CN206001968U - Collector allotter, heat exchanger and air-conditioning device - Google Patents
Collector allotter, heat exchanger and air-conditioning device Download PDFInfo
- Publication number
- CN206001968U CN206001968U CN201490001354.1U CN201490001354U CN206001968U CN 206001968 U CN206001968 U CN 206001968U CN 201490001354 U CN201490001354 U CN 201490001354U CN 206001968 U CN206001968 U CN 206001968U
- Authority
- CN
- China
- Prior art keywords
- peristome
- flow path
- solder
- area
- collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004378 air conditioning Methods 0.000 title claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 146
- 238000000576 coating method Methods 0.000 claims abstract description 146
- 229910000679 solder Inorganic materials 0.000 claims abstract description 143
- 238000009826 distribution Methods 0.000 claims description 56
- 230000002093 peripheral effect Effects 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 44
- 238000005452 bending Methods 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 15
- 238000003780 insertion Methods 0.000 description 19
- 230000037431 insertion Effects 0.000 description 19
- 238000002844 melting Methods 0.000 description 17
- 230000008018 melting Effects 0.000 description 17
- 239000003507 refrigerant Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000005057 refrigeration Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000006200 vaporizer Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/04—Arrangements for sealing elements into header boxes or end plates
- F28F9/16—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling
- F28F9/18—Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
Abstract
This utility model provides collector allotter, heat exchanger and air-conditioning device, and collector allotter (2) possesses plate body (11), and this plate body has：Uncoated part (12_1～12_5), they form first flow path, are formed with first area at least a portion of outer surface, and this first area is region and the region for having the first peristome of end as first flow path of uncoated solder；Coating member (13_1～13_4), they form second flow path, it is formed with second area at least a portion of outer surface, this first area is region and the region for having the second peristome of end as second flow path being coated with solder, solder bonds are passed through with the second area of coating member (13_1～13_4) in the first area of uncoated part (12_1～12_5), thus first flow path is coupled together with second flow path, solder is coated in the second area in the way of becoming the big state of the aperture area of open area ratio first peristome of the peristome of solder of the second peristome.
Description
Technical field
This utility model is related to collector allotter, heat exchanger and air-conditioning device.
Background technology
As conventional collector allotter, possesses plate body, this plate body has：Uncoated part, it forms first flow path
And in the uncoated solder of outer surface；Coating member, it forms second flow path simultaneously has solder in outer surface-coated, and uncoated part with
Coating member is engaged by solder, thus first flow path and second flow path are coupled together (for example, referring to patent documentation 1).
Patent documentation 1：Japanese Unexamined Patent Publication 2008-249241 publication ([0021]～[0029] section, Fig. 2～Fig. 7)
In conventional collector allotter, solder-coated being not inserted into stream between uncoated part and coating member is managed
The periphery in region till, therefore in melt solder, this solder is flowed into the region being not inserted into pipe in stream, makes this region
Flow path shape uneven, thus leading to the uniformity of fluid distribution to reduce, and exist lead in fluid produce pressure damage
Lose and increase such problem.Further, since the region of the pipe insertion to stream for the solder-coated at the surface of coating member and the back side
Periphery, therefore in melt solder, this solder penetrate into stream in pipe insertion region and pipe between gap and reach pipe
End, thus the region being not inserted into pipe being flowed in stream, make the flow path shape in this region become uneven, lead to fluid
The uniformity of distribution reduces, and there is a problem of leading to the pressure loss producing in fluid to increase.
Utility model content
This utility model be with problem as described above by background made it is therefore intended that being improved fluid distribution
The collector allotter of the pressure loss producing in uniformity, minimizing fluid.In addition, this utility model purpose is to obtain possessing that
The heat exchanger of the collector allotter of sample.In addition, the purpose of this utility model is the sky obtaining possessing such heat exchanger
Adjust device.In addition, the purpose of this utility model is to be improved the uniformity of fluid distribution, reduces the pressure producing in fluid
The manufacture method of the collector allotter of loss.
Collector allotter of the present utility model, has the distribution stream being two by the divided fluid stream of inflow, described collector
Allotter is characterised by, possesses plate body, and this plate body has：Uncoated part, it forms first flow path, and is formed with first
Region, this first area is the region of first peristome with the end as described first flow path；And coating member, its shape
Become second flow path, and be formed with second area, this second area is second opening with the end as described second flow path
The region in portion, the described first area of described uncoated part is engaged by solder with the described second area of described coating member,
Thus couple together described first flow path with described second flow path, by described first flow path and the described second of described connection
Road constitutes a part for described distribution stream, is coated with described solder to become following condition mode in described second area,
I.e.：Make the aperture area of the part of uncoated described solder that described second peristome comprised that is, the peristome of described solder
Bigger than the aperture area of described first peristome.
It is preferably, be formed with jut in the described first area of described uncoated part, described first peristome is formed at
Described jut, described jut is prominent to the inner side of described second flow path.
The distribution stream that it is two by the divided fluid stream of inflow that collector allotter of the present utility model has, described collector divides
Orchestration is characterised by, possesses plate body, and this plate body has：Uncoated part, it forms first flow path, and is formed with the firstth area
Domain, this first area is the region of first peristome with the end as described first flow path；And coating member, its formation
Second flow path, and it is formed with second area, this second area is second peristome with the end as described second flow path
Region, the described first area of described uncoated part engaged by solder with the described second area of described coating member, from
And described first flow path and described second flow path are coupled together, by described first flow path and the described second flow path of described connection
Constitute a part for described distribution stream, be formed with jut in the described first area of described uncoated part, described first opens
Oral area is formed at described jut, and described jut is prominent to the inner side of described second flow path.
Preferably, in the state of before described melt solder, in outer peripheral face and the described second flow path of described jut
It is formed with gap between inner peripheral surface.
It is preferably, described gap is the gap that the root closer to described jut more narrows.
It is preferably, the projecting height of described jut is below the thickness of slab of described coating member.
Be preferably, described solder being coated in the way of becoming following state in described second area, that is,：Make described second
The peristome of the base material of described coating member of the second peristome described in the open area ratio of the peristome of this solder of peristome
Aperture area is big.
Be preferably, described solder being coated in the way of becoming following state in described second area, that is,：Make this solder
The surface of the base material than described coating member for the surface is close to described first area.
Be preferably, described solder being coated in the way of becoming following state in described second area, that is,：Make described second
In peristome close to described coating member periphery region this solder peristome inner peripheral surface and described coating member base material
The inner peripheral surface of peristome between the width of the exposed division of this base material that formed, than in described second peristome away from described bag
This width covering the region of the periphery of part is little.
It is preferably, described second peristome is the shape with bending section, described solder is to become in described second area
Mode for following state coats, that is,：Make the opening of this solder close to the region of described bending section in described second peristome
The width of the exposed division of this base material being formed between the inner peripheral surface of the peristome of the base material of the inner peripheral surface in portion and described coating member,
Less away from this width in the region of described bending section than in described second peristome.
It is preferably, be formed with multiple described second peristomes in a described coating member, described solder is in described secondth area
Coated in the way of becoming following state in domain, that is,：Make in described second peristome close to the region of other the second peristomes
This base material being formed between the inner peripheral surface of the peristome of the base material of the inner peripheral surface of the peristome of this solder and described coating member
The width of exposed division is less away from this width in the region of other the second peristomes than in described second peristome.
Be preferably, described solder being coated in the way of becoming following state in described second area, that is,：Make this solder
Thickness is less than the 30% of the thickness of slab of the base material of described coating member.
Heat exchanger of the present utility model, possesses：Collector allotter described in any of the above-described；And heat-transfer pipe, its connection
In plate body.
Air-conditioning device of the present utility model, possesses above-mentioned heat exchanger.
For collector allotter of the present utility model, solder is in second area to become the weldering making the second peristome
The mode of the big state of aperture area of open area ratio first peristome of peristome of material coats.Therefore suppress the weldering melting
Stream enters region below, that is,：In stream be not inserted into pipe region, penetrate into stream in pipe insertion region and pipe between
Gap and reach the end of pipe, thus flowing into region being not inserted into pipe in stream etc., thus suppressing flow path shape uneven and leading
The uniformity causing fluid distribution reduces, leads to the pressure loss producing in fluid to increase etc..
Brief description
Fig. 1 is the figure of the structure of the heat exchanger representing embodiment 1.
Fig. 2 is the figure of the structure of collector allotter of the heat exchanger for embodiment 1 is described.
Fig. 3 is the figure of the structure of collector allotter of the heat exchanger for embodiment 1 is described.
Fig. 4 is the figure of the flowing of the cold-producing medium of collector allotter of the heat exchanger for embodiment 1 is described.
Fig. 5 is the details with the junction surface of coating member for the uncoated part of the heat exchanger for embodiment 1 is described
Figure.
Fig. 6 is the junction surface with coating member for the uncoated part of the variation -1 of the heat exchanger for embodiment 1 is described
Details figure.
Fig. 7 is the junction surface with coating member for the uncoated part of the variation -1 of the heat exchanger for embodiment 1 is described
Details figure.
Fig. 8 is the figure of the structure of collector allotter of the variation -2 of the heat exchanger for embodiment 1 is described.
Fig. 9 is the figure of the structure of the air-conditioning device of the heat exchanger representing application implementation mode 1.
Figure 10 is the figure of the structure of collector allotter of the heat exchanger for embodiment 2 is described.
Figure 11 is the figure of the structure of collector allotter of the heat exchanger for embodiment 2 is described.
Figure 12 is the figure of the flowing of the cold-producing medium of collector allotter of the heat exchanger for embodiment 2 is described.
Figure 13 is the details with the junction surface of coating member for the uncoated part of the heat exchanger for embodiment 2 is described
Figure.
Figure 14 is the details with the junction surface of coating member for the uncoated part of the heat exchanger for embodiment 2 is described
Figure.
Figure 15 is the junction surface with coating member for the uncoated part of the variation -1 of the heat exchanger for embodiment 2 is described
Details figure.
Figure 16 is the figure of the structure of collector allotter of the variation -2 of the heat exchanger for embodiment 2 is described.
Figure 17 is the junction surface with coating member for the uncoated part of the variation -3 of the heat exchanger for embodiment 2 is described
Details figure.
Specific embodiment
Hereinafter, using accompanying drawing, collector allotter of the present utility model is illustrated.
In addition, the following feelings illustrating that collector allotter of the present utility model is applied to the heat exchanger for cold-producing medium inflow
Condition, but collector allotter of the present utility model can also be applied to the other equipment flowing into for other fluids.In addition, following explanation
Structure, an only example such as action, be not limited to such structure, action etc..In addition in the various figures, to identical or
Similar part mark identical reference or omission mark reference.In addition, the construction for details is suitably simple
Change or omit diagram.In addition, suitably simplifying for the explanation repeating or be similar to or omitting.
Embodiment 1
The heat exchanger of embodiment 1 is illustrated.
Structure ＞ of ＜ heat exchanger
Hereinafter, the structure of the heat exchanger of embodiment 1 is illustrated.
Fig. 1 is the figure of the structure of the heat exchanger representing embodiment 1.In addition, below Fig. 1 represents refrigeration with filled arrows
The flow direction of agent.
As shown in figure 1, heat exchanger 1 has：Collector allotter 2, collector 3, multiple heat-transfer pipe 4 and multiple fin 5.Separately
Outward, collector 3 can be the collector same with collector allotter 2, in addition can also be the collector of different types.
Distribute stream 2a in being internally formed of collector allotter 2.Connect cold-producing medium in the inflow side of distribution stream 2a to join
Pipe.Connect multiple heat-transfer pipes 4 in the outflow side of distribution stream 2a.Collaborate stream 3a in being internally formed of collector 3.In interflow stream
The inflow side of 3a connects multiple heat-transfer pipes 4.Connect refrigerant piping in the outflow side of interflow stream 3a.
Heat-transfer pipe 4 is pipe.Heat-transfer pipe 4 is, for example, aluminum.It is bonded to multiple fins 5 in heat-transfer pipe 4.Fin 5 is, for example,
Aluminum.Heat-transfer pipe 4 can also be soldered joint with the joint of fin 5.In addition, figure 1 illustrates the feelings that heat-transfer pipe 4 is eight
Condition, but it is not limited to such situation.
The flowing ＞ of the cold-producing medium of ＜ heat exchanger
Hereinafter, the flowing to the cold-producing medium of the heat exchanger of embodiment 1 illustrates.
Flow into collector allotter 2 in the cold-producing medium of refrigerant piping flowing and distribute in distribution stream 2a, and flow out at most
Individual heat-transfer pipe 4.Cold-producing medium for example carries out heat exchange with the air supplying by fan etc. in multiple heat-transfer pipes 4.In multiple biographies
The cold-producing medium of heat pipe 4 flowing flows into the interflow stream 3a of collector 3 and collaborates, and flows out to refrigerant piping.Cold-producing medium can be inverse
Stream.
Structure ＞ of ＜ collector allotter
Hereinafter, the structure of the collector allotter of the heat exchanger of embodiment 1 is illustrated.
Fig. 2 and Fig. 3 is the figure of the structure of collector allotter of the heat exchanger for embodiment 1 is described.In addition, figure
2 be collector allotter 2 is decomposed after in the state of axonometric chart.In addition, Fig. 3 is the state after decomposing collector allotter 2
Under with uncoated part 12_2～12_5 and coating member 13_1～13_4 as group, according to the axonometric chart of the situation of every group of description.
As shown in Fig. 2 collector allotter 2 possesses plate body 11.Plate body 11 passes through uncoated part 12_1～12_5
Alternately it is laminated and is formed with coating member 13_1～13_4.Hereinafter sometimes uncoated part 12_2～12_5 is referred to as and is recited as
Uncoated part 12.Hereinafter sometimes coating member 13_1～13_4 is referred to as and is recited as coating member 13.
Uncoated part 12_1 and uncoated part 12 are, for example, aluminum.To uncoated part 12_1 and uncoated part 12 not
Coated with solder.Can also be to a part of coated with solder of uncoated part 12_1 and uncoated part 12.In uncoated part 12_1
It is formed with the surface of insertion uncoated part 12_1 and first flow path 12a_1 at the back side.In uncoated each surface of part 12 (refrigeration
The face of the side that agent flows into) side is formed with jut 12b, is respectively formed with the top surface of insertion jut 12b in uncoated part 12
First flow path 12a_2～12a_5 with the back side (face of the side that cold-producing medium flows out) of uncoated part 12.If uncoated part
12_1 and uncoated part 12 are laminated with coating member 13, then first flow path 12a_1～12a_5 is respectively as distribution stream 2a
A part of function.Hereinafter sometimes first flow path 12a_2～12a_5 is referred to as and is recited as first flow path 12a.
Coating member 13 is, for example, aluminum, and thinner than uncoated part 12_1 and uncoated part 12.In coating member 13 extremely
Few surface and backside coating solder.Solder can also be not coated by the part on the surface of coating member 13 and the back side.In coating member
13 surfaces being respectively formed with insertion coating member 13 and the second flow path 13a_1～13a_4 at the back side.If uncoated part 12_1
And uncoated part 12 is laminated with coating member 13, then second flow path 13a_1～13a_4 is respectively as one of distribution stream 2a
Divide function.Hereinafter sometimes second flow path 13a_1～13a_4 is referred to as and is recited as second flow path 13a.
It is connected with refrigerant piping in first flow path 12a_1 being formed at uncoated part 12_1.First flow path 12a_1
It is, for example, the through hole of toroidal.For example joint etc. can also be set in the face side of uncoated part 12_1, and via this joint
Deng connecting refrigerant piping, in addition, the inner peripheral surface of first flow path 12a_1 can also be the outer peripheral face along refrigerant piping
Shape, and it is directly connected to refrigerant piping not via joint etc. in first flow path 12a_1.
First flow path 12a_2～the 12a_4 being formed at uncoated part 12_2～12_4 is the insertion of Z-shaped respectively
Hole.The jut 12b being formed at uncoated part 12_2～12_4 is respectively along in first flow path 12a_2～12a_4
The projection of the shape of side face, i.e. Z-shaped.Jut 12b can also be not along first flow path 12a_2～12a_4 respectively
The projection of the shape of inner peripheral surface.Shape in the inner peripheral surface respectively along first flow path 12a_2～12a_4 for the jut 12b
Projection in the case of, uncoated part 12_2～12_4 can be made larger with the bond area of coating member 13_1～13_3.
It is formed at the second flow path 13a_1～13a_3 of coating member 13_1～13_3 respectively along being laminated in back surface side not
The through hole of the shape of the outer peripheral face of jut 12b of coating member 12, i.e. Z-shaped, and compared with the outer peripheral face of jut 12b
Relatively, great Yi Quan.
It is directly connected to heat-transfer pipe 4 in first flow path 12a_5 being formed at uncoated part 12_5.First flow path 12a_5 is
Through hole along the shape of the outer peripheral face of heat-transfer pipe 4, i.e. toroidal.The jut 12b being formed at uncoated part 12_5 is edge
The shape of the inner peripheral surface of first flow path 12a_5, the i.e. projection of toroidal.Jut 12b can also be not along first flow path
The projection of the shape of the inner peripheral surface of 12a_5.It is the projection of the shape of the inner peripheral surface along first flow path 12a_5 in jut 12b
In the case of, uncoated part 12_5 can be made larger with the bond area of coating member 13_4.It is formed at the second of coating member 13_4
Stream 13a_4 is the through hole of the shape of the outer peripheral face of the jut 12b along uncoated part 12_5, i.e. toroidal, and with
The outer peripheral face of jut 12b compares, great Yi Quan.Can also change uncoated according to the insertion of required heat-transfer pipe 4
The thickness of part 12_5 and coating member 13_4 and at least one party of quantity.Alternatively, it is also possible to according to required heat-transfer pipe 4
Insertion, to change the internal diameter of internal diameter, the external diameter of jut 12b and second flow path 13a_4 of first flow path 12a_5
At least one.
If as shown in figure 3, uncoated part 12_1 and uncoated part 12 are laminated with coating member 13, jut 12b inserts
To the inner side of second flow path 13a_1～13a_4, thus first flow path 12a_1～12a_5 connection.
The flowing ＞ of cold-producing medium in ＜ collector allotter
Hereinafter, the flowing to the cold-producing medium of the collector allotter of the heat exchanger of embodiment 1 illustrates.
Fig. 4 is the figure of the flowing of the cold-producing medium of collector allotter of the heat exchanger for embodiment 1 is described.In addition,
Fig. 4 is the figure after launching the axonometric chart shown in Fig. 3.
As shown in figure 4, be flowed into the cold-producing medium of first flow path 12a_1 from refrigerant piping, flow into first flow path 12a_2
Center.The cold-producing medium being flowed into the center of first flow path 12a_2 collides the surface of coating member 13_2 and shunts, and from first-class
The top of road 12a_2 and the center of bottom inflow first flow path 12a_3.Equally, it is flowed into the center of first flow path 12a_3
Cold-producing medium collides the surface of coating member 13_3 and shunts, and the top from first flow path 12a_3 and bottom flow into first-class
The center of road 12a_4.Equally, the cold-producing medium being flowed into the center of first flow path 12a_4 collides the surface with coating member 13_4
And shunt, and the top from first flow path 12a_4 and bottom flow into heat-transfer pipe 4 via first flow path 12a_5.
In addition, first flow path 12a_2 shown in Fig. 2～Fig. 4～12a_4 is the situation of the through hole of Z-shaped, but collector
Allotter 2 is not limited to such situation.Such as first flow path 12a_2～12a_4 can also be the through hole of S shape.?
In the case that one stream 12a_2～12a_4 is the through hole of Z-shaped, cold-producing medium is in first flow path 12a_2～12a_4
The heart, the shunting of i.e. linear part, particularly in collector allotter 2 by cold-producing medium to not vertical with gravity direction direction distribution
In the case of etc., it is possible to increase the uniformity of cold-producing medium distribution.In addition, for example first flow path 12a_2～12a_4 can also be
The linear through hole parallel with gravity direction.It is the through hole of Z-shaped, S shape in first flow path 12a_2～12a_4
Through hole etc. in the case of, cold-producing medium is at the center of first flow path 12a_2～12a_4, i.e. not parallel with gravity direction
Part shunts, particularly in the case that cold-producing medium is distributed by collector allotter 2 to not vertical with gravity direction direction etc., carry
The uniformity of high cold-producing medium distribution.
In addition, distribution stream 2a shown in Fig. 2～Fig. 4 is repeated a number of times and for the cold-producing medium of inflow to split into two
Situation, but collector allotter 2 is not limited to such situation.For example distribution stream 2a can also only carry out the system that once will flow into
Cryogen splits into two or more, alternatively, it is also possible to be repeated a number of times, the cold-producing medium of inflow is split into more than three.In distribution
Stream 2a is repeated a number of times in the case that the cold-producing medium of inflow is split into two, it is possible to increase it is uniform that cold-producing medium distributes
Property.
In addition, distribution stream 2a shown in Fig. 1～Fig. 4 is by the situation of the cold-producing medium edgewise flowing into distribution, but collection
Pipe allotter 2 is not limited to such situation.For example, heat-transfer pipe 4 can also arrange multiple row, the refrigeration that distribution stream 2a will flow into
Agent edgewise and column direction distribution.First flow path 12a can and located at a uncoated part 12, in addition can also separate simultaneously
Located at multiple uncoated parts 12.In addition, second flow path 13a can and located at a coating member 13, in addition can also separate and set
In multiple coating members 13.
The details ＞ at the junction surface of the uncoated part of ＜ and coating member
Hereinafter, the uncoated part of heat exchanger and the details at the junction surface of coating member of embodiment 1 is said
Bright.
Fig. 5 is the details with the junction surface of coating member for the uncoated part of the heat exchanger for embodiment 1 is described
Figure.In addition, Fig. 5 is the A1-A1 line of Fig. 3, the sectional view of B1-B1 line, B2-B2 line and B3-B3 line.Collector allotter 2 is not
It is defined in the situation of the section all as shown in Figure 5 of A1-A1 line, B1-B1 line, B2-B2 line and B3-B3 line of Fig. 3.Separately
Outward, Fig. 5 illustrates the state before solder 13c melting.
As shown in figure 5, in the region of the uncoated solder of uncoated part 12 that is, first area 12r formed jut 12b.
Form first flow path 12a in the way of the back side of the top surface 12c of insertion jut 12b and uncoated part 12, in top surface 12c side shape
Become the first peristome 12o.In addition, in the region that is, the second area 13r that are coated with solder 13c of coating member 13, with insertion bag
The mode on the surface and the back side of covering part 13 forms second flow path 13a, forms the second peristome 13o in the rear side of coating member 13.
Second peristome 13o includes：The peristome 13oc of the peristome 13ob of the base material 13b of coating member 13 and solder 13c.Can also
It is coated with solder 13c in the inner peripheral surface of second flow path 13a.
The thickness of slab of uncoated part 12 is set to T1, the thickness of slab of coating member 13 is set to T2, by the base material 13b's of coating member 13
Thickness of slab is set to T2b, and the thickness being coated on the solder 13c of base material 13b is set to T2c, will be formed in the jut of uncoated part 12
The projecting height of 12b is set to H0, and the external diameter that will be formed in the jut 12b of uncoated part 12_5 is set to D0, will be formed in not wrapping
The width covering the jut 12b of part 12_2～12_4 is set to W0, will be formed in first flow path 12a_5 of uncoated part 12_5
Internal diameter be set to D1, the width that will be formed in the first flow path 12a_2～12a_4 of uncoated part 12_2～12_4 is set to
W1, the internal diameter that will be formed in second flow path 13a_4 of coating member 13_4 is set to D2, will be formed in coating member 13_1～13_3
The width of second flow path 13a_1～13a_3 be set to W2.
In order to reduce the usage amount of solder 13c, and guarantee the cementability of first area 12r and second area 13r, solder
13c coats in the way of thickness T2c becomes less than the 30% of thickness of slab T2b.
To be attached in order to heat-transfer pipe 4 is inserted in first flow path 12a_5, first flow path 12a_5 is formed as internal diameter
D1 is bigger than the external diameter of heat-transfer pipe 4.
When uncoated part 12 is with coating member 13 stacking, in order that jut 12b becomes the interior pleurapophysis to second flow path 13a
The state going out, second flow path 13a is formed as the outer diameter D 0 that internal diameter D2 or width W2 are than jut 12b or width W0 is big.That is,
In the state of before solder 13c melting first area 12r is engaged with second area 13r, it is coated on the rear side of coating member 13
Solder 13c so that open area ratio the first peristome 12o's of the peristome 13oc of the solder 13c of the second peristome 13o opens
The big mode of open area coats.Therefore when the solder 13c of the rear side being coated on coating member 13 melts, in the second peristome
It is folded with the wall of jut 12b between the peristome 13oc of the solder 13c of 13o and the first peristome 12o.
In addition, being similarly coated on the solder 13c of the face side of coating member 13 so that the opening surface of the peristome of solder 13c
The big mode of the long-pending aperture area than the first peristome 12o coats.In addition, the open area ratio layer with the peristome of solder 13c
It is laminated on the uncoated part 12_1 of the face side of coating member 13 and the aperture area of the peristome of rear side of uncoated part 12 is big
Mode coat.Even if therefore when the solder 13c of the face side being coated on coating member 13 melts, in the peristome of solder 13c
Also it is folded with wall of jut 12b etc. and the first peristome 12o between.In addition, solder 13c peristome be laminated in bag
Cover between uncoated part 12_1 and the peristome of rear side of uncoated part 12 of the face side of part 13, be folded with jut
Wall of 12b etc..The peristome being coated on the solder 13c of the face side of coating member 13 also corresponds to of the present utility model " second
The peristome of the solder of peristome ".In addition, being laminated in the uncoated part 12_1 of the face side of coating member 13 and uncoated part
The peristome of 12 rear side, also corresponds to " the first peristome " of the present utility model.
In order that coating member 13 and the uncoated part 12_1 being laminated in this coating member 13 face side and uncoated part 12
Engage reliable, it is below thickness of slab T2 that jut 12b is formed as projecting height H0.
The effect ＞ of ＜ heat exchanger
Hereinafter, the effect to the heat exchanger of embodiment 1 illustrates.
State in collector allotter 2, before solder 13c melting first area 12r is engaged with second area 13r
Under, solder 13c is with the opening of open area ratio the first peristome 12o of the peristome 13oc of the solder 13c of the second peristome 13o
The big mode of area coats.Therefore when solder 13c melts, in the peristome 13oc and of the solder 13c of the second peristome 13o
It is folded with the wall of jut 12b, thus suppressing the solder 13c melting to be flowed in distribution stream 2a between one peristome 12o
It is not inserted into the region of heat-transfer pipe 4 and be flowed between the region that in infiltration distribution stream 2a, heat-transfer pipe 4 inserts and heat-transfer pipe 4
Gap and reach the end of heat-transfer pipe 4, thus be flowed into distribution stream 2a in be not inserted into region of heat-transfer pipe 4 etc., therefore pressing down
The situation that the flow path shape of system distribution stream 2a is uneven and leads to the uniformity of cold-producing medium distribution to reduce.In addition, suppression refrigeration
The pressure loss producing in agent increases.
Further, since being that solder 13c is difficult to invade the construction of distribution stream 2a, therefore make the uncoated of collector allotter 2
Part 12_1 and uncoated part 12 are reliable with the joint of coating member 13, thus improving the reliability of collector allotter 2.In addition, by
Then solder 13c is difficult to invade the construction of distribution stream 2a, and therefore suppression solder 13c flows into heat-transfer pipe 4, thus suppressing heat-transfer pipe
4 flow path shape uneven and lead to heat exchanger 1 heat exchanger effectiveness reduce, suppress in cold-producing medium produce the pressure loss increase
Plus etc..In addition, other means that heat-transfer pipe 4 is flowed into using suppression solder 13c, the passage blockage of suppression heat-transfer pipe 4 can be reduced
Necessity, thus cutting down manufacturing cost etc..
In addition, in collector allotter 2, distribution stream 2a pass through to be formed with partial flowpafh (first flow path 12a_1 with
And first flow path 12a, second flow path 13a) sheet material (uncoated part 12_1 and uncoated part 12, coating member 13) stacking and
Formed.Therefore regardless of whether dividing for the uniformity improving cold-producing medium distribution, the collector reducing the pressure loss producing in cold-producing medium
Orchestration 2, all can simply realize the change of the porthole bridge of the partial flowpafh of cold-producing medium by the shape of changing section stream,
That is, the thickness of collector allotter 2 can be simply changed, therefore improve the versatility of collector allotter 2.In addition, regardless of whether
For improving the uniformity of cold-producing medium distribution, reducing the collector allotter 2 of the pressure loss producing in cold-producing medium, all can be by increasing
Subtract the quantity of sheet material and simply realize the change of the distribution number of collector allotter 2, therefore improve the general of collector allotter 2
Property.In addition, regardless of whether for improve cold-producing medium distribution uniformity, reduce cold-producing medium in produce the pressure loss collector distribution
Device 2, all can simply realize the change of the insertion of heat-transfer pipe 4 by the quantity of increase and decrease sheet material or thickness, therefore make
The joint of heat-transfer pipe 4 is reliable, thus improving the reliability of heat exchanger 1.
In addition, in collector allotter 2, distribution stream 2a passes through to be formed with hole (first flow path 12a_1 and first
Stream 12a, second flow path 13a) sheet material (uncoated part 12_1 and uncoated part 12, coating member 13) stacking and formed.Cause
This regardless of whether for improve cold-producing medium distribution uniformity, reduce cold-producing medium in produce the pressure loss collector allotter 2, all
Can simply realize making complex-shapedization of partial flowpafh by changing the shape in hole, thus improving collector distribution further
The uniformity of the cold-producing medium distribution in device 2, therefore improves the versatility of collector allotter 2.
＜ variation -1 ＞
Fig. 6 and Fig. 7 is uncoated part and the coating member of the variation -1 of the heat exchanger for embodiment 1 is described
The figure of the details at junction surface.In addition, Fig. 6 and Fig. 7 is A1-A1 line in Fig. 3, B1-B1 line, B2-B2 line and B3-B3
The sectional view of line.Collector allotter 2 is not limited to all of A1-A1 line, B1-B1 line, B2-B2 line and the B3-B3 line of Fig. 3
The situation of the section shown in Fig. 6 and Fig. 7.In addition, Fig. 6 and Fig. 7 illustrates the state before solder 13c melting.
As shown in fig. 6, in the state of before solder 13c melting, solder 13c is with the outer peripheral face and second in jut 12b
The mode forming gap S between the inner peripheral surface of stream 13a coats.Gap S plays work(as the relief area of the solder 13c spilling
Energy.By being formed with gap S, the solder 13c being coated on around distribution stream 2a is made to reduce, thus suppressing solder 13c further
Invade distribution stream 2a.In addition being formed in gap S has the leg of solder 13c, improves the joint of uncoated part 12 and coating member 13
Reliability.In addition, the width of gap S can set according to the amount of solder 13c, material etc..In the excessive feelings of the width of gap S
Under condition, the uncoated part 12 of distribution stream 2a periphery is not enough with the cementability of coating member 13, can be therefore gap S≤2mm.
In addition, as shown in fig. 7, solder 13c melting before in the state of, solder 13c with jut 12b outer peripheral face with
Form the mode the closer to the narrower gap S of the root of jut 12b between the inner peripheral surface of second flow path 13a to coat.By this
Sample is constituted, and makes to form leg reliability, the reliability that uncoated part 12 is engaged with coating member 13 around the root of jut 12b
Improve further.In addition, gap S can also be the root the closer to jut 12b, the gap that the amount narrowing more slowly reduces.
Constituted by such, make formation leg around the root of jut 12b become further reliability, uncoated part 12 and coating member
The reliability of 13 joints improves further.
The situation of the fitting portion beyond collector allotter 2 is formed with the fitting portion that jut 12b is with second flow path 13a
Down it is also possible to form the gap S shown in Fig. 6 and Fig. 7 in this fitting portion.Even if in this case, also improve uncoated
The reliability that part 12 is engaged with coating member 13.
＜ variation -2 ＞
Fig. 8 is the figure of the structure of collector allotter of the variation -2 of the heat exchanger for embodiment 1 is described.Separately
Outward, Fig. 8 be collector allotter 2 is decomposed after in the state of axonometric chart.
As shown in figure 8, heat-transfer pipe 4 is the flat tube that multiple streams are internally formed as column-shaped.In this case,
The inner peripheral surface of first flow path 12a_5 that is formed at uncoated part 12_5, the jut 12b that is formed at uncoated part 12_5
The inner peripheral surface of outer peripheral face and second flow path 13a_4 being formed at coating member 13_4 becomes flat.
In collector allotter 2, distribution stream 2a passes through to be formed with hole (first flow path 12a_1 and first flow path
12a, second flow path 13a) sheet material (uncoated part 12_1 and uncoated part 12, coating member 13) stacking and formed.Therefore no
By whether being the uniformity improving cold-producing medium distribution, the collector allotter 2 reducing the pressure loss producing in cold-producing medium, by hole
The change of shape all can simply realize the complex-shaped heat-transfer pipe 4 using outer peripheral face.In addition, employing outer peripheral face
Multiple heat exchangers 1 of variform heat-transfer pipe 4 in, can make a part of part (uncoated part 12_1～12_4 with
And coating member 13_1～13_3) common, thus cutting down manufacturing cost.
Occupation mode ＞ of ＜ heat exchanger
Hereinafter, an example of the occupation mode of the heat exchanger of embodiment 1 is illustrated.
In addition, the situation that the following heat exchanger to embodiment 1 is used for air-conditioning device illustrates, but it is not limited to this
The situation of sample, the heat exchanger of embodiment 1 for example can be used for other kind of refrigeration cycle dress with refrigerant circulation loop
Put.In addition, being that the situation that cooling operation and heating operation are switched over illustrates to air-conditioning device, but it is not limited to so
Situation or air-conditioning device only carry out cooling operation or heating operation.
Fig. 9 is the figure of the structure of the air-conditioning device representing that the heat exchanger of embodiment 1 is applied.In addition, with fact in Fig. 9
The arrow of line illustrates the flow direction of cold-producing medium during cooling operation, illustrates the flowing of cold-producing medium during heating operation with the arrow of dotted line
Direction.
As shown in figure 9, air-conditioning device 51 has：Compressor 52, cross valve 53, heat source side heat exchanger 54, throttling arrangement
55th, load-side heat exchanger 56, heat source side fan 57, load-side fan 58 and control device 59.Compressor 52, cross valve
53rd, heat source side heat exchanger 54, throttling arrangement 55 and load-side heat exchanger 56 are connected by refrigerant piping, form refrigeration
Agent closed circuit.
For example it is connected with compressor 52, cross valve 53, throttling arrangement 55, heat source side fan 57, load in control device 59
Crosswind fans 58 and various sensor etc..Switch the stream of cross valve 53 by control device 59, thus switching cooling operation
With heating operation.Heat source side heat exchanger 54 plays a role as condenser in cooling operation, in heating operation as steaming
Send out device to play a role.Load-side heat exchanger 56 plays a role as vaporizer in cooling operation, the conduct in heating operation
Condenser plays a role.
Flowing to cold-producing medium during cooling operation illustrates.
The cold-producing medium of the gaseous state of the high pressure-temperature discharged from compressor 52, flows into heat source side heat via cross valve 53
Exchanger 54, is condensed by the heat exchange with the extraneous air being supplied by heat source side fan 57, thus becoming the liquid of high pressure
The cold-producing medium of state, and flow out from heat source side heat exchanger 54.The liquid condition of the high pressure flowing out from heat source side heat exchanger 54
Cold-producing medium flow throttling device 55, become the cold-producing medium of the gas-liquid two-phase state of low pressure.The low pressure flowing out from throttling arrangement 55
Gas-liquid two-phase state cold-producing medium flow into load-side heat exchanger 56, and by with the Interior Space being supplied by load-side fan 58
The heat exchange of gas and evaporate, thus becoming the cold-producing medium of the gaseous state of low pressure, and flow out from load-side heat exchanger 56.From negative
The cold-producing medium carrying the gaseous state of low pressure of side heat exchanger 56 outflow is sucked by compressor 52 via cross valve 53.
Flowing to cold-producing medium during heating operation illustrates.
The cold-producing medium of the gaseous state of the high pressure-temperature discharged from compressor 52 flows into load-side heat via cross valve 53
Exchanger 56, is condensed by the heat exchange with the room air being supplied by load-side fan 58, thus becoming the liquid of high pressure
The cold-producing medium of state, and flow out from load-side heat exchanger 56.The liquid condition of the high pressure flowing out from load-side heat exchanger 56
Cold-producing medium flow throttling device 55, become the cold-producing medium of the gas-liquid two-phase state of low pressure.The low pressure flowing out from throttling arrangement 55
The cold-producing medium of gas-liquid two-phase state flow into heat source side heat exchanger 54, and by outside empty with supplied by heat source side fan 57
The heat exchange of gas and evaporate, thus becoming the cold-producing medium of the gaseous state of low pressure, and flow out from heat source side heat exchanger 54.From heat
The cold-producing medium of the gaseous state of low pressure that source heat exchanger 54 flows out is sucked by compressor 52 via cross valve 53.
At least one party of heat source side heat exchanger 54 and load-side heat exchanger 56 uses heat exchanger 1.Heat exchanger 1
So that when heat exchanger 1 plays a role as vaporizer, cold-producing medium flows into from collector allotter 2 and cold-producing medium flows out from collector 3
Mode connect.That is, when heat exchanger 1 plays a role as vaporizer, the cold-producing medium of gas-liquid two-phase state is joined from cold-producing medium
Pipe flow enters collector allotter 2, and the cold-producing medium of gaseous state flows into collector 3 from heat-transfer pipe 4.In addition, in heat exchanger 1 as cold
When condenser plays a role, the cold-producing medium of gaseous state flows into collector 3 from refrigerant piping, and the cold-producing medium of liquid condition is from heat-transfer pipe
4 inflow collector allotters 2.
Collector allotter 2 is the structure of the uniformity improving cold-producing medium distribution, even if being therefore relatively difficult to uniformly distribute
The cold-producing medium of gas-liquid two-phase state flow into it is also possible to make to flow out to respectively the flow of cold-producing medium of multiple heat-transfer pipes 4 and dry
Dry degree is uniformly.That is, collector allotter 2 is applied to refrigerating circulatory device as air-conditioning device 51.
Embodiment 2
The heat exchanger of embodiment 2 is illustrated.
In addition, repeating with embodiment 1 or similar explanation suitably simplifies or omits.
Structure ＞ of ＜ collector allotter
Hereinafter, the structure of the collector allotter of the heat exchanger of embodiment 2 is illustrated.
Figure 10 and Figure 11 is the figure of the structure of collector allotter of the heat exchanger for embodiment 2 is described.In addition,
Figure 10 is the axonometric chart of the state after decomposing collector allotter 2.In addition, Figure 11 is the state after decomposing collector allotter 2
Lower is group by uncoated part 12_2～12_5 and coating member 13_1～13_4, according to the axonometric chart of the situation of every group of description.
As shown in Figure 10, it is formed with the surface of insertion uncoated part 12_1 and the first-class of the back side in uncoated part 12_1
Road 12a_1.Do not form jut 12b in each uncoated part 12, but form the surface of the uncoated part of insertion 12 and the back side
First flow path 12a.In addition, being formed with the surface of insertion coating member 13 and second flow path 13a at the back side in each coating member 13.
First flow path 12a_2～the 12a_4 being formed at uncoated part 12_2～12_4 is the insertion of Z-shaped respectively
Hole.It is formed at the second flow path 13a_1～13a_3 of coating member 13_1～13_3, respectively along being formed at overleaf side
The uncoated part 12_2～shape of the inner peripheral surface of first flow path 12a_2～12a_4 of 12_4 of stacking, i.e. the passing through of Z-shaped
Through hole, and be the size almost equal with this inner peripheral surface.
First flow path 12a_5 being formed at uncoated part 12_5 is the shape of the outer peripheral face along heat-transfer pipe 4, that is, circular
The through hole of shape.Second flow path 13a_4 being formed at coating member 13_4 is along being formed at the first-class of uncoated part 12_5
The through hole of the shape of the inner peripheral surface of road 12a_5, i.e. toroidal, and be the size almost equal with this inner peripheral surface.
As shown in figure 11, if uncoated part 12_1 and uncoated part 12 are laminated with coating member 13, first flow path
12a_1～12a_5 is connected with second flow path 13a_1～13a_4.
The flowing ＞ of cold-producing medium in ＜ collector allotter
Hereinafter, the flowing to the cold-producing medium of the collector allotter of the heat exchanger of embodiment 2 illustrates.
Figure 12 be the heat exchanger for embodiment 2 is described collector allotter in cold-producing medium flowing figure.In addition,
Figure 12 is the figure after launching the axonometric chart shown in Figure 11.
As shown in figure 12, it is flowed into the cold-producing medium of first flow path 12a_1 from refrigerant piping, flow into first flow path 12a_
2 and the center of second flow path 13a_1.It is flowed into the refrigeration at the center of first flow path 12a_2 and second flow path 13a_1
Agent is shunted with the surface collision of coating member 13_2, from the top of first flow path 12a_2 and second flow path 13a_1 and
Bottom flows into the center of first flow path 12a_3 and second flow path 13a_2.Equally, be flowed into first flow path 12a_3 and
The cold-producing medium at the center of second flow path 13a_2 is shunted with the surface collision of coating member 13_3, from first flow path 12a_3 with
And the top of second flow path 13a_2 and the center of bottom inflow first flow path 12a_4 and second flow path 13a_3.With
Sample, is flowed into the cold-producing medium at center of first flow path 12a_4 and second flow path 13a_3 and the surface of coating member 13_4 is touched
Hit and shunt, from the top of first flow path 12a_4 and second flow path 13a_3 and bottom via first flow path 12a_5 with
And second flow path 13a_4, flow into heat-transfer pipe 4.
The details ＞ at the junction surface of the uncoated part of ＜ and coating member
Hereinafter, the uncoated part of heat exchanger and the details at the junction surface of coating member of embodiment 2 is said
Bright.
Figure 13 and Figure 14 is the junction surface with coating member for the uncoated part of the heat exchanger for embodiment 2 is described
The figure of details.In addition, Figure 13 is the A1-A1 line of Figure 11, the sectional view of B1-B1 line, B2-B2 line and B3-B3 line.Collector
Allotter 2 is not limited to the section shown in all Figure 13 of A1-A1 line, B1-B1 line, B2-B2 line and the B3-B3 line of Figure 11
Situation.In addition, Figure 13 illustrates the state before solder 13c melting.In addition, Figure 14 illustrates the exposed division 13d's of coating member 13_3
One example of manufacturing process.An example for the manufacturing process of the exposed division 13d of coating member 13_1,13_2,13_4
Similarly.
As shown in figure 13, in region that is, the first area 12r of the uncoated solder of uncoated part 12, uncoated with insertion
The mode at the surface of part 12 and the back side forms first flow path 12a, and the face side in uncoated part 12 forms the first peristome
12o.In addition in the region that is, the second area 13r that are coated with solder 13c of coating member 13, with the surface of insertion coating member 13 and
The mode at the back side forms second flow path 13a, and the rear side in coating member 13 forms the second peristome 13o.Second peristome 13o
Including：The peristome 13oc of the peristome 13ob of the base material 13b of coating member 13 and solder 13c.
The thickness of slab of uncoated part 12 is set to T1, the thickness of slab of coating member 13 is set to T2, by the base material 13b's of coating member 13
Thickness of slab is set to T2b, and the wall thickness being coated on the solder 13c of base material 13b is set to T2c, will be formed in the first of uncoated part 12_5
The internal diameter of stream 12a_5 is set to D1, will be formed in the first flow path 12a_2～12a_4's of uncoated part 12_2～12_4
Width is set to W1, and the internal diameter that will be formed in second flow path 13a_4 of base material 13b of coating member 13_4 is set to D2b, will be formed in
The internal diameter of second flow path 13a_4 of solder 13c of coating member 13_4 is set to D2c, will be formed in coating member 13_1～13_3
The width of the second flow path 13a_1～13a_3 of base material 13b be set to W2b, will be formed in the weldering of coating member 13_1～13_3
The width of the second flow path 13a_1～13a_3 of material 13c is set to W2c.
In order to reduce the usage amount of solder 13c, and guarantee the cementability of first area 12r and second area 13r, solder
Less than 30% mode with wall thickness T2c for thickness of slab T2b for the 13c coats.
Coating member 13 with the state of before solder 13c melting, internal diameter D2c or width W2c be formed as than internal diameter D2b or
Person width W2b is big.That is, in the state of before solder 13c melting makes first area 12r engage with second area 13r, it is coated on
The solder 13c of the rear side of coating member 13 coats, that is, as follows：Make the peristome of the solder 13c of the second peristome 13
The aperture area of open area ratio the first peristome 12o of 13oc is big, and makes the opening of the solder 13c of the second peristome 13o
The aperture area of the peristome 13ob of base material 13b of open area ratio the second peristome 13o of portion 13oc is big.And, in solder
Between the inner peripheral surface of second flow path 13a of the inner peripheral surface of second flow path 13a of 13c and base material 13b, it is formed with the dew of base material 13b
Go out portion 13d, in second area 13r, compared with the surface of the exposed division 13d of base material 13b, the surface of solder 13c becomes close
The state of first area 12r.In the state of therefore before the solder 13c melting of the rear side being coated on coating member 13, second
Between the peristome 13oc of the solder 13c in peristome 13o and the first peristome 12o, it is folded with gap S.
In addition, similarly, the solder 13c being coated on the face side of coating member 13 coats, that is, as follows：Make solder
The open area ratio of the peristome of 13c is laminated in the uncoated part 12_1 of the face side of coating member 13 and uncoated part 12
The aperture area of the peristome of rear side is big, and make the peristome of open area ratio base material 13b of the peristome of solder 13c
Aperture area is big.Therefore when the solder 13c of the face side being coated on coating member 13 melts, in peristome and the layer of solder 13c
Between being laminated between the uncoated part 12_1 of the face side of coating member 13 and the peristome of rear side of uncoated part 12 being folded with
Gap S.Be coated on the peristome of the solder 13c of the face side of coating member 13, also correspond to of the present utility model " the second peristome
The peristome of solder ".In addition, being laminated in the uncoated part 12_1 of the face side of coating member 13 and the back side of uncoated part 12
The peristome of side, also corresponds to " the first peristome " of the present utility model.
As shown in figure 14, exposed division 13d can also pass through machining etc. by the solder of the surrounding of the second peristome 13o
13c removes and is formed.In addition, exposed division 13d can also be by being formed using mask etc. in the printing processing of solder 13c.
The width of exposed division 13d can also set according to the amount of solder 13c, material etc..
The effect ＞ of ＜ heat exchanger
Hereinafter, the effect to the heat exchanger of embodiment 2 illustrates.
State in collector allotter 2, before solder 13c melting first area 12r is engaged with second area 13r
Under, solder 13c coats as follows, that is,：Make the open area ratio of the peristome 13oc of the solder 13c of the second peristome 13o
The aperture area of the first peristome 12o is big, and the open area ratio of the peristome 13oc of the solder 13c of the second peristome 13o
The aperture area of the peristome 13ob of the base material 13b of the second peristome 13o is big.Therefore when solder 13c melts, in the second opening
Between the peristome 13oc of the solder 13c of portion 13o and the first peristome 12o, it is folded with gap S, thus suppressing the solder melting
13c flows into the region that in distribution stream 2a, heat-transfer pipe 4 is not inserted into, penetrates into the region of heat-transfer pipe 4 insertion and biography in distribution stream 2a
The gap of heat pipe 4 and reach the end of heat-transfer pipe 4, thus region of being not inserted into of heat-transfer pipe 4 being flowed in distribution stream 2a etc..
In addition, formed in gap S there is the leg of solder 13c, thus the reliability that uncoated part 12 is engaged with coating member 13
Improve, therefore the reliability of collector allotter 2 improves.
In addition, the usage amount of solder 13c can reduce the amount forming exposed division 13d in coating member 13, thus realizing collector
Allotter 2 cost degradation.
In addition, complex-shapedization of uncoated part 12 can not be made, and improve the uniformity of cold-producing medium distribution, reduce system
The collector allotter 2 of the pressure loss producing in cryogen, therefore cuts down manufacturing cost of collector allotter 2 etc..
In addition, in second area 13r, compared with the surface of the exposed division 13d of base material 13b, the surface of solder 13c is
Close to first area 12r state such that it is able to take into account the formation of gap S and uncoated part 12 engaged with coating member 13
Reliable, thus improving the reliability of collector allotter 2.
＜ variation -1 ＞
Figure 15 is the junction surface with coating member for the uncoated part of the variation -1 of the heat exchanger for embodiment 2 is described
Details figure.In addition, figure 15 illustrates the shape of the exposed division 13d of coating member 13_3.For coating member 13_1,
The shape of the exposed division 13d of 13_2,13_4 is similarly.
As shown in figure 15, solder 13c coats as follows, that is,：Make in the second peristome 13o close to coating member 13 periphery
Width ratio the second peristome 13o of the exposed division 13d in region in away from coating member 13 periphery region exposed division 13d width
Degree is little.That is, with the second peristome 13o away from coating member 13 periphery region exposed division 13d width compared with, second
In peristome 13o, the width close to the exposed division 13d in the region of coating member 13 periphery becomes more than 0 less value.By this
Sample is constituted, and the reliability that the uncoated part 12 in the few region of bonding surplus is engaged with coating member 13 improves.In addition, in bonding surplus
In other few regions, equally can also reduce the width of exposed division 13d.
In the case of being particularly the shape with bending section 13e in second flow path 13a, solder 13c can also be with as follows
Mode coats, that is,：Make width ratio second peristome of the exposed division 13d close to the region of bending section 13e in the second peristome 13o
Little away from the width of the exposed division 13d in the region of bending section 13e in 13o.That is, with the second peristome 13o in away from bending section
The width of the exposed division 13d in the region of 13e compares, the exposed division in the region of bending section 13e in the second peristome 13o
The width of 13d is more than 0 less value.In bending section 13e, due to stagnating in the flowing of cold-producing medium, therefore so
Constitute, the solder 13c of melting flows into bending section 13e, even if be formed with the leg of solder 13c in bending section 13e, give collector and divides
The impact of the uniformity of cold-producing medium distribution of orchestration 2 is also less.Therefore so constitute, improve uncoated part 12 and cladding preferential
The reliability aspect that part 13 engages is very effective.
In addition, in the case that a coating member 13 is formed with multiple second peristome 13o, solder 13c is as follows
Coating, that is,：Make to open close to the width ratio second of the exposed division 13d in the region of other second peristomes 13o in the second peristome 13o
The width of the exposed division 13d in the region away from other second peristomes 13o in oral area 13o is little.That is, with the second peristome 13o
In the width of the exposed division 13d in the region away from other second peristomes 13o compare, near it in the second peristome 13o
The width of the exposed division 13d in the region of his the second peristome 13o is more than 0 less value.Constituted by such, improve bonding
The reliability that the uncoated part 12 in the few region of surplus is engaged with coating member 13.
＜ variation -2 ＞
Figure 16 is the figure of the structure of collector allotter of the variation -2 of the heat exchanger for embodiment 2 is described.Separately
Outward, Figure 16 is the axonometric chart of the state after decomposing collector allotter 2.
As shown in figure 16, heat-transfer pipe 4 is the flat tube that multiple streams are internally formed as column-shaped.In such situation
Under, it is formed at the inner peripheral surface of first flow path 12a_5 of uncoated part 12_5 and the second being formed at coating member 13_4
The inner peripheral surface of road 13a_4 becomes flat.
＜ variation -3 ＞
Figure 17 is the junction surface with coating member for the uncoated part of the variation -3 of the heat exchanger for embodiment 2 is described
Details figure.In addition, Figure 17 is in the A1-A1 line being equivalent to Figure 11, B1-B1 line, B2-B2 line and B3-B3 line
Sectional view at line.Collector allotter 2 is not limited to be equivalent to A1-A1 line, B1-B1 line, B2-B2 line and the B3-B3 of Figure 11
The situation of the section shown in all Figure 17 of the line of line.In addition, Figure 17 illustrates the state before solder 13c melting.
As shown in figure 17 it is also possible to form jut 12b in uncoated part 12.Even such structure is it is also possible to press down
The solder 13c making melting flows into the region that in distribution stream 2a, heat-transfer pipe 4 is not inserted into, infiltration distributes heat-transfer pipe 4 in stream 2a and inserts
Gap between the region entering and heat-transfer pipe 4 and reach the end of heat-transfer pipe 4, thus being flowed into heat-transfer pipe 4 in distribution stream 2a
Region being not inserted into etc..In addition can also be to inner peripheral surface coated with solder 13c of second flow path 13a.
More than, embodiment 1 and embodiment 2 are illustrated, but this utility model is not limited to each embodiment party
The explanation of formula.For example it is also possible to combine all or part of each embodiment, each variation etc..
Description of reference numerals：1... heat exchanger；2... collector allotter；2a... distributes stream；3... collector；3a...
Interflow stream；4... heat-transfer pipe；5... fin；11... plate body；12nd, the uncoated part of 12_1～12_5...；12a, 12a_
1～12a_5... first flow path；12b... jut；The top surface of 12c... jut；12o... first peristome；12r...
First area；13rd, 13_1～13_4... coating member；13a, 13a_1～13a_4... second flow path；13b... base material；
13c... solder；13d... exposed division；13e... bending section；13o... second peristome；The peristome of 13ob... base material；
The peristome of 13oc... solder；13r... second area；51... air-conditioning device；52... compressor；53... cross valve；
54... heat source side heat exchanger；55... throttling arrangement；56... load-side heat exchanger；57... heat source side fan；58... bear
Carry crosswind fan；59... control device.
Claims (14)
1. a kind of collector allotter, has the distribution stream being two by the divided fluid stream of inflow, the spy of described collector allotter
Levy and be,
Possesses plate body, this plate body has：
Uncoated part, it forms first flow path, and is formed with first area, and this first area is to have as described first flow path
The first peristome of end region；And
Coating member, it forms second flow path, and is formed with second area, and this second area is to have as described second flow path
The region of the second peristome of end,
The described first area of described uncoated part is engaged by solder with the described second area of described coating member, thus will
Described first flow path is coupled together with described second flow path,
The described part distributing stream is constituted by the described first flow path and described second flow path of described connection,
It is coated with described solder to become following condition mode in described second area, that is,：Described second peristome is made to be wrapped
The opening of the first peristome described in the part of uncoated described solder containing that is, the open area ratio of the peristome of described solder
Area is big.
2. collector allotter according to claim 1 it is characterised in that
It is formed with jut in the described first area of described uncoated part,
Described first peristome is formed at described jut,
Described jut is prominent to the inner side of described second flow path.
3. a kind of collector allotter, has the distribution stream being two by the divided fluid stream of inflow, the spy of described collector allotter
Levy and be,
Possesses plate body, this plate body has：
Uncoated part, it forms first flow path, and is formed with first area, and this first area is to have as described first flow path
The first peristome of end region；And
Coating member, it forms second flow path, and is formed with second area, and this second area is to have as described second flow path
The region of the second peristome of end,
The described first area of described uncoated part is engaged by solder with the described second area of described coating member, thus will
Described first flow path is coupled together with described second flow path,
The described part distributing stream is constituted by the described first flow path and described second flow path of described connection,
It is formed with jut in the described first area of described uncoated part,
Described first peristome is formed at described jut,
Described jut is prominent to the inner side of described second flow path.
4. the collector allotter according to Claims 2 or 3 it is characterised in that
In the state of before described melt solder, shape between the outer peripheral face and the inner peripheral surface of described second flow path of described jut
Become to have gap.
5. collector allotter according to claim 4 it is characterised in that
Described gap is the gap that the root closer to described jut more narrows.
6. the collector allotter according to Claims 2 or 3 it is characterised in that
The projecting height of described jut is below the thickness of slab of described coating member.
7. the collector allotter according to Claims 2 or 3 it is characterised in that
Described solder being coated in the way of becoming following state in described second area, that is,：Make being somebody's turn to do of described second peristome
The aperture area of the peristome of the base material of described coating member of the second peristome described in the open area ratio of the peristome of solder is big.
8. collector allotter according to claim 7 it is characterised in that
Described solder being coated in the way of becoming following state in described second area, that is,：The surface making this solder is than described
The surface of the base material of coating member is close to described first area.
9. collector allotter according to claim 7 it is characterised in that
Described solder being coated in the way of becoming following state in described second area, that is,：Make to connect in described second peristome
The inner peripheral surface of the peristome of this solder in the region of periphery of closely described coating member and the peristome of base material of described coating member
The width of the exposed division of this base material being formed between inner peripheral surface, than the periphery away from described coating member in described second peristome
Region this width little.
10. collector allotter according to claim 7 it is characterised in that
Described second peristome is the shape with bending section,
Described solder to coat in the way of becoming following state in described second area, that is,：Make to connect in described second peristome
The inner peripheral surface of the peristome of this solder in region of closely described bending section and the inner peripheral surface of the peristome of base material of described coating member
Between the width of the exposed division of this base material that formed, than in described second peristome away from described bending section region this is wide
Degree is little.
11. collector allotters according to claim 7 it is characterised in that
It is formed with multiple described second peristomes in a described coating member,
Described solder being coated in the way of becoming following state in described second area, that is,：Make to connect in described second peristome
The inner peripheral surface of the peristome of this solder in region of other the second peristomes nearly is interior with the peristome of the base material of described coating member
The width of the exposed division of this base material being formed between side face, than the area away from other the second peristomes in described second peristome
This width in domain is little.
12. collector allotters according to Claims 2 or 3 it is characterised in that
Described solder being coated in the way of becoming following state in described second area, that is,：The thickness making this solder is described
Less than the 30% of the thickness of slab of the base material of coating member.
A kind of 13. heat exchangers are it is characterised in that possess：
Collector allotter any one of claim 1～12；With
Heat-transfer pipe, it is connected to described plate body.
A kind of 14. air-conditioning devices it is characterised in that
Possesses the heat exchanger described in claim 13.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2014/061208 WO2015162677A1 (en) | 2014-04-21 | 2014-04-21 | Header distributor, heat exchanger, air conditioning device, and method for manufacturing header distributor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206001968U true CN206001968U (en) | 2017-03-08 |
Family
ID=54331872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490001354.1U Expired - Lifetime CN206001968U (en) | 2014-04-21 | 2014-04-21 | Collector allotter, heat exchanger and air-conditioning device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6207724B2 (en) |
| CN (1) | CN206001968U (en) |
| WO (1) | WO2015162677A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113167553A (en) * | 2018-11-20 | 2021-07-23 | 株式会社电装 | Heat exchanger |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5123482A (en) * | 1991-11-14 | 1992-06-23 | Wynn's Climate Systems, Inc. | Oval tube heat exchanger |
| JP3959834B2 (en) * | 1998-03-30 | 2007-08-15 | 株式会社デンソー | Stacked heat exchanger |
| FR2803378B1 (en) * | 1999-12-29 | 2004-03-19 | Valeo Climatisation | MULTI-CHANNEL TUBE HEAT EXCHANGER, PARTICULARLY FOR MOTOR VEHICLES |
| JP2002011570A (en) * | 2000-06-30 | 2002-01-15 | Zexel Valeo Climate Control Corp | Manufacture of heat exchanger |
| JP4606230B2 (en) * | 2005-04-08 | 2011-01-05 | 日軽熱交株式会社 | Heat exchanger |
| JP2007303787A (en) * | 2006-05-15 | 2007-11-22 | Calsonic Kansei Corp | Heat exchanger |
| JP2008249241A (en) * | 2007-03-30 | 2008-10-16 | Showa Denko Kk | Heat exchanger |
| JP2010014382A (en) * | 2008-07-07 | 2010-01-21 | Denso Corp | Evaporator |
| WO2010038672A1 (en) * | 2008-09-30 | 2010-04-08 | カルソニックカンセイ株式会社 | Heat exchanger with receiver tank |
-
2014
- 2014-04-21 CN CN201490001354.1U patent/CN206001968U/en not_active Expired - Lifetime
- 2014-04-21 JP JP2016514571A patent/JP6207724B2/en active Active
- 2014-04-21 WO PCT/JP2014/061208 patent/WO2015162677A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113167553A (en) * | 2018-11-20 | 2021-07-23 | 株式会社电装 | Heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2015162677A1 (en) | 2017-04-13 |
| JP6207724B2 (en) | 2017-10-04 |
| WO2015162677A1 (en) | 2015-10-29 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |