CN206077824U - A kind of flexible circuit board of the foldable moulding of use heat dissipation metal - Google Patents

A kind of flexible circuit board of the foldable moulding of use heat dissipation metal Download PDF

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Publication number
CN206077824U
CN206077824U CN201620977124.XU CN201620977124U CN206077824U CN 206077824 U CN206077824 U CN 206077824U CN 201620977124 U CN201620977124 U CN 201620977124U CN 206077824 U CN206077824 U CN 206077824U
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CN
China
Prior art keywords
circuit board
flexible circuit
metal
moulding
utility
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Active
Application number
CN201620977124.XU
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Chinese (zh)
Inventor
王言新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUBEI YONGCHUANGXIN ELECTRONICS Co.,Ltd.
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Guangdong Forever Innovation Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201620977124.XU priority Critical patent/CN206077824U/en
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Publication of CN206077824U publication Critical patent/CN206077824U/en
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Abstract

The utility model discloses a kind of flexible circuit board of the foldable moulding of heat dissipation metal, including flexible circuit board, the flexible circuit board back side is provided with polylith metal fin, is connected by flexible circuit board between the metal fin, and the side of adjacent metal fin is relative.This utility model arranges the detached metal fin of polylith at the flexible circuit board back side, is connected by flexible circuit board between metal fin, has both been capable of achieving quick heat radiating, also can be folded moulding, applied widely.

Description

A kind of flexible circuit board of the foldable moulding of use heat dissipation metal
Technical field
This utility model is related to flexible circuit board, and in particular to a kind of flexible circuit board of the foldable moulding of use heat dissipation metal.
Background technology
Existing heat dissipation for circuit board technology major part is that heat radiating metal is bonded in after circuit board, but for needing folding to make For the circuit board of type, directly bondd using heat radiating metal, as metal is not pliable, which can be caused to carry out folding and made Type.The circuit board with heat radiating metal as disclosed in the Chinese utility model of Publication No. CN202026521U, discloses and will radiate Metal invests the technical scheme of circuit board bottom, can be very good to realize the radiating of circuit board, but the program is only applicable to hard electricity Road plate, if circuit board needs to fold, can rupture and scrap.
Utility model content
In order to solve above-mentioned technical problem, the purpose of this utility model is to provide a kind of the foldable of heat dissipation metal to make The flexible circuit board of type.
The technical scheme adopted by this utility model is:
A kind of flexible circuit board of the foldable moulding of heat dissipation metal, including flexible circuit board, the flexible circuit board back side are close to Polylith metal fin is provided with, is connected by flexible circuit board between the metal fin, the side phase of adjacent metal fin It is right.
Used as the further improvement of above-mentioned technical proposal, the metal fin includes one piece of polygonal centre slice, with And the polylith pleated sheet arranged around centre slice.
The beneficial effects of the utility model are:
This utility model arranges the detached metal fin of polylith at the flexible circuit board back side, by soft between metal fin Circuit board connects, and has both been capable of achieving quick heat radiating, also can be folded moulding, applied widely.
Description of the drawings
For the technical scheme being illustrated more clearly that in this utility model embodiment, below will be to needed for embodiment description Accompanying drawing to be used is briefly described.Obviously, described accompanying drawing is a part of embodiment of the present utility model, rather than entirely Portion's embodiment, those skilled in the art on the premise of not paying creative work, can be with according to these accompanying drawings acquisitions Other designs and accompanying drawing.
Fig. 1 is the structural representation of one of which embodiment of the present utility model.
Fig. 2 is the structural representation of another kind of embodiment of the present utility model.
Specific embodiment
The technique effect of design of the present utility model, concrete structure and generation is carried out below with reference to embodiment and accompanying drawing Clearly and completely describe, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment It is a part of embodiment of the present utility model, rather than whole embodiments, based on embodiment of the present utility model, the skill of this area The other embodiment obtained on the premise of not paying creative work by art personnel, belongs to the model of this utility model protection Enclose.
With reference to Fig. 1, Fig. 1 provides first embodiment of the present utility model, including flexible circuit board 1, and the flexible circuit board 1 is carried on the back Face is provided with two pieces of metal fins 2, and the side of two pieces of metal fins 2 is relative, and is connected to one by flexible circuit board 1 Rise.
With reference to Fig. 2, Fig. 2 provides second embodiment of the present utility model, including flexible circuit board 1, and the flexible circuit board 1 is carried on the back Face is provided with polylith metal fin, and the metal fin includes one piece of polygonal centre slice 3, and around center The polylith pleated sheet 4 that piece 3 is arranged, a line of every piece of correspondence centre slice 3 of pleated sheet 4, the centre slice 3 and pleated sheet 4 pass through Flexible circuit board 1 links together.
This utility model arranges the detached metal fin of polylith at the flexible circuit board back side, by soft between metal fin Circuit board connects, and has both been capable of achieving quick heat radiating, also can easily carry out fold configuration, applied widely.
This utility model additionally provides the preparation method of the flexible circuit board for preparing above-mentioned, comprises the following steps:S1, by full wafer Flexible circuit board be bonded together with the sheet metal of full wafer;S2, protecting film is sticked on sheet metal, protecting film covers to be retained Position;S3, the sheet metal that unprotected film is covered is dissolved by chemical attack mode, make sheet metal be separated into multinugget Category fin.
Above concrete structure and sized data are that preferred embodiment of the present utility model is illustrated, but this reality The embodiment is not limited to new creation, those of ordinary skill in the art are in the premise without prejudice to this utility model spirit A variety of equivalent variations or replacement can be also made down, the deformation or replacement of these equivalents are all contained in the application claim and are limited In fixed scope.

Claims (2)

1. the flexible circuit board of the foldable moulding of a kind of heat dissipation metal, it is characterised in that:Including flexible circuit board, the flexible circuit board The back side is provided with polylith metal fin, is connected by flexible circuit board between the metal fin, adjacent metal radiating The side of piece is relative.
2. the flexible circuit board of the foldable moulding of a kind of heat dissipation metal according to claim 1, it is characterised in that:The gold Category fin includes one piece of polygonal centre slice, and the polylith pleated sheet arranged around centre slice.
CN201620977124.XU 2016-08-29 2016-08-29 A kind of flexible circuit board of the foldable moulding of use heat dissipation metal Active CN206077824U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620977124.XU CN206077824U (en) 2016-08-29 2016-08-29 A kind of flexible circuit board of the foldable moulding of use heat dissipation metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620977124.XU CN206077824U (en) 2016-08-29 2016-08-29 A kind of flexible circuit board of the foldable moulding of use heat dissipation metal

Publications (1)

Publication Number Publication Date
CN206077824U true CN206077824U (en) 2017-04-05

Family

ID=58434556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620977124.XU Active CN206077824U (en) 2016-08-29 2016-08-29 A kind of flexible circuit board of the foldable moulding of use heat dissipation metal

Country Status (1)

Country Link
CN (1) CN206077824U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106132079A (en) * 2016-08-29 2016-11-16 广东永创鑫电子有限公司 Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106132079A (en) * 2016-08-29 2016-11-16 广东永创鑫电子有限公司 Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof

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GR01 Patent grant
GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20220118

Address after: Building c8-c10, circuit board industrial park, No.9 Changxing Avenue, Dongbao District, Jingmen City, Hubei Province

Patentee after: HUBEI YONGCHUANGXIN ELECTRONICS Co.,Ltd.

Address before: 529000 floor 4, building B2, No. 17, Keyuan Road, Jianghai District, Jiangmen City, Guangdong Province

Patentee before: GUANGDONG YONGCHUANGXIN ELECTRONICS Co.,Ltd.