes being located at viewing area
Data wire and thin film transistor (TFT) source and drain pattern.
9. array base palte according to claim 1, it is characterised in that second conductive layer also includes being located at viewing area
Transparency electrode.
10. a kind of display device, it is characterised in that including the array base palte described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621167964.6U CN206098393U (en) | 2016-11-01 | 2016-11-01 | Array baseplate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621167964.6U CN206098393U (en) | 2016-11-01 | 2016-11-01 | Array baseplate and display device |
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| Publication Number | Publication Date |
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| CN206098393U true CN206098393U (en) | 2017-04-12 |
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ID=58486231
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| CN201621167964.6U Active CN206098393U (en) | 2016-11-01 | 2016-11-01 | Array baseplate and display device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020199300A1 (en) * | 2019-04-02 | 2020-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
| CN111970816A (en) * | 2020-08-27 | 2020-11-20 | 合肥鑫晟光电科技有限公司 | Drive circuit backboard, manufacturing method thereof and backlight module |
| CN112992938A (en) * | 2021-02-25 | 2021-06-18 | 合肥鑫晟光电科技有限公司 | Array substrate, preparation method thereof and display panel |
| CN114743464A (en) * | 2022-05-20 | 2022-07-12 | 昆山国显光电有限公司 | Driving module and display device |
| WO2023019425A1 (en) * | 2021-08-17 | 2023-02-23 | Boe Technology Group Co., Ltd. | Display panel having a bonding region |
-
2016
- 2016-11-01 CN CN201621167964.6U patent/CN206098393U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020199300A1 (en) * | 2019-04-02 | 2020-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
| CN111970816A (en) * | 2020-08-27 | 2020-11-20 | 合肥鑫晟光电科技有限公司 | Drive circuit backboard, manufacturing method thereof and backlight module |
| CN111970816B (en) * | 2020-08-27 | 2022-01-25 | 合肥鑫晟光电科技有限公司 | Drive circuit backboard, manufacturing method thereof and backlight module |
| CN112992938A (en) * | 2021-02-25 | 2021-06-18 | 合肥鑫晟光电科技有限公司 | Array substrate, preparation method thereof and display panel |
| CN112992938B (en) * | 2021-02-25 | 2023-09-19 | 合肥鑫晟光电科技有限公司 | Array substrate, preparation method thereof and display panel |
| WO2023019425A1 (en) * | 2021-08-17 | 2023-02-23 | Boe Technology Group Co., Ltd. | Display panel having a bonding region |
| CN114743464A (en) * | 2022-05-20 | 2022-07-12 | 昆山国显光电有限公司 | Driving module and display device |
| CN114743464B (en) * | 2022-05-20 | 2023-11-28 | 昆山国显光电有限公司 | Driving module and display device |
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