CN205943453U - Photosensitive resin material's sound absorbing structure - Google Patents

Photosensitive resin material's sound absorbing structure Download PDF

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Publication number
CN205943453U
CN205943453U CN201620901674.3U CN201620901674U CN205943453U CN 205943453 U CN205943453 U CN 205943453U CN 201620901674 U CN201620901674 U CN 201620901674U CN 205943453 U CN205943453 U CN 205943453U
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China
Prior art keywords
splitter
bottom plate
photosensitive resin
sound
base plate
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Active
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CN201620901674.3U
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Chinese (zh)
Inventor
王鲲鹏
陶猛
江坤
陈文清
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Guizhou University
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Guizhou University
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  • Soundproofing, Sound Blocking, And Sound Damping (AREA)

Abstract

The utility model discloses a photosensitive resin material's sound absorbing structure, including splitter and bottom plate, the splitter array arrange the bottom plate one of them on the surface, bottom plate and splitter adopt photosensitive resin integral type 3D to print the shaping, are provided with the perforation on the bottom plate, at the inside splitter cavity that is provided with of splitter, the splitter cavity with bore a hole correspondingly, be provided with the microperforated panel on the surface at another of bottom plate. The utility model discloses a compound sound absorbing structure of bottom plate + splitter, impedance match's principle has been utilized to the total, and the splitter is used for realizing effective transmission of low -frequency range sound wave, and the base is used for consuming effectively passing through the sound wave in it. In addition, the microperforated panel that sets up on the bottom plate has formed lumen coupling resonance structure with perforation, the splitter cavity on the bottom plate jointly, has utilized the resonant sound absorption characteristics of lumen coupling to consume acoustic energy well, has further improved the sound absorption effect.

Description

A kind of sound absorption structure of photosensitive resin material
Technical field
This utility model is related to a kind of sound absorption structure of photosensitive resin material, belongs to noise control technique field.
Background technology
In noise control engineering, the sound absorption material and structure species of application is a lot, is broadly divided into by its principle that absorbs sound Porous sound-absorbing material and resonance sound-absorbing material.Such as foamed aluminium and foam copper etc. broadly fall into porous sound-absorbing material, and thin plate Resonance sound-absorbing structure, thin film resonance sound-absorbing structure, perforated plate resonance sound-absorbing broadly fall into resonance sound-absorbing material.And in recent years about making an uproar The research of sound deepens continuously, the broader field by the application extension of resonance sound-absorbing structure.Although perforated plate resonance sound-absorbing is tied Structure and microperforated panel soundabsorbing construction have many excellent compared with porous sound-absorbing material at sound absorption characteristics, flow resistance, the aspect such as corrosion-resistant More feature, but still cannot meet some noise control being actually needed, particularly in the field that sound absorption space is severely limited Under conjunction, low-frequency noise to be controlled will manifest deficiency, will strengthen its Low Frequency Sound Absorption, is necessary for cavity depth is significantly increased, and This often cannot accomplish in Practical Project.
China Patent Publication No. is that CN104882138A is disclosed " sound absorption structure of porous foam carborundum sound-absorbing material ", Its structure, using the foam silicon carbon material sound absorption principle of " stacking " structure, increases its acoustic absorptivity and acoustic resistance, improves low frequency and inhale Sound effective value.But in terms of processing, the machining property difference of carborundum is it is impossible to meet machining needs.And carborundum Granular size be also most important in terms of sound absorption, as excessive in fruit granule, its sound absorbing capabilities can be affected very big, be greatly reduced Sound absorbing capabilities, if therefore wanting to ensure that preferable sound absorbing capabilities must be using tiny " cystose " granule, its machining accuracy, Traditional processing industry is difficult to realize, is unfavorable for promoting the use of of this structure, in addition, this structure of disclosed sound absorption can not be abundant Using lumen coupled resonance sound absorption characteristics come sound energy consumption.
Utility model content
The technical problems to be solved in the utility model is:There is provided a kind of sound absorption structure, structure is simple, using photosensitive resin 3D Printing shaping, without machining, the sound absorption characteristics that simultaneously can make full use of lumen coupled resonance are carried out sound energy consumption, are improved and inhale Sound effective value.
The purpose of this utility model is achieved through the following technical solutions:
A kind of sound absorption structure of photosensitive resin material, including splitter and base plate, splitter array is arranged in wherein the one of base plate On surface, described base plate and splitter adopt photosensitive resin integral type 3D printing molding, are provided with perforation, on base plate in splitter Portion is provided with splitter cavity, and splitter cavity is corresponding with perforation, is provided with microperforated panel on another surface of base plate.
A diameter of 0.1 ~ 0.8mm of micropore on described microperforated panel, the punching rate of microperforated panel is 0.3 ~ 0.5%.
The thickness of base plate is 5 ~ 10mm, and the height of splitter is 40 ~ 50mm, and the axis of splitter is perpendicular to the surface of base plate.
A diameter of 1 ~ 6mm of described perforation, the diameter of splitter cavity oral area is matched with the diameter of perforation.
Compared with prior art, the beneficial effects of the utility model are as follows:
1st, this utility model adopts the compound sound-absorption structural of base plate+splitter, and total has used the principle of impedance matching, Splitter is used for realizing effective transmission of low-frequency range sound wave, and base is used for consumption effectively and is transmitted to its interior sound wave.In addition, base plate Perforation on the microperforated panel of upper setting and base plate, splitter cavity together form lumen coupled resonance structure, utilize well The sound absorption characteristics of lumen coupled resonance carry out sound energy consumption, further increase acoustically effective.
2nd, in this utility model, base plate and splitter adopt photosensitive resin integral type 3D printing molding, without machining, gram Take the defect adding difficulty using Conventional silicon carbide material, beneficial to promoting the use of of this utility model sound absorption structure, meanwhile, photosensitive Resin has good low frequency absorption performance.
Brief description
Fig. 1 is structural representation of the present utility model;
Description of reference numerals:1st, splitter;2nd, base plate;3rd, splitter cavity;4th, bore a hole;5th, microperforated panel.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment is described further to utility model:
A kind of sound absorption structure of photosensitive resin material, including splitter 1 and base plate 2, splitter 1 array is arranged in its of base plate 2 In on a surface, described base plate 2 and splitter 1 adopt photosensitive resin integral type 3D printing molding, are provided with perforation 4 on a base plate 2, It is internally provided with splitter cavity 3 in splitter 1, splitter cavity 3 is corresponding with perforation 4, is provided with micro- on another surface of base plate 2 Perforated plate 5.
In the present embodiment, the material of microperforated panel 5 is made using materials such as steel plate, aluminium sheet, hard plastic boards, micropunch A diameter of 0.1 ~ 0.8mm of micropore on plate 5, the punching rate of microperforated panel 5 is 0.3 ~ 0.5%.
Further, the thickness of base plate 2 is 5 ~ 10mm, and the height of splitter 1 is 40 ~ 50mm, and the axis of splitter 1 is the bottom of perpendicular to The surface of plate 2, a diameter of 1 ~ 6mm of described perforation 4, the diameter of splitter cavity 3 oral area with perforation 4 diameter phase Join.
Sound absorption structure described in the utility model, in the low-frequency range of 50~2000Hz, obtains good sound absorbing capabilities, The acoustic absorptivity of 300Hz is higher than 0.5, and other frequency ranges are above 0.75.
Above content be with reference to specific preferred implementation further detailed description of the utility model it is impossible to Identification is of the present utility model to be embodied as being confined to these explanations.Ordinary skill for this utility model art For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should regard For belonging to protection domain of the present utility model.

Claims (4)

1. a kind of sound absorption structure of photosensitive resin material, including splitter(1)And base plate(2), splitter(1)Array is arranged in base plate (2)Wherein one surface on it is characterised in that:Described base plate(2)And splitter(1)Become using photosensitive resin integral type 3D printing Type, in base plate(2)On be provided with perforation(4), in splitter(1)It is internally provided with splitter cavity(3), splitter cavity(3)With perforation (4)Corresponding, in base plate(2)Another surface on be provided with microperforated panel(5).
2. a kind of photosensitive resin material according to claim 1 sound absorption structure it is characterised in that:Described microperforated panel (5)A diameter of 0.1 ~ 0.8mm of upper micropore, microperforated panel(5)Punching rate be 0.3 ~ 0.5%.
3. a kind of photosensitive resin material according to claim 1 sound absorption structure it is characterised in that:Base plate(2)Thickness For 5 ~ 10mm, splitter(1)Height be 40 ~ 50mm, splitter(1)Axis perpendicular to base plate(2)Surface.
4. a kind of photosensitive resin material according to claim 1 sound absorption structure it is characterised in that:Described perforation(4)'s A diameter of 1 ~ 6mm, splitter cavity(3)The diameter of oral area and perforation(4)Diameter match.
CN201620901674.3U 2016-08-19 2016-08-19 Photosensitive resin material's sound absorbing structure Active CN205943453U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620901674.3U CN205943453U (en) 2016-08-19 2016-08-19 Photosensitive resin material's sound absorbing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620901674.3U CN205943453U (en) 2016-08-19 2016-08-19 Photosensitive resin material's sound absorbing structure

Publications (1)

Publication Number Publication Date
CN205943453U true CN205943453U (en) 2017-02-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106205587A (en) * 2016-08-19 2016-12-07 贵州大学 A kind of sound absorption structure of photosensitive resin material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106205587A (en) * 2016-08-19 2016-12-07 贵州大学 A kind of sound absorption structure of photosensitive resin material

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