CN205905225U - Semiconductor grain cutting device - Google Patents
Semiconductor grain cutting device Download PDFInfo
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- CN205905225U CN205905225U CN201620681914.3U CN201620681914U CN205905225U CN 205905225 U CN205905225 U CN 205905225U CN 201620681914 U CN201620681914 U CN 201620681914U CN 205905225 U CN205905225 U CN 205905225U
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- cutting wire
- semiconductor grain
- cutter sweep
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Abstract
The utility model relates to a semiconductor grain processing technology field, name are semiconductor grain cutting device, a semiconductor grain's cutting device, including the frame, install cutting wire's running roller in the frame, cutting wire installs on the running roller in addition, and cutting wire connects power device, and the power device operation drives the cutting wire operation, the machining -position progressive of cutting wire fortune shape process crystal bar, cutting wire be that steel wire outside is adhered to and is had the silk of diamond dust line knot to construct. Such semiconductor grain's line cutting method and cutting device have the reduction to environmental pollution, efficient, the guaranteed advantage of product quality of cutting.
Description
Technical field
The present invention relates to semiconductor grain processing technique field, concretely relate to the cutting method of semiconductor grain,
Further relate to the cutter sweep of semiconductor grain.
Background technology
Semiconductor refrigeration member is to be formed on porcelain plate by crystal particle welding, and crystal grain is formed through cutting by crystal bar, brilliant
The main component of rod is three telluride two bismuth, and crystal grain is regular cuboid or square, and its arris is neat, corner specification, brilliant
Grain is cutting on cutting machine.
Using cutter sweep, crystal bar is cut, the part that cutter sweep has fixture and installs cutting wire, cutting wire
Operation can be cut to crystal bar；In prior art, the cutting wire of use is steel wire, pours into a mould cutting liquid, cutting in facet
The main component of liquid is oils and fatss, adds corundum or carborundum inside oils and fatss, and it has and easily causes pollution, cutting efficiency
The poor shortcoming of low, product quality.
Content of the invention
The purpose of the present invention is aiming at disadvantages mentioned above, provides a kind of minimizing environmental pollution, cutting efficiency height, product product
The cutting method of the guaranteed semiconductor grain of matter and cutter sweep.
The technical scheme of the cutting method of semiconductor grain of the present invention is achieved in that a kind of cutting of semiconductor grain
Method, is cut to crystal bar using the method for cutting on cutting machine, it is characterized in that: cutting wire used is corundum silk,
Described corundum silk is the conductive structure being attached with corundum outside steel wire.
Further say, during cutting, clear water or suds are used as cutting liquid.
Further say, the temperature of described cutting liquid is maintained at 15 20 DEG C.
The technical scheme of cutter sweep of the present invention is achieved in that a kind of cutter sweep of semiconductor grain, including machine
Frame, is provided with the running roller of cutting wire in frame, and also cutting wire is arranged on running roller, cutting wire connecting power device, power
Plant running drives cutting wire to run, and cutting wire runs the processing stations through crystal bar, it is characterized in that: described cutting wire is steel
It is attached with the conductive structure of corundum outside silk.
Further say, cutter sweep also pours the apparatus for pouring drenching cutting liquid, is cast in processing stations with pipeline, in pipe
Road middle setting has cooling-part.
The invention has the beneficial effects as follows:
The wire cutting method of such semiconductor grain and cutter sweep have minimizing environmental pollution, cutting efficiency high,
The guaranteed advantage of product quality；Clear water or suds are used as cutting liquid during cutting, described cutting liquid
Temperature is maintained at 20 30 DEG C, has the more preferable advantage of product quality；Cutter sweep also pours the apparatus for pouring drenching cutting liquid, uses
Pipeline is cast in processing stations, in the duct between be provided with cooling-part, there is the more preferable advantage of the product quality produced.
Brief description
Fig. 1 is the structural representation of semiconductor grain cutter sweep of the present invention.
Fig. 2 is the cross-sectional view of corundum silk.
Wherein: 1, frame 2, running roller 3, cutting wire 4, processing stations 5, apparatus for pouring 6, cooling-part 7,
Steel wire 8, corundum.
Specific embodiment
The present invention is described further with reference to the accompanying drawings and examples.
As shown in Figure 1, 2, a kind of cutter sweep of semiconductor grain, including frame 1, is provided with cutting wire in frame
Running roller 2, also cutting wire 3 be arranged on running roller, cutting wire connecting power device, power set run drive cutting wire run,
Cutting wire runs the processing stations 4 through crystal bar, it is characterized in that: described cutting wire is the silk being attached with corundum outside steel wire
Line structure.
, due to being used corundum silk as cutting tool, it is sharper for this device, can without cutting liquid, or use clear
Water is as cutting liquid, rather than with oils and fatss cutting liquid of the prior art, does not result in the pollution of environment, it is possible to achieve this
The purpose of invention, in addition it can also improve the quality of product, is easy to the recovery of leftover bits
Further say, cutter sweep also pours the apparatus for pouring 5 drenching cutting liquid, is cast in processing stations with pipeline,
Pipeline middle setting has cooling-part 6.
So crystal bar will cut at low temperature, is more beneficial for the raising of product quality.
Embodiment 1
Crystal bar is placed on wire cutting machine and is cut, steel wire is used as cutting wire, due to the cutting power of steel wire
Poor, need to use cutting liquid, and need to place diamond dust in cutting liquid, cutting liquid is in the process cut with steel wire
In pour drench cutting part liquid, in order to prevent diamond dust precipitate, need oils and fatss to be used as the main body of cutting liquid；Raw
Produce 10000 crystal grain.
Time used by producing is 200 minutes, and the temperature of cutting liquid is increased to 80 DEG C aborning, such production technology
Environmental pollution can be caused, be also unfavorable for the recovery of leftover bits, the quality percentage of product is 45%.
Embodiment 2
Crystal bar is placed on wire cutting machine and is cut, be used corundum silk as cutting wire, described cutting wire is
It is attached with the conductive structure (similarly hereinafter) of corundum 8 outside steel wire 7 in cutting process without any cutting liquid, produce 10000
Crystal grain.
Time used by producing is 180 minutes, and the temperature of the cutting part of crystal bar is increased to 90 DEG C aborning, such
Production technology does not result in environmental pollution, is also unfavorable for the recovery of leftover bits, the quality percentage of product is 55%.
Embodiment 3
Crystal bar is placed on wire cutting machine and is cut, corundum silk is used as cutting wire, use in cutting process
Clear water, as cutting liquid, produces 10000 crystal grain.
Time used by producing is 130 minutes, is increased to 30 DEG C in the temperature of the cutting part of crystal bar, such production work
Skill does not result in environmental pollution, is additionally favorable for the recovery of leftover bits, the quality percentage of product is 75%.
Embodiment 4
Crystal bar is placed on wire cutting machine and is cut, corundum silk is used as cutting wire, use in cutting process
Suds, as cutting liquid, produce 10000 crystal grain.
Time used by producing is 130 minutes, is increased to 30 DEG C in the temperature of the cutting part of crystal bar, such production work
Skill does not result in environmental pollution, is additionally favorable for the recovery of leftover bits, the quality percentage of product is 75%.
Embodiment 5
Repeat above-described embodiment 3, cutting liquid temp is down to 15-20 DEG C.
Time used by producing is 130 minutes, is increased to 20 DEG C in the temperature of the cutting part of crystal bar, such production work
Skill does not result in environmental pollution, is additionally favorable for the recovery of leftover bits, the quality percentage of product is 90%.
Embodiment 6
Repeat above-described embodiment 4, cutting liquid temp is down to 15-20 DEG C.
Time used by producing is 130 minutes, is increased to 20 DEG C in the temperature of the cutting part of brilliant plate, such production work
Skill does not result in environmental pollution, is additionally favorable for the recovery of leftover bits, the quality percentage of product is 90%.
It was verified that be more beneficial for the raising of product quality with the cutting liquid of low temperature.
The present invention, without oils and fatss cutting liquid, is more beneficial for environmental health, reduces environmental pollution, reduces production cost, favorably
In the recovery of leftover bits, improve the quality of product.
The foregoing is only the specific embodiment of the present invention, but the architectural feature of the present invention is not limited to this, any ability
The technical staff in domain in the field of the invention, all cover in the scope of the claims of the present invention by the change made or modification.
Claims (2)
1. a kind of cutter sweep of semiconductor grain, including frame, is provided with the running roller of cutting wire, also cutting wire in frame
It is arranged on running roller, cutting wire connecting power device, power set run and drive cutting wire to run, cutting wire fortune shape is through crystal bar
Processing stations, it is characterized in that: described cutting wire is the conductive structure being attached with corundum outside steel wire.
2. the cutter sweep of semiconductor grain according to claim 1, is characterized in that: cutter sweep also pours pouring cutting liquid
Apparatus for pouring, be cast in processing stations with pipeline, in the duct between be provided with cooling-part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620681914.3U CN205905225U (en) | 2016-07-01 | 2016-07-01 | Semiconductor grain cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620681914.3U CN205905225U (en) | 2016-07-01 | 2016-07-01 | Semiconductor grain cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205905225U true CN205905225U (en) | 2017-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620681914.3U Active CN205905225U (en) | 2016-07-01 | 2016-07-01 | Semiconductor grain cutting device |
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| CN (1) | CN205905225U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965708A (en) * | 2016-07-01 | 2016-09-28 | 河南鸿昌电子有限公司 | Method and device for cutting out semiconductor dies |
-
2016
- 2016-07-01 CN CN201620681914.3U patent/CN205905225U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965708A (en) * | 2016-07-01 | 2016-09-28 | 河南鸿昌电子有限公司 | Method and device for cutting out semiconductor dies |
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