CN205944145U - Organic light -emitting diode manufacture equipment - Google Patents
Organic light -emitting diode manufacture equipment Download PDFInfo
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- CN205944145U CN205944145U CN201620753342.5U CN201620753342U CN205944145U CN 205944145 U CN205944145 U CN 205944145U CN 201620753342 U CN201620753342 U CN 201620753342U CN 205944145 U CN205944145 U CN 205944145U
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Abstract
The utility model provides an organic light -emitting diode manufacture equipment, contains and holds carrier seat, light shield and flasher. Hold carrier seat for bearing substrate. Be formed with a plurality of luminescent material on the base plate. The light shield sets up in the base plate top. The light shield has a plurality of openings district. The flasher sets up in the light shield top for shine luminescent material via opening district, and then make the contact segment between the at least double -phase adjacent person among the luminescent material gasified or the sintering. Therefore, the utility model discloses an organic light -emitting diode manufacture equipment can make the organic light -emitting diode component of high resolution to effective colo(u)r bias phenomenon of solving in the past because of various precision factors cause.
Description
Technical field
This utility model relates to a kind of Organic Light Emitting Diode manufacturing equipment.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display is also called organic electric shock
Luminous (Organic Electro-Luminescent, OEL) display, it is except the active having light emitting diode concurrently is luminous, Gao Ying
Answer speed characteristics, and liquid crystal display power saving, frivolous the advantages of outside, with processing procedure simply low cost, can be applicable to scratch
The characteristics such as song panel, due to its excellent characteristic, are considered one of optimal display.
Make at present in the full-color technology of Organic Light Emitting Diode, the most just genus pixel juxtaposition of maturation and volume production of having an opportunity most
Method (separate RGB pixel).This manufacturing method thereof is to be done and covered using accurate light shield (tension mask), and then respectively
The luminescent material of three kinds of colors such as R, G, B on evaporation.However, can be because the material of evaporation during masking is covered on due to precise light
The situation that material adheres to and occurs bending and deformation is not so that screening effect is good.In addition, the material that this kind of precision light shield uses is gold
The problems such as genus, easy generation machining accuracy deficiency and para-position precision are inadequate.Above-mentioned factor all can lead to two neighboring
The luminescent material of different colours overlaps, and forms so-called colo(u)r bias phenomenon.
Utility model content
In view of this, a purpose of the present utility model be to propose a kind of can effectively solving the problems referred to above organic light emission two
Pole pipe manufacture method and Organic Light Emitting Diode manufacturing equipment.
In order to achieve the above object, according to an embodiment of the present utility model, a kind of Organic Light Emitting Diode manufacture sets
Standby comprise load bearing seat, light shield and flasher.Load bearing seat, in order to bearing substrate, is wherein formed with multiple luminous materials on substrate
Material.Light shield is arranged at surface, and wherein light shield has multiple open regions.Flasher is arranged above light shield, in order to via
Open region is irradiated to luminescent material, and then the contact portion between at least two neighbors in luminescent material is gasified
Or sintering.
In one or more embodiments of the present utility model, have between at least two neighbors in above-mentioned luminescent material
There is overlapping region.Organic Light Emitting Diode manufacturing equipment also comprises substrate contraposition module.Substrate contraposition module is operatively connected holds
Carry seat, in order to make substrate with light shield para-position so that above-mentioned overlay region is covered in one of them orthographic projection on substrate of open region
Domain.
In one or more embodiments of the present utility model, have between at least two neighbors in above-mentioned luminescent material
There is overlapping region.Organic Light Emitting Diode manufacturing equipment also comprises light shield contraposition module.Light shield contraposition module in order to make light shield with
Load bearing seat para-position is so that above-mentioned overlapping region is covered in one of them orthographic projection on substrate of open region.
In one or more embodiments of the present utility model, above-mentioned Organic Light Emitting Diode manufacturing equipment also comprises close
Closed chamber body.Load bearing seat, light shield and flasher are located in airtight cavity.
In one or more embodiments of the present utility model, above-mentioned airtight cavity is vacuum cavity.
In one or more embodiments of the present utility model, above-mentioned airtight cavity is the cavity of tool nitrogen filling.
In one or more embodiments of the present utility model, above-mentioned Organic Light Emitting Diode manufacturing equipment also comprises gas
Body import modul and gas monitor module.Gas import modul connects airtight cavity, close in order to import at least one gas entrance
Closed chamber body.Gas monitor module is arranged in airtight cavity, in order to monitor at least one gas in airtight cavity content and
Ratio.
In one or more embodiments of the present utility model, above-mentioned Organic Light Emitting Diode manufacturing equipment also comprises temperature
Degree measurer.Measuring temp device is arranged in airtight cavity, in order to measure the temperature in airtight cavity.
In one or more embodiments of the present utility model, above-mentioned Organic Light Emitting Diode manufacturing equipment also comprises light
Intensity measurer.Light intensity measurer is arranged in airtight cavity, and is arranged at light shield towards the side of flasher, in order to measure
Survey the light intensity that flasher exposes to light shield.
In one or more embodiments of the present utility model, above-mentioned airtight cavity has load port.Organic light emission
Diode manufacturing equipment also comprise transport module be arranged in airtight cavity, in order to by substrate by outside airtight cavity pass through load terminal
Mouth is transported on load bearing seat, or substrate is transported to outside airtight cavity by load port by load bearing seat.
In one or more embodiments of the present utility model, above-mentioned Organic Light Emitting Diode manufacturing equipment also comprises certainly
Dynamic optical detecting module, automatic optics inspection module is arranged in airtight cavity, the luminous material being gasified in order to detect or sintering
Material.
In one or more embodiments of the present utility model, above-mentioned flasher is 0.1 to 100 hertz of flicker frequency of tool
The light source of rate.
In sum, Organic Light Emitting Diode manufacturing equipment of the present utility model is the passage of scintillation light with quick and high intensity
Source is irradiated on the luminescent material on substrate, by photo-thermal effect, make luminescent material surface produce high temperature, and then reach gasification or
The purpose of sintering luminescent material.And, before exposing to luminescent material, light produced by flasher can first pass through light shield
On open region, therefore optionally can be gasified in the surface of luminescent material by the light of open region or be sintered (for example,
Optionally the lap of adjacent two luminescent materials is gasified or is sintered), to reach the effect of fine patterning.Borrow
This, Organic Light Emitting Diode manufacturing equipment of the present utility model can make the organic light-emitting diode element of high-res, and
Effectively solving is in the past because of the colo(u)r bias phenomenon caused by various precision factors.
The above be only illustrate problem, the technological means of solve problem that this utility model to be solved and its
Effect producing etc., detail of the present utility model will be discussed in detail in embodiment below and relevant drawings.
Brief description
It is that above and other purpose of the present utility model, feature, advantage and embodiment can be become apparent, appended accompanying drawing
Be described as follows：
Fig. 1 is the flow chart of the production method of organic light emitting diode illustrating this utility model one embodiment；
Fig. 2 is the schematic diagram of the Organic Light Emitting Diode manufacturing equipment illustrating this utility model one embodiment；
Fig. 3 A be the schematic diagram illustrating flasher, light shield and substrate in Fig. 2, the wherein luminescent material on substrate not yet
Gasified or sintered；
Fig. 3 B is the schematic diagram illustrating flasher, light shield and substrate in Fig. 2, wherein the luminescent material on substrate by
Gasification or sintering.
Specific embodiment
Hereinafter multiple embodiment of the present utility model will be disclosed with accompanying drawing, as clearly stated, in many practices
Details will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit this practicality newly
Type.That is, in this utility model some embodiments, the details in these practices is non-essential.Additionally, for simplifying
For the sake of accompanying drawing, usual structure and element known to some will be illustrated in the accompanying drawings in the way of simple signal.
Refer to Fig. 1, it is the flow process of the production method of organic light emitting diode illustrating this utility model one embodiment
Figure.
As shown in figure 1, in present embodiment, production method of organic light emitting diode comprises step S100 to step
S103, as follows.
Step S100：Substrate is provided, multiple luminescent materials is wherein formed with substrate, at least two in luminescent material are adjacent
There is between person overlapping region.
Step S101：Place light and cover in surface, wherein light shield has multiple open regions.
Step S102：Light shield is carried out para-position with substrate so that one of them orthographic projection on substrate of open region is covered
Overlapping region.
Step S103：Via open region, luminescent material is irradiated with flasher, and then makes in luminescent material
The part that at least two neighbors are located in orthographic projection is sintered or gasifies.
In one or more embodiments, step S103 is to carry out under vacuum conditions.In one or more embodiments,
Step S103 is to carry out in a nitrogen environment.However, this utility model is not limited thereto.
Will be described below executing the Organic Light Emitting Diode manufacturing equipment of above-mentioned production method of organic light emitting diode
One or more embodiments.
Refer to Fig. 2, Fig. 3 A and Fig. 3 B.Fig. 2 is the Organic Light Emitting Diode illustrating this utility model one embodiment
The schematic diagram of manufacturing equipment 100.Fig. 3 A is the schematic diagram illustrating flasher 113, light shield 112 and substrate 200 in Fig. 2, its
Luminescent material 210 on middle substrate 200 is not yet gasified or is sintered.Fig. 3 B is to illustrate flasher 113 in Fig. 2, light shield 112
With the schematic diagram of substrate 200, the wherein luminescent material 210 on substrate 200 gasified or sintered.
As shown in Fig. 2 to Fig. 3 B, in present embodiment, Organic Light Emitting Diode manufacturing equipment 100 comprises airtight cavity
110th, load bearing seat 111, light shield 112 and flasher 113.Load bearing seat 111, light shield 112 and flasher 113 are located at airtight
In cavity 110.Load bearing seat 111, in order to bearing substrate 200, is wherein formed with multiple luminescent materials 210 on substrate 200.As Fig. 3 A
Shown, two adjacent luminescent materials 210 are to contact two-by-two and constitute a contact portion 211.Light shield 112 is arranged at substrate 200
Top, wherein light shield 112 have multiple open region 112a.Flasher 113 is arranged above light shield 112, in order to via light shield
112 open region 112a is irradiated to luminescent material 210, and then makes connecing between two neighbors in luminescent material 210
Contact portion divides 211 to be gasified.
Specifically, as shown in Figure 3A, two adjacent luminescent materials 210 not only contact two-by-two, also have overlapping region
S.Corresponding overlapping region S is covered in orthographic projection on substrate 200 for each open region 112a of light shield 112.It is noted that sending out
Luminescent material 210 is aforesaid contact portion 211 in the part in the 112a orthographic projection of open region.For especially, Yu Benshi
Apply in mode, adjacent two luminescent materials 210 corresponding to each open region 112a of light shield 112 are the material sending different colours
Material.Whereby, after the contact portion 211 between by adjacent two luminescent materials 210 gasifies, you can efficiently solve in the past because sending out
Luminescent material 210 overlap caused by colo(u)r bias phenomenon.
In other embodiment, it is possible with flasher 113 by the contact portion between adjacent two luminescent materials 210
211 are sintered.Specifically, it is to the contact portion 211 between adjacent two luminescent materials 210 using flasher 113
Surface is sintered so that the surface being sintered can harden or crystallize, and then is transformed into the material that cannot light, and equally may be used
Efficiently solve the colo(u)r bias phenomenon caused by the past overlaping because of luminescent material 210.And, in this embodiment,
Because luminescent material 210 is only sintered rather than is gasified, therefore heat effect can't affect substrate 200 characteristic of itself, less
Can be because the effect of high-energy causes substrate 200 to deform or melts.
In order to produce the light of quick and high intensity, in present embodiment, the flicker frequency of flasher 113 is 0.1
To 100 hertz, the dosage that flasher 113 exposes to these luminescent materials 210 is 0.5J/cm2More than, and pulse width is about
10us to 10000us.However, this utility model is not limited thereto.
It follows that Organic Light Emitting Diode manufacturing equipment 100 of the present utility model is the sudden strain of a muscle with quick and high intensity
Bright light source 113 is irradiated on the luminescent material 210 on substrate 200, by photo-thermal effect, so that luminescent material 210 surface is produced high
Temperature, and then reach gasification or the purpose of sintering luminescent material 210.More specifically, flasher 113 can be at short notice for one
It is continuous or the light launching high-energy of interval is so that luminescent material 210 just improves temperature after the light absorbing this high-energy,
And then when luminescent material 210 lifts temperature within certain time, even more than gasification temperature or during sintering temperature itself, luminous material
Material 210 just forms the phenomenon of gasification or sintering.Additionally, before being irradiated to luminescent material 210, produced by flasher 113
Light can first pass through the open region 112a on light shield 112, and the light therefore passing through open region 112a can be to the table of luminescent material 210
Optionally gasified or sintered and (for example, optionally entered circulation of qi promoting to the contact portion 211 of adjacent two luminescent materials 210 in face
Change or sinter), to reach the effect of fine patterning.
In one or more embodiments, flasher 113 can pass through that sequencing contro is opened/closed or lamp source is overlapping
Permutation and combination, the region of once irradiating is increased and obtains light and the heat of high-energy, and then reach wanting of comprehensive irradiation homogeneity
Ask.
In one or more embodiments, the luminous source that flasher 113 drives for voltage.For example, passage of scintillation light
The voltage in source 113 is about 0.5KV to 5KV, but this utility model is not limited thereto.
In present embodiment, Organic Light Emitting Diode manufacturing equipment 100 also comprises substrate contraposition module 114a.Substrate pair
Position module 114a is in order to make load bearing seat 111 and light shield 112 para-position so that each open region 112a of light shield 112 is on substrate 200
Orthographic projection at least cover corresponding overlapping region S.
Additionally, in present embodiment, Organic Light Emitting Diode manufacturing equipment 100 also comprises light shield contraposition module 114b.
Light shield contraposition module 114b is in order to make light shield 112 with load bearing seat 111 para-position so that one of them of open region 112a is in substrate
Above-mentioned overlapping region S is at least covered in orthographic projection on 200.
In order that substrate contraposition module 114a and light shield contraposition module 114b mutually can work in coordination with para-position, in present embodiment
In, Organic Light Emitting Diode manufacturing equipment 100 also comprises image extraction module 114c.According to image extraction module 114c to substrate 200 and light
Cover 112 carries out capture, and a controller (not shown) can be according to capture result (for example, by judging substrate 200 and light shield 112
A certain edge whether align) control base board contraposition module 114a and/or light shield contraposition module 114b start, make base so as to reaching
Plate 200 and light shield 112 carry out the purpose of para-position.
In other embodiment, Organic Light Emitting Diode manufacturing equipment 100 also can only comprise aforesaid base plate contraposition module
114a or light shield contraposition module 114b.That is, para-position can be carried out using moving substrate 200 and by the way of fixing light shield 112,
Or carry out para-position using mobile light shield 112 and by the way of fixing substrate 200.
In other embodiment, also can adopt other mechanical localization mechanism auxiliary positioning.For example, can be in substrate
200 with surrounding's setting Stop structure (not shown) of light shield 112, and aforementioned image extraction module 114c can cancel.When substrate para-position mould
Block 114a drives load bearing seat 111 mobile and drives light shield 112 to move against corresponding Stop structure and/or light shield contraposition module 114b
Dynamic and during against corresponding Stop structure, you can the para-position between completing substrate 200 and light shield 112.
In one or more embodiments, the para-position of aforesaid base plate contraposition module 114a and/or light shield contraposition module 114b
Trueness error is about ± 2um to ± 5um, but this utility model is not limited thereto.
In one or more embodiments, airtight cavity 110 is vacuum cavity.In one or more embodiments, airtight
Cavity 110 is the cavity of tool nitrogen filling.However, this utility model is not limited thereto.
In present embodiment, Organic Light Emitting Diode manufacturing equipment 100 also comprises gas import modul 115a and gas
Body monitoring module 115b.Gas import modul 115a connects airtight cavity 110, enters airtight cavity in order to import at least one gas
110.Gas monitor module 115b is arranged in airtight cavity 110, in order to monitor containing of at least one gas in airtight cavity 110
Amount and ratio.Setting by gas import modul 115a and gas monitor module 115b, you can in airtight cavity 110 i.e.
When monitoring gas content, and analyze the ratio of each gas in airtight cavity 110, therefore processing procedure personnel can need according to various parameters
Ask and adjust gas with various and be passed through in airtight cavity 110.
In present embodiment, Organic Light Emitting Diode manufacturing equipment 100 also comprises measuring temp device 116.Measuring temp
Device 116 is arranged in airtight cavity 110, in order to measure the temperature in airtight cavity 110.
In one or more embodiments, the temperature monitoring scope of measuring temp device 116 is about 25 DEG C to 1500 DEG C, but this
Utility model is not limited thereto.
In present embodiment, Organic Light Emitting Diode manufacturing equipment 100 also comprises light intensity measurer 117.Light intensity
Measurer 117 is arranged in airtight cavity 110, and is arranged at light shield 112 towards the side of flasher 113, in order to measure sudden strain of a muscle
Bright light source 113 exposes to the light intensity of light shield 112.
In one or more embodiments, the light intensity monitoring range of light intensity measurer 117 can select according to demand,
The light being for example directed to 365nm, 405nm equiwavelength is monitored, but this utility model is not limited thereto.
Setting by measuring temp device 116 and light intensity measurer 117, you can the temperature in immediately monitoring closed chamber body with
Light intensity, therefore processing procedure personnel can do the adjustment of parameter at any time according to feedback result, and then guarantee the temperature in airtight cavity 110
Homogeneity, and reach the stability of processing procedure.
Because the Organic Light Emitting Diode manufacturing equipment 100 of this case is to carry out fabrication process in airtight chamber, therefore in
In present embodiment, airtight cavity 110 has load port (load port) 110a.Organic Light Emitting Diode manufacturing equipment 100
Also comprise transport module 118 to be arranged in airtight cavity 110, in order to substrate 200 is passed through load port by airtight cavity 110 is outer
110a is transported on load bearing seat 111, or substrate 200 is transported to airtight cavity 110 by load bearing seat 111 by load port 110a
Outward.In practical application, transporting module 118 can be mechanical arm, but this utility model is not limited thereto.
In present embodiment, Organic Light Emitting Diode manufacturing equipment 100 also comprises automatic optics inspection module 119, if
It is placed in airtight cavity 110, the luminescent material 210 being gasified in order to detect or sintering.Gasified on substrate 200 or sinter sends out
Luminescent material 210 is via the automatic inspection of automatic optics inspection module 119, you can during automated manufacturing, quick inspection is produced
The quality of product and characteristic, and make quick product specification feedback, to avoid product to leave caused product after airtight cavity 110
Geological Problems.
In one or more embodiments, the live width/spacing (Line/Space) of light shield 112 is about 1um/1um extremely
100um/100um, but this utility model is not limited thereto.In one or more embodiments, the material of light shield 112 can be gold
Genus, soda lime (soda lime), quartz etc., but this utility model is not limited thereto.
By the above detailed description for specific embodiment of the present utility model, it is apparent that of the present utility model
Production method of organic light emitting diode and Organic Light Emitting Diode manufacturing equipment are to shine with quick and high intensity flasher
Penetrate on the luminescent material on substrate, by photo-thermal effect, make luminescent material surface produce high temperature, and then reach gasification or sinter
The purpose of luminescent material.And, before being irradiated to luminescent material, light produced by flasher can first pass through on light shield
Open region, therefore can optionally be gasified or be sintered (for example, selection by the light of open region to the surface of luminescent material
Property ground the contact portion of adjacent two luminescent materials is gasified or is sintered), to reach the effect of fine patterning.Whereby,
Production method of organic light emitting diode of the present utility model and Organic Light Emitting Diode manufacturing equipment can make high-res
Organic light-emitting diode element, and effectively solving is in the past because of the colo(u)r bias phenomenon caused by various precision factors.
Although this utility model is disclosed above with embodiment, so it is not in order to limit this utility model, any ripe
Know this those skilled in the art, without departing from spirit and scope of the present utility model, when can be used for a variety of modifications and variations, therefore this practicality
New protection domain ought be defined depending on the scope of which is defined in the appended claims.
Claims (12)
1. a kind of Organic Light Emitting Diode manufacturing equipment is it is characterised in that comprise：
One load bearing seat, in order to carry a substrate, is wherein formed with multiple luminescent materials on this substrate；
One light shield, is arranged at this surface, and wherein this light shield has multiple open regions；And
One flasher, is arranged above this light shield, in order to carry out to the plurality of luminescent material via the plurality of open region
Irradiate, and then so that the contact portion between at least two neighbors in the plurality of luminescent material is gasified or sinter.
2. Organic Light Emitting Diode manufacturing equipment according to claim 1 is it is characterised in that in the plurality of luminescent material
This at least two neighbor between there is an overlapping region, this Organic Light Emitting Diode manufacturing equipment also comprises a substrate para-position mould
Block, this substrate contraposition module is operatively connected this load bearing seat, in order to make this substrate and this light shield para-position so that the plurality of opening
This overlapping region is covered in one of them orthographic projection on this substrate of area.
3. Organic Light Emitting Diode manufacturing equipment according to claim 1 is it is characterised in that in the plurality of luminescent material
This at least two neighbor between there is an overlapping region, this Organic Light Emitting Diode manufacturing equipment also comprises a light shield para-position mould
Block, this light shield contraposition module is in order to make this light shield with this load bearing seat para-position so that one of the plurality of open region is in this base
This overlapping region is covered in an orthographic projection on plate.
4. Organic Light Emitting Diode manufacturing equipment according to claim 1 is it is characterised in that also comprise an airtight cavity,
Wherein this load bearing seat, this light shield and this flasher are located in this airtight cavity.
5. Organic Light Emitting Diode manufacturing equipment according to claim 4 is it is characterised in that this airtight cavity is vacuum chamber
Body.
6. Organic Light Emitting Diode manufacturing equipment according to claim 4 is it is characterised in that this airtight cavity is tool nitrogen
The cavity of filling.
7. Organic Light Emitting Diode manufacturing equipment according to claim 4 is it is characterised in that also comprise：
One gas import modul, connects this airtight cavity, enters this airtight cavity in order to import at least one gas；And
One gas monitor module, is arranged in this airtight cavity, in order to monitor one of this at least one gas in this airtight cavity
Content and a ratio.
8. Organic Light Emitting Diode manufacturing equipment according to claim 4 is it is characterised in that also comprise a measuring temp
Device, this measuring temp device is arranged in this airtight cavity, in order to measure the temperature in this airtight cavity.
9. Organic Light Emitting Diode manufacturing equipment according to claim 4 measures it is characterised in that also comprising a light intensity
Device, this light intensity measurer is arranged in this airtight cavity, and is arranged at this light shield towards the side of this flasher, in order to measure
Survey the light intensity that this flasher exposes to this light shield.
10. Organic Light Emitting Diode manufacturing equipment according to claim 4 is it is characterised in that this airtight cavity has one
Load port, this Organic Light Emitting Diode manufacturing equipment also comprises a transport module and is arranged in this airtight cavity, in order to should
Substrate is transported on this load bearing seat by this load port by outside this airtight cavity, or this substrate is passed through this dress by this load bearing seat
Load port is transported to outside this airtight cavity.
11. Organic Light Emitting Diode manufacturing equipments according to claim 4 are it is characterised in that also comprise an automated optical
Detection module, this automatic optics inspection module is arranged in this airtight cavity, and gasified in order to detect or sinter is the plurality of
Luminescent material.
12. Organic Light Emitting Diode manufacturing equipments according to claim 1 are it is characterised in that this flasher is tool 0.1
Light source to 100 hertz of flicker frequencies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620753342.5U CN205944145U (en) | 2016-07-18 | 2016-07-18 | Organic light -emitting diode manufacture equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620753342.5U CN205944145U (en) | 2016-07-18 | 2016-07-18 | Organic light -emitting diode manufacture equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205944145U true CN205944145U (en) | 2017-02-08 |
Family
ID=57928406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620753342.5U Active CN205944145U (en) | 2016-07-18 | 2016-07-18 | Organic light -emitting diode manufacture equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205944145U (en) |
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2016
- 2016-07-18 CN CN201620753342.5U patent/CN205944145U/en active Active
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