CN206047875U - A kind of moveable economizing type semiconductor grinding device - Google Patents
A kind of moveable economizing type semiconductor grinding device Download PDFInfo
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- CN206047875U CN206047875U CN201621045465.XU CN201621045465U CN206047875U CN 206047875 U CN206047875 U CN 206047875U CN 201621045465 U CN201621045465 U CN 201621045465U CN 206047875 U CN206047875 U CN 206047875U
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- fixedly connected
- motor
- grinding
- device body
- lapping device
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Abstract
The utility model discloses a kind of moveable economizing type semiconductor grinding device, including lapping device body, the first motor, the first electric expansion bar, the first grinding stone, three-motor, the second grinding stone, the second electric expansion bar, bearing, the second motor, immersible pump and roller, the turning end of first motor is fixedly connected with the cylinder end of the first electric expansion bar by bearing；The telescopic rod end of first electric expansion bar is fixedly connected with the centre of the first grinding stone；The turning end of second motor is fixedly connected with the cylinder end of the second electric expansion bar by bearing；The telescopic rod end of second electric expansion bar is fixedly connected with the centre of the second grinding stone；Immersible pump is fixed with the inner bottom surface of the lapping device body；The lower end surrounding of the lapping device body is provided with four rolling.The beneficial effect of the utility model is to economize on resources, and movement is easy to use, and high working efficiency and grinding polishing effect are good.
Description
Technical field
This utility model belongs to semiconductor grinding engineering device technique field, and in particular to a kind of moveable economizing type quasiconductor
Lapping device.
Background technology
In semiconductor fabrication, the semiconductor crystal wafer to tentatively producing is needed to carry out surface polishing, so needing to make
Semiconductor grinding device is used, is provided with semiconductor grinding device to the dress that lapping liquid is provided at semiconductor crystal wafer grinding and polishing
Put, reduce mechanical wear during grinding and polishing, improve grinding polishing effect.
Current semiconductor grinding device, it is impossible to using lapping liquid carry out recycling so that waste of resource and
Movement is not using convenient.
Therefore, invent a kind of moveable economizing type semiconductor grinding device and seem very necessary.
Utility model content
The purpose of this utility model is to provide a kind of moveable economizing type semiconductor grinding device, to solve the above-mentioned back of the body
Current semiconductor grinding device is proposed in scape technology, it is impossible to using lapping liquid carry out recycling so that waste money
Source and movement use not easily problem.
For achieving the above object, this utility model provides following technical scheme：A kind of moveable economizing type quasiconductor grinds
Mill apparatus, including lapping device body, the first motor, lapping liquid storage barrel, the first electric expansion bar, the first grinding stone, grind
Mill material carrier platform, three-motor, toughened glass window, safety protective door, the second grinding stone, folding, the second electric expansion bar, axle
Hold, the second motor, tube for transfusion, immersible pump, jointed shaft, roller, burette and controlled valve, a left side for the lapping device body
Upper end is fixedly connected with the first motor；The turning end of first motor passes through the cylinder of bearing and the first electric expansion bar
End is fixedly connected；The telescopic rod end of first electric expansion bar is fixedly connected with the centre of the first grinding stone；The grinding
The upper right side of device body is fixedly connected with the second motor；The turning end of second motor is electronic with second by bearing
The cylinder end of expansion link is fixedly connected；The telescopic rod end of second electric expansion bar is connected with the middle fixed of the second grinding stone
Connect；The middle upper end of the lapping device body is fixedly connected with lapping liquid storage barrel；The lower end of the lapping liquid storage barrel and drop
The upper end connection of fixed tube；The interior lower end of the lapping device body is fixedly connected with three-motor；The three-motor
Turning end by bearing with grind material carrier platform in the middle of be fixedly connected；The right-hand member of the lapping device body is provided with security protection
Door；The safety protective door is hinged with lapping device body by folding；The centre of the safety protective door and toughened glass window
It is fixedly connected；Immersible pump is fixed with the inner bottom surface of the lapping device body；The liquid outlet and tube for transfusion of the immersible pump
One end be fixedly connected；The other end of the tube for transfusion is connected with the upper end of lapping liquid storage barrel；The lapping device body
Lower end surrounding is provided with four rolling；The roller is fixedly connected with lapping device body by jointed shaft.
Further, controlled valve is provided with the burette.
Further, the roller is a kind of universal wheel, and outside is provided with abrasive rubber set.
Further, one end of the safety protective door is provided with hand draw ring, and safety protective door and lapping device body
Contact position be provided with caulking gum packing ring.
Technique effect of the present utility model and advantage：The moveable economizing type semiconductor grinding device, by arranging the
One motor drives the first grinding stone and the second motor to drive the second grinding stone to enter to grinding the semiconductor crystal wafer on material carrier platform
Row grinding and polishing, and three-motor drives grinding material carrier platform to be rotatably assorted the work of the first motor and the second motor,
So that grinding polishing effect is good, and arranges the first grinding stone and the second grinding stone, can be operated simultaneously so that production effect
Fruit is high；The first grinding stone automatic lifting and the second electric expansion bar is driven to drive second to grind by arranging the first electric expansion bar
Stone automatic lifting, replaces original manual operation or pneumatic operation so that easy to use and sensitivity is high；By in lapping device
This arranges immersible pump in vivo and the unemployed lapping liquid of lapping device body inner bottom part can will be scattering in device, is transported to and grinds
Recycling is circulated in grinding fluid storage barrel so that save material；Lower end surrounding in lapping device body is provided with four
Individual roller causes device, and movement is easy to use.
Description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure：1- lapping device bodies；The first motor of 2-；3- lapping liquid storage barrels；The first electric expansion bars of 4-；5-
One grinding stone；6- grinds material carrier platform；7- three-motors；8- toughened glass windows；9- safety protective doors；The second grinding stones of 10-；
11- foldings；The second electric expansion bars of 12-；13- bearings；The second motor of 14-；15- tube for transfusions；16- immersible pumps；17- is hinged
Axle；18- rollers；19- burettes；20- controlled valves.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only this utility model a part of embodiment, rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of this utility model protection.
This utility model is there is provided a kind of moveable economizing type semiconductor grinding device as shown in Fig. 1, including grinding
Device body 1, the first motor 2, lapping liquid storage barrel 3, the first electric expansion bar 4, the first grinding stone 5, grinding material carrier platform 6,
Three-motor 7, toughened glass window 8, safety protective door 9, the second grinding stone 10, folding 11, the second electric expansion bar 12, bearing
13rd, the second motor 14, tube for transfusion 15, immersible pump 16, jointed shaft 17, roller 18, burette 19 and controlled valve 20, described to grind
The left upper end of mill apparatus body 1 is fixedly connected with the first motor 2；The turning end of first motor 2 by bearing 13 with
The cylinder end of the first electric expansion bar 4 is fixedly connected；The telescopic rod end of first electric expansion bar 4 and the first grinding stone 5
Centre be fixedly connected；The upper right side of the lapping device body 1 is fixedly connected with the second motor 14；Second motor
14 turning end is fixedly connected with the cylinder end of the second electric expansion bar 12 by bearing 13；Second electric expansion bar 12
Telescopic rod end is fixedly connected with the centre of the second grinding stone 10；The middle upper end of the lapping device body 1 is stored with lapping liquid
Bucket 3 is fixedly connected；The lower end of the lapping liquid storage barrel 3 is connected with the upper end of burette 19；The lapping device body 1 it is interior
Subordinate end is fixedly connected with three-motor 7；The turning end of the three-motor 7 is by bearing 13 and grinding material carrier platform 6
Between be fixedly connected；The right-hand member of the lapping device body 1 is provided with safety protective door 9；The safety protective door 9 passes through folding 11
It is hinged with lapping device body 1；The centre of the safety protective door 9 is fixedly connected with toughened glass window 8；The lapping device sheet
Immersible pump 16 is fixed with the inner bottom surface of body 1；The liquid outlet of the immersible pump 16 is fixedly connected with one end of tube for transfusion 15；Institute
The other end for stating tube for transfusion 15 is connected with the upper end of lapping liquid storage barrel 3；The lower end surrounding of the lapping device body 1 is provided with
Four rolling 18；The roller 18 is fixedly connected with lapping device body 1 by jointed shaft 17.
Further, controlled valve 20 is provided with the burette 19.
Further, the roller 18 is a kind of universal wheel, and outside is provided with abrasive rubber set.
Further, one end of the safety protective door 9 is provided with hand draw ring, and safety protective door 9 and lapping device sheet
The contact position of body 1 is provided with caulking gum packing ring.
Operation principle：The moveable economizing type semiconductor grinding device, drives first to grind by arranging the first motor 2
Grinding stone 5 and the second motor 14 drive the semiconductor crystal wafer on 10 pairs of grinding material carrier platforms 6 of the second grinding stone to be ground polishing, and
And three-motor 7 drives grinding material carrier platform 6 to be rotatably assorted the work of the first motor 2 and the second motor 14 so that grinding
Polishing effect is good, and arranges the first grinding stone 5 and the second grinding stone 10, can be operated simultaneously so that production effect is high；
5 automatic lifting of the first grinding stone and the second electric expansion bar 12 is driven to drive second to grind by arranging the first electric expansion bar 4
10 automatic lifting of stone, replaces original manual operation or pneumatic operation so that easy to use and sensitivity is high；By in grinding dress
Put setting immersible pump 16 in body 1 and in device, can will be scattering into the unemployed lapping liquid of 1 inner bottom part of lapping device body, it is defeated
It is sent in lapping liquid storage barrel 3 and is circulated recycling so that saves material；By the lower end surrounding in lapping device body 1
It is provided with four rolling 18 and causes device, movement is easy to use.
Using technical scheme described in the utility model, or those skilled in the art's opening in technical solutions of the utility model
Give, design similar technical scheme, and reach above-mentioned technique effect, fall into protection domain of the present utility model.
Claims (4)
1. a kind of moveable economizing type semiconductor grinding device, including lapping device body（1）, the first motor（2）, grinding
Liquid storage barrel（3）, the first electric expansion bar（4）, the first grinding stone（5）, grinding material carrier platform（6）, three-motor（7）, tempering
Windowpane（8）, safety protective door（9）, the second grinding stone（10）, folding（11）, the second electric expansion bar（12）, bearing（13）、
Second motor（14）, tube for transfusion（15）, immersible pump（16）, jointed shaft（17）, roller（18）, burette（19）And controlled valve
（20）, it is characterised in that：The lapping device body（1）Left upper end and the first motor（2）It is fixedly connected；Described first is electric
Motivation（2）Turning end pass through bearing（13）With the first electric expansion bar（4）Cylinder end be fixedly connected；Described first electronic stretches
Contracting bar（4）Telescopic rod end and the first grinding stone（5）Centre be fixedly connected；The lapping device body（1）Upper right side
With the second motor（14）It is fixedly connected；Second motor（14）Turning end pass through bearing（13）With the second electric expansion
Bar（12）Cylinder end be fixedly connected；Second electric expansion bar（12）Telescopic rod end and the second grinding stone（10）In
Between be fixedly connected；The lapping device body（1）Middle upper end and lapping liquid storage barrel（3）It is fixedly connected；The lapping liquid storage
Deposit bucket（3）Lower end and burette（19）Upper end connection；The lapping device body（1）Interior lower end and three-motor
（7）It is fixedly connected；The three-motor（7）Turning end pass through bearing（13）With grinding material carrier platform（6）Centre is fixedly connected；
The lapping device body（1）Right-hand member be provided with safety protective door（9）；The safety protective door（9）By folding（11）With
Lapping device body（1）It is hinged；The safety protective door（9）Centre and toughened glass window（8）It is fixedly connected；The grinding dress
Put body（1）Inner bottom surface on be fixed with immersible pump（16）；The immersible pump（16）Liquid outlet and tube for transfusion（15）One
End is fixedly connected；The tube for transfusion（15）The other end and lapping liquid storage barrel（3）Upper end connection；The lapping device body
（1）Lower end surrounding be provided with four rolling（18）；The roller（18）By jointed shaft（17）With lapping device body（1）Gu
It is fixed to connect.
2. moveable economizing type semiconductor grinding device according to claim 1, it is characterised in that：The burette
（19）On be provided with controlled valve（20）.
3. moveable economizing type semiconductor grinding device according to claim 1, it is characterised in that：The roller（18）
It is a kind of universal wheel, and outside is provided with abrasive rubber set.
4. moveable economizing type semiconductor grinding device according to claim 1, it is characterised in that：The security protection
Door（9）One end be provided with hand draw ring, and safety protective door（9）With lapping device body（1）Contact position be provided with sealing
Rubber washer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621045465.XU CN206047875U (en) | 2016-09-09 | 2016-09-09 | A kind of moveable economizing type semiconductor grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621045465.XU CN206047875U (en) | 2016-09-09 | 2016-09-09 | A kind of moveable economizing type semiconductor grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206047875U true CN206047875U (en) | 2017-03-29 |
Family
ID=58369860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621045465.XU Active CN206047875U (en) | 2016-09-09 | 2016-09-09 | A kind of moveable economizing type semiconductor grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206047875U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107138958A (en) * | 2017-07-01 | 2017-09-08 | 张帝 | A kind of intermetallic composite coating grading material device |
| CN107932306A (en) * | 2017-12-22 | 2018-04-20 | 朱玉林 | A kind of new semi-conducting material milling apparatus |
| CN107932307A (en) * | 2017-12-22 | 2018-04-20 | 朱玉林 | A kind of semi-conducting material milling apparatus |
-
2016
- 2016-09-09 CN CN201621045465.XU patent/CN206047875U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107138958A (en) * | 2017-07-01 | 2017-09-08 | 张帝 | A kind of intermetallic composite coating grading material device |
| CN107138958B (en) * | 2017-07-01 | 2019-03-15 | 广东创汇实业有限公司 | A kind of intermetallic composite coating grading material device |
| CN107932306A (en) * | 2017-12-22 | 2018-04-20 | 朱玉林 | A kind of new semi-conducting material milling apparatus |
| CN107932307A (en) * | 2017-12-22 | 2018-04-20 | 朱玉林 | A kind of semi-conducting material milling apparatus |
| CN107932307B (en) * | 2017-12-22 | 2018-10-23 | 连云港兴达石英材料有限公司 | A kind of semi-conducting material milling apparatus |
| CN107932306B (en) * | 2017-12-22 | 2018-12-18 | 徐州吉兴新材料有限公司 | A kind of novel semiconductor material milling apparatus |
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