CN206040634U - Series connection diode integrated device - Google Patents
Series connection diode integrated device Download PDFInfo
- Publication number
- CN206040634U CN206040634U CN201621050572.1U CN201621050572U CN206040634U CN 206040634 U CN206040634 U CN 206040634U CN 201621050572 U CN201621050572 U CN 201621050572U CN 206040634 U CN206040634 U CN 206040634U
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- CN
- China
- Prior art keywords
- diode
- lead frame
- series
- diode chip
- pressure regulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The utility model relates to a series connection diode integrated device, include: the lead frame, be located two at least diode chips of establishing ties in proper order on the lead frame through the metal wire, the anode lead who draws forth from the positive pole of first diode chip of establishing ties, the cathode lead wire who draws forth from the negative pole of final diode chip of establishing ties, the external lead wire of drawing forth from the metal wire of connecting two adjacent diodes, and the insulating layer, cathode lead wire, anode lead and external lead wire respectively with the lead frame on the pin be connected and form negative pole pin, positive pole pin and pressure regulating foot. The voltage that bears at the during operation through every diode chip among pressure regulating foot, positive pole pin and the testable series connection diode integrated device of negative pole pin to dispose resistance and/or electric capacity according to the actual need in the circuit board and crossing the voltage of the diode chip of height with reduced voltage, a plurality of diodes of avoiding establishing ties are withstand voltage and losing efficacy on average, the reliability of the diode of improvement series connection.
Description
Technical field
This utility model is related to diode manufacturing technology field, more particularly to a kind of series diode integrating device.
Background technology
Diode has a wide range of applications in electronic applications as the simplest semiconductor device of structure, especially in parallel
The application of diode is relatively conventional, and diode in parallel can reach rated operational current addition.The diode of series connection can reach volume
Fixed reversely pressure addition, but the series connection of diode is in actual applications, due to static and dynamic imbalance, frequently results in series connection
Multiple diodes averagely cannot bear voltage and fail.For example, connect two 300 volts of (Voltage:V) two pressure poles
Pipe, in the side circuit design of actual reversely total voltage 400V is used, two diodes D1 and D2 are not to be evenly distributed to
The voltage of 200V, but it is unequal and variation, if wherein D1 or D2 bear the voltage more than more than 300V, two will be caused
Pole pipe is breakdown and fail, therefore, it is unreliable that traditional Diode series increase reversely pressure mode, it is impossible to by diode string
Connection makes the mode of voltage multiplication, substantial amounts of and be reliably applied in various circuit designs.
Utility model content
Based on this, it is necessary to provide a kind of reliability high series diode integrating device.
A kind of series diode integrating device, including：
Lead frame；
At least two diode chip for backlight unit being sequentially connected in series by metal wire on the lead frame；
From the anode tap that the anode of first diode chip for backlight unit of series connection is drawn；
From the cathode leg that the negative electrode of last diode chip for backlight unit of series connection is drawn；
From each external lead wire that the metal wire of connection two diodes of arbitrary neighborhood is drawn；And
It is arranged on the lead frame and coats each diode chip for backlight unit, metal wire, each external lead wire, negative electrode
The insulating barrier of lead and anode tap；
The anode tap is connected to form negative electrode pin with pin on lead frame；On the cathode leg and lead frame
Pin connects to form negative electrode pin；Each external lead wire is connected to form pressure regulation foot with pin on lead frame.
In one embodiment, each diode chip for backlight unit is by being sintered to fix on the lead frame with stannum.
In one embodiment, the anode tap, cathode leg and the external lead wire are aluminium wire or copper cash.
In one embodiment, the insulating barrier is epoxy resin layer.
In one embodiment, also including pressure regulation unit, the pressure regulation unit is by the negative electrode pin, pressure regulation foot or the moon
The voltage of pole pin and the corresponding diode chip for backlight unit parallel connection, the quantity of the pressure regulation unit and position according to diode chip for backlight unit
It is determined that.
In one embodiment, the pressure regulation unit is electric capacity.
In one embodiment, the pressure regulation unit is resistance.
In one embodiment, the pressure regulation unit includes resistance and the electric capacity connected.
In one embodiment, copper radiating rib is provided with the lead frame.
Above-mentioned series diode integrating device, by connecting on the lead frames, at least two diode chip for backlight unit are collected
Into series diode integrating device, with negative electrode pin and negative electrode pin, and from the metal wire of the two neighboring diode of connecting
Draw external lead wire to be connected to form pressure regulation foot with the pin on lead frame.By pressure regulation foot, negative electrode pin and negative electrode pin, can
The voltage that operationally bears of each diode chip for backlight unit in test series diode integrating device, so as to according to being actually needed in electricity
Resistance and/or electric capacity is configured in the plate of road to reduce the voltage of the diode chip for backlight unit of overtension position, it is to avoid multiple the two of series connection
Pole pipe averagely cannot be born voltage and be failed, so as to improve the reliability of the diode of series connection.
Description of the drawings
External structure schematic diagrams of the Fig. 1 for the series diode integrating device of one embodiment；
Connection diagrams of the Fig. 2 for the diode of two series connection in the series diode integrating device of one embodiment；
Connection diagrams of the Fig. 3 for diode and lead frame in the series diode integrating device of one embodiment；
Schematic diagrams of the Fig. 4 for the series diode integrating device of two diode chip for backlight unit compositions of one embodiment；
Schematic diagrams of the Fig. 5 for the series diode integrating device of three diode chip for backlight unit compositions of one embodiment；
Fig. 6 is the schematic diagram of the pressure regulation unit for the series diode integrating device of resistance of one embodiment；
Fig. 7 is the schematic diagram of the pressure regulation unit for the series diode integrating device of resistance of another embodiment；
Fig. 8 is the schematic diagram of the pressure regulation unit for the series diode integrating device of electric capacity of one embodiment；
Fig. 9 is the schematic diagram of the pressure regulation unit for the series diode integrating device of electric capacity of another embodiment；
Figure 10 is showing for the series diode integrating device of electric capacity and resistance that the pressure regulation unit of one embodiment is series connection
It is intended to.
Specific embodiment
As shown in Figure 1 to Figure 3, a kind of series diode integrating device includes：Lead frame 10, on lead frame 10
At least two diode chip for backlight unit 20 being sequentially connected in series by metal wire 21, are drawn from the anode of first diode chip for backlight unit of series connection
Anode tap 31, from series connection last diode chip for backlight unit negative electrode draw cathode leg 32, from connection arbitrary neighborhood
Each external lead wire 33 that the metal wire 21 of two diodes is drawn, and be arranged on lead frame 10 and coat each diode core
The insulating barrier of piece 20, metal wire 21, each external lead wire 33, cathode leg 32 and anode tap 31.Anode tap 31, cathode leg
32 and external lead wire 33 be connected with the pin of lead frame 10 respectively.
Diode chip for backlight unit in the present embodiment refers to unencapsulated naked diode.Two diode chip for backlight unit series connection are referred to one
The anode of individual diode chip for backlight unit is connected with the negative electrode of another diode chip for backlight unit.It is understood that employed in the present embodiment
At least two diodes should be the high diode of electrical equipment feature consistency, such that it is able to stable increase series diode
Integrating device bears backward voltage, and make that multiple diodes can bear it is reverse pressure more average, make this series diode
Integrating device has reasonability, convenience, general applicability and long-term reliability.
Specifically, anode tap 31 is connected with pin 11 on lead frame 10, formed negative electrode pin, cathode leg 32 with draw
On wire frame 10, pin 12 connects, and forms negative electrode pin, and each external lead wire 33 is connected with the pin 13 of lead frame 10, is formed and is adjusted
Presser feet.It is flat to solve the voltage in different designs circuit that pressure regulation foot can be used for the components such as external equalizing resistance, adjustable resistance, electric capacity
Equal and stability problem, with higher reliability.Diode chip for backlight unit in series diode integrating device is in use
Heat is produced, copper radiating rib 14 is provided with lead frame 10, is radiated by conduction of heat.
Above-mentioned series diode integrating device, by connecting on the lead frames, at least two diode chip for backlight unit are collected
Into series diode integrating device, with negative electrode pin and negative electrode pin, and from the metal wire of the two neighboring diode of connecting
Draw external lead wire to be connected to form pressure regulation foot with the pin on lead frame.By pressure regulation foot, negative electrode pin and negative electrode pin, can
The voltage that operationally bears of each diode chip for backlight unit in test series diode integrating device, so as to according to being actually needed in electricity
Resistance and/or electric capacity is configured in the plate of road to reduce the voltage of the diode chip for backlight unit of overtension position, it is to avoid multiple the two of series connection
Pole pipe averagely cannot be born voltage and be failed, so as to improve the reliability of the diode of series connection.
In another embodiment, diode 20 is by being sintered to fix on lead frame 10 with stannum.Specifically, with tin cream
Or soldering piece is sintered to fix on lead frame 10.Wherein, anode tap 31, cathode leg 32 and external lead wire 33 be aluminium wire or
Copper wire.After diode 20 is sintered to fix with stannum on lead frame 10, diode is sequentially connected in series using metal wire 21, gold
Category line 21 can be aluminium wire or copper wire.And the anode tap drawn from the anode of first diode chip for backlight unit using aluminium wire or copper wire
31, anode tap 31 is connected with pin 11 on lead frame 10, negative electrode pin is formed.Using aluminium wire or copper wire from last
The cathode leg 32 that the negative electrode of diode chip for backlight unit is drawn, cathode leg 32 are connected with pin 12 on lead frame 10, form negative electrode
Pin.From the external lead wire 33 that metal wire 21 is drawn, external lead wire 33 is connected with the pin 13 of lead frame 10, forms pressure regulation
Foot.Finally, the lead frame 10 that connection is completed is placed in mould, the lead frame 10 completed to connection in module sprays absolutely
Edge material forms the series diode integrating device that insulating barrier obtains the present embodiment.The insulant of the present embodiment can be epoxy
Resin.
Above-mentioned integrated series connection diode, integrated design are simultaneously reduced using required space, reach high power
Density has simultaneously adapted to the compact trend of the market demand.Using the integrated series connection diode of the present embodiment, can reach more
Low cost, the double effectses of higher efficiency, and resistance, electric capacity and other electronic building bricks can be increased outward, all differences can be adapted to
Application, to meet development and the needs of energy-saving high efficiency.
A kind of integrated series connection diode including two diode chip for backlight unit is as shown in figure 4, one includes three diodes
The series diode integrating device of chip as shown in figure 5, draw external lead wire from the metal wire for connecting two neighboring diode, and
The characteristic coherency of these diode chip for backlight unit is optimal, can stablize and press, also, can test each two pole by external lead wire
The virtual voltage of die, carries out pressure regulation so as to increase resistance in parallel and/or electric capacity to corresponding diode chip for backlight unit, makes voltage
The voltage for crossing the diode chip for backlight unit of high position is reduced, it is to avoid multiple diodes of series connection averagely cannot bear voltage and fail, from
And improve the reliability of the diode of series connection.
In one embodiment, the diode integrating device of connecting also includes pressure regulation unit, pressure regulation unit by negative electrode pin,
Pressure regulation foot or negative electrode pin are in parallel with corresponding diode chip for backlight unit.The quantity of pressure regulation unit and position are according to every in actual circuit
The different voltages of individual diode chip for backlight unit determine, place corresponding pressure regulation unit to adjust the electricity of diode chip for backlight unit in correspondence position
Pressure, for example, configure in the circuit board pressure regulation unit to reduce the electricity of the diode chip for backlight unit of overtension position according to being actually needed
Pressure.Pressure regulation unit is specifically as follows electric capacity, resistance or the electric capacity and resistance including series connection.
In a specific embodiment, pressure regulation unit is resistance.The resistance of resistance can be according to each diode chip for backlight unit
Virtual voltage selected.Such as Fig. 6, one end of a resistance be connected with the negative electrode pin of integrated diode, the other end and
Pressure regulation foot connects.One end of another resistance is connected with pressure regulation foot, and the other end is connected with the negative electrode pin of integrated diode.
As shown in fig. 7, series diode integrating device has two pressure regulation feet.One end of first resistance and integrated two
The negative electrode pin connection of pole pipe, the other end are connected with first pressure regulation foot.One end of second resistor is connected with first pressure regulation foot
Connect, the other end is connected with the second pressure regulation foot.One end of 3rd resistance is connected with second pressure regulation foot, the other end and integrated two
The negative electrode pin connection of pole pipe.
In another specific embodiment, pressure regulation unit is electric capacity.The capacity of electric capacity can be according to each diode core
The virtual voltage of piece is selected.As shown in figure 8, one end of an electric capacity is connected with the negative electrode pin of integrated diode, separately
One end is connected with pressure regulation foot.One end of another electric capacity is connected with pressure regulation foot, the negative electrode pin of the other end and integrated diode
Connection.
Series diode integrating device as shown in Figure 9 has two pressure regulation feet.One end of first electric capacity with it is integrated
The negative electrode pin connection of diode, the other end are connected with first pressure regulation foot.One end of second electric capacity and first pressure regulation foot
Connection, the other end are connected with the second pressure regulation foot.One end of 3rd electric capacity is connected with second pressure regulation foot, the other end with it is integrated
The negative electrode pin connection of diode.
In another embodiment, pressure regulation unit includes electric capacity and the resistance connected.As shown in Figure 10.The string of the present embodiment
Di- pole pipe integrating device can be used in the circuit of transformator.First diode chip for backlight unit D1 is closer to transformator, can be because
The leakage inductance produced for transformator causes the voltage that the first diode chip for backlight unit D1 bears higher, therefore, according to the first diode chip for backlight unit
The opering characteristic of electric apparatus of D1 calculates resistance and capacitance, to improve the voltage resistance of the first diode chip for backlight unit D1, it is to avoid first
It is breakdown that individual diode chip for backlight unit D1 bears too high voltages.
Each technical characteristic of embodiment described above arbitrarily can be combined, for making description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more concrete and detailed,
But therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the common skill of this area
For art personnel, without departing from the concept of the premise utility, some deformations and improvement can also be made, these belong to
Protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be defined by claims.
Claims (9)
1. a kind of series diode integrating device, it is characterised in that include：
Lead frame；
At least two diode chip for backlight unit being sequentially connected in series by metal wire on the lead frame；
From the anode tap that the anode of first diode chip for backlight unit of series connection is drawn；
From the cathode leg that the negative electrode of last diode chip for backlight unit of series connection is drawn；
From each external lead wire that the metal wire of connection two diodes of arbitrary neighborhood is drawn；And
It is arranged on the lead frame and coats each diode chip for backlight unit, metal wire, each external lead wire, cathode leg
With the insulating barrier of anode tap；
The anode tap is connected to form negative electrode pin with pin on lead frame；The cathode leg and pin on lead frame
Connection forms negative electrode pin；Each external lead wire is connected to form pressure regulation foot with pin on lead frame.
2. series diode integrating device according to claim 1, it is characterised in that each diode chip for backlight unit by with
Stannum is sintered to fix on the lead frame.
3. series diode integrating device according to claim 1, it is characterised in that the anode tap, cathode leg
It is aluminium wire or copper cash with the external lead wire.
4. series diode integrating device according to claim 1, it is characterised in that the insulating barrier is epoxy resin
Layer.
5. series diode integrating device according to claim 1, it is characterised in that also including pressure regulation unit, the tune
Pressure unit is in parallel with the corresponding diode chip for backlight unit by the negative electrode pin, pressure regulation foot or negative electrode pin, the pressure regulation list
The quantity of unit and position are determined according to the voltage of diode chip for backlight unit.
6. series diode integrating device according to claim 5, it is characterised in that the pressure regulation unit is electric capacity.
7. series diode integrating device according to claim 5, it is characterised in that the pressure regulation unit is resistance.
8. series diode integrating device according to claim 5, it is characterised in that the pressure regulation unit includes what is connected
Resistance and electric capacity.
9. series diode integrating device according to claim 1, it is characterised in that be provided with copper on the lead frame
Fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621050572.1U CN206040634U (en) | 2016-09-12 | 2016-09-12 | Series connection diode integrated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621050572.1U CN206040634U (en) | 2016-09-12 | 2016-09-12 | Series connection diode integrated device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206040634U true CN206040634U (en) | 2017-03-22 |
Family
ID=58299939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621050572.1U Active CN206040634U (en) | 2016-09-12 | 2016-09-12 | Series connection diode integrated device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206040634U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494210A (en) * | 2018-12-25 | 2019-03-19 | 山东晶导微电子股份有限公司 | A kind of half-bridge encapsulating structure |
-
2016
- 2016-09-12 CN CN201621050572.1U patent/CN206040634U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494210A (en) * | 2018-12-25 | 2019-03-19 | 山东晶导微电子股份有限公司 | A kind of half-bridge encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170818 Address after: 518000, A, building 611, south-east square International Plaza, Shek ha ha North Street, Futian District, Guangdong, Shenzhen Patentee after: Shenzhen silicon Lake Semiconductor Co., Ltd. Address before: 518000 Guangdong, Shenzhen, Futian District, No. 3013 Yitian Road, South Plaza, building A room, Room 302 Co-patentee before: Luo Xiaochun Patentee before: Chen Wenbin |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210104 Address after: 518017 1103, block B, South International Plaza, 3013 Yitian Road, Mingyue community, Fubao street, Futian District, Shenzhen City, Guangdong Province Patentee after: Luo Xiaochun Address before: 518000 611, building a, Southeast International Plaza, Shixia North 3rd Street, Fubao street, Futian District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN SIRECT SEMICONDUCTOR Co.,Ltd. |
|
| TR01 | Transfer of patent right |