CN205808199U - The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure - Google Patents

The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure Download PDF

Info

Publication number
CN205808199U
CN205808199U CN201620558436.7U CN201620558436U CN205808199U CN 205808199 U CN205808199 U CN 205808199U CN 201620558436 U CN201620558436 U CN 201620558436U CN 205808199 U CN205808199 U CN 205808199U
Authority
CN
China
Prior art keywords
microchannel
heat
fluid circuit
heat pipe
cold plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620558436.7U
Other languages
Chinese (zh)
Inventor
吴亦农
张添
杨帆
谢荣建
董德平
张畅
周志坡
李战兵
赵锐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Institute of Technical Physics of CAS
Original Assignee
Shanghai Institute of Technical Physics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Technical Physics of CAS filed Critical Shanghai Institute of Technical Physics of CAS
Priority to CN201620558436.7U priority Critical patent/CN205808199U/en
Application granted granted Critical
Publication of CN205808199U publication Critical patent/CN205808199U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of pump fluid circuit microchannel cold plates with compound conduit heat pipe structure, this cold drawing includes microchannel base plate, steam cavity, structure stand, gasket seal, heat-resisting cover plate, fastening bolt, suction line, outlet line, turbulent baffle.The cross section of microchannel is designed as Ω shape with reference to high-performance axial-grooved heat pipe, can provide certain REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power while providing high exchange capability of heat.When thermal source heating hot-fluid is less, capillary force drives working medium to flow in system, and liquid refrigerant is heated and undergoes phase transition spilling, is refluxed by capillary force effect after condensation.When heat source hot-fluid is bigger, driven by mechanical pump increasing the flow of working medium, the unit interval, more liquid refrigerant underwent phase transition in cold drawing, increased cold drawing heat-sinking capability.This cold drawing can meet various heat exchange requirement simultaneously as the vaporizer in the fluid circuit of capillary force and driven by mechanical pump.

Description

The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure
Technical field
This utility model relates to pump fluid circuit cold drawing designing technique, specifically refers to lead to the micro-of compound conduit heat pipe structure Road heat exchanger is as the cold drawing in pump fluid circuit.Pump fluid circuit can be used for the transmission of the hot and cold amount of distance, as big rule The cooling heat radiation of load etc. on vlsi die, high-power electronic device, high power solid state laser, star.
Background technology
Fluid circuit can be broadly divided into capillary force according to type of drive difference and drive and driven by mechanical pump two kinds.Two kinds of loops The driving force of middle offer is different, thus produces the difference that can bear thermic load.Capillary power-actuated fluid circuit refrigerant flow rate is slow, Flow is little, it is adaptable to the cooling heat radiation under little thermic load.Mechanical pump can be that fluid circuit provides bigger lift and driving force, can Cooling heat radiation under big thermic load.
Common capillary force drives fluid circuit such as capillary pumped loops (CPL) and loop circuit heat pipe (LHP), First CPL is proposed by the F.J.Stenger of the U.S. as far back as the sixties in 20th century, and within 1971, the former Soviet Union proposes similar LHP's Heat pipe, being officially named LHP is to propose by academy of science of former Soviet Union Yu.F.Maidanik in 1989.The vaporizer of CHL frequently with Flow channel for liquids filled by multilamellar crin net, and filamentary webs parcel solid particle forms capillary structure and forms meniscus offer capillary force.LHP The less porous sintered material of middle use particle diameter and aperture, common such as nikel powder, Si3N4Liquid absorbing ceramic core, it is possible to provide higher hair Thin power, but the loss of its corresponding vaporizer internal resistance also increases.
The fluid circuit of driven by mechanical pump mainly uses various vane type, positive displacement pump to drive working medium circulation.Fluid is steaming Send out in device phase transformation of being heated, after endothermic gasification working medium flow to heat sink after condensation, under pumping action, again pass back into vaporizer, constantly will Heat from heat source band is to heat sink.Common micro-channel heat exchanger cross section mostly is the single geometries such as rectangle, triangle or circle, Its available wicking capacity is limited.Meanwhile, when there is Working fluid phase changing, along with in passage, gas phase mark constantly increases, formed Bubble volume excessive time can form vent plug blocking liquid flowing and make heat transfer deterioration and cause streamwise temperature uneven.
Summary of the invention
The purpose of this utility model be propose one can provide simultaneously certain capillary force and keep bigger exchange capability of heat, Capillary force can be simultaneously used for and drive the microchannel cold plates of the fluid circuit with driven by mechanical pump.
For reaching above-mentioned purpose, mentality of designing of the present utility model is:
1. refer to axial-grooved heat pipe channel structure design low flow resistance, the MCA of certain capillary force can be provided.
2., according to existing micro-channel heat exchanger structure, in conjunction with conduit heat pipe air, liquid runner design, design containing steam cavity Micro-channel heat exchanger, separates air-liquid runner.
According to above-mentioned thinking, the present invention uses following technical step.
A kind of pump fluid circuit microchannel cold plates, including: microchannel base plate 11, structure stand 12, turbulent baffle 13, steaming Air cavity 14, gasket seal 15, heat-resisting cover plate 16, fastening bolt 17, suction line 18, outlet line 19.When operating, cold drawing Bottom mounting surfaces absorbs heat from heat source and it is uniformly reached bottom microchannel, and the liquid refrigerant in passage is heated and undergoes phase transition into For gaseous working medium.Constantly formed along with gaseous working medium and leaving channel is gathered in uppermost vapor chamber, when pressure increases to certain journey When spending, gaseous working medium flows out along outlet line, and in cold drawing, the amount of working medium reduces, and new liquid working substance is weight under the effect of driving force New inflow.
When thermal source heating hot-fluid is less, microchannel self Ω shape conduit produces capillary force effect to working medium, and capillary force is Working medium circulation provides driving force, and now cold drawing can be as the vaporizer in the loop circuit heat pipe of capillary pump driving.When thermal source heating heat When flowing bigger, need to increase the working medium flow heat-sinking capability with increase cold drawing, system uses driven by mechanical pump Working fluid flow, the coldest Plate can be as the vaporizer in mechanical pump fluid circuit.
Concrete structure design is as follows:
A kind of pump fluid circuit microchannel cold plates of compound conduit heat pipe structure includes microchannel base plate 11, structure stand 12, turbulent baffle 13, steam cavity 14, gasket seal 15, heat-resisting cover plate 16, fastening bolt 17, suction line 18, outlet line 19, wherein:
The microchannel base plate 11 of described microchannel cold plates, structure stand 12 and heat-resisting cover plate 16 use fastening bolt 17 Knot together, has gasket seal 15 between microchannel base plate 11 and structure stand 12 and structure stand 12 and heat-resisting cover plate 16, enters Mouth pipeline 18 and outlet line 19 are separately mounted to the two ends of structure stand 12.
Having multiple Ω shape conduit along the arrangement of vertical portals pipeline direction on described microchannel base plate 11, separation is 1.6mm, number of channels is determined by cold drawing width;Described Ω shape conduit section comprises rectangle and circular two parts, wherein, circular Section diameter D=0.8-1.2mm, rectangle part width L=0.2mm, high H=0.5-2mm, Ω shape conduit total depth is not less than entrance Pipeline 18 external diameter.
Described structure stand 12 respectively opens a circular hole varied in size on the limit i.e. minor face end face of vertical Ω shape conduit, its Middle aperture is connected with suction line 18, and macropore is connected with outlet line 19.
The described semi-circular tube that turbulent baffle 13 is band round hole, perforate is symmetrical about baffle plate center line, from interior to Outer hole diameter is about axis of symmetry flaring, and pitch of holes becomes arithmetic progression to increase successively;Turbulent baffle 13 is fixedly welded near little On the structure stand 12 of side, hole, parallel with its minor face.
Described heat-resisting cover plate 16 lower surface is a U-shaped boss, and boss minor face is near suction line 18 side.
The utility model has the advantages that:
In microchannel cold plates, microchannel cross-section is designed as Ω shape with reference to high-performance axial-grooved heat pipe, is providing high exchange capability of heat While certain REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power can be provided.When thermal source heating hot-fluid is less, capillary force drives working medium to flow in system, liquid State working medium is heated and is undergone phase transition spilling, is refluxed by capillary force effect after condensation.When heat source hot-fluid is bigger, drive mechanical pump The dynamic flow increasing working medium, the unit interval, more liquid refrigerant underwent phase transition in cold drawing, increased cold drawing heat-sinking capability.This is cold Plate can meet various heat exchange requirement simultaneously as the vaporizer in the fluid circuit of capillary force and driven by mechanical pump.
Accompanying drawing explanation
Pump fluid loop system figure under two kinds of operating modes of Fig. 1.
Fig. 2 microchannel cold plates outside drawing.
Fig. 3 microchannel cold plates orthogonal view.
Fig. 4 microchannel cold plates sectional side view.
Fig. 5 microchannel cold plates feeder connection flow dividing structure.
Detailed description of the invention
Pump fluid circuit mainly comprises two kinds of operating conditions, such as Fig. 1.When cool down thermic load less time, applying working condition a dozen Valve opening 3 short circuit mechanical pump 5.Close valve closing 3 when system heat load is bigger and turn on reservoir 4, pump 5.
Cold drawing mainly includes microchannel base plate 11, structure stand 12, turbulent baffle 13, steam cavity 14, gasket seal 15, resistance to Hot cover plate 16, fastening bolt 17, suction line 18, outlet line 19.When being designed as demountable structure, according to microchannel base plate 11, structure stand 12, heat-resisting cover plate 16 order of connection from the bottom to top uses fastening bolt 17 to connect, microchannel base plate 11 He A gasket seal 15 is used to seal between structure stand 12 and structure stand 12 and heat-resisting cover plate 16 respectively.Structure stand 12 Two STHs and suction line 18, outlet line 19 use socket weld to connect.Microchannel base plate 11 uses high-thermal conductive metal material, Such as copper, aluminum, use low-speed WEDM processing.Structure stand 12 and suction line 18, outlet line 19 use low heat-conducting metal, Such as stainless steel material;Structure stand 12 can use casting, turning process, need to ensure the roughness of sealing surface.Heat-resisting cover plate 16 makes Process with heat-resistant tempered, the quartz glass being suitable under high temperature.Turbulent baffle 13 two ends are fixedly welded on structure stand 12.
During work, bottom mounting surfaces absorbs heat from heat source and it uniformly reaches microchannel surface, the liquid work in passage Matter is heated to undergo phase transition becomes gaseous working medium.Constantly formed along with gaseous working medium and leaving channel is gathered in uppermost vapor chamber, when When pressure increases to a certain degree, gaseous working medium flows out along outlet line, and in cold drawing, the amount of working medium reduces, and new liquid working substance exists Back flow back under the effect of driving force.
After said structure ensures that fluid from inlet pipeline flows into cold drawing, first flow through microchannel, enter back into after vaporization of being heated Upper steam chamber, is finally flowed out by outlet line.Can be according to the different volumes adjusting steam cavity of working medium.When visual without using When change and design for disassembly, cover plate 16 and structure stand 12 are integrated, and use vacuum brazing and microchannel base plate 11 to connect, with Time can save gasket seal 15 and fastening bolt 17, and reduce cold plate thickness.

Claims (5)

1. a pump fluid circuit microchannel cold plates for compound conduit heat pipe structure, props up including microchannel base plate (11), structure Frame (12), turbulent baffle (13), steam cavity (14), gasket seal (15), heat-resisting cover plate (16), fastening bolt (17), inlet tube Line (18), outlet line (19), it is characterised in that:
The microchannel base plate (11) of described microchannel cold plates, structure stand (12) and heat-resisting cover plate (16) use fastening bolt (17) it is bound up, has between microchannel base plate (11) and structure stand (12) and structure stand (12) and heat-resisting cover plate (16) Gasket seal (15), inlet line (18) and outlet line (19) are separately mounted to the two ends of structure stand (12).
A kind of pump fluid circuit the most according to claim 1 microchannel cold plates of compound conduit heat pipe structure, its feature It is: having multiple Ω shape conduit along the arrangement of vertical portals pipeline direction on described microchannel base plate (11), separation is 1.6mm, number of channels is determined by cold drawing width;Described Ω shape conduit section comprises rectangle and circular two parts, wherein, circular Section diameter D=0.8-1.2mm, rectangle part width L=0.2mm, high H=0.5-2mm, Ω shape conduit total depth is not less than entrance Pipeline (18) external diameter.
A kind of pump fluid circuit the most according to claim 1 microchannel cold plates of compound conduit heat pipe structure, its feature It is: described structure stand (12) respectively opens a circular hole varied in size on the limit i.e. minor face end face of vertical Ω shape conduit, its Middle aperture is connected with suction line (18), and macropore is connected with outlet line (19).
A kind of pump fluid circuit the most according to claim 1 microchannel cold plates of compound conduit heat pipe structure, its feature It is: the described semi-circular tube that turbulent baffle (13) is band round hole, perforate is symmetrical about baffle plate center line, from the inside to the outside Hole diameter is about axis of symmetry flaring, and pitch of holes becomes arithmetic progression to increase successively;Turbulent baffle (13) is fixed near aperture one On the structure stand (12) of side, parallel with its minor face.
A kind of pump fluid circuit the most according to claim 1 microchannel cold plates of compound conduit heat pipe structure, its feature It is: described heat-resisting cover plate (16) lower surface is a U-shaped boss, and boss minor face is near suction line (18) side.
CN201620558436.7U 2016-06-12 2016-06-12 The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure Expired - Fee Related CN205808199U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620558436.7U CN205808199U (en) 2016-06-12 2016-06-12 The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620558436.7U CN205808199U (en) 2016-06-12 2016-06-12 The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure

Publications (1)

Publication Number Publication Date
CN205808199U true CN205808199U (en) 2016-12-14

Family

ID=58142438

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620558436.7U Expired - Fee Related CN205808199U (en) 2016-06-12 2016-06-12 The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure

Country Status (1)

Country Link
CN (1) CN205808199U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105910480A (en) * 2016-06-12 2016-08-31 中国科学院上海技术物理研究所 Microchannel cooling plate of combined channel heat pipe structure for pump fluid loop
CN111315192A (en) * 2020-03-11 2020-06-19 合肥丰蓝电器有限公司 Liquid cooling type cold plate heat pipe heat exchange device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105910480A (en) * 2016-06-12 2016-08-31 中国科学院上海技术物理研究所 Microchannel cooling plate of combined channel heat pipe structure for pump fluid loop
CN111315192A (en) * 2020-03-11 2020-06-19 合肥丰蓝电器有限公司 Liquid cooling type cold plate heat pipe heat exchange device

Similar Documents

Publication Publication Date Title
CN105910480B (en) A kind of microchannel cold plates of the compound conduit heat pipe structure of pump fluid circuit
CN109990262B (en) Auxiliary heating steam generator
CN103307917B (en) A kind of microchannel heat sink
CN106332529A (en) Corrugated tube type micro-circulation radiator and micro-circulation heat exchange system
CN209930775U (en) Combined type water-cooling radiator
CN106304805A (en) A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system
CN205808199U (en) The pump fluid circuit microchannel cold plates of compound conduit heat pipe structure
CN111707117B (en) Optimized heat dissipation device of flat-plate evaporator
CN113959244A (en) Double-evaporator condenser loop heat pipe
CN206251533U (en) A kind of pipe type microcirculation radiator and microcirculation heat-exchange system
CN107062963B (en) A kind of alternating expression micro-channel condenser for hair cell regeneration
CN101924321A (en) Micro-scale phase change cooling integrated system for side pump high-average power round-bar laser crystal
CN112432391A (en) Low-temperature flooded evaporator and use method
CN111397414B (en) Loop heat pipe heat accumulator
CN103453792A (en) Bottom enhanced heat transfer structure of gravity assisted heat pipe
CN207299597U (en) Coaxial type level-one Stirling two level vascular hybrid refrigeration machine Intermediate Heat Exchanger
CN203534297U (en) Strengthened heat transfer structure, gravity assisted heat pipe using same and radiator using gravity assisted heat pipe
CN104949557A (en) Anti-gravity capillary pumped loop
CN113865389A (en) Plate type pulsating heat pipe radiator of condensation end integrated plate type heat exchanger
CN210537201U (en) Liquid cooling plate based on phase change liquid cooling and phase change liquid cooling heat dissipation system applying same
CN109945706B (en) Design method for heat storage capacity of bottom of loop heat pipe
CN102683307A (en) CPU (Central Processing Unit) radiator with combined corner-tube type flat self-excited capillary heat pipe
CN206118284U (en) Plate -fin microcirculation radiator and microcirculation heat transfer system
CN112968342A (en) End-pumped laser crystal microchannel water-cooling structure for heat dissipation
WO2023029429A1 (en) Heat transfer plate

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161214

Termination date: 20190612