CN206024108U - Micro-electro-mechanical microphone - Google Patents
Micro-electro-mechanical microphone Download PDFInfo
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- CN206024108U CN206024108U CN201620839119.2U CN201620839119U CN206024108U CN 206024108 U CN206024108 U CN 206024108U CN 201620839119 U CN201620839119 U CN 201620839119U CN 206024108 U CN206024108 U CN 206024108U
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- pole plate
- back pole
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- vibrating diaphragm
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Abstract
Disclose a kind of micro-electro-mechanical microphone.The micro-electro-mechanical microphone includes：Back pole plate, vibrating diaphragm and sensing layer, wherein, the back pole plate includes first surface and second surface, the vibrating diaphragm is relative with the first surface of the back pole plate and predetermined distance is arranged, so that forming electric field between the vibratile vibrating diaphragm and the back pole plate, the sensing layer is attached at the second surface of the back pole plate, and the deformation of the sensing layer drives the back pole plate to deform upon.The micro-electro-mechanical microphone that the utility model is provided is integrated with the sensing function of other physical quantitys, and compact conformation on the basis of with microphone function, saves layout area.
Description
Technical field
The utility model is related to compound sensor neighborhood, more particularly, to a kind of micro-electro-mechanical microphone.
Background technology
MEMS (Micro-Electro-Mechanical System, MEMS) is collection microsensor, micro- execution
The micro- energy of device, micro mechanical structure, micro battery, signal transacting and control circuit, high-performance electronic integrated device, interface, communication etc.
Microdevice or system in one.MEMS is a revolutionary new technology, is widely used in new high-tech industry, is one
It is in microelectric technique basis to be related to the development in science and technology of country, the key technology MEMS of of prosperous economy and national defense safety
The electromechanical devices that the employing micro fabrication for growing up makes, have been widely used as sensor and actuator, microcomputer
Electric microphone is exactly representative therein.
At present, clearly, but MEMS processing procedures and encapsulation procedure between different sensors are poor for the trend of sensor fusion
Different larger, which is professional to there is also certain mutex relation, and therefore common current traditional scheme is that multiple sensors are assembled into one
With the respective physical quantity of acquisition on block circuit board.In prior art, by manometric MEMS and special IC
(Application Specific Integrated Circuits, ASIC) chip and the MEMS and ASIC of micro-electro-mechanical microphone
Chip package is in a housing so that visually only see a product, and the product provides two kinds of physical quantity letters simultaneously
Breath, can so save the cost of some encapsulation.
But two kinds of independent sensors are simply packaged together merely by above-mentioned compound sensor, its structure and layout
Area commonly greater than both plus and.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of micro-electro-mechanical microphone, the micro-electro-mechanical microphone
The sensing function of other physical quantitys, and compact conformation is integrated with the basis of with microphone function, saves layout area.
According to the utility model provide a kind of micro-electro-mechanical microphone, including：
Back pole plate, the back pole plate include first surface and second surface；
Vibrating diaphragm, the vibrating diaphragm is relative with the first surface of the back pole plate and predetermined distance is arranged so that
Electric field is formed between the vibratile vibrating diaphragm and the back pole plate；
Sensing layer, the sensing layer are attached at the second surface of the back pole plate, and the deformation of the sensing layer drives
The back pole plate is deformed upon.
Preferably, the sensitive signal frequency of the sensing layer is 0～20 hertz.
Preferably, the sensing layer is wet sensitive sensing layer.
Preferably, the scope that the back pole plate is deformed upon is be separated by between the vibrating diaphragm and the back pole plate described pre-
- the 12% of set a distance～+12%.
Preferably, the micro-electro-mechanical microphone also includes：
Substrate, the substrate include the operatic tunes, and the vibrating diaphragm is located on the substrate and is connected by the operatic tunes and outside
Pass to reception voice signal；
Supporting layer, the supporting layer are arranged between the substrate and the vibrating diaphragm and the vibrating diaphragm and the back pole plate
Between.
Preferably, the micro-electro-mechanical microphone also includes：
Special IC, the special IC are electrically connected with the back pole plate and the vibrating diaphragm.
Preferably, the special IC includes：
Metal-oxide semiconductor fieldeffect transistor (metal-oxide-semiconductor), the special IC is by detecting the MOS
The temperature characterisitic of pipe exports the electric signal relevant with temperature.
According to micro-electro-mechanical microphone of the present utility model, other physical quantitys are integrated with the basis of with microphone function
Sensing function, and compact conformation saves layout area.By detecting that metal-oxide-semiconductor temperature characterisitic exports the telecommunications related to temperature
Number so that micro-electro-mechanical microphone can be with output temperature physical quantity, so that the micro-electro-mechanical microphone is more suitable for consumption electricity
The occasion that the end products such as son, Internet of Things, smart home are all required in multiple physical quantitys such as acoustics, temperature, humidity.
Description of the drawings
By description referring to the drawings to the utility model embodiment, of the present utility model above-mentioned and other mesh
, feature and advantage will be apparent from, in the accompanying drawings：
Fig. 1 illustrates the stereogram of the micro-electro-mechanical microphone according to the utility model specific embodiment.
Fig. 2 illustrates the three-dimensional exploded view of the micro-electro-mechanical microphone according to the utility model specific embodiment.
Fig. 3 illustrates the top view of the micro-electro-mechanical microphone according to the utility model specific embodiment.
Fig. 4 illustrates the sectional view of the micro-electro-mechanical microphone according to the utility model specific embodiment.
Fig. 5 a to Fig. 5 d illustrate each of the manufacture method of the micro-electro-mechanical microphone according to the utility model specific embodiment
The sectional view in stage.
Specific embodiment
The utility model is more fully described hereinafter with reference to accompanying drawing.In various figures, identical element is using similar
Reference representing.For the sake of clarity, the various pieces in accompanying drawing are not necessarily to scale.Furthermore, it is possible to not shown
Part known to some.
It should be appreciated that in the structure of outlines device, when a floor, a region to be referred to as being located at another floor, another area
When domain " above " or " top ", can refer to above another layer, another region, or its with another layer, another
Also comprising other layers or region between individual region.Also, if device is overturn, this layer, a region will be positioned at another
Layer, another region " below " or " lower section ".
If in order to describe located immediately at another layer, another region above scenario, herein will be using " A is directly on B
Face " or the form of presentation of " A is adjoined on B and therewith ".In this application, " A is in B " represents that A is located in B, and
And A and B is abutted directly against.
The utility model provides a kind of micro-electro-mechanical microphone, and the micro-electro-mechanical microphone includes：Back pole plate, vibrating diaphragm, Yi Jichuan
Sense layer, wherein, the back pole plate includes first surface and second surface, the first surface of the vibrating diaphragm and the back pole plate
Relative and predetermined distance is arranged so that form electric field, the biography between the vibratile vibrating diaphragm and the back pole plate
Sense layer is attached at the second surface of the back pole plate, and the deformation of the sensing layer drives the back pole plate to deform upon.This
The micro-electro-mechanical microphone that utility model is provided is integrated with the sensing function of other physical quantitys on the basis of with microphone function,
And compact conformation, save layout area.
1 to Fig. 4 illustrates the embodiment of micro-electro-mechanical microphone of the present utility model below in conjunction with the accompanying drawings, hereinafter retouches
Many specific details of the present utility model are stated, the structure of such as device, material, size, handling process and technology, so as to more
It is expressly understood the utility model.But just as the skilled person will understand, can not be specific according to these
Details realizing the utility model.
Fig. 1 to Fig. 4 is shown respectively the stereogram of the micro-electro-mechanical microphone according to the utility model specific embodiment, solid point
Line A-A ' in Xie Tu, top view and sectional view, wherein Fig. 3 illustrates the interception position of sectional view.The micro-electro-mechanical microphone bag
Back pole plate 140 is included, the back pole plate 140 includes first surface and second surface；Vibrating diaphragm 130, the vibrating diaphragm 130 and the backplane
The first surface of plate 140 is relative and predetermined distance is arranged so that the vibratile vibrating diaphragm 130 and the backplane
Electric field is formed between plate 140；And sensing layer 150, the sensing layer 150 is attached at second table of the back pole plate 140
Face, the deformation of the sensing layer 150 drive the back pole plate 140 to deform upon.
Further, the micro-electro-mechanical microphone of the present embodiment also includes：Substrate 110, the substrate 110 include the operatic tunes 111,
The vibrating diaphragm 130 is located at the top of the substrate 110, and the vibrating diaphragm 130 passes through the operatic tunes 111 and ft connection to receive sound
Message number；Supporting layer 120, the supporting layer 120 are arranged between the substrate 110 and the vibrating diaphragm 130 and the vibrating diaphragm
Between 130 and the back pole plate 140.
Back pole plate 140 is made up of conductive material (for example adulterate polysilicon, metal or alloy), and vibrating diaphragm layer 130 is by conduction
Material (for example adulterate polysilicon, metal or alloy) composition, substrate 110 are, for example, body silicon substrate, silicon-on-insulator (SOI) lining
Bottom etc., the substrate 110, the vibrating diaphragm layer 130, the back pole plate 140 include relative first surface and second surface,
The material of support layer 120 is, for example, silica or silicon nitride.In the present embodiment, the substrate 110 is annular, is internally provided with
Connection 110 first surface of substrate and the operatic tunes 111 of second surface, the vibrating diaphragm 130 are arranged on the first surface of the substrate 110
Top, and the supporting layer 120 is provided therebetween, the second surface of the vibrating diaphragm 130 is exposed in the operatic tunes 111,
External sound signal reaches 130 second surface of the vibrating diaphragm by the operatic tunes 111 so that the vibrating diaphragm 130 vibrates.Institute
The top that back pole plate 140 is arranged on the vibrating diaphragm 130 is stated, and is separated pre- by arranging the supporting layer 120 therebetween
Set a distance, the vibrating diaphragm 120 and the back pole plate 140 are all circular, and above-mentioned supporting layer 120 is corresponding to the vibrating diaphragm 120, institute
State the annular of 140 outer circumferential edges of back pole plate, the first surface of the second surface of the back pole plate 140 and the vibrating diaphragm 130
Relative, and electric field is formed therebetween, when the vibrating diaphragm 130 vibrates, also there is respective change in the electric field, so that acoustics
Signal is reflected by capacitance signal.
Sensing layer 150 can the sensitive material sensitive to various physical quantitys make, such as temperature sensing material, humidity-sensitive material, pressure-sensitive
Material etc..Sensing layer 150 in the present embodiment is attached on the first surface of the back pole plate 140, can be circular, and its
Size can be slightly less than the size of the back pole plate 140, and such as its outer circumferential edges are interior corresponding to the annular brace layer 120
Circumferential edges, the sensing layer 150 can be deformed upon when detecting the change of corresponding sensitive physical amount, i.e. breathing, the change
The back pole plate 140 can be driven while deforming upon, the change of distance between the back pole plate 140 and the vibrating diaphragm 120 is reflected as
Change, so that the electric capacity of electric field changes between the back pole plate 140 and the vibrating diaphragm 120 so that the sensitive physical amount
Change be reflected as capacitance signal and be illustrated.
Of course, it should be understood that the vibrating diaphragm 130, the back pole plate 140, the shape of the sensing layer 150 are not limited to
Circle in above-described embodiment, it is also possible to make other shapes according to actual needs, for example square, accordingly, the substrate
110th, the supporting layer 120 can also the side's of being annular.
Clearly as the frequency range of acoustic signal is 20～20000 hertz (Hz), be not suitable for that frequency range is had overlap
Motion sensor such as accelerometer, gyroscope etc. integrate with the micro-electro-mechanical microphone, to avoid cannot be distinguished by electricity
It is to characterize amount of exercise or the difficulty of acoustics amount to hold signal, and the measurement for physical quantitys such as pressure, humidity, temperature, can more
It is suitable for integrated.It is preferred that the signal frequency of 150 sensitivity of the sensing layer is 0～20Hz, to avoid reflecting sensing layer detection
Electric capacity (lower the be referred to as sensitization capacitance) signal of physical quantity variation and the electric capacity of reflection acoustic signal (lower be referred to as acoustic capacitance) signal
Between obscure, using capacitance signal that frequency is 0～20Hz as the output of moisture signal, the electric capacity of 20～20000Hz is believed
Number as voice signal output.
The material of sensing layer 150 can be porous silicon or polyimides, and the sensing layer 150 can be wet sensitive sensing layer,
So that the micro-electro-mechanical microphone had not only retained the function of microphone but also the function with detection humidity.Preferably, the back pole plate
The scope for deforming upon is -12%～+the 12% of the preset distance being separated by between the vibrating diaphragm and the back pole plate.Generally
In the case of, it is desirable to the sensitivity accuracy of micro-electro-mechanical microphone is controlled to ± 1 decibel (dB), and the sensitivity of micro-electro-mechanical microphone is
Embodied by detecting the ratio in total capacitance value of the acoustic capacitance change between the vibrating diaphragm 130 and the back pole plate 140,
Herein, it is C to define the total capacitance value between the vibrating diaphragm 130 and the back pole plate 1400, the change of the acoustic capacitance turns to
Δ C, then sensitivity pass through Δ C/C0Embody, it is d to set total distance between the vibrating diaphragm 130 and the back pole plate 1400, in sound
Under sound signal function, the amplitude of the displacement of vibrating diaphragm 130 is Δ d, when Δ d is less, has Δ C/C0≈Δd/d0, the sensing layer
150 when driving the back pole plate 140 to deform upon and under voice signal effect the deformation of back pole plate 140 can change above-mentioned
d0, while Δ d does not have significant change, the now micro-electro-mechanical microphone sensitivity can receive d0Impact.Precision due to 1dB
Correspond between the vibrating diaphragm 130 and the back pole plate 140 always apart from d012%, need to ensure that the back pole plate is deformed upon
Scope be -12%～+the 12% of the preset distance being separated by between the vibrating diaphragm and the back pole plate.Of course, it is possible to manage
Solution, according to difference of the reality to the micro-electro-mechanical microphone required precision, the scope that above-mentioned back pole plate is deformed upon accounts for institute
The percentage for stating the preset distance being separated by between vibrating diaphragm and the back pole plate can make corresponding adjustment so that newly integrated
The detection of sensitive physical amount in allowed limits, reduces the sensitivity to the precision and Properties Control of the micro-electro-mechanical microphone
Influencing each other between capacitance signal and the acoustic capacitance signal.
Further, the micro-electro-mechanical microphone of the present embodiment also includes special IC (ASIC, figure not shown in), institute
State ASIC to electrically connect with the back pole plate 140 and the vibrating diaphragm 130 so that the back pole plate 140 and the vibrating diaphragm 130
Electrical signal is exported by the ASIC.Yet further, the ASIC includes metal (metal)-oxide again
(oxide)-semiconductor (semiconductor) field-effect transistor (abbreviation metal-oxide-semiconductor), the micro-electro-mechanical microphone can be direct
The electric signal relevant with temperature is exported by detecting the temperature characterisitic of the metal-oxide-semiconductor so that the micro-electro-mechanical microphone is also
Can simultaneously this sensitive physical amount of detection temperature, be integrated with temperature, humidity sensor function the micro-electro-mechanical microphone basic
Do not increase the cost of product, volume, power consumption, be more suitable for the end products such as consumer electronics, Internet of Things, smart home acoustics,
The occasion that multiple physical quantitys such as temperature, humidity are all required.
Manufacture microcomputer of the present utility model is described with the making of the micro-electro-mechanical microphone in above-mentioned specific embodiment below
The method of electric microphone, Fig. 5 a to Fig. 5 d illustrate the manufacture method of the micro-electro-mechanical microphone according to the utility model specific embodiment
Each stage sectional view, the line A-A ' in Fig. 3 illustrates the interception position of each sectional view.
Such as Fig. 5 a, there is provided substrate 110, form vibrating diaphragm 130 on the substrate 110, it is preferable that the substrate 110 with
Supporting layer 120 is formed between the vibrating diaphragm 130 so that the marginal portion of the vibrating diaphragm 130 obtains propping up for the supporting layer 120
Support.
Then, such as Fig. 5 b, supporting layer 120 is re-formed on the vibrating diaphragm 130, the supporting layer 120 is patterned, and at this
Back pole plate 140 is formed on supporting layer 120 so that the vibrating diaphragm 130 is separated by by the supporting layer 120 with the back pole plate 140
Preset distance.
Then, such as Fig. 5 c, the operatic tunes 111 is formed in the substrate 110, the operatic tunes 111 is relative through the substrate 110
Two surfaces so that the vibrating diaphragm 130 can by the operatic tunes 111 receive the external world voice signal.Form the operatic tunes 111
Technique can be dry etch process, in the present embodiment, using inductively coupled plasma (Inductively Coupled
Plasma, ICP) etching technics, during forming the operatic tunes 111 using the technique, its temperature would generally be Celsius more than 300
Degree.Of course, it should be understood that other methods well known in the art can also be adopted the step of the above-mentioned formation operatic tunes 111.
Then, such as Fig. 5 d, sensing layer 150 is formed on the back pole plate 140, the sensing layer 150 is attached to the back of the body
On pole plate 140, so as to its deformation can drive the back pole plate 140 to deform upon.Micro-electro-mechanical microphone in above-described embodiment
Sensing layer 150 is made using polyimides, can according to the step of existing micro-electro-mechanical microphone processing procedure, the formation operatic tunes 111
To carry out at any time, but in the present embodiment, the sensing layer 150 that polyimides is made is Celsius for -200～300 using temperature
Degree, is to ensure that the processing procedure formed after the sensing layer 150 does not affect its sensitivity characteristic, needs the step will form sensing layer 150
Suddenly be arranged on temperature can be more than 300 degrees Celsius of Overall Steps after, therefore in the present embodiment, after the operatic tunes 111 is formed
Carry out the step of forming the sensing layer 150 again, after forming the sensing layer 150, technological temperature can be carried out Celsius less than 300
Other steps of degree, the present embodiment pattern the supporting layer using wet-etching technology after the sensing layer 150 is formed
120, discharge the core of the vibrating diaphragm 130 and the back pole plate 140.It should be noted that can in the vibrating diaphragm layer 130
To be provided with perforate (not shown), to facilitate the patterning to the supporting layer 120.Finally, by above-mentioned micro-electro-mechanical microphone
In the vibrating diaphragm 130, the back pole plate 140 and corresponding ASIC electrical connection, complete the making of the micro-electro-mechanical microphone.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation are made a distinction with another entity or operation, and are not necessarily required or implied these entities or deposit between operating
In any this actual relation or order.And, term " including ", "comprising" or its any other variant are intended to
Nonexcludability includes, so that a series of process, method, article or equipment including key elements not only includes that those will
Element, but also other key elements including being not expressly set out, or also include for this process, method, article or equipment
Intrinsic key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that
Also there is other identical element in process, method, article or equipment including the key element.
According to embodiment of the present utility model as described above, these embodiments do not have all of details of detailed descriptionthe,
Also it is only described specific embodiment not limit the utility model.Obviously, as described above, a lot of modifications and change can be made
Change.This specification is chosen and specifically describes these embodiments, be in order to preferably explain principle of the present utility model and actual should
With so that skilled artisan can repairing using the utility model and on the basis of the utility model well
Change use.The utility model is only limited by claims and its four corner and equivalent.
Claims (7)
1. a kind of micro-electro-mechanical microphone, it is characterised in that include：
Back pole plate, the back pole plate include first surface and second surface；
Vibrating diaphragm, the vibrating diaphragm is relative with the first surface of the back pole plate and predetermined distance is arranged so that can shake
Electric field is formed between the dynamic vibrating diaphragm and the back pole plate；
Sensing layer, the sensing layer are attached at the second surface of the back pole plate, and the deformation drive of the sensing layer is described
Back pole plate is deformed upon.
2. micro-electro-mechanical microphone according to claim 1, it is characterised in that the sensitive signal frequency of the sensing layer is 0
～20 hertz.
3. micro-electro-mechanical microphone according to claim 2, it is characterised in that the sensing layer is wet sensitive sensing layer.
4. micro-electro-mechanical microphone according to claim 3, it is characterised in that the scope that the back pole plate is deformed upon is institute
State -12%～+the 12% of the preset distance being separated by between vibrating diaphragm and the back pole plate.
5. micro-electro-mechanical microphone according to claim 1, it is characterised in that also include：
Substrate, the substrate include the operatic tunes, the vibrating diaphragm be located on the substrate and by the operatic tunes and ft connection with
Receive voice signal；
Supporting layer, the supporting layer be arranged between the substrate and the vibrating diaphragm and the vibrating diaphragm and the back pole plate it
Between.
6. micro-electro-mechanical microphone according to claim 5, it is characterised in that also include：
Special IC, the special IC are electrically connected with the back pole plate and the vibrating diaphragm.
7. micro-electro-mechanical microphone according to claim 6, it is characterised in that the special IC includes：
Metal-oxide semiconductor fieldeffect transistor (metal-oxide-semiconductor), the special IC is by detecting the metal-oxide-semiconductor
Temperature characterisitic exports the electric signal relevant with temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620839119.2U CN206024108U (en) | 2016-08-04 | 2016-08-04 | Micro-electro-mechanical microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620839119.2U CN206024108U (en) | 2016-08-04 | 2016-08-04 | Micro-electro-mechanical microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206024108U true CN206024108U (en) | 2017-03-15 |
Family
ID=58246409
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620839119.2U Active CN206024108U (en) | 2016-08-04 | 2016-08-04 | Micro-electro-mechanical microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206024108U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109211281A (en) * | 2018-08-06 | 2019-01-15 | 歌尔股份有限公司 | A kind of sensor |
-
2016
- 2016-08-04 CN CN201620839119.2U patent/CN206024108U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109211281A (en) * | 2018-08-06 | 2019-01-15 | 歌尔股份有限公司 | A kind of sensor |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180718 Address after: 261000 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 100190 Beijing, Haidian District, Zhongguancun, north two, 13, 44, 118 rooms. Patentee before: Beijing Acuti Microsystems Co., Ltd. |