CN205845913U - A kind of exposure structure for crystal round fringes - Google Patents
A kind of exposure structure for crystal round fringes Download PDFInfo
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- CN205845913U CN205845913U CN201620794643.2U CN201620794643U CN205845913U CN 205845913 U CN205845913 U CN 205845913U CN 201620794643 U CN201620794643 U CN 201620794643U CN 205845913 U CN205845913 U CN 205845913U
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Abstract
The utility model discloses a kind of exposure structure for crystal round fringes, including: rotation platform, rotatable around its center axis, its upper surface is used for placing described wafer；Exposure cameras, be directed at below on described rotation platform place wafer by antermarginal position；Support, is arranged at the outside of described rotation platform, is used for fixing described exposure cameras；Wherein, the upper surface of described wafer is coated with negative photoresist, and when described exposure cameras is exposed, described wafer rotates a circle around the central axis of described rotation platform such that it is able to produce ring-shaped platform at described wafer by antermarginal position.Of the present utility model have the technical effect that, electroplate jig is placed at the ring-shaped platform produced by antermarginal position of wafer by exposure cameras, thus solve crystal round fringes pattern and affect problem to electroplate, it is to avoid the generation of the plating plating abnormal phenomena such as side leakage or plating.
Description
Technical field
This utility model relates to a kind of exposure structure for crystal round fringes in salient point encapsulates, and belongs to semiconductor packages skill
Art field.
Background technology
At present, negative photoresist has been widely used in salient point (Bumping) encapsulation technology.Enter stud bump making it
After, need to form a ubm layer (Under-bump Metallurgy in wafer surface；UBM), then golden under salient point
Belong to and on layer, form negative photo glue-line, and expose, be developed to required bump patterns, then form bump solder.
In dry film photoresist layer technique, the support using negative photoresist can form electric insulation layer and subsequent structural is put down
Platform, the purpose of negative photoresist exposure is intended to transfer the pattern onto on photoresist figure layer by radiation source, with the time the shortest
Chien shih photoresist is the most photosensitive, obtains the highest membrane left rate after development.
But, after whole exposing wafer completes, the position at crystal round fringes is left patterns of openings, even if it is clear to do edge
Wash process technique, also can make the photoresist at edge because the existence of pattern and out-of-flatness.Need CRS when follow-up electroplating work procedure
(Contact Ring Seal, Contact Seal ring) tool is pressed on crystal round fringes, and this flatness at edge will result in sealing
Bad, then produce the plating plating abnormal problem such as side leakage or plating.
Utility model content
In view of drawbacks described above or deficiency present in prior art, this utility model provides a kind of for crystal round fringes
Exposure structure, it can effectively solve the problem that the problem that wafer plating is abnormal.
According to one side of the present utility model, it is provided that a kind of exposure structure for crystal round fringes, including: rotary flat
Platform, rotatable around its center axis, its upper surface is used for placing described wafer；Exposure cameras, is directed at described rotary flat below
On platform place wafer by antermarginal position；Support, is arranged at the outside of described rotation platform, is used for fixing described exposure
Camera lens；Wherein, the upper surface of described wafer is coated with negative photoresist, when described exposure cameras is exposed, and described wafer
Central axis around described rotation platform rotates a circle such that it is able to produce ring at described wafer by antermarginal position
Shape platform.
Alternatively, the distance between the edge of described ring-shaped platform and described wafer is set to 1.4+/-0.3mm.
Alternatively, described exposure cameras includes: shell；Luminous source, is arranged at described enclosure, is used for providing light source；
Lens, are arranged at described enclosure, are positioned at the front of described luminous source along the direction that light is propagated；Diaphragm, is arranged at described
The front end of shell, is positioned at the front of described lens, has the ring of an aperture centered by described diaphragm along the direction that light is propagated
Shape blade construction.
Alternatively, the luminous source of described exposure cameras is the light source by fiber optic conduction or is Halogen light.
Alternatively, the outside of the lens of described exposure cameras is provided with snap ring, outside the outer circumference surface of described snap ring is provided with
Screw thread, the inside of described shell is fixed the corresponding position of described lens and is provided with one section of female thread, the upper surface of described snap ring
Diametrically disposed have two grooves.
Alternatively, the shell of described exposure cameras is set to two Split type structures by the mutual tabling of screw thread, described
Mirror is fixed on the inside of one of them Split type structure.
Alternatively, the material of the shell of described exposure cameras is rustless steel or alloy.
Alternatively, the diaphragm of described exposure cameras is iris, and described iris includes: multiple blades, Ding Quan, dynamic
Circle and drive mechanism, described fixed circle is fixed on the front end of described shell, and described moving-coil and drive mechanism are arranged at described shell
Outside is to control the motion of the plurality of blade so that the area of the aperture surrounded between the plurality of blade is variable.
Alternatively, the drive mechanism of described iris is driven by motor.
The beneficial effects of the utility model are, are difficult to the characteristic of development according to negative photoresist, by described exposure after exposing
Light camera lens to place electroplate jig, thus solves wafer limit at the ring-shaped platform produced by antermarginal position of wafer
Edge pattern affects problem to plating, it is to avoid the generation of the plating plating abnormal phenomena such as side leakage or plating.
It is described above in the description of the feature mentioned and feature combination and accompanying drawing below that mention and/or individually shows
Show that feature in the accompanying drawings and feature combination are available, can be used not only in the combination each specified, and can be also used in it
He combines or in single feature, without deviating from scope of the present utility model.
Accompanying drawing explanation
The detailed description to non-limiting example made by referring to the following drawings, other spy of the present utility model
Levy, purpose and advantage will become more apparent upon.Wherein display:
Fig. 1 is the organigram of the exposure structure for crystal round fringes according to embodiment of the present utility model.
Fig. 2 is that the structure for the exposure cameras of the exposure structure of crystal round fringes according to embodiment of the present utility model shows
It is intended to.
Fig. 3 is that the structure for the iris of the exposure structure of crystal round fringes according to embodiment of the present utility model shows
It is intended to.
Fig. 4 is that the exposure structure shown in Fig. 1 is at the ring-shaped platform produced after the exposure of the position of crystal round fringes
Organigram.
Should be appreciated that accompanying drawing is not necessarily drawn to scale, what it presented is the various features of the ultimate principle that the present invention is described
The expression slightly simplified.The specific design feature of the present invention as disclosed herein, including, such as, concrete size, direction,
Position and shape will partly be determined by specific intended application and use environment.
Detailed description of the invention
With embodiment, the application is described in further detail below in conjunction with the accompanying drawings.It is understood that this place is retouched
The specific embodiment stated is used only for explaining relevant utility model, rather than the restriction to this utility model.Further need exist for explanation
, for the ease of describing, accompanying drawing illustrate only the part relevant to utility model.
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can phases
Combination mutually.Describe the application below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
Fig. 1 is the organigram of the exposure structure for crystal round fringes according to embodiment of the present utility model.Such as Fig. 1
Shown in, exposure structure 10 includes: rotation platform 1, rotatable around its center axis, and its upper surface is used for placing described wafer 2；Expose
Light camera lens 3, below alignment rotation platform 1 on place wafer 2 by antermarginal position；Support 4, is arranged at rotation platform
The outside of 1, is used for fixing exposure cameras 3；Wherein, the upper surface of wafer 2 is coated with negative photoresist.
Fig. 2 is that the structure for the exposure cameras of the exposure structure of crystal round fringes according to embodiment of the present utility model shows
It is intended to.As in figure 2 it is shown, exposure cameras 3 includes: shell 100；Luminous source 200, is arranged at shell 100 internal, is used for providing light
Source, luminous source 200 can be by the light source of fiber optic conduction, it is also possible to for Halogen light；Lens 300, are arranged at shell 100 internal,
The front of luminous source 200 it is positioned at along the direction that light is propagated；Diaphragm 400, is arranged at the front end of shell 100, propagates along light
Direction is positioned at the front of lens 300, has the ring-shaped blade structure of an aperture centered by diaphragm 400.
When exposure cameras 3 is exposed, wafer 2 rotates a circle around the central axis of rotation platform 1, luminous source 200
Light is irradiated to the position of the close edge C of wafer 2 through the aperture at lens 300 and diaphragm 400 center, such that it is able to by wafer
Inside 2 edge C, the negative photoresist exposure of one fixed width, can produce crosslinking (Cross after exposure due to negative photoresist
Linking) reaction so that it is structural strengthening and be not dissolved in developer solution, so the part that negative photoresist is exposed can not be shown
Shadow falls and obtains approximately perpendicular photoresist sidewall and controlled live width such that it is able in the position of the close edge C of wafer 2
Producing ring-shaped platform A, the feature sizes of ring-shaped platform A is relevant with the aperture size of the aperture at diaphragm 400 center.Diaphragm 400
Ring-shaped blade then the light being close to the two side portions of this ring-shaped platform A is blocked, the part blocked will developed fall.Ring
Distance between shape platform A and the edge C of wafer 2 is traditionally arranged to be 1.4+/-0.3mm, with specific reference to size and the reality of wafer
Depending on process condition.
As in figure 2 it is shown, the outside of the lens 300 of exposure cameras 3 is fixed with snap ring 301, the outer circumference surface of snap ring 301 is arranged
The corresponding position having external screw thread, the inside of shell 100 to fix lens 300 is provided with one section of female thread.It addition, snap ring 301
Upper surface is diametrically disposed two groove B, two that special instrument stretches into inside shell 100 and inserts snap ring 301
To rotate relative to shell 100 in groove B, lens 300 can be manually adjusted in the position within shell 100, such that it is able to
Adjust the distance between lens 300 and luminous source 200, diaphragm 400.
As the optional embodiment of one, the shell 100 of exposure cameras 3 is disposed through the mutual tabling of screw thread
Two Split type structures, lens 300 are fixed on the inside of one of them Split type structure, can relatively turning by two Split type structures
Move the distance adjusted between lens 300 and luminous source 200, diaphragm 400.The material of shell 100 is rustless steel or alloy.
As the optional embodiment of one, the diaphragm 400 of exposure cameras 3 could be arranged to iris 400 '.Fig. 3 is
The organigram of the iris of the exposure structure for crystal round fringes according to embodiment of the present utility model.Such as Fig. 3 institute
Showing, iris 400 ' includes multiple blade 401, surely encloses 402, moving-coil 403 and drive mechanism 404.Wherein, circle 402 is solid surely
It is arranged at the outside of shell 100 to control the motion of blade 401 due to the front end of shell 100, moving-coil 403 and drive mechanism 404.
When hand rotation drive mechanism 404, drive moving-coil 403 move radially, blade 401 also concomitant rotation, multiple blades 401 it
Between the area of aperture that surrounds will change, thus change the relative aperture value of lens 300, therefore, it can regulation and pass through
The intensity of illumination of the light beam of this aperture and illumination zone.
As the optional embodiment of one, the drive mechanism 404 of iris 400 ' can by motor drive from
The dynamic relative aperture value adjusting lens 300.Due to the ripe design that the overall structure of iris 400 ' is prior art, herein
Repeat no more.
Fig. 4 is that the exposure structure shown in Fig. 1 is at the ring-shaped platform produced after the exposure of the position of crystal round fringes
Organigram.As shown in Figure 4, after the edge C of wafer 2 exposes, the exposed and developed of whole wafer is carried out, so, rear
During continuous electroplating work procedure, can CRS tool 5 be tightly suppressed at the ring-shaped platform A of wafer 2, to avoid the out-of-flatness of wafer 2 edge C
Part, thus solve crystal round fringes pattern and affect problem to electroplate.
This utility model is difficult to the characteristic of development according to negative photoresist after exposing, by described exposure cameras at wafer
The ring-shaped platform produced by antermarginal position is to place electroplate jig, thus solves crystal round fringes pattern to plating
Affect problem, it is to avoid the generation of the plating plating abnormal phenomena such as side leakage or plating.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that utility model scope involved in the application, however it is not limited to the particular combination of above-mentioned technical characteristic
Technical scheme, also should contain in the case of conceiving without departing from described utility model simultaneously, by above-mentioned technical characteristic or its equivalent
Other technical scheme that feature carries out combination in any and formed.Such as features described above has with (but not limited to) disclosed herein
The technical scheme that the technical characteristic having similar functions is replaced mutually and formed.
Claims (9)
1. the exposure structure for crystal round fringes, it is characterised in that described exposure structure includes:
Rotation platform, rotatable around its center axis, its upper surface is used for placing described wafer；
Exposure cameras, be directed at below on described rotation platform place wafer by antermarginal position；
Support, is arranged at the outside of described rotation platform, is used for fixing described exposure cameras；
Wherein, the upper surface of described wafer is coated with negative photoresist, when described exposure cameras is exposed, described wafer around
The central axis of described rotation platform rotates a circle such that it is able to produce annular at described wafer by antermarginal position
Platform.
Exposure structure the most according to claim 1, it is characterised in that between the edge of described ring-shaped platform and described wafer
Distance be set to 1.4+/-0.3mm.
Exposure structure the most according to claim 1, it is characterised in that described exposure cameras includes:
Shell；
Luminous source, is arranged at described enclosure, is used for providing light source；
Lens, are arranged at described enclosure, are positioned at the front of described luminous source along the direction that light is propagated；
Diaphragm, is arranged at the front end of described shell, is positioned at the front of described lens along the direction that light is propagated, during described diaphragm is
The heart has the ring-shaped blade structure of an aperture.
Exposure structure the most according to claim 3, it is characterised in that the luminous source of described exposure cameras is by fiber optic conduction
Light source or be Halogen light.
Exposure structure the most according to claim 3, it is characterised in that the outside of the lens of described exposure cameras is provided with card
Ring, the outer circumference surface of described snap ring is provided with external screw thread, and the inside of described shell is fixed the corresponding position of described lens and arranged
Having one section of female thread, the upper surface of described snap ring is diametrically disposed two grooves.
Exposure structure the most according to claim 3, it is characterised in that the shell of described exposure cameras is set to pass through screw thread
Two Split type structures of tabling mutually, described lens are fixed on the inside of one of them Split type structure.
Exposure structure the most according to claim 3, it is characterised in that the sheathing material of described exposure cameras be rustless steel or
Person's alloy.
8. according to the exposure structure described in any one of claim 3 or 7, it is characterised in that the diaphragm of described exposure cameras is can
Darkening door screen, comprising: multiple blade, Ding Quan, moving-coil and drive mechanism, described fixed circle is fixed on the front end of described shell, described
Moving-coil and drive mechanism are arranged at the outside of described shell to control the motion of the plurality of blade so that the plurality of blade it
Between the area of aperture that surrounds be variable.
Exposure structure the most according to claim 8, it is characterised in that the drive mechanism of described iris is driven by motor
Dynamic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620794643.2U CN205845913U (en) | 2016-07-26 | 2016-07-26 | A kind of exposure structure for crystal round fringes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620794643.2U CN205845913U (en) | 2016-07-26 | 2016-07-26 | A kind of exposure structure for crystal round fringes |
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| Publication Number | Publication Date |
|---|---|
| CN205845913U true CN205845913U (en) | 2016-12-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620794643.2U Active CN205845913U (en) | 2016-07-26 | 2016-07-26 | A kind of exposure structure for crystal round fringes |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106950801A (en) * | 2017-04-16 | 2017-07-14 | 合肥芯碁微电子装备有限公司 | A kind of rapid edge exposure method without mask laser direct-write photoetching equipment |
| CN108227403A (en) * | 2018-01-03 | 2018-06-29 | 业成科技（成都）有限公司 | Expose rotating jig |
| CN110068989A (en) * | 2018-01-23 | 2019-07-30 | 上海微电子装备（集团）股份有限公司 | Silicon wafer processing unit and method |
| CN114217508A (en) * | 2021-12-06 | 2022-03-22 | 江苏芯德半导体科技有限公司 | Method for processing wafer edge in photoetching-exposure process |
-
2016
- 2016-07-26 CN CN201620794643.2U patent/CN205845913U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106950801A (en) * | 2017-04-16 | 2017-07-14 | 合肥芯碁微电子装备有限公司 | A kind of rapid edge exposure method without mask laser direct-write photoetching equipment |
| CN108227403A (en) * | 2018-01-03 | 2018-06-29 | 业成科技（成都）有限公司 | Expose rotating jig |
| CN110068989A (en) * | 2018-01-23 | 2019-07-30 | 上海微电子装备（集团）股份有限公司 | Silicon wafer processing unit and method |
| CN114217508A (en) * | 2021-12-06 | 2022-03-22 | 江苏芯德半导体科技有限公司 | Method for processing wafer edge in photoetching-exposure process |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |