CN205828442U - A kind of packaging system - Google Patents
A kind of packaging system Download PDFInfo
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- CN205828442U CN205828442U CN201620808326.1U CN201620808326U CN205828442U CN 205828442 U CN205828442 U CN 205828442U CN 201620808326 U CN201620808326 U CN 201620808326U CN 205828442 U CN205828442 U CN 205828442U
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- display device
- substrate
- packaging system
- supersonic generator
- microscope carrier
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Abstract
This utility model provides a kind of packaging system, for encapsulating display device, described display device includes the first substrate put and second substrate relatively, and the target implant being filled between first substrate and second substrate, and described packaging system includes: microscope carrier and supersonic generator；The loading end of described microscope carrier and the first substrate of described display device or second substrate are fitted；Described supersonic generator is arranged on described microscope carrier and deviates from the side of described display device, and the ultrasonic wave range that described supersonic generator sends covers described target implant, so that described target implant is accelerated to merge.This utility model can speed up the fusion of target implant, so that the target implant in the display device of encapsulation forms a uniform entirety, eliminates the contact inhomogeneities between target implant, thus improves the display performance of display device.
Description
Technical field
This utility model relates to display device encapsulation technology field, particularly relates to a kind of packaging system.
Background technology
In existing Display Technique, organic light-emitting diode display (Organic Light Emitting Diode,
The plurality of advantages such as OLED), low-power consumption frivolous with it, high-contrast, high colour gamut and Flexible Displays, are increasingly becoming display of future generation
The development trend of device.Packaging system is for preparing the important research and development of each functional layer film during OLED shows and production equipment, it
It is widely used in many organic photoelectric fields such as organic solar batteries (OPV), organic field effect tubes (OFET) simultaneously.
Due to the characteristic of organic material, after contacting with outside steam and oxygen, the characteristics of luminescence of OLED can be deteriorated, therefore
Must be packaged in the OLED display device of preparation.In existing various encapsulation technology, Dam&Fill encapsulation technology is mesh
Front a kind of common technology that OLED display device is packaged.
As it is shown in figure 1, Dam&Fill encapsulation technology is filled 3 glue of glue filler use the scheme got ready, this
Sample, between different filler glue points and not in contact with, during to box, as in figure 2 it is shown, along with the increasing of pressing pressure
Greatly, the spacing between first substrate 1 and second substrate 5 diminishes, and fills glue filler 3 and is pressed off, and gradually with the filling of surrounding
Glue filler 3 contacts；Along with the further reduction of spacing, adjacent filling glue filler 3 the most slowly converges to finally
Form whole complete filling glue filler 3.But owing to filling the waiting time after the viscosity of glue filler 3, some glue
And the impact of the bubble of residual between array base palte and base plate for packaging before pressing, as it is shown on figure 3, after box is completed, no
Merge the most completely between same filler glue point, but define obvious demarcation line, on microcosmic between glue point and glue point
Being exactly a concealed wire, so display screen shows when, corresponding region arises that many tetragonal grid-like showing
Showing inequality, we are referred to as gridiron pattern mura.This display inequality affects the display effect of display very much, reduces yield.And
In liquid crystal display manufacture field, after liquid crystal drip-injection to box during, it is also possible to occur liquid crystal skewness phenomenon.
Utility model content
For the defect of prior art, this utility model provides a kind of packaging system, it is possible to solve in prior art box
After encapsulation, in display device, implant between two substrates cannot fully merge or the problem of skewness.
First aspect, this utility model provides a kind of packaging system, is used for encapsulating display device, described display device bag
Include the first substrate put and second substrate relatively, and the target implant being filled between first substrate and second substrate,
Described packaging system includes: microscope carrier and supersonic generator；
The loading end of described microscope carrier and the first substrate of described display device or second substrate are fitted；
Described supersonic generator is arranged on described microscope carrier and deviates from the side of described display device, described supersonic generator
The ultrasonic wave range sent covers described target implant, so that described target implant is accelerated to merge.
Preferably, described supersonic generator includes: at least one ultrasonic oscillator.
Preferably, described ultrasonic oscillator is multiple；
The one side that the plurality of ultrasonic oscillator is relative with described loading end on described microscope carrier is equidistantly intervally arranged.
Preferably, described supersonic generator includes: at least one ultrasound wave shake plate.
Preferably, described ultrasound wave shake plate is multiple；
The one side that the plurality of ultrasound wave shake plate is relative with described loading end on described microscope carrier is equidistantly intervally arranged.
Preferably, described supersonic generator sends the ultrasound wave of predeterminated frequency and predetermined power.
Preferably, described supersonic generator sends the ultrasound wave that frequency is gradually increased with target implant fusion degree.
Preferably, described display device is Organic Light Emitting Diode OLED display device；
Described target implant is the filling glue filler being filled between described first substrate and described second substrate.
Preferably, described display device is liquid crystal display device；
Described target implant is the liquid crystal being filled between described first substrate and described second substrate.
Preferably, described packaging system also includes: baric systerm；
Described baric systerm is arranged on described microscope carrier and carries the side of display device, for by the of described display device
One substrate and second substrate pressing.
As shown from the above technical solution, the packaging system that this utility model provides, by deviating from display device at microscope carrier
Side arranges supersonic generator, and the ultrasonic wave range that described supersonic generator sends covers described target implant, then exist
Display device encapsulation process sends the ultrasound wave source as the strongest vibrational energy, to improve the dispersion speed of target implant
Degree, accelerates the fusion of target implant, so that the target implant formation one in the display device of encapsulation is uniform whole
Body, eliminates the contact inhomogeneities between target implant, thus eliminates the chessboard trellis mura in actual displayed, improves display
The display performance of part.
For prior art, this utility model can be applied not only to OLED display device encapsulation technology, also may be used
It is applied to liquid crystal drip-injection integration field in liquid crystal display device manufacture process.Solve OLED display device envelope in prior art
Fill during dress between glue filler glue point and cannot merge completely, and the demarcation line between glue point and glue point makes display device show
Uneven, additionally it is possible to when solving liquid crystal display device manufacture, liquid crystal drip-injection is to liquid crystal skewness contingent during box
Problem.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only
It is embodiments more of the present utility model, for those of ordinary skill in the art, in the premise not paying creative work
Under, it is also possible to other accompanying drawing is obtained according to these figures.
Fig. 1 is Filler glue point glue schematic diagram in Dam&Fill encapsulation technology in prior art；
Fig. 2 is the existing encapsulation cross-sectional view to box structure；
Fig. 3 is the existing encapsulation plan structure schematic diagram to box structure；
Fig. 4 is the structural representation of a kind of packaging system that this utility model one embodiment provides；
Fig. 5 is the structural representation of a kind of packaging system that another embodiment of this utility model provides；
Fig. 6 is the vertical view effect schematic diagram of a kind of packaging system that another embodiment of this utility model provides；
Description of symbols in Fig. 1～Fig. 6: 1-first substrate；2-sealed plastic box；3-fills glue filler；4-OLED device；5-
Second substrate；6-microscope carrier；7-pressure；8-ultrasonic oscillator；9-ultrasound wave shake plate.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
This utility model one embodiment provides a kind of packaging system, and this packaging system is used for encapsulating display device, described
Display device includes the first substrate put and second substrate relatively, and the mesh being filled between first substrate and second substrate
Mark implant.Described packaging system includes: microscope carrier and supersonic generator.
Wherein, the loading end of described microscope carrier is fitted with first substrate or the second substrate of described display device.
Described supersonic generator is arranged on described microscope carrier and deviates from the side of described display device, described supersonic generator
The ultrasonic wave range sent covers described target implant, so that described target implant is accelerated to merge.
As can be seen here, the packaging system that the present embodiment provides, arrange ultrasonic by deviating from the side of display device at microscope carrier
Wave producer, the ultrasonic wave range that described supersonic generator sends covers described target implant, then encapsulates at display device
During send the ultrasound wave source as the strongest vibrational energy, to improve the rate of dispersion of target implant, accelerate target fill out
Fill the fusion of thing, so that the target implant in the display device of encapsulation forms a uniform entirety, eliminate target and fill out
Fill the contact inhomogeneities between thing, thus eliminate the chessboard trellis mura in actual displayed, improve the display performance of display device.
In an alternative embodiment of the present utility model, described display device can be OLED display device.If Fig. 4 is to figure
Shown in 6, OLED display device includes: the first substrate 1 relatively put and second substrate 5, sealed plastic box 2, fill glue filler 3,
OLED 4.
It will be appreciated that in the present embodiment, above-mentioned target implant is and is filled in described first substrate 1 and described
Filling glue filler 3 between two substrates 5.
In an alternative embodiment of the present utility model, described display device can be liquid crystal display device.
Correspondingly, in the present embodiment, above-mentioned target implant is for being filled in described first substrate and described second substrate
Between liquid crystal.
In an alternative embodiment of the present utility model, described supersonic generator includes: at least one ultrasound wave shakes
Son.As shown in Figure 4, as a example by OLED display device, the packaging system in the present embodiment includes: microscope carrier 6 and supersonic generator.
Wherein, described supersonic generator includes: at least one ultrasonic oscillator 8 (showing 5 ultrasonic oscillators 8 in Fig. 4).
When described ultrasonic oscillator is multiple, the plurality of ultrasonic oscillator on described microscope carrier with described loading end phase
To one side be equidistantly intervally arranged.As shown in Figure 4,5 ultrasonic oscillators 8 are on microscope carrier 1 relative with described loading end one
Equidistantly it is intervally arranged on face.So so that in OLED, filling glue filler 3 everywhere all can be by ultrasonic oscillator 8
The ultrasonic wave range sent is covered, thus accelerates the fusion of filling glue filler 3 everywhere.
Specifically, as shown in Figure 4, OLED there are the filling glue filler 3 with dot method coating and frame glue side
The sealed plastic box 2 of formula coating.Before box, after chamber forvacuum to certain vacuum degree, second substrate 5 drop to a certain degree with
First substrate 1 is carried out box, and this rear chamber inflates, and the inside and outside differential pressure after box is made in the way of pressure 7 first substrate 1 and second
Substrate 5 pressing.During this is whole, the ultrasonic oscillator 8 installed below microscope carrier 1, ultrasonic shake 8 sends ultrasound wave, and this surpasses
The vibrational energy of sound wave can improve the rate of dispersion filling glue filler 3, accelerates to fill everywhere the fusion of glue filler 3, from
And fill glue filler 3 in making the OLED display device of encapsulation and form a uniform entirety, eliminate point-like and fill glue
Contact inhomogeneities between filler 3.
It should be noted that each ultrasonic oscillator in the present embodiment isolates each other, non-interference, all can individually control
System.
In an alternative embodiment of the present utility model, described supersonic generator includes: at least one ultrasound wave shakes
Plate.As it is shown in figure 5, as a example by OLED display device, the packaging system in the present embodiment includes: microscope carrier 6 and supersonic generator.
Wherein, described supersonic generator includes: at least one ultrasound wave shake plate 9 (showing 3 ultrasound wave shake plates 9 in Fig. 5).
When described ultrasound wave shake plate be multiple time, the plurality of ultrasound wave shake plate on described microscope carrier with described loading end phase
To one side be equidistantly intervally arranged.As it is shown in figure 5,3 ultrasound wave shake plate 9 is on microscope carrier 1 relative with described loading end one
Equidistantly it is intervally arranged on face.So so that in OLED, filling glue filler 3 everywhere all can be shaken plate 9 by ultrasound wave
The ultrasonic wave range sent is covered, thus accelerates the fusion of filling glue filler 3 everywhere.
Specifically, as it is shown in figure 5, have the filling glue filler 3 with dot method coating and frame glue side in OLED
The sealed plastic box 2 of formula coating.Before box, after chamber forvacuum to certain vacuum degree, second substrate 5 drop to a certain degree with
First substrate 1 is carried out box, and this rear chamber inflates, and the inside and outside differential pressure after box is made in the way of pressure 7 first substrate 1 and second
Substrate 5 pressing.During this is whole, the ultrasound wave shake plate 9 installed below microscope carrier 1, ultrasound wave shake plate 9 sends ultrasound wave, should
The vibrational energy of ultrasound wave can improve the rate of dispersion filling glue filler 3, accelerates to fill everywhere the fusion of glue filler 3,
So that fill glue filler 3 in the OLED display device of encapsulation to form a uniform entirety, eliminate point-like and fill glue
Contact inhomogeneities between filler 3.
It should be noted that each ultrasonic shake plate controlled range in the present embodiment is a panel region, area size can
Regulate according to ultrasonic shake plate size.
As shown in Figure 6, after using supersonic generator, the filling glue filler 3 in the display device of encapsulation forms one
Uniform overall, eliminate the chessboard trellis mura in actual displayed, thus improve the display performance of display device.
It will be appreciated that the structure of above-mentioned packaging system can equally be well applied to liquid crystal display device, do not repeat them here.
As can be seen here, surface large area configuration supersonic generator under microscope carrier, it is adaptable to large scale OLED display field, special
Not being applicable to Dam&Fill encapsulated type, its Main Function is by ultrasound wave, drives the vibration of Fill glue, and then strengthens adjacent
The osmosis of Fill glue point, allows two glue points form the state being interlaced with one another, reduces the inequality of two glue point adjacents further
Even property, it is to avoid form visible display inequality.Be also applied in liquid crystal display manufacture field, after liquid crystal drip-injection to box process
In, it is also possible to liquid crystal skewness phenomenon occurs, and therefore, this technology is also applied for leading box after liquid crystal display liquid crystal drip-injection
Territory.
Then for prior art, in above-described embodiment, packaging system can be applied not only to OLED display device envelope
Packing technique, applies also for liquid crystal drip-injection integration field in liquid crystal display device manufacture process.Solve in prior art
Fill during OLED display device encapsulation between glue filler glue point and cannot merge completely, and the demarcation line between glue point and glue point makes
Obtain display device display inequality, additionally it is possible to when solving liquid crystal display device manufacture, liquid crystal drip-injection is to contingent during box
The problem of liquid crystal skewness.
In an alternative embodiment of the present utility model, described supersonic generator sends predeterminated frequency and predetermined power
Ultrasound wave.
So, the vibrational energy of the ultrasound wave of this predeterminated frequency and predetermined power can improve the dispersion speed of target implant
Degree, accelerates the fusion of target implant everywhere, so that the target implant in the display device of encapsulation forms one uniformly
Entirety, eliminate the contact inhomogeneities between point target implant.
In an alternative embodiment of the present utility model, described supersonic generator sends frequency and melts with target implant
The ultrasound wave that conjunction degree is gradually increased.
For example, ultrasonic oscillator can be set or ultrasound wave shake plate is variable ratio frequency changer mode, with low frequency at the beginning of to box
Rate mode accelerates the flowing velocity of target implant, along with the distance between adjacent target implant is close to such an extent as to contacts, progressively
Increase ultrasonic frequency, strengthen the Oscillation Amplitude of target implant, accelerate the speed that interpenetrates of the adjacent implant of target everywhere,
Preferably reduce the inhomogeneities of adjacent target implant, reduce display mura.This set can reduce time of fusion, improves
Production capacity.
Further, described packaging system also includes: baric systerm；
Described baric systerm is arranged on described microscope carrier and carries the side of display device, for by the of described display device
One substrate and second substrate pressing.
As shown in Figures 4 and 5, baric systerm (not shown in Fig. 4 and Fig. 5) is i.e. used for providing pressure 7, to change first
The pressure atmosphere of the chamber in substrate 1, second substrate 5 and sealed plastic box 2 besieged city.
In description of the present utility model, it should be noted that term " on ", the orientation of the instruction such as D score or position relationship
For based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description rather than refer to
Show or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not manage
Solve as to restriction of the present utility model.Unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection " should do
Broadly understood, connect for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；Can be to be mechanically connected,
It can also be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two element internals
Connection.For the ordinary skill in the art, can understand that above-mentioned term is in this utility model as the case may be
Concrete meaning.
Also, it should be noted in this article, the relational terms of such as first and second or the like is used merely to one
Entity or operation separate with another entity or operating space, and not necessarily require or imply between these entities or operation
There is relation or the order of any this reality.And, term " includes ", " comprising " or its any other variant are intended to contain
Comprising of lid nonexcludability, so that include that the process of a series of key element, method, article or equipment not only include that those are wanted
Element, but also include other key elements being not expressly set out, or also include for this process, method, article or equipment
Intrinsic key element.In the case of there is no more restriction, statement " including ... " key element limited, it is not excluded that
Including process, method, article or the equipment of described key element there is also other identical element.
Above example only in order to the technical solution of the utility model to be described, is not intended to limit；Although with reference to aforementioned reality
Execute example this utility model has been described in detail, it will be understood by those within the art that: it still can be to front
State the technical scheme described in each embodiment to modify, or wherein portion of techniques feature is carried out equivalent；And these
Amendment or replacement, do not make the essence of appropriate technical solution depart from spirit and the model of this utility model each embodiment technical scheme
Enclose.
Claims (10)
1. a packaging system, is used for encapsulating display device, and described display device includes the first substrate and second put relatively
Substrate, and the target implant being filled between first substrate and second substrate, it is characterised in that described packaging system bag
Include: microscope carrier and supersonic generator；
The loading end of described microscope carrier and the first substrate of described display device or second substrate are fitted；
Described supersonic generator is arranged on described microscope carrier and deviates from the side of described display device, and described supersonic generator sends
Ultrasonic wave range cover described target implant so that described target implant accelerate merge.
Packaging system the most according to claim 1, it is characterised in that described supersonic generator includes: at least one surpasses
Acoustic wave transducer.
Packaging system the most according to claim 2, it is characterised in that described ultrasonic oscillator is multiple；
The one side that the plurality of ultrasonic oscillator is relative with described loading end on described microscope carrier is equidistantly intervally arranged.
Packaging system the most according to claim 1, it is characterised in that described supersonic generator includes: at least one surpasses
Sound wave shake plate.
Packaging system the most according to claim 4, it is characterised in that described ultrasound wave shake plate is multiple；
The one side that the plurality of ultrasound wave shake plate is relative with described loading end on described microscope carrier is equidistantly intervally arranged.
Packaging system the most according to claim 1, it is characterised in that described supersonic generator sends predeterminated frequency with pre-
If the ultrasound wave of power.
Packaging system the most according to claim 1, it is characterised in that described supersonic generator sends frequency and fills out with target
Fill the ultrasound wave that thing fusion degree is gradually increased.
Packaging system the most according to claim 1, it is characterised in that described display device is Organic Light Emitting Diode OLED
Display device；
Described target implant is the filling glue being filled between described first substrate and described second substrate.
Packaging system the most according to claim 1, it is characterised in that described display device is liquid crystal display device；
Described target implant is the liquid crystal being filled between described first substrate and described second substrate.
Packaging system the most according to claim 1, it is characterised in that described packaging system also includes: baric systerm；
Described baric systerm is arranged on described microscope carrier and carries the side of display device, for by the first base of described display device
Plate and second substrate pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808326.1U CN205828442U (en) | 2016-07-28 | 2016-07-28 | A kind of packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808326.1U CN205828442U (en) | 2016-07-28 | 2016-07-28 | A kind of packaging system |
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| Publication Number | Publication Date |
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| CN205828442U true CN205828442U (en) | 2016-12-21 |
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ID=57559804
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| CN201620808326.1U Active CN205828442U (en) | 2016-07-28 | 2016-07-28 | A kind of packaging system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108944085A (en) * | 2018-06-22 | 2018-12-07 | 京东方科技集团股份有限公司 | A kind of vacuum drying cabinet, Minton dryer and vacuum drying method |
| CN110609644A (en) * | 2019-09-17 | 2019-12-24 | 业成科技（成都）有限公司 | Bonding apparatus and bonding method |
| CN112635696A (en) * | 2020-12-22 | 2021-04-09 | 合肥维信诺科技有限公司 | Packaging device and packaging method thereof |
-
2016
- 2016-07-28 CN CN201620808326.1U patent/CN205828442U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108944085A (en) * | 2018-06-22 | 2018-12-07 | 京东方科技集团股份有限公司 | A kind of vacuum drying cabinet, Minton dryer and vacuum drying method |
| CN110609644A (en) * | 2019-09-17 | 2019-12-24 | 业成科技（成都）有限公司 | Bonding apparatus and bonding method |
| CN112635696A (en) * | 2020-12-22 | 2021-04-09 | 合肥维信诺科技有限公司 | Packaging device and packaging method thereof |
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