CN206022343U - Full-automatic silicon wafer breaking machine - Google Patents
Full-automatic silicon wafer breaking machine Download PDFInfo
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- CN206022343U CN206022343U CN201621078094.5U CN201621078094U CN206022343U CN 206022343 U CN206022343 U CN 206022343U CN 201621078094 U CN201621078094 U CN 201621078094U CN 206022343 U CN206022343 U CN 206022343U
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- silicon chip
- base plate
- silicon
- manipulator
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Abstract
The utility model discloses a kind of full-automatic silicon wafer breaking machine, including：Base plate, one end of base plate are provided with guide rail, and guide rail one end is provided with Maila paper suction and puts manipulator, and the other end is provided with silicon chip suction and puts manipulator, and silicon chip suction is put the side of manipulator and is provided with silicon chip positioning table；Manipulator is put in Maila paper suction and silicon chip is inhaled and put between manipulator, on base plate, be provided with stack rotation platform；Corresponding stack rotation platform, is provided with nozzle on base plate；The side of base plate is provided with rolls haul mechanism, the gripper shoe that haul mechanism includes fixing is rolled with base plate, guide rail screw mandrel is provided with gripper shoe, elevating screw is provided with guide rail screw mandrel, elevating screw connection haul cylinder and pinch roller, the telescopic shaft of haul cylinder is connected with sucker, below pinch roller, sliver rolling platform is provided with base plate, and the side for rolling platform is provided with blanking conveyer belt.The silicon chip breaking machine reduces the labour intensity of staff, with stable reliability, improves yield and the quality of product.
Description
Technical field
The utility model is related to silicon wafer processing equipment, especially, is related to a kind of full-automatic silicon wafer breaking machine.
Background technology
Domestic even international market, can all have silicon chip to be separated into crystal grain, crystalline substance in the production process of high-power bridge rectifier
Grain collects the operation being arranged in packaging.At present, silicon chip is separated into crystal grain and removes leftover pieces using manual sliver, by hand,
Silicon chip is during sliver, because its product performance, sliver angle requirement is very high, and because of operating force, processing is skilled for manual processing
The impact of the objective factors such as degree makes the product yield of silicon chip sliver not high and unstable, while long-time, the operation of high speed,
Manpower can not more meet its Production requirement.The automation of the progressive boosting of technology substitute artificial, liberate artificial process, existing
Emerge in large numbers in the automation equipment for there are many forms, but existing automated production equipment, with complex structure, product sliver is not
The higher shortcoming of yield and quality risk.
Utility model content
The utility model purpose is to provide a kind of full-automatic silicon wafer breaking machine, with solution technology in, silicon chip sliver from
Dynamic metaplasia produces device structure complexity, the higher technical problem of the fraction defective of product sliver and quality risk.
For achieving the above object, the utility model provides a kind of full-automatic silicon wafer breaking machine, including：Base plate, the base plate
One end be provided with guide rail, described guide rail one end is provided with Maila paper inhales and puts manipulator, and the other end is provided with silicon chip to be inhaled and put machinery
Hand, the side that manipulator is put in the silicon chip suction are provided with silicon chip positioning table；Inhale in the Maila paper manipulator is put with the silicon chip
Suction is put between manipulator, is provided with stack rotation platform on the base plate；The corresponding stack rotation platform, sets on the base plate
It is equipped with nozzle；The side of the base plate is provided with rolls haul mechanism, and the haul mechanism that rolls includes fixing with the base plate
Gripper shoe, be provided with guide rail screw mandrel in the gripper shoe, be provided with elevating screw on the guide rail screw mandrel, the elevating screw
It is connected with haul cylinder and pinch roller, the telescopic shaft of the haul cylinder is connected with sucker, below the pinch roller, on the base plate
Sliver rolling platform is provided with, the side of the rolling platform is provided with blanking conveyer belt.
Further, the pinch roller is the square pinch roller of polytetrafluoroethylene (PTFE) that seamed edge is provided with R angles；Or, it is diameter 6mm-
The polytetrafluoroethylene (PTFE) cylinder pinch roller of 18mm.
Further, the silicon chip positioning table includes silicon chip supporting plate, is provided with silicon chip locating support on the silicon chip supporting plate；
In the silicon chip locating support and the junction of the silicon chip supporting plate, on the silicon chip supporting plate, detent is offered, described fixed
Position groove is provided with the locating piece being adapted with the detent, and the locating piece is fixed on the base plate.
Further, the silicon chip supporting plate is placed in silicon box, and the bottom of the silicon box is provided with opening.
Further, in cylinder, the silicon chip supporting plate is rounded for the silicon box.
Further, the mouth rim of the silicon box is provided with opening.
Further, the silicon chip locating support is in inverted U-shaped, and its two ends is separately fixed at the both sides of the detent.
Further, the detent on the silicon chip supporting plate is trapezoidal, and the locating piece is trapezoid block.
The utility model has the advantages that：
The silicon chip breaking machine simple structure, low cost full automatic can complete the sliver operation of silicon chip, substantially reduce work
Make the labour intensity of personnel, with stable reliability, improve yield and the quality of product.
Description of the drawings
Below with reference to figure, the utility model is described in further detail.Constitute the accompanying drawing of the part of the application
It is used for providing further understanding to of the present utility model, schematic description and description of the present utility model is used for explaining this reality
With new, do not constitute to improper restriction of the present utility model.In the accompanying drawings：
Fig. 1 is the structural representation of the utility model full-automatic silicon wafer breaking machine preferred embodiment；
Fig. 2 is the structural representation of silicon chip positioning table in the utility model full-automatic silicon wafer breaking machine preferred embodiment.
Specific embodiment
Embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
Fig. 1 is referred to, the utility model preferred embodiment provides a kind of full-automatic silicon wafer breaking machine, including：Base plate 20, institute
The one end for stating base plate 20 is provided with guide rail 21, and 21 one end of the guide rail is provided with Maila paper suction and puts manipulator 22, and the other end is arranged
There is silicon chip to inhale and put manipulator 23, the side that manipulator 23 is put in the silicon chip suction is provided with silicon chip positioning table 25；In the Maila paper
Manipulator 22 is put in suction and the silicon chip is inhaled and put between manipulator 23, is provided with stack rotation platform 24 on the base plate 20；Corresponding
The stack rotation platform 24, is provided with nozzle 26 on the base plate 20；The side of the base plate 20 is provided with rolls material conveyer
Structure, described roll haul mechanism include with the base plate 20 fix gripper shoe 27, be provided with guide rail silk in the gripper shoe 27
Bar 28, is provided with elevating screw 29, the elevating screw 29 and haul cylinder on the guide rail screw mandrel 28（Not shown）And pinch roller
32 connections, the telescopic shaft of the haul cylinder is connected with sucker 31, below the pinch roller 32, is provided with and splits on the base plate 20
Piece rolls platform 33, and the side of the rolling platform 33 is provided with blanking conveyer belt 34.
During work, silicon chip is placed in silicon chip positioning table 25 carries out position and angle positioning, base plate 20 can arrange bear from
Sub- air generator（Not shown）, negative ion wind generator into silicon chip positioning table 25 is blown into anionic wind and silicon chip destaticed
Process.Then, Maila paper suction is put manipulator 22 and is moved along guide rail 21, inhales one layer of Maila paper and is placed on stack rotation platform 24,
Nozzle 26 sprays the mixed liquor of alcohol and water on Maila paper, and Maila paper can be using the polyester insulated thin of thickness 5um-25um
Film.Then, silicon chip is inhaled to put manipulator 23 and move along guide rail 21 and is placed on Maila paper in a piece of silicon chip of 25 interior suction of silicon chip positioning table；
Then, nozzle 26 sprays the mixed liquor of alcohol and water, 45 ° of 24 synchronous rotary of stack rotation platform on Maila paper and silicon chip；Spray
Mouth 26 is fixed on the base plate 20, and at a certain angle the mixed liquor of alcohol and water is sprayed onto on Maila paper and silicon chip, alcohol and water
Mixing liquid proportional 5:1-1:In the range of 5.Hereafter, Maila paper suction is put manipulator 22 and is moved along guide rail 21, then inhales one layer of wheat
Draw is placed on silicon chip, and silicon chip is covered.
Then, the elevating screw 29 rolled in haul mechanism is come into operation with sucker 31, elevating screw 29 and 31 edge of sucker
Guide rail screw mandrel 28 is moved horizontally, and sucker 31 is moved to the position of stack rotation platform 24, and elevating screw 29 is with haul cylinder simultaneously
The silicon chip for having pasted Maila paper is held and is transported on sliver rolling platform 33 by control 31 oscilaltion of sucker, sucker 31；So
Afterwards, elevating screw 29 is moved along guide rail screw mandrel 28 with pinch roller 32, and elevating screw 29 drives 32 oscilaltion of pinch roller, make pinch roller 32 with
Silicon chip contact on sliver rolling platform 33, pinch roller 32 are moved back and forth along guide rail screw mandrel 28, the scrolling realization on silicon chip of pinch roller 32
The die separation of silicon chip, sliver roll platform 33 and are rotated by 90 ° after every single or reciprocal rolling, and the rolling of last time pinch roller is not revolved
Turn.After completing rolling, haul cylinder is moved to the position that sliver rolls platform 33 with sucker 31 along guide rail screw mandrel 28, and sucker 31 will
Silicon chip is picked up and is transported on blanking conveyer belt 34, and silicon chip is delivered to next operation by blanking conveyer belt 34.The silicon chip breaking machine knot
Structure is simple, and low cost full automatic can complete the sliver operation of silicon chip, substantially reduce the labour intensity of staff, have
Stable reliability, improves yield and the quality of product.
Preferably, it is the die separation effect that improves silicon chip, the pinch roller 32 is provided with the polytetrafluoroethylene (PTFE) at R angles for seamed edge
Square pinch roller；Or, it is the polytetrafluoroethylene (PTFE) cylinder pinch roller of diameter 6mm-18mm.
Refer to Fig. 2, it is preferable that the silicon chip positioning table 25 includes silicon chip supporting plate 2, is provided with the silicon chip supporting plate 2
Silicon chip locating support 4；In the silicon chip locating support 4 and the junction of the silicon chip supporting plate 2, open up on the silicon chip supporting plate 2
There is detent 5, at the detent 5, be provided with the locating piece 6 being adapted with the detent 5, the locating piece 6 is solid
It is scheduled on the base plate 20.During work, silicon chip 10 is neatly overlayed on silicon chip supporting plate 2, make the side of silicon chip 10 fixed against silicon chip
Position support 4, silicon chip supporting plate 2 is moved at the locating piece 6 being fixed on automated production equipment, and is fitted into locating piece 6
In detent 5, by cooperating for locating piece 6 and detent 5, silicon chip 10 is positioned at processing desired position and angle
Degree.25 simple structure of silicon chip positioning table, is engaged with the detent 5 on silicon chip supporting plate 2 using locating piece 6, realizes silicon chip
Position in process is positioned with angle, and easy to use, accurate positioning greatly improves the processing yield of product.
Preferably, the silicon chip supporting plate 2 is placed in silicon box 1, and the bottom of the silicon box 1 is provided with opening 3.Silicon chip
After supporting plate 2 is integrally placed in silicon box 1 with silicon chip 10, the detent 5 on silicon chip supporting plate 2 is directed at opening for 1 bottom of silicon box
Mouth 3, then, locating piece 6 can insert detent 5 from opening 3, meanwhile, can also be blown using air pressure gun or fan at opening 3
Wind, plays a part of electrostatic to silicon chip 10.Under the restriction of silicon box 1, the position of the silicon chip 10 on silicon chip supporting plate 2 will not be sent out
The larger skew of life, improves the accuracy of positioning.Preferably, in cylinder, the silicon chip supporting plate 2 is rounded for the silicon box 1.
Preferably, the mouth rim of the silicon box 1 is provided with opening, and silicon box 1 is higher than silicon chip locating support 4, is easy to
The hand of operating personnel is stretched in silicon box 1, and silicon chip supporting plate 2 is put into.
Preferably, the silicon chip locating support 4 is in inverted U-shaped, and its two ends is separately positioned on the both sides of the detent 5.
Silicon chip locating support 4 takes the shape of the letter U and is easy to operating personnel to take silicon chip supporting plate 2, while silicon chip locating support 4 has two root posts, just
Keep to the side to stack neatly in silicon chip 10.
Preferably, the detent 5 on the silicon chip supporting plate 2 is trapezoidal, and the locating piece 6 is trapezoid block.Trapezoidal
Locating piece 6 be adapted with detent 5 by two inclined-planes and positioned, it is more accurate to position.
Preferred embodiment of the present utility model is the foregoing is only, the utility model is not limited to；For this
For the technical staff in field, the utility model can have various modifications and variations.All of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements that is made etc. are should be included within protection domain of the present utility model.
Claims (8)
1. a kind of full-automatic silicon wafer breaking machine, it is characterised in that include：
Base plate, one end of the base plate are provided with guide rail, and described guide rail one end is provided with Maila paper suction and puts manipulator, and the other end sets
It is equipped with silicon chip suction and puts manipulator, the side that manipulator is put in the silicon chip suction is provided with silicon chip positioning table；Inhale in the Maila paper and put
Manipulator and the silicon chip are inhaled and are put between manipulator, are provided with stack rotation platform on the base plate；The corresponding stack rotation
Platform, is provided with nozzle on the base plate；The side of the base plate is provided with rolls haul mechanism, and the haul mechanism that rolls wraps
The gripper shoe that fixes with the base plate is included, and guide rail screw mandrel is provided with the gripper shoe, lifting is provided with the guide rail screw mandrel
Leading screw, the elevating screw are connected with haul cylinder and pinch roller, and the telescopic shaft of the haul cylinder is connected with sucker, in the pressure
Wheel lower section, is provided with sliver rolling platform on the base plate, the side of the rolling platform is provided with blanking conveyer belt.
2. full-automatic silicon wafer breaking machine according to claim 1, it is characterised in that：
The pinch roller is the square pinch roller of polytetrafluoroethylene (PTFE) that seamed edge is provided with R angles；Or, it is the polytetrafluoroethyl-ne of diameter 6mm-18mm
Alkene cylinder pinch roller.
3. full-automatic silicon wafer breaking machine according to claim 1, it is characterised in that：
The silicon chip positioning table includes silicon chip supporting plate, is provided with silicon chip locating support on the silicon chip supporting plate；Fixed in the silicon chip
Position support and the junction of the silicon chip supporting plate, offer detent on the silicon chip supporting plate, arrange at the detent
There are the locating piece being adapted with the detent, the locating piece to be fixed on the base plate.
4. full-automatic silicon wafer breaking machine according to claim 3, it is characterised in that：
The silicon chip supporting plate is placed in silicon box, and the bottom of the silicon box is provided with opening.
5. full-automatic silicon wafer breaking machine according to claim 4, it is characterised in that：
, in cylinder, the silicon chip supporting plate is rounded for the silicon box.
6. full-automatic silicon wafer breaking machine according to claim 3, it is characterised in that：
The mouth rim of the silicon box is provided with opening.
7. full-automatic silicon wafer breaking machine according to claim 3, it is characterised in that：
The silicon chip locating support is in inverted U-shaped, and its two ends is separately fixed at the both sides of the detent.
8. full-automatic silicon wafer breaking machine according to claim 3, it is characterised in that：
The detent on the silicon chip supporting plate is trapezoidal, and the locating piece is trapezoid block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621078094.5U CN206022343U (en) | 2016-09-26 | 2016-09-26 | Full-automatic silicon wafer breaking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621078094.5U CN206022343U (en) | 2016-09-26 | 2016-09-26 | Full-automatic silicon wafer breaking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206022343U true CN206022343U (en) | 2017-03-15 |
Family
ID=58260563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621078094.5U Expired - Fee Related CN206022343U (en) | 2016-09-26 | 2016-09-26 | Full-automatic silicon wafer breaking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206022343U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298652A (en) * | 2016-09-26 | 2017-01-04 | 华朔工业自动化设备无锡有限公司 | Full-automatic silicon wafer breaking machine |
| CN114851411A (en) * | 2022-06-02 | 2022-08-05 | 深圳市光道激光技术有限公司 | Brittle plate splitting machine and splitting process |
-
2016
- 2016-09-26 CN CN201621078094.5U patent/CN206022343U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298652A (en) * | 2016-09-26 | 2017-01-04 | 华朔工业自动化设备无锡有限公司 | Full-automatic silicon wafer breaking machine |
| CN106298652B (en) * | 2016-09-26 | 2018-08-03 | 华朔工业自动化设备无锡有限公司 | Full-automatic silicon wafer breaking machine |
| CN114851411A (en) * | 2022-06-02 | 2022-08-05 | 深圳市光道激光技术有限公司 | Brittle plate splitting machine and splitting process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170315 Termination date: 20210926 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |