Heating device applied to high-efficiency energy-saving electric boiler
Technical Field
The utility model relates to an electric heating equipment field, concretely relates to be applied to heating device on energy-efficient electric boiler.
Background
An electric boiler is a boiler device which can convert electric energy into heat energy, and the electric boiler has high consumption of the electric energy. The heating pipe of the existing heating device is easy to damage and explode a heating element under the condition that heat cannot be taken away in time, and the maintenance cost is invisibly increased; meanwhile, the heating element in the existing electric boiler heating device has small heating area and low heat exchange efficiency, so that more electric energy needs to be consumed to provide heat meeting the requirement. Meanwhile, the existing heating pipe made of pure aluminum alloy material is easy to expand, and the service life of the heating device is influenced.
On the other hand, the existing methods wrap the heat-insulating material on the periphery of the heating pipe, and actually, the heat on the periphery of the heating pipe is not effectively utilized. Therefore, it is necessary to provide a heating apparatus capable of effectively utilizing heat of the outer periphery of the heating pipe.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims to overcome the not enough of prior art, provide a simple structure, the heat transfer is effectual, and can carry out the heating device on energy-efficient electric boiler of being applied to that effectively utilizes to the heat of heating pipe periphery.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a heating device applied to an efficient energy-saving electric boiler comprises a semiconductor heating pipe, an electric control plate, a relay, a fuse, a water inlet pipe and a water outlet pipe; the quantity of the relays and the quantity of the fuses are equal to that of the semiconductor heating pipes; wherein,
the semiconductor heating pipe comprises a heating element and a pipe body; the tube body is hollow and is used for water flow circulation, and an accommodating cavity for accommodating the heating element is integrally formed on the peripheral surface of the tube body; the accommodating cavity is arranged along the length direction of the pipe body.
The heating device also comprises coil pipes with the same number as the semiconductors, the coil pipes are wound on the semiconductor heating pipes, one end of each coil pipe is communicated with the branch pipe at the water inlet, and the other end of each coil pipe is communicated with the branch pipe at the water outlet;
the electric control board is electrically connected with the relay, and the relay is used for controlling the on-off of the heating element; the heating elements are accommodated in the accommodating cavity of the tube body, and the heating elements in the semiconductor heating tubes are connected with the corresponding fuses in series and then connected with commercial power; the water inlet pipe is communicated with the water inlet ends of the semiconductor heating pipes through the branch pipes, and the water outlet ends of the semiconductor heating pipes are communicated with the water outlet pipe through the branch pipes.
Further, the external screw thread has all been seted up at the both ends of body.
Further, still include the pipe, the pipe cover is established on the semiconductor heating pipe, the coil pipe winding is in on the pipe.
Furthermore, the number of the semiconductor heating pipes is more than two.
Further, the diameter of the semiconductor heating tube is 6-8 cm, and the length is 40-60 cm.
Furthermore, the heating element is accommodated in the accommodating cavity, and the silicone sealant is used for sealing two ends of the tube body.
Further, the number of the accommodating cavities is four or six; when the number of the containing cavities is four, the four containing cavities are arranged on the peripheral surface of the pipe body in an encircling manner at equal intervals, and the cross section of the formed pipe body is quadrilateral; when the number of the accommodating cavities is six, the six accommodating cavities are arranged on the peripheral surface of the pipe body in an encircling mode at equal intervals, and the cross section of the formed pipe body is hexagonal.
Further, the heating element is a PTC ceramic heating element.
Further, the length of the circular tube is equal to that of the semiconductor heating tube.
The utility model adopts the technical proposal, the two ends of the pipe body are both provided with external threads, thereby facilitating the overall maintenance; heating elements in each semiconductor heating pipe are connected with corresponding fuses in series and then connected with commercial power, and even if a certain heating element is damaged, other pipe bodies are not affected to carry out transduction. Meanwhile, the round pipe is sleeved on the pipe body, so that expansion of the pipe body is effectively prevented, and a guarantee is provided for safety of the heating device. On the other hand, the coil pipe is wound on the semiconductor heating pipe, one end of the coil pipe is communicated with the branch pipe at the water inlet, and the other end of the coil pipe is communicated with the branch pipe at the water outlet. Compare with current winding insulation material's mode, the utility model provides a coil pipe winding, the very big heat that utilizes the heating pipe periphery, the effectual heat exchange efficiency that has improved be equipped with on the outer peripheral face of body and hold the cavity, conveniently hold heating element, through setting up four or six cavities that hold, increased the area of contact of heating element with the body outer wall, improved heat exchange efficiency.
Drawings
FIG. 1 is a schematic structural view of a heating device according to the present invention;
fig. 2 is one of the schematic cross-sectional views of the semiconductor heating tube of the present invention;
fig. 3 is a second schematic cross-sectional view of the semiconductor heating tube of the present invention;
fig. 4 is a schematic structural view of the semiconductor heating tube with a round tube of the present invention.
In the figure: 1. a semiconductor heating pipe; 2. an electric control board; 3. a relay; 4. a fuse; 5. a water inlet pipe; 6. a water outlet pipe; 7. an electric boiler; 8. a heating element; 9. a pipe body; 10. a receiving cavity; 11. a coil pipe; 12. an external thread; 13. a circular tube.
Detailed Description
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
As shown in fig. 1, the utility model provides a heating device applied to a high-efficiency energy-saving electric boiler, which is installed on an electric boiler 7, and comprises a semiconductor heating pipe 1, an electric control board 2, a relay 3, a fuse 4, a water inlet pipe 5 and a water outlet pipe 6; the number of the relays 3 and the number of the fuses 4 are equal to the number of the semiconductor heating tubes 1;
the semiconductor heating pipe 1 comprises a heating element 8 and a pipe body 9; the tube body 9 is hollow and is used for water flow circulation, and an accommodating cavity 10 for accommodating the heating element 8 is integrally formed on the outer peripheral surface of the tube body 9; the receiving cavity 10 is disposed along a length direction of the tube body 9.
The electric control board 2 is electrically connected with the relay 3, and the relay 3 is used for controlling the on-off of the heating element 8; the heating element 8 is accommodated in the accommodating cavity 10 of the tube body 9, and the heating element 8 in each semiconductor heating tube 1 is connected with the corresponding fuse 4 in series and then is connected with commercial power; the water inlet pipe 5 is communicated with the water inlet ends of the semiconductor heating pipes 1 through a branch pipe, and the water outlet ends of the semiconductor heating pipes 1 are communicated with the water outlet pipe 6 through the branch pipe;
heating device still include with coil pipe 11 that semiconductor quantity equals, coil pipe 11 twines on semiconductor heating pipe 1, coil pipe 11 one end with the bleeder of water inlet department is linked together, coil pipe 11 the other end with the bleeder of water outlet department is linked together.
In this embodiment, the two ends of the pipe body 9 are both provided with external threads 12.
As a preferred embodiment, the semiconductor heating tube further comprises a circular tube 13, the circular tube 13 is sleeved on the semiconductor heating tube 1, and the coil 11 is wound on the circular tube 13.
Furthermore, the number of the semiconductor heating pipes 1 is more than two. The diameter of the semiconductor heating tube 1 is 6-8 cm, and the length is 40-60 cm. The length of the circular tube 13 is equal to that of the semiconductor heating tube 1.
As a preferred embodiment, the heating element further comprises a silicone sealant, and after the heating element 8 is accommodated in the accommodating cavity 10, the silicone sealant is used to seal two ends of the tube 9.
As a preferred embodiment, the number of said housing cavities 10 is four or six; when the number of the accommodating cavities 10 is four, the four accommodating cavities 10 are arranged on the outer peripheral surface of the tube body 9 in an encircling manner at equal intervals, and the cross section of the formed tube body 9 is quadrilateral; when the number of the accommodating cavities 10 is six, the six accommodating cavities 10 are arranged on the outer peripheral surface of the pipe body 9 in an encircling manner at equal intervals, and the cross section of the formed pipe body 9 is hexagonal.
It should be further noted that the heating element 8 is a PTC ceramic heating element 8.
The utility model is provided with external threads 12 at both ends of the tube body 9, which is convenient for the overall maintenance; the heating elements 8 in each semiconductor heating tube 1 are connected with the corresponding fuses 4 in series and then connected with the mains supply, and even if a certain heating element 8 is damaged, the other tube bodies 9 are not influenced to carry out transduction. Simultaneously, establish pipe 13 cover the effectual inflation that prevents body 9 on the body 9 provides the guarantee for heating device's safety. On the other hand, the coil pipe 11 is wound on the semiconductor heating pipe 1, one end of the coil pipe 11 is communicated with the branch pipe at the water inlet, and the other end of the coil pipe 11 is communicated with the branch pipe at the water outlet. Compare with current winding insulation material's mode, the utility model provides a 11 winding methods of coil pipe, the very big heat that utilizes the heating pipe periphery, the effectual heat exchange efficiency that has improved be equipped with on the outer peripheral face of body 9 and hold cavity 10, conveniently hold heating element 8, through setting up four or six cavity 10 that hold, increased the area of contact of heating element 8 with the 9 outer walls of body, improved heat exchange efficiency.
The present invention is not limited to the above-mentioned preferred embodiments, and any other products in various forms can be obtained by the teaching of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as the present invention, fall within the protection scope of the present invention.