CN106205587A - A kind of sound absorption structure of photosensitive resin material - Google Patents

A kind of sound absorption structure of photosensitive resin material Download PDF

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Publication number
CN106205587A
CN106205587A CN201610686826.7A CN201610686826A CN106205587A CN 106205587 A CN106205587 A CN 106205587A CN 201610686826 A CN201610686826 A CN 201610686826A CN 106205587 A CN106205587 A CN 106205587A
Authority
CN
China
Prior art keywords
splitter
base plate
sound
photosensitive resin
perforation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610686826.7A
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Chinese (zh)
Inventor
王鲲鹏
陶猛
江坤
陈文清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guizhou University
Original Assignee
Guizhou University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guizhou University filed Critical Guizhou University
Priority to CN201610686826.7A priority Critical patent/CN106205587A/en
Publication of CN106205587A publication Critical patent/CN106205587A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/162Selection of materials
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/172Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using resonance effects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Building Environments (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)

Abstract

The invention discloses the sound absorption structure of a kind of photosensitive resin material, including splitter and base plate, splitter array is arranged on a wherein surface of base plate, described base plate and splitter use photosensitive resin integral type 3D printing shaping, base plate is provided with perforation, being internally provided with splitter cavity at splitter, splitter cavity is corresponding with perforation, is provided with microperforated panel on another surface of base plate.The present invention uses the compound sound-absorption structural of base plate+splitter, and total has used the principle of impedance matching, and splitter is used for realizing effective transmission of low-frequency range sound wave, and base is used for effectively consuming being transmitted to its interior sound wave.It addition, the microperforated panel arranged on base plate together form lumen coupled resonance structure with the perforation on base plate, splitter cavity, make use of the sound absorption characteristics of lumen coupled resonance to carry out sound energy consumption well, further increase acoustically effective.

Description

A kind of sound absorption structure of photosensitive resin material
Technical field
The present invention relates to the sound absorption structure of a kind of photosensitive resin material, belong to noise control technique field.
Background technology
In noise control engineering, the sound absorption material and structure kind of application is a lot, is broadly divided into by its sound absorption principle Porous sound-absorbing material and resonance sound-absorbing material.Such as foamed aluminium and foam copper etc. broadly fall into porous sound-absorbing material, and thin plate Resonance sound-absorbing structure, thin film resonance sound-absorbing structure, perforated plate resonance sound-absorbing broadly fall into resonance sound-absorbing material.And in recent years about making an uproar The research of sound deepens continuously, the broader field by the application extension of resonance sound-absorbing structure.Although perforated plate resonance sound-absorbing is tied Structure and microperforated panel soundabsorbing construction have many excellent compared with porous sound-absorbing material at sound absorption characteristics, flow resistance, the aspect such as corrosion-resistant More feature, but still cannot meet some noise control being actually needed, particularly in the field that sound absorption space is severely limited Under conjunction, low-frequency noise to be controlled will manifest deficiency, will strengthen its Low Frequency Sound Absorption, is necessary for being significantly increased cavity depth, and This cannot accomplish in Practical Project often.
China Patent Publication No. is that CN104882138A is disclosed " sound absorption structure of porous foam carborundum sound-absorbing material ", Its structure utilizes the foam silicon carbon material sound absorption principle of " stacking " structure, increases its acoustic absorptivity and acoustic resistance, improves low frequency and inhale Sound effective value.But in terms of processing, the machining property of carborundum is poor, it is impossible to meet machining needs.And carborundum Granular size be also most important in terms of sound absorption, as fruit granule is excessive, its sound absorbing capabilities can be affected very big, be greatly reduced Sound absorbing capabilities, if therefore wanting to ensure, preferable sound absorbing capabilities must use tiny " cystose " granule, its machining accuracy, Tradition processing industry is difficulty with, and is unfavorable for promoting the use of of this structure, it addition, this structure of disclosed sound absorption can not be abundant The sound absorption characteristics utilizing lumen coupled resonance carry out sound energy consumption.
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of sound absorption structure, simple in construction, uses photosensitive resin 3D to print Molding, it is not necessary to machining, the sound absorption characteristics that simultaneously can make full use of lumen coupled resonance are carried out sound energy consumption, are improved sound absorption effect Really.
It is an object of the invention to be achieved through the following technical solutions:
The sound absorption structure of a kind of photosensitive resin material, including splitter and base plate, splitter array is arranged in a wherein surface of base plate On, described base plate and splitter use photosensitive resin integral type 3D printing shaping, be provided with perforation, set inside splitter on base plate Being equipped with splitter cavity, splitter cavity is corresponding with perforation, is provided with microperforated panel on another surface of base plate.
A diameter of 0.1 ~ 0.8mm of micropore on described microperforated panel, the punching rate of microperforated panel is 0.3 ~ 0.5%.
The thickness of base plate is 5 ~ 10mm, and the height of splitter is 40 ~ 50mm, and the axis of splitter is perpendicular to the surface of base plate.
A diameter of 1 ~ 6mm of described perforation, the diameter of splitter cavity oral area matches with the diameter of perforation.
Compared with prior art, beneficial effects of the present invention is as follows:
1, the present invention uses the compound sound-absorption structural of base plate+splitter, and total has used the principle of impedance matching, and splitter is used for Realizing effective transmission of low-frequency range sound wave, base is used for effectively consuming being transmitted to its interior sound wave.It addition, arrange on base plate Microperforated panel together form lumen coupled resonance structure with the perforation on base plate, splitter cavity, make use of tube chamber coupling well The sound absorption characteristics amounting to shake carry out sound energy consumption, further increase acoustically effective.
2, in the present invention, base plate and splitter use photosensitive resin integral type 3D printing shaping, it is not necessary to machining, overcome Using Conventional silicon carbide material to add the defect of difficulty, promoting the use of of sound absorption structure the most of the present invention, meanwhile, photosensitive resin has Good low frequency absorption performance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention;
Description of reference numerals: 1, splitter;2, base plate;3, splitter cavity;4, perforation;5, microperforated panel.
Detailed description of the invention
Below in conjunction with the accompanying drawings and invention is described further by specific embodiment:
The sound absorption structure of a kind of photosensitive resin material, including splitter 1 and base plate 2, splitter 1 array is arranged in wherein the one of base plate 2 On surface, described base plate 2 and splitter 1 use photosensitive resin integral type 3D printing shaping, are provided with perforation 4 on a base plate 2, are splitting Point 1 is internally provided with splitter cavity 3, and splitter cavity 3 is corresponding with perforation 4, is provided with micropunch on another surface of base plate 2 Plate 5.
In the present embodiment, the material of microperforated panel 5 uses the materials such as steel plate, aluminium sheet, hard plastic board to make, micropunch A diameter of 0.1 ~ 0.8mm of micropore on plate 5, the punching rate of microperforated panel 5 is 0.3 ~ 0.5%.
Further, the thickness of base plate 2 is 5 ~ 10mm, and the height of splitter 1 is 40 ~ 50mm, and the axis of splitter 1 is perpendicular to the end The surface of plate 2, a diameter of 1 ~ 6mm of described perforation 4, the diameter of the diameter of splitter cavity 3 oral area and perforation 4 is mutually Join.
Sound absorption structure of the present invention, in the low-frequency range of 50~2000Hz, it is thus achieved that good sound absorbing capabilities, 300Hz's Acoustic absorptivity is higher than 0.5, and other frequency ranges are above 0.75.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to assert Being embodied as of the present invention is confined to these explanations.For general technical staff of the technical field of the invention, On the premise of present inventive concept, it is also possible to make some simple deduction or replace, all should be considered as belonging to the present invention's Protection domain.

Claims (4)

1. a sound absorption structure for photosensitive resin material, including splitter (1) and base plate (2), splitter (1) array is arranged in base plate (2) on a wherein surface, it is characterised in that: described base plate (2) and splitter (1) use photosensitive resin integral type 3D to be printed as Type, is provided with perforation (4) on base plate (2), is internally provided with splitter cavity (3), splitter cavity (3) and perforation at splitter (1) (4) corresponding, another surface of base plate (2) is provided with microperforated panel (5).
The sound absorption structure of a kind of photosensitive resin material the most according to claim 1, it is characterised in that: described microperforated panel (5) a diameter of 0.1 ~ 0.8mm of upper micropore, the punching rate of microperforated panel (5) is 0.3 ~ 0.5%.
The sound absorption structure of a kind of photosensitive resin material the most according to claim 1, it is characterised in that: the thickness of base plate (2) Being 5 ~ 10mm, the height of splitter (1) is 40 ~ 50mm, and the axis of splitter (1) is perpendicular to the surface of base plate (2).
The sound absorption structure of a kind of photosensitive resin material the most according to claim 1, it is characterised in that: described perforation (4) A diameter of 1 ~ 6mm, the diameter of splitter cavity (3) oral area matches with the diameter of perforation (4).
CN201610686826.7A 2016-08-19 2016-08-19 A kind of sound absorption structure of photosensitive resin material Pending CN106205587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610686826.7A CN106205587A (en) 2016-08-19 2016-08-19 A kind of sound absorption structure of photosensitive resin material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610686826.7A CN106205587A (en) 2016-08-19 2016-08-19 A kind of sound absorption structure of photosensitive resin material

Publications (1)

Publication Number Publication Date
CN106205587A true CN106205587A (en) 2016-12-07

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Country Status (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110491361A (en) * 2019-07-23 2019-11-22 浙江大学 A kind of low frequency absorption device suitable for becoming power distribution station
CN110853611A (en) * 2019-11-22 2020-02-28 山西尚风科技股份有限公司 Noise reduction device for tail of fog gun

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104882138A (en) * 2015-04-01 2015-09-02 中国科学院金属研究所 Sound-absorbing structure of porous foam silicon carbide sound-absorbing material
CN105109122A (en) * 2015-09-18 2015-12-02 贵州大学 Viscoelasticity composite sound insulating board
CN105118497A (en) * 2015-09-18 2015-12-02 贵州大学 Tube-bundle perforated panel and spring cyclic structure sound absorption apparatus
CN205943453U (en) * 2016-08-19 2017-02-08 贵州大学 Photosensitive resin material's sound absorbing structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104882138A (en) * 2015-04-01 2015-09-02 中国科学院金属研究所 Sound-absorbing structure of porous foam silicon carbide sound-absorbing material
CN105109122A (en) * 2015-09-18 2015-12-02 贵州大学 Viscoelasticity composite sound insulating board
CN105118497A (en) * 2015-09-18 2015-12-02 贵州大学 Tube-bundle perforated panel and spring cyclic structure sound absorption apparatus
CN205943453U (en) * 2016-08-19 2017-02-08 贵州大学 Photosensitive resin material's sound absorbing structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110491361A (en) * 2019-07-23 2019-11-22 浙江大学 A kind of low frequency absorption device suitable for becoming power distribution station
CN110491361B (en) * 2019-07-23 2021-08-24 浙江大学 Low-frequency sound absorption device suitable for transformer substation
CN110853611A (en) * 2019-11-22 2020-02-28 山西尚风科技股份有限公司 Noise reduction device for tail of fog gun

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Application publication date: 20161207

RJ01 Rejection of invention patent application after publication