CN206059357U - The spinning of modified model silicon chip and oscillating mechanism - Google Patents
The spinning of modified model silicon chip and oscillating mechanism Download PDFInfo
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- CN206059357U CN206059357U CN201621053315.3U CN201621053315U CN206059357U CN 206059357 U CN206059357 U CN 206059357U CN 201621053315 U CN201621053315 U CN 201621053315U CN 206059357 U CN206059357 U CN 206059357U
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Abstract
This utility model is related to a kind of spinning of modified model silicon chip and oscillating mechanism, including upper and lower oscillating mechanism and silicon chip spin rotation mechanism, oscillating mechanism includes upper and lower vibration motor reductor up and down, cam mechanism, beat bearing transmission mechanism, linear slide rail, vibration motor output end of reducer connects cam mechanism up and down, cam mechanism connects beat bearing transmission mechanism, beat bearing transmission mechanism does straight line up and down motion, beat bearing transmission mechanism is connected with hanging axis, the hanging axis other end is provided with silicon chip spin rotation mechanism, silicon chip spin rotation mechanism includes servomotor, spinning drive mechanism, circular rotating shaft, cross pulling axis, the outfan connection spinning drive mechanism of servomotor, spinning drive mechanism drives circular rotating shaft, cross pulling axis is rotated, spinning drive mechanism is non-contact type magnetic element drive mechanism；This utility model avoids etching not enough or the appearance of overetch situation, and effect is significant, reduces working strength, improves production efficiency.
Description
[technical field]
This utility model is related to technical field of manufacturing semiconductors, specifically a kind of spinning of modified model silicon chip and vibration
Mechanism.
[background technology]
In LED and semicon industry, Wet-type etching is an indispensable Technology.In order to improve silicon chip surface erosion
Uniformity and etch-rate concordance are carved, lateral erosion and the etch differential opposite sex is reduced, each equipment manufacturers propose all kinds of modes, to
Capture this difficult problem.What is be in the industry cycle widely adopted at present mainly has following several ways：Guaranteed uniformly using circulation processing procedure groove
The flow field of concentration；Etch uniformity and rate consistency ... are provided in view of pin by physical force auxiliary using upper and lower oscillating mechanism
The persistence in this direction is assaulted fortified position and studied, it has been proposed that some new modes, such as silicon chip spinning and oscillating mechanism
Mechanism is rocked with wet developing auxiliary, etch uniformity and etch-rate concordance can be improved to a certain extent.However, Jing
Long-term practice test is crossed, existing mechanism yet suffers from the space that can improve lifting.
Meanwhile, with asking for the further lightening and wearable type electronic product such as product such as Google's eyes of electronic product
Generation, does less and less as the size of the critical piece TFT-LCD panels and LCD driving chips of display device, the thickness of display
Thinner, less to the area requirements of driving chip, the firing point distance in chip between circuit and circuit is nearer.Through skill
Art is introduced, and has come into the country, the envelope of correspondence chip product as world-class 22 micron level product a few years ago
Dress technical requirements are also stepped up.Wherein most prominent several parts, the such as selection of lower cost materials, making technology simplification with should
It is that process control and reliability are improved, and the control of etching precision is even more the emphasis of each big encapsulation manufacturer technique research and development.
Accordingly, as process apparatus manufacturer, carry out equipment corresponding with making technology for the follow-up of appeal situation or set
Module in standby carries out beforehand research and exploitation also becomes very urgent, and except deepening in manufacturing process to high-cleanness, high pipeline system
The cleanliness factor of system and equipment microenvironment controls to reduce due to beyond the not good impact to finished product rate of cleanliness factor.More attach most importance to
Will, it is less with respect to running cost in other words (electric energy and filtration system of the consumption of microenvironment that manufacture process or product have
Relatively costly, electric energy needed for having data to show toilet's air circulation accounts for more than the 50% of whole HVAC system energy consumption, tends to
Reach 400W/m2, if plus chemistry and gas filtration consumptive material expense, holistic cost will be more surprising) method be improve
The controllability of rate of etch.
Metal etch mainly divides dry ecthing (Plasma electric paste etchings) and wet etching at present (also known as photochemical etching).As
Main several technical specifications of wet etching process, etching factor (also known as etching coefficient), etch-rate, etch uniformity.To upper
Tell that there is etching characteristic the factor of considerable influence typically to depend on chemical composition (pickling or alkalescence) with etching solution, etch temperature,
It is etched material and material thickness (often having circuit design to determine), the geometry of circuit, and etching liquid fluid itself
The impact of mechanics.From from the point of view of equipment supplier, etching temperature is affected often through the precision of raising equipment temperature control system
Degree, improves the impact in terms of etching liquid hydrodynamics by the design of ductwork design and reaction cell body.
At present, it is to improve etch-rate and etch uniformity, commonly uses circulation processing procedure groove and change medicinal liquid flow field.The medication of etching institute
Liquid has stronger corrosivity, processing procedure groove and circulating pump to be both needed to apply special substance, and cost is high, and procurement cycle is long, and pipeline is multiple
Miscellaneous, maintenance cost is high, is largely limited by relevant supplier, is unfavorable for the fast development of domestic semicon industry.Although
Also there is another purely mechanic mechanism (Agitation) at present, only realize vibrating (0～60 time/min, stroke 30mm) up and down, though
So etch-rate and etch uniformity are improve to a certain extent, but easily there is acid trip, cannot much meet client
The requirement for increasingly improving.
[utility model content]
The purpose of this utility model seeks to solve above-mentioned deficiency and provide a kind of spinning of modified model silicon chip and vibration
Mechanism, improves etch uniformity, it is to avoid etching not enough or overetch situation appearance, and effect is significant, largely
The working strength of rework rate and operator is reduced, production efficiency is improve.
A kind of spinning of modified model silicon chip and oscillating mechanism, including upper and lower oscillating mechanism and silicon are designed for achieving the above object
Piece spin rotation mechanism, the upper and lower oscillating mechanism include upper and lower vibration motor reductor 1, cam mechanism 2, beat bearing-transmission machine
Structure 3, linear slide rail 4, the outfan connection cam mechanism 2 of the upper and lower vibration motor reductor 1, the cam mechanism 2 connect
And beat bearing transmission mechanism 3 is driven, linear slide rail 4, the beat bearing-transmission are provided with the beat bearing transmission mechanism 3
Mechanism 3 does straight line up and down motion under the guiding of linear slide rail 4, and the beat bearing transmission mechanism 3 is connected with hanging axis 5, described
5 other end of hanging axis is provided with silicon chip spin rotation mechanism, and the silicon chip spin rotation mechanism includes servomotor 6, spinning driver
Structure, circular rotating shaft 7, cross pulling axis 8, the outfan connection spinning drive mechanism of the servomotor 6, the spinning are passed
Motivation structure drives circular rotating shaft 7, cross pulling axis 8 to rotate, and the spinning drive mechanism is driven for non-contact type magnetic element
Mechanism.
5 one end of the hanging axis connects beat bearing transmission mechanism 3 by hanging axis fixed seat 9, and 5 other end of the hanging axis passes through
Hanging axis mounting flange 10 is arranged on installing plate 11, and sealing ring 12 and waterproof cover are equiped between the hanging axis 5 and installing plate 11
13。
The installing plate 11 is fixedly connected on motor protection box 14, the servomotor 6 pass through motor mounting plate 15 and
Motor adjustable plate 16 is arranged in motor protection box 14.
14 left and right sides of motor protection box is equipped with floor 17, is provided with support riser on rear side of the motor protection box 14
18, the floor 17, support riser 18 are connected as one with motor protection box 14.
The spinning drive mechanism include active magnetic drive 19, magnetic gearing wheel 1, magnetic gearing wheel 2 21,
Auxiliary rotating wheel 22, the active magnetic drive 19 are connected with the outfan of servomotor 6, the active magnetic drive 19
It is connected with magnetic gearing wheel 1, the magnetic gearing wheel 1 is arranged on by rotating shaft 2 24 and is supported on riser 18, the magnetic
Property drive 1 drive magnetic gearing wheel 2 21, auxiliary rotating wheel 22 to make rotating in same direction, the magnetic gearing wheel 2 21, auxiliary
Rotating wheel 22 drives circular rotating shaft 7, cross pulling axis 8 to rotate respectively.
Compared with the existing technology, assembly is simple, easy care, reliable operation, cost are relatively low, to difference for this utility model
Technique and processing procedure have the preferable suitability, improve etch uniformity, it is to avoid etching is not enough or overetch situation goes out
It is existing, and effect is significant, the working strength of rework rate and operator is largely reduced, production efficiency is improve；Also,
The modified model silicon chip spinning and oscillating mechanism can realize vibrating and rotate that be independent of each other, user can basis at the same time or separately
Actual demand sets, while in running, because drive system introduces untouchable magnetic transmission part, it is to avoid gear engagement is produced
Raw break flour and noise, improve working environment, have in the semicon industry higher to purity requirements and are more widely applied
Scope.
[description of the drawings]
Fig. 1 is structural representation of the present utility model；
Fig. 2 is structural representation of the present utility model two；
Fig. 3 is the structural representation one of silicon chip spin rotation mechanism in this utility model；
Fig. 4 is the structural representation two of silicon chip spin rotation mechanism in this utility model；
Fig. 5 is the exploded view of silicon chip spin rotation mechanism in this utility model；
In figure：1st, upper and lower vibration motor reductor 2, cam mechanism 3, beat bearing transmission mechanism 4, linear slide rail 5,
Hanging axis 6, servomotor 7, circular rotating shaft 8, cross pulling axis 9, hanging axis fixed seat 10, hanging axis mounting flange 11, installation
Plate 12, sealing ring 13, waterproof cover 14, motor protection box 15, motor mounting plate 16, motor adjustable plate 17, floor 18,
Support riser 19, active magnetic drive 20, magnetic gearing wheel 1, magnetic gearing wheel 2 22, auxiliary rotating wheel 23,
Motor mount 24, rotating shaft 2 25, shaft seating 26, gaily decorated basket placement rack.
[specific embodiment]
Further explained below is made to this utility model below in conjunction with the accompanying drawings：
As shown in drawings, this utility model includes：Upper and lower oscillating mechanism and silicon chip spin rotation mechanism, upper and lower oscillating mechanism bag
Upper and lower vibration motor reductor 1, cam mechanism 2, beat bearing transmission mechanism 3, linear slide rail 4 are included, upper and lower vibration motor slows down
The outfan connection cam mechanism 2 of machine 1, cam mechanism 2 connect and drive beat bearing transmission mechanism 3, beat bearing-transmission machine
Linear slide rail 4 is provided with structure 3, beat bearing transmission mechanism 3 does straight line up and down motion, beat axle under the guiding of linear slide rail 4
Hold drive mechanism 3 to be connected with hanging axis 5,5 other end of hanging axis is provided with silicon chip spin rotation mechanism, silicon chip spin rotation mechanism includes servo
Motor 6, spinning drive mechanism, circular rotating shaft 7, cross pulling axis 8, the outfan connection spinning driver of servomotor 6
Structure, spinning drive mechanism drive circular rotating shaft 7, cross pulling axis 8 to rotate, and spinning drive mechanism is non-contact type magnetic unit
Part drive mechanism.
In this utility model, 5 one end of hanging axis connects beat bearing transmission mechanism 3 by hanging axis fixed seat 9, and hanging axis 5 is another
End is arranged on installing plate 11 by hanging axis mounting flange 10, and sealing ring 12 and waterproof are equiped between hanging axis 5 and installing plate 11
Lid 13, installing plate 11 are fixedly connected on motor protection box 14, and servomotor 6 passes through motor mounting plate 15 and motor adjustable plate 16
In motor protection box 14,14 left and right sides of motor protection box is equipped with floor 17, is provided with and props up on rear side of motor protection box 14
Support riser 18, floor 17, support riser 18 are connected as one with motor protection box 14.Spinning drive mechanism includes active magnetic
Drive 19, magnetic gearing wheel 1, magnetic gearing wheel 2 21, auxiliary rotating wheel 22, active magnetic drive 19 and servo electricity
The outfan of machine 6 is connected, and active magnetic drive 19 is connected with magnetic gearing wheel 1, and magnetic gearing wheel 1 passes through rotating shaft two
24 are arranged on support riser 18, and magnetic gearing wheel 1 drives magnetic gearing wheel 2 21, auxiliary rotating wheel 22 to make rotating in same direction,
Magnetic gearing wheel 2 21, auxiliary rotating wheel 22 drive circular rotating shaft 7, cross pulling axis 8 to rotate respectively.
Principle of the present utility model is：Cam mechanism is driven using upper and lower vibration motor reductor, is led by linear slide rail
To making circular motion be changed into up and down motion, realize oscillation functions；Simultaneously by Serve Motor Control relatively independent in addition,
Non-contact type magnetic element drive mechanism is driven, makes silicon chip realize automatic rotation function.The modified model silicon chip spinning and vibrating machine
The vibration of structure is independent of each other with spinfunction, separate, 0～60 time/min of oscillation rate of oscillating mechanism, amplitude 30mm；Silicon
The rotating speed of piece spin rotation mechanism is adjustable, and to avoid the phenomenons such as fragmentation, general silicon chip spinning rotating speed is between 0～5rpm.
At present, the problems and disadvantages such as following table that prior art is present：
This utility model is made up of upper and lower oscillating mechanism and silicon chip spin rotation mechanism respectively, and the two is assembled in one by hanging axis
Rise.Oscillating mechanism provides power output by inverter motor up and down, and Jing reductors drive cam mechanism after improving moment of torsion, utilize
Circular motion is converted into straight line up and down motion by beat bearing transmission mechanism and linear slide rail, drives hanging axis and silicon chip spin favourable turn
Structure realizes upper and lower oscillating movement；Silicon chip spin rotation mechanism utilizes servomotor and control unit to provide power output and rotating speed control
System, then drives circular rotating shaft and cross pulling axis same by spinning drive mechanism (non-contact type magnetic element drive mechanism)
To rotation, and then the automatic circumference of silicon chip is realized using circular rotating shaft and the friction of silicon chip and the toggle action of cross pulling axis
Rotation.
This utility model is applied in Wet-type etching equipment, assisted etch process realize, improve etch uniformity with it is controllable
Property；The volume and quality of the modified model silicon chip spinning and oscillating mechanism will control in certain scope, machinery and electrically connect
Mouth will carry out modularity design, to tackle the embedded requirement of following difference process apparatus；By the servo electricity suitable for clean environment
Machine is controlled, and vibration and rotation adhere to two sets of power and control system separately, do not interfere with each other, and the velocity-stabilization for vibrating and rotating is adjustable, point
Do not sensed by multiple position sensors, it is ensured that vibration and rotation stop position are controllable, so as to follow-up full automatic process operations；
And non-contact type magnetic element is selected, it is entirely sealed in corrosion resistant NPP containment vessels, had both can ensure that stablizing for magneticss
It is reliable, also avoid being corroded, while magneticss select zinc-plated process, further increase its corrosion resistance.Untouchable biography
Dynamic element realizes contactless transmission by magnetic field, operates steadily, noiselessness, does not produce engagement dust, improves cleanliness factor, improves
Working environment.
In this utility model, untouchable actuated element selects high magnetic material, it is ensured that transmitting torque, in order to avoid magnetic
Influencing each other between, the less two little gear only one of which of spacing magnetize, and another is only used as accessory drive, without magnetic
Property；The wafer of different size is suitable for by the quantity and drive centre distancc of changing untouchable actuated element, it is also contemplated that
Other processing procedures are applied to, are such as developed or is removed photoresist, it is preferable for the embeddability of different processing procedures；Dynamical system adopts corrosion-resistant material
Exterior protection is carried out, the suitability in soda acid chemical environment is improve；Its upper and lower oscillation rate and the equal scalable of rotary rpm,
Through multiple authentication, it is proposed that oscillation rate scope is more suitable in 0～60rpm up and down, and amplitude is adjustable in 30～50mm, silicon chip is certainly
Rotary rpm is adjustable in 0～5rpm；The modified model silicon chip spinning and oscillating mechanism simple structure, it is easy to control, select big
Amount general part, reduces processing and assembles difficulty, it is easy to safeguard, for the lifting of etch-rate and etch uniformity has preferably
Effect, possesses larger cost or advantageous effect.
This utility model is not limited by above-mentioned embodiment, other any real without departing from spirit of the present utility model
Matter and the change, modification, replacement made under principle, combine, simplify, should be equivalent substitute mode, being included in practical
Within new protection domain.
Claims (5)
1. a kind of spinning of modified model silicon chip and oscillating mechanism, it is characterised in that：Including upper and lower oscillating mechanism and silicon chip spinning
Mechanism, the upper and lower oscillating mechanism include upper and lower vibration motor reductor (1), cam mechanism (2), beat bearing transmission mechanism
(3), linear slide rail (4), outfan connection cam mechanism (2) of the upper and lower vibration motor reductor (1), the cam mechanism
(2) connect and drive beat bearing transmission mechanism (3), beat bearing transmission mechanism (3) place to be provided with linear slide rail (4), institute
State beat bearing transmission mechanism (3) and straight line up and down motion, the beat bearing transmission mechanism are done under the guiding of linear slide rail (4)
(3) it is connected with hanging axis (5), hanging axis (5) other end is provided with silicon chip spin rotation mechanism, the silicon chip spin rotation mechanism includes
Servomotor (6), spinning drive mechanism, circular rotating shaft (7), cross pulling axis (8), the outfan of the servomotor (6)
Connection spinning drive mechanism, the spinning drive mechanism drive circular rotating shaft (7), cross pulling axis (8) to rotate, it is described from
Rotating actuator is non-contact type magnetic element drive mechanism.
2. modified model silicon chip as claimed in claim 1 spinning and oscillating mechanism, it is characterised in that：Described hanging axis (5) one end
Beat bearing transmission mechanism (3) is connected by hanging axis fixed seat (9), hanging axis (5) other end passes through hanging axis mounting flange
(10) on installing plate (11), between the hanging axis (5) and installing plate (11), sealing ring (12) and waterproof cover are equiped with
(13)。
3. modified model silicon chip as claimed in claim 2 spinning and oscillating mechanism, it is characterised in that：The installing plate (11) is solid
Surely it is connected on motor protection box (14), the servomotor (6) is pacified by motor mounting plate (15) and motor adjustable plate (16)
It is mounted in motor protection box (14).
4. modified model silicon chip as claimed in claim 3 spinning and oscillating mechanism, it is characterised in that：The motor protection box
(14) left and right sides is equipped with floor (17), and support riser (18), the floor are provided with rear side of the motor protection box (14)
(17), riser (18) is supported to connect as one with motor protection box (14).
5. modified model silicon chip as claimed in claim 4 spinning and oscillating mechanism, it is characterised in that：The spinning driver
Structure includes active magnetic drive (19), magnetic gearing wheel one (20), magnetic gearing wheel two (21), auxiliary rotating wheel (22), institute
The outfan that active magnetic drive (19) is stated with servomotor (6) is connected, and the active magnetic drive (19) is passed with magnetic
Driving wheel one (20) is connected, the magnetic gearing wheel one (20) by rotating shaft two (24) installed in supporting on riser (18), the magnetic
Property drive one (20) drive magnetic gearing wheel two (21), auxiliary rotating wheel (22) make rotating in same direction, the magnetic gearing wheel two
(21) rotating wheel (22), is aided in drive circular rotating shaft (7), cross pulling axis (8) to rotate respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621053315.3U CN206059357U (en) | 2016-09-13 | 2016-09-13 | The spinning of modified model silicon chip and oscillating mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621053315.3U CN206059357U (en) | 2016-09-13 | 2016-09-13 | The spinning of modified model silicon chip and oscillating mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206059357U true CN206059357U (en) | 2017-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621053315.3U Active CN206059357U (en) | 2016-09-13 | 2016-09-13 | The spinning of modified model silicon chip and oscillating mechanism |
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| CN (1) | CN206059357U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113571455A (en) * | 2021-09-27 | 2021-10-29 | 智程半导体设备科技(昆山)有限公司 | Supporting assembly for semiconductor device containing device |
-
2016
- 2016-09-13 CN CN201621053315.3U patent/CN206059357U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113571455A (en) * | 2021-09-27 | 2021-10-29 | 智程半导体设备科技(昆山)有限公司 | Supporting assembly for semiconductor device containing device |
| CN113571455B (en) * | 2021-09-27 | 2022-02-01 | 智程半导体设备科技(昆山)有限公司 | Supporting assembly for semiconductor device containing device |
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