CN205864742U - Dynamic swage group and earphone - Google Patents
Dynamic swage group and earphone Download PDFInfo
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- CN205864742U CN205864742U CN201620586916.4U CN201620586916U CN205864742U CN 205864742 U CN205864742 U CN 205864742U CN 201620586916 U CN201620586916 U CN 201620586916U CN 205864742 U CN205864742 U CN 205864742U
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Abstract
This utility model relates to a kind of dynamic swage group and earphone.Including for the electric capacity of filtering and be fixed together and be respectively equipped with that the intermediate frequency of circuit board moves ferrum unit, high frequency moves ferrum unit and hyperfrequency moves ferrum unit, described electric capacity electrically connects with described circuit board.Intermediate frequency moves ferrum unit, high frequency moves ferrum unit and moves with hyperfrequency together with ferrum unit fixed Combination, simplify assemble flow, improve efficiency of assembling, and structure is compacter, position between each dynamic ferrum unit will not change, it is ensured that the concordance of the audio curve of dynamic ferrum unit.Under the filter action of electric capacity, intermediate frequency, high frequency and the most well-bedded accurate reproduction of hyperfrequency acoustical signal, the frequency range that the sound being reduced is comprised is abundanter, the great third dimension of sound making earphone send and stereovision, it be rich in emotion and vitality, it is ensured that the overall sound quality effect of sound.
Description
Technical field
This utility model relates to loudspeaker techniques field, particularly relates to a kind of dynamic swage group and earphone.
Background technology
The signal of telecommunication that earphone accepts media player or receptor is sent, utilizes the speaker of ear to be converted
For the sound that can hear, it it is stereo set conventional in people's live and work.Traditional earphone is usually moving-coil earphone, dynamic
Circle earphone is relatively low to the resolution of medium-high frequency, and sound lacks third dimension.For improving the fidelity of audio frequency, the earphone after improvement adds
Dynamic ferrum unit, realizing bass and alt complementation, but dynamic ferrum earphone exists to be believed intermediate frequency, high frequency and hyperfrequency sound
Number defect that resolution is relatively low, it is difficult to form the sound experience that frequency range is abundant, the most three-dimensional.
Utility model content
Based on this, it is necessary to provide a kind of dynamic swage group that can improve audio frequency resolution and the ear containing this dynamic swage group
Machine.
A kind of dynamic swage group, including for the electric capacity of filtering and be fixed together and be respectively equipped with the intermediate frequency of circuit board and move
Ferrum unit, high frequency move ferrum unit and hyperfrequency moves ferrum unit, and described electric capacity electrically connects with described circuit board.
Wherein in an embodiment, described high frequency moves ferrum unit and hyperfrequency to move the vibrating diaphragm front facet of ferrum unit the tightest
Patch connects.
Wherein in an embodiment, described high frequency moves ferrum unit and hyperfrequency moves the end being provided with out sound mouth on ferrum unit
Face is the most concordant.
Wherein in an embodiment, dynamic swage group is additionally provided with fixing described high frequency and moves ferrum unit and described hyperfrequency moves
The sheet metal of ferrum unit, described intermediate frequency moves ferrum unit and is fixed on described sheet metal and moves ferrum unit and/or institute away from described high frequency
State hyperfrequency and move one end going out sound mouth of ferrum unit.
Wherein in an embodiment, described high frequency moves ferrum unit and described hyperfrequency moves and is respectively provided with a gold medal on ferrum unit
Belonging to sheet, described sheet metal includes moving ferrum unit beyond described high frequency and described hyperfrequency moves the cantilever end of ferrum unit, described intermediate frequency
Dynamic ferrum unit is fixed between the cantilever end of two described sheet metals.
Wherein in an embodiment, described intermediate frequency moves ferrum unit, high frequency moves ferrum unit and hyperfrequency moves ferrum unit respectively
Constitute a group of connecting with a described electric capacity and form three series connection groups, be connected in parallel between described three series connection groups.
Wherein in an embodiment, described intermediate frequency moves ferrum unit and a described electric capacity constitutes a series connection group；Described
High frequency move ferrum unit and hyperfrequency move ferrum unit parallel connection after constitute another group of connecting again with a described capacitances in series, described one
It is connected in parallel between individual series connection group and another series connection group.
Wherein in an embodiment, described intermediate frequency moves ferrum unit and a described electric capacity constitutes a series connection group；Described
High frequency moves ferrum unit and hyperfrequency moves a described electric capacity of connecting between ferrum unit and constitutes another series connection group, one series connection group
And be connected in parallel between another series connection group.
A kind of earphone, including the dynamic swage group of any of the above-described, moving-coil unit and housing；Described moving-coil unit and dynamic swage
Group is housed in described housing, and described housing includes the base with sound guide tube and is arranged on the top cover on described base, described
High frequency moves ferrum unit and hyperfrequency moves ferrum unit and is arranged in described sound guide tube.
Wherein in an embodiment, described high frequency moves ferrum unit and hyperfrequency move ferrum unit go out sound mouth near described in lead
The sender of sound tube；Described intermediate frequency moves the sound mouth that outes of of ferrum unit and is arranged on the side of the sender of described sound guide tube.
Dynamic swage group that this utility model provides and earphone, move ferrum unit, high frequency moves ferrum unit and hyperfrequency moves by intermediate frequency
Ferrum unit fixed Combination together, simplifies assemble flow, improves efficiency of assembling, and structure is compacter, each dynamic ferrum unit it
Between position will not change, it is ensured that the concordance of the audio curve of dynamic ferrum unit.Each dynamic ferrum unit is made in the filtering of electric capacity
Under with, intermediate frequency, high frequency and the most well-bedded accurate reproduction of hyperfrequency acoustical signal, the frequency range that the sound being reduced is comprised is more
Add abundant, the great third dimension of sound making earphone send and stereovision, it is rich in emotion and vitality, it is ensured that the overall sound quality of sound
Effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of swage group；
Fig. 2 is the circuit structure diagram that an embodiment moves swage group；
Fig. 3 is the circuit structure diagram that another embodiment moves swage group；
Fig. 4 is the circuit structure diagram that another embodiment moves swage group；
Fig. 5 is the decomposition texture schematic diagram of earphone；
Fig. 6 is the integral installation distribution structure schematic diagram of earphone；
Fig. 7 is the partial structurtes schematic diagram of earphone.
Detailed description of the invention
For the ease of understanding this utility model, below with reference to relevant drawings, this utility model is more fully retouched
State.Accompanying drawing gives better embodiment of the present utility model.But, this utility model can come in many different forms
Realize, however it is not limited to embodiments described herein.On the contrary, providing the purpose of these embodiments is to make to this practicality newly
It is more thorough comprehensive that the disclosure of type understands.
It should be noted that when element is referred to as " being fixed on " another element, and it can be directly on another element
Or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can be to be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " interior ", " outward ", "left", "right" and
For illustrative purposes only, being not offered as is unique embodiment in similar statement.
Simultaneously refering to Fig. 1 to Fig. 4, a kind of dynamic swage group 10, move including electric capacity 400 and fixed Combination intermediate frequency together
Ferrum unit 300, high frequency move ferrum unit 100 and hyperfrequency moves ferrum unit 200.Intermediate frequency moves ferrum unit 300, high frequency moves ferrum unit 100
Be respectively arranged with circuit board on the one side that hyperfrequency moves ferrum unit 200, electric capacity 400 electrically connects with circuit board, electric capacity 400
Quantity can be two, it is also possible to is three, and electric capacity 400 can be connected with circuit board by wire, it is also possible to passes through Laser Welding
The mode connect is directly anchored on circuit board.
Concrete, intermediate frequency moves ferrum unit 300, high frequency moves ferrum unit 100 or hyperfrequency moves ferrum unit 200 and is cylindricality knot
Structure, high frequency moves ferrum unit 100 and hyperfrequency moves the vibrating diaphragm front facet 110 of ferrum unit 200 and is mutually close to connect, vibrating diaphragm front facet
110 are that intermediate frequency moves ferrum unit 300, high frequency moves ferrum unit 100 or hyperfrequency moves parallel with vibrating diaphragm on ferrum unit 200 and and vibrating diaphragm
The shortest one side of spacing, this side is rectangular surfaces, and high frequency moves ferrum unit 100 and hyperfrequency moves the two of ferrum unit 200
By glueing joint or fixing connection by the way of welding between individual vibrating diaphragm front facet 110.
When dynamic swage group 10 works, move ferrum unit 100 due to high frequency and hyperfrequency moves the vibrating diaphragm front facet of ferrum unit 200
110 are close to connect, so that two vibrating diaphragms are oppositely arranged, when vibrating diaphragm drives high frequency to move ferrum unit 100 and hyperfrequency moves ferrum unit
During 200 vibration itself, both vibrations can be cancelled out each other, and reduces each dynamic ferrum unit self vibration interference to sound, improves
The acoustical quality of dynamic swage group 10.
High frequency moves ferrum unit 100 and hyperfrequency moves end face vertical with vibrating diaphragm front facet 110 on ferrum unit 200 and is respectively provided with
Having sound mouth 210, when high frequency moves ferrum unit 100 and hyperfrequency moves the 200 fixing connection of ferrum unit, both go out sound mouth 210 institute
End face the most concordant, in other words, these both ends of the surface are located in the same horizontal plane, and so can guarantee that out that sound mouth 210 is respectively at height
It is essentially identical that the dynamic ferrum unit 100 of frequency and hyperfrequency move location on ferrum unit 200.
High frequency moves ferrum unit 100 and/or hyperfrequency moves the sheet metal 310 being provided with strip on ferrum unit 200, sheet metal
The quantity of 310 can be one or two, and one end of sheet metal 310 is fixed on high frequency and moves ferrum unit 100 and/or hyperfrequency and move
On ferrum unit 200, the other end of sheet metal 310 is cantilever end (i.e. free end), and intermediate frequency moves ferrum unit 300 and is then fixed on sheet metal
On the cantilever end of 310, namely away from the one end going out sound mouth 210.Intermediate frequency moves the sound mouth that outes of of ferrum unit 300 and is positioned at towards high frequency dynamic
Ferrum unit 100 or hyperfrequency move on the side of ferrum unit 200 so that intermediate frequency moves ferrum unit 300, high frequency moves ferrum unit 100 and surpasses
The pronunciation direction going out sound mouth 210 that high frequency moves on ferrum unit 200 keeps consistent substantially.
Refering to Fig. 2, in an embodiment, intermediate frequency moves ferrum unit 300, high frequency moves ferrum unit 100 and hyperfrequency moves ferrum unit 200
Constitute a group of connecting with an electric capacity 400 respectively, be connected in parallel between three series connection groups.Three electric capacity 400 can be respectively welded
Move ferrum unit 300 at intermediate frequency, high frequency moves ferrum unit 100 and hyperfrequency moves on the circuit board of ferrum unit 200, and electric capacity 400 can use
Patch capacitor, after making combination, the structure of dynamic swage group 10 is compacter, simplifies the control circuit of dynamic swage group 10, uses simpler
Folk prescription is just.Due to the filter action of electric capacity 400, sound intermediate frequency signal is moved ferrum unit 300 by intermediate frequency and reduces, high-frequency sound signal by
High frequency moves ferrum unit 100 and reduces, and hyperfrequency acoustical signal is moved ferrum unit 200 by hyperfrequency and reduces.When high frequency moves ferrum unit 100 He
Hyperfrequency move the low frequency energy difference of ferrum unit 200 bigger time, by moving ferrum unit 100 and hyperfrequency moves ferrum unit at high frequency
200 above one electric capacity 400 of series connection the most respectively, filter high frequency and move the low frequency of ferrum unit 100 and hyperfrequency moves the low of ferrum unit 200
Frequently so that high frequency moves the low frequency of ferrum unit 100 and hyperfrequency moves the low frequency between ferrum unit 200 and will not interfere, and sound is listened
Stereovision of getting up is higher, and details is more rich, effectively strengthens third dimension and the fidelity of sound.
Refering to Fig. 3, in another embodiment, intermediate frequency moves ferrum unit 300 and constitutes a group of connecting with an electric capacity 400；High frequency
Dynamic ferrum unit 100 and hyperfrequency are connected with in series another of electric capacity 400 after moving ferrum unit 200 parallel connection group again, and these are two years old
It is connected in parallel between individual series connection group.When high frequency moves ferrum unit 100 and hyperfrequency moves the low frequency energy of ferrum unit 200 and is more or less the same
Time, move, by high frequency, an electric capacity 400 of connecting again after ferrum unit 100 moves ferrum unit 200 parallel connection with hyperfrequency, filter high frequency
The low frequency of dynamic ferrum unit 100 and hyperfrequency move the low frequency of ferrum unit 200.Because high frequency moves ferrum unit 100 and hyperfrequency moves ferrum list
The low frequency energy of unit 200 is similar, so, an electric capacity 400 just can allow sound sound that stereovision is higher, and details is more rich.
Refering to Fig. 4, in another embodiment, intermediate frequency moves ferrum unit 300 and constitutes a group of connecting with an electric capacity 400；High frequency
Dynamic ferrum unit 100 and hyperfrequency move an electric capacity 400 of connecting between ferrum unit 200 and constitute another series connection group, two series connection groups it
Between be connected in parallel.High frequency being moved ferrum unit 100 and hyperfrequency moves after ferrum unit 200 is together in series, high frequency moves ferrum unit 100 He
Hyperfrequency moves the voltage that ferrum unit 200 bears will reduce half, and such high frequency moves ferrum unit 100 and hyperfrequency moves ferrum unit 200
Distortion will reduce, make the high frequency detail in sound more rich.
Simultaneously refering to Fig. 5, Fig. 6 and Fig. 7, this utility model also provides for a kind of earphone, and this earphone includes above-mentioned being previously mentioned
Dynamic swage group 10, this earphone also includes that housing and moving-coil unit 700, moving-coil unit 700 and dynamic swage group 10 are installed in housing
In, housing includes base 500 and top cover 600, and top cover 600 is fixed on base 500, and top cover 600 and base 500 surround shell jointly
The inner chamber of body.Being provided with sound guide tube 510 on base 500, the sound that dynamic swage group 10 and moving-coil unit 700 are sent is from sound guide tube
510 input human ear, moving-coil unit 700 is provided with the audio transmission line 800 connected with external device.Acoustical signal passes from audio frequency
Defeated line 800 enters in housing, reduces through dynamic swage group 10 and moving-coil unit 700, and the sound after reduction is through sound guide tube 510
Sender 511 enters human ear.
Before earphone assembles, dynamic swage group 10 individually produces manufacture, and in headphone set process of assembling, dynamic swage group 10 is as one
Individual entirety is directly loadable in housing rather than single is fixed combination in housing, so can simplify assemble flow, ensure
Improving efficiency of assembling on the basis of assembling quality, the position between each dynamic ferrum unit will not change, it is ensured that dynamic ferrum unit
Audio curve concordance is more preferable.High frequency moves ferrum unit 100 and hyperfrequency moves ferrum unit 200 and is all contained in sound guide tube 510, due to
High frequency and hyperfrequency acoustical signal, close to straightline propagation, are easily subject to the stop of barrier, and propagation distance is limited, therefore, and high frequency
What dynamic ferrum unit 100 and hyperfrequency moved ferrum unit 200 goes out the sound mouth 210 sender 511 near sound guide tube 510, is so avoided that
There is decay or the phenomenon of distortion in the reflection of housing endogenous cause of ill in high frequency and hyperfrequency acoustical signal, it is ensured that the overall sound quality of earphone.
When dynamic swage group 10 assembles, intermediate frequency moves the sound mouth that outes of of ferrum unit 300 and is positioned at and moves ferrum unit 100 or superelevation towards high frequency
On the side of the dynamic ferrum unit 200 of frequency, when dynamic swage group 10 loads in the housing of earphone, intermediate frequency moves and goes out sound mouth on ferrum unit 300
The side at place is just towards the sender 511 of sound guide tube 510, and in other words, intermediate frequency moves ferrum unit 300, high frequency moves ferrum unit 100
Move with hyperfrequency and go out sound mouth all towards the sender 511 of sound guide tube 510, even if intermediate frequency moves ferrum unit 300 on ferrum unit 200
Going out sound mouth distant from the sender 511 of sound guide tube 510, sound intermediate frequency signal also will not produce decay because of reflection.
Installing dynamic swage group 10 in earphone, dynamic swage group 10 is responsible for reduction intermediate frequency, high frequency and ultra-high frequency signal, moving-coil unit
700 reduction low frequency sound signals, it is ensured that the acoustical signal of each frequency range all will not distortion, the frequency range that the sound being reduced is comprised
Abundanter, improve stereovision and the third dimension of headphones sound, sound is rich in emotion and vitality, it is ensured that the overall sound of sound
Matter effect.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed several embodiments of the present utility model, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that, for the common skill of this area
For art personnel, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these broadly fall into
Protection domain of the present utility model.Therefore, the protection domain of this utility model patent should be as the criterion with claims.
Claims (10)
1. a dynamic swage group, it is characterised in that include the electric capacity for filtering and be fixed together and be respectively equipped with circuit board
Intermediate frequency move ferrum unit, high frequency moves ferrum unit and hyperfrequency moves ferrum unit, described electric capacity electrically connects with described circuit board.
Dynamic swage group the most according to claim 1, it is characterised in that described high frequency moves ferrum unit and hyperfrequency moves ferrum unit
Vibrating diaphragm front facet mutually be close to connect.
Dynamic swage group the most according to claim 1, it is characterised in that described high frequency moves ferrum unit and hyperfrequency moves ferrum unit
On to be provided with out the end face of sound mouth the most concordant.
Dynamic swage group the most according to claim 3, it is characterised in that be additionally provided with fixing described high frequency and move ferrum unit and institute
Stating hyperfrequency and move the sheet metal of ferrum unit, described intermediate frequency moves ferrum unit and is fixed on described sheet metal and moves ferrum list away from described high frequency
First and/or described hyperfrequency moves one end going out sound mouth of ferrum unit.
Dynamic swage group the most according to claim 4, it is characterised in that described high frequency moves ferrum unit and described hyperfrequency moves ferrum
Being respectively provided with a sheet metal on unit, described sheet metal includes moving ferrum unit beyond described high frequency and described hyperfrequency moves ferrum unit
Cantilever end, described intermediate frequency moves between the cantilever end that ferrum unit is fixed on two described sheet metals.
Dynamic swage group the most according to claim 1, it is characterised in that described intermediate frequency moves ferrum unit, high frequency moves ferrum unit and
Hyperfrequency moves ferrum unit and constitutes a group of connecting respectively with described electric capacity and form three series connection groups, described three series connection groups it
Between be connected in parallel.
Dynamic swage group the most according to claim 1, it is characterised in that described intermediate frequency moves ferrum unit and a described electric capacity structure
Become a series connection group；Described high frequency moves ferrum unit and hyperfrequency move ferrum unit parallel connection after constitute with a described capacitances in series again
Another series connection group, is connected in parallel between one series connection group and another series connection group.
Dynamic swage group the most according to claim 1, it is characterised in that described intermediate frequency moves ferrum unit and a described electric capacity structure
Become a series connection group；Described high frequency moves ferrum unit and hyperfrequency moves a described electric capacity of connecting between ferrum unit and constitutes another series connection
Group, is connected in parallel between one series connection group and another series connection group.
9. an earphone, it is characterised in that include the dynamic swage group according to any one of claim 1 to 8, moving-coil unit and shell
Body；Described moving-coil unit and dynamic swage group are housed in described housing, and described housing includes the base with sound guide tube and installs
Top cover on described base, described high frequency moves ferrum unit and hyperfrequency moves ferrum unit and is arranged in described sound guide tube.
Earphone the most according to claim 9, it is characterised in that described high frequency moves ferrum unit and hyperfrequency moves ferrum unit
Go out the sound mouth sender near described sound guide tube；Described intermediate frequency moves the sound mouth that outes of of ferrum unit and is arranged on going out towards described sound guide tube
On the side of sound hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620586916.4U CN205864742U (en) | 2016-06-15 | 2016-06-15 | Dynamic swage group and earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620586916.4U CN205864742U (en) | 2016-06-15 | 2016-06-15 | Dynamic swage group and earphone |
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| Publication Number | Publication Date |
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| CN205864742U true CN205864742U (en) | 2017-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620586916.4U Active CN205864742U (en) | 2016-06-15 | 2016-06-15 | Dynamic swage group and earphone |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156547A (en) * | 2017-12-04 | 2018-06-12 | 深圳倍声声学技术有限公司 | A kind of TWS earphones |
| WO2020103757A1 (en) * | 2018-11-22 | 2020-05-28 | 比亚迪股份有限公司 | Sound production module and electronic device |
-
2016
- 2016-06-15 CN CN201620586916.4U patent/CN205864742U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156547A (en) * | 2017-12-04 | 2018-06-12 | 深圳倍声声学技术有限公司 | A kind of TWS earphones |
| CN108156547B (en) * | 2017-12-04 | 2023-09-12 | 深圳市长盈精密技术股份有限公司 | TWS earphone |
| WO2020103757A1 (en) * | 2018-11-22 | 2020-05-28 | 比亚迪股份有限公司 | Sound production module and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 35th floor, block a, Tanglang City, 3333 Liuxian Avenue, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Wanmo acoustics Co.,Ltd. Address before: 518000 14th floor, east block, Tianliao building, Tanglang primary school, Xili Xueyuan Avenue, Nanshan District, Shenzhen City, Guangdong Province Patentee before: 1MORE Inc. |
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| CP03 | Change of name, title or address |