CN2058786U - New-type silicon wafer etching apparatus - Google Patents
New-type silicon wafer etching apparatus Download PDFInfo
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- CN2058786U CN2058786U CN 89205180 CN89205180U CN2058786U CN 2058786 U CN2058786 U CN 2058786U CN 89205180 CN89205180 CN 89205180 CN 89205180 U CN89205180 U CN 89205180U CN 2058786 U CN2058786 U CN 2058786U
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- specimen holder
- silicon wafer
- etching
- new
- type silicon
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Abstract
The utility model discloses a new-type silicon wafer etching apparatus which can obtain large area homogeneous etching. The utility model is composed of etching tanks, sample holders and pugmill system. The new-type silicon wafer etching apparatus is characterized in that the sample holder adopts three-claw framework, the pugmill system adopts an eccentric bidirectional rotation stirrer, the rotation direction of the sample holder is opposite to the rotation direction of the stirrer, and the etching solution temperature is controlled by temperature controller. The utility model has the advantages of simple structure, convenient operation, available silicon wafer of large area homogeneous etching.
Description
The utility model is a kind of device that is used for corrosion of silicon, belongs to technical field of semiconductors.
Silicon slice corrosion is one of critical process of development various transducers, actuator and processing SOI material.In existing corrosion device, silicon chip will be by adhesive on specimen holder, thereby silicon chip loading and unloading inconvenience, and is subjected to the contamination of adhesive easily.In addition and since specimen holder rotate with the stirrer that stirs corrosive liquid between be coaxial rotation, both be easy to generate eddy current, and because of silicon chip everywhere the linear velocity difference cause silicon chip corrosion rate differences everywhere.Therefore, existing apparatus is difficult to guarantee the uniformity of silicon chip large tracts of land corrosion.
The purpose of this utility model is at the deficiencies in the prior art, provides a kind of silicon chip easy to loading and unloading, can obtain the silicon slice corrosion device of large tracts of land homogeneous corrosion.
The utility model is made up of etching tank, specimen holder and stirring system, and its characteristics are that specimen holder adopts the three-pawl type structure, and it is the rotation direction of eccentric specimen holder and the direction of rotation of stirrer that stirring system adopts eccentric two-way rotation to stir.For the ease of the control corrosion temperature, in the etching tank temperature sensor can be set, and control the corrosive liquid temperature by temperature controller.The three-pawl type specimen holder is made by polymethyl methacrylate or rubber-like plastics.Specimen holder also can be made multi-claw type structures such as two pawls, four paws or five pawls except making the three-pawl type structure.
The utlity model has advantages such as simple in structure, easy to use, in use adhesive-free stains, and part is not corroded in the silicon chip noresidue.Because the stirring system that adopts has been eliminated eddy current, silicon chip each point average linear velocity is even, therefore can make silicon chip obtain homogeneous corrosion, the silicon chip quality after the raising corrosion.
Fig. 1 is a structural representation of the present utility model; Fig. 2 is the specimen holder schematic diagram that is used for the different-diameter silicon chip; Fig. 3 is the multi-claw type specimen holder schematic diagram that is used for same diameter silicon chip.
The utility model can adopt following scheme to realize: adopt structure as shown in Figure 1, etching tank (1) is with 500~1000ml or bigger plastic containers or the glass container of volume; With specimen holder (2) the eccentric placement of etching tank relatively, and, press certain orientation with suitable rotating speed and rotate with the dc speed-regulating motor drive; Magnetic stirrer makes magnetic stick (3) press with the direction of specimen holder direction of rotation with certain rotating speed and rotates; Temperature sensor (4) can adopt the mercury contact-making switch; Temperature controller (5) can adopt common electronic temperature controller.In order to make a specimen holder can put the silicon chip of different-diameter, can take taper three-pawl type structure as shown in Figure 2.If will make a specimen holder can put the silicon chip of the same diameter of multi-disc, can adopt structure shown in Figure 3.Rotating shaft (6) is connected with dc speed-regulating motor, has a plurality of load grooves (8) on the elastic claw (7), should remain on the same plan position approach with the load groove on one deck.For the very thin silicon chip of corrosion thickness, can adopt silicon chip sticked on the substrate slice of other material and corrode.
Claims (4)
1, a kind of silicon slice corrosion device that obtains the large tracts of land homogeneous corrosion, form by etching tank, specimen holder and stirring system, it is characterized in that specimen holder adopts the three-pawl type structure, stirring system adopts eccentric two-way rotation stirrer, the rotation direction of specimen holder and the direction of rotation of stirrer.
2, silicon slice corrosion device according to claim 1 is characterized in that specimen holder can make multi-claw type structures such as two pawls, four paws or five pawls.
3, silicon slice corrosion device according to claim 1 and 2 is characterized in that specimen holder made by polymethyl methacrylate or rubber-like plastics.
4, silicon slice corrosion device according to claim 3 is characterized in that specimen holder is made of rotating shaft and elastic claw, has a plurality of load grooves on the elastic claw.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 89205180 CN2058786U (en) | 1989-06-23 | 1989-06-23 | New-type silicon wafer etching apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 89205180 CN2058786U (en) | 1989-06-23 | 1989-06-23 | New-type silicon wafer etching apparatus |
Publications (1)
Publication Number | Publication Date |
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CN2058786U true CN2058786U (en) | 1990-06-27 |
Family
ID=4862389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 89205180 Withdrawn CN2058786U (en) | 1989-06-23 | 1989-06-23 | New-type silicon wafer etching apparatus |
Country Status (1)
Country | Link |
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CN (1) | CN2058786U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100341119C (en) * | 2004-12-20 | 2007-10-03 | 华中科技大学 | Silicon microbridge corrosion unit for ferroelectric film infrared detector |
CN102892254A (en) * | 2012-09-26 | 2013-01-23 | 东莞市五株电子科技有限公司 | Machining process and device of printed circuit board |
WO2018127561A1 (en) | 2017-01-09 | 2018-07-12 | Institut National De La Santé Et De La Recherche Médicale (Inserm) | Method and apparatus for etching a substrate |
CN109142206A (en) * | 2018-10-08 | 2019-01-04 | 北方电子研究院安徽有限公司 | A kind of type silicon wafer etching apparatus |
CN110648957A (en) * | 2019-09-26 | 2020-01-03 | 上海科技大学 | Wafer clamp and using method |
CN111689458A (en) * | 2019-03-13 | 2020-09-22 | 北京大学 | Preparation system and process method of high-depth, wide and high-symmetry high-surface smoothness silicon micro-hemispherical curved surface |
-
1989
- 1989-06-23 CN CN 89205180 patent/CN2058786U/en not_active Withdrawn
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100341119C (en) * | 2004-12-20 | 2007-10-03 | 华中科技大学 | Silicon microbridge corrosion unit for ferroelectric film infrared detector |
CN102892254A (en) * | 2012-09-26 | 2013-01-23 | 东莞市五株电子科技有限公司 | Machining process and device of printed circuit board |
WO2018127561A1 (en) | 2017-01-09 | 2018-07-12 | Institut National De La Santé Et De La Recherche Médicale (Inserm) | Method and apparatus for etching a substrate |
CN109142206A (en) * | 2018-10-08 | 2019-01-04 | 北方电子研究院安徽有限公司 | A kind of type silicon wafer etching apparatus |
CN111689458A (en) * | 2019-03-13 | 2020-09-22 | 北京大学 | Preparation system and process method of high-depth, wide and high-symmetry high-surface smoothness silicon micro-hemispherical curved surface |
CN110648957A (en) * | 2019-09-26 | 2020-01-03 | 上海科技大学 | Wafer clamp and using method |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |