CN205847808U - High heat conduction engineering fin - Google Patents
High heat conduction engineering fin Download PDFInfo
- Publication number
- CN205847808U CN205847808U CN201620428089.6U CN201620428089U CN205847808U CN 205847808 U CN205847808 U CN 205847808U CN 201620428089 U CN201620428089 U CN 201620428089U CN 205847808 U CN205847808 U CN 205847808U
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- Prior art keywords
- heat
- fin
- conducting plate
- high heat
- heat conduction
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Abstract
This utility model discloses a kind of high heat conduction engineering fin, and including heat-conducting plate and base, described heat-conducting plate is fixed in the end face of described base, and described heat-conducting plate is orthogonal with described base, and described heat-conducting plate and described base all use high heat-conducting plastic to be made.This high heat conduction engineering fin cost of manufacture is low, has high thermal conductivity, is easily installed on the various electronic component needing heat conduction, and anti-tampering ability is strong.
Description
Technical field
This utility model relates to the technical field of radiator, particularly relates to a kind of high heat conduction engineering fin.
Background technology
Fin is a kind of device dispelled the heat to the easy heat-generating electronic elements in electrical equipment, how by aluminium alloy, pyrite or bronze
Make tabular, lamellar, splintery etc., as in computer, cpu central processing unit to use sizable fin, power supply in television set
Pipe, line pipe, the power tube in amplifirer will use fin.General fin in use will be at electronic component and fin
Contact surface is coated with last layer heat-conducting silicone grease, and the heat making electronic component send more effectively is transmitted on fin, then through fin
It is dispersed in surrounding air.The most conventional fin material is copper and aluminium alloy, and the two is respectively arranged with its pluses and minuses.The heat conduction of copper
Property is good, but expensive, and difficulty of processing is higher, weight excessive (a lot of fine copper radiators have been above CPU counterweight quantitative limitation),
Thermal capacity is less, and easily aoxidizes.And fine aluminium is too soft, it is impossible to directly use, it is all that the aluminium alloy used just is provided that enough
Hardness, the advantage of aluminium alloy is cheap, lightweight, but heat conductivity will be far short of what is expected than copper.Dissipating of existing fin
Thermal effect is the most inconspicuous, the most often along with interference signal, disturbs the normal work of electronic component.
Utility model content
A purpose of the present utility model is: provide a kind of high heat conduction engineering fin, this high heat conduction engineering fin
Cost of manufacture is low, has high thermal conductivity, is easily installed on the various electronic component needing heat conduction, and anti-tampering ability is strong.
For reaching this purpose, this utility model by the following technical solutions:
A kind of high heat conduction engineering fin, including heat-conducting plate and base, described heat-conducting plate is fixed in the end face of described base,
Described heat-conducting plate is orthogonal with described base, and described heat-conducting plate and described base all use high heat-conducting plastic to be made.
Wherein, the bottom surface of described base is provided with square groove, and described square groove is arranged at the bottom surface of described base
Center.
Wherein, described square groove being provided with circular patch, described circular patch is just being arranged at described square groove
Center, described circular patch is affixed with described square groove.
Concrete, described circular patch includes heat-conducting pad, protection sheet, between described heat-conducting pad and described protection sheet also
It is provided with thermal conductive adhesive.
Concrete, described heat-conducting pad and thermal conductive adhesive are respectively provided with elasticity.
Preferably, described high heat-conducting plastic is PA6 nylon.
Preferably, described heat-conducting plate be shaped as cuboid, two sides adjacent between described heat-conducting plate is parallel to each other.
Wherein, the quantity of described heat-conducting plate is 21.
The beneficial effects of the utility model are: provide a kind of high heat conduction engineering fin, including heat-conducting plate and base, described
Heat-conducting plate is fixed in the end face of described base, and described heat-conducting plate is orthogonal with described base, described heat-conducting plate and described base
High heat-conducting plastic is all used to be made.This high heat conduction engineering fin cost of manufacture is low, has high thermal conductivity, convenient installation
On the various electronic components needing heat conduction, anti-tampering ability is strong.
Accompanying drawing explanation
Below according to drawings and Examples, this utility model is described in further detail.
Fig. 1 is the left view of the high heat conduction engineering fin described in embodiment；
Fig. 2 is the front view of the high heat conduction engineering fin described in embodiment；
Fig. 3 is the top view of the high heat conduction engineering fin described in embodiment；
Fig. 4 is the upward view of the high heat conduction engineering fin described in embodiment.
In Fig. 1 to Fig. 4:
1, heat-conducting plate；2, base；3, circular patch；4, square groove.
Detailed description of the invention
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by detailed description of the invention.
As shown in figures 1-4, in the present embodiment, a kind of high heat conduction engineering fin, including heat-conducting plate 1 and base 2, institute
Stating heat-conducting plate 1 and be fixed in the end face of described base 2, described heat-conducting plate 1 is orthogonal with described base 2, described heat-conducting plate 1 and institute
Stating base 2 all uses high heat-conducting plastic to be made.This high heat-conducting plastic has good heat conductivility, reduces from gold in a large number
Belong to the signal disturbing situation caused by material, effectively the normal work of the electronic component of this high heat conduction engineering fin of protection use
Make.
In the present embodiment, the bottom surface of described base 2 is provided with square groove 4, and described square groove 4 is arranged at the described end
The center of the bottom surface of seat 2.
In the present embodiment, described square groove 4 being provided with circular patch 3, described circular patch 3 is arranged at described side
The center of connected in star 4, described circular patch 3 is affixed with described square groove 4.Use this high heat conduction of described circular patch 3
Engineering fin is firmly coupled to each other with the electronic component needing heat radiation.
In the present embodiment, described circular patch 3 includes heat-conducting pad, protection sheet, described heat-conducting pad and described protection
Thermal conductive adhesive it is additionally provided with between paper.
In the present embodiment, described heat-conducting pad and thermal conductive adhesive are respectively provided with elasticity.Elastic heat-conducting pad is with elastic
Thermal conductive adhesive this high heat conduction engineering fin can be made at air spots, have the tightly stickup on the most concavo-convex electronic component of height
Together, the contact area of joint face increases, and heat conductivility is more preferable.
In the present embodiment, described high heat-conducting plastic is PA6 nylon.This material has certain thermostability, can be at 100 degree
Used below, nontoxic, odorless, do not go rotten, have self-extinguishment, good weatherability, good heat conductivity.
In the present embodiment, described heat-conducting plate 1 be shaped as cuboid, two sides adjacent between described heat-conducting plate 1 is mutual
Parallel.Described heat-conducting plate 1 uses this distribution effectively to dispel the heat.
In the present embodiment, the quantity of described heat-conducting plate 1 is 21.
It is to be understood that, above-mentioned detailed description of the invention is only preferred embodiment of the present utility model and institute's application technology
Principle, in technical scope disclosed in the utility model, any those familiar with the art is readily apparent that
Change or replacement, all should contain in protection domain of the present utility model.
Claims (6)
1. one kind high heat conduction engineering fin, it is characterised in that include that heat-conducting plate and base, described heat-conducting plate are fixed in the described end
The end face of seat, described heat-conducting plate is orthogonal with described base, and described heat-conducting plate and described base all use high heat-conducting plastic system
Forming, the bottom surface of described base is provided with square groove, and described square groove is arranged at the center of the bottom surface of described base,
Being provided with circular patch on described square groove, described circular patch is arranged at the center of described square groove, described circle
Paster is affixed with described square groove.
High heat conduction engineering fin the most according to claim 1, it is characterised in that described circular patch includes heat conductive pad
Sheet, protection sheet, be additionally provided with thermal conductive adhesive between described heat-conducting pad and described protection sheet.
High heat conduction engineering fin the most according to claim 2, it is characterised in that described heat-conducting pad and thermal conductive adhesive
It is respectively provided with elasticity.
High heat conduction engineering fin the most according to claim 1, it is characterised in that described high heat-conducting plastic is PA6 nylon.
High heat conduction engineering fin the most according to claim 1, it is characterised in that being shaped as of described heat-conducting plate is rectangular
Body, two sides adjacent between described heat-conducting plate is parallel to each other.
High heat conduction engineering fin the most according to claim 1, it is characterised in that the quantity of described heat-conducting plate is 21.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620428089.6U CN205847808U (en) | 2016-05-11 | 2016-05-11 | High heat conduction engineering fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620428089.6U CN205847808U (en) | 2016-05-11 | 2016-05-11 | High heat conduction engineering fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205847808U true CN205847808U (en) | 2016-12-28 |
Family
ID=57627379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620428089.6U Active CN205847808U (en) | 2016-05-11 | 2016-05-11 | High heat conduction engineering fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205847808U (en) |
-
2016
- 2016-05-11 CN CN201620428089.6U patent/CN205847808U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |