CN205790441U - A kind of software high-conductivity polymer flexible connection structure - Google Patents
A kind of software high-conductivity polymer flexible connection structure Download PDFInfo
- Publication number
- CN205790441U CN205790441U CN201620636331.9U CN201620636331U CN205790441U CN 205790441 U CN205790441 U CN 205790441U CN 201620636331 U CN201620636331 U CN 201620636331U CN 205790441 U CN205790441 U CN 205790441U
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- China
- Prior art keywords
- connecting portion
- software
- bus duct
- copper sheet
- bending part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The open a kind of software high-conductivity polymer flexible connection structure of this utility model, include multiple macromolecule copper sheet, the plurality of macromolecule copper sheet overlaps the most successively and is fixed together, and each macromolecule copper sheet all includes the first connecting portion of one-body molded connection, software bending part and the second connecting portion.It is fixed together by using multiple macromolecule copper sheets to overlap the most successively, and coordinate each macromolecule copper sheet all to include the first connecting portion of one-body molded connection, software bending part and the second connecting portion, it is thusly-formed software copper bar connector, during use, first connecting portion is connected with transformator, second connecting portion is connected with bus duct, the resonance produced during transformator work can effectively be slowed down on software bending part, will not conduct to bus duct, thus reduce the resonance infringement to bus duct, extend the service life of bus duct.
Description
Technical field
This utility model relates to bus duct art, refers in particular to a kind of software high-conductivity polymer flexible connection structure.
Background technology
Bus duct is developed by the U.S., referred to as the new circuit mode of " Bus-Way-System ", and it is with copper
Or aluminum is as conductor, with non-alkene insulating supporting, then installs to the novel conductor formed in metallic channel.Actual in Japan
Application is that bus duct is developed from then in Showa 29 years (i.e. 1954).Nowadays electric in skyscraper, factory etc.
Indispensable wiring mode has been become in equipment, power system.
Due to the needs of the various building electric power such as building, factory, and this need the trend increased year by year, use former
The circuit wiring pattern come, i.e. poling mode, bring many difficulties during construction, and, when distribution system to be changed, to be made it
Becoming simple, some are nearly impossible, but, if using bus duct, it is very easy to just can achieve the goal, additionally
Building also can be made to become more attractive in appearance.
Bus duct needs to be coupled to transformator, in prior art, between transformator and bus duct during using
Connecting and all use Hard link structure, so, the resonance that transformator operationally produces is the most female easily by Hard link structure conduction
In wire casing, cause bus duct to suffer damage, and shorten the service life of bus duct.
Summary of the invention
In view of this, this utility model is for the disappearance of prior art existence, and it is high that its main purpose is to provide a kind of software
Conducting polymer flexible connection structure, it can effectively solve the connection between existing transformator and bus duct and all use Hard link to tie
Structure causes the problem that bus duct suffers damage.
For achieving the above object, this utility model uses such as purgation technical scheme:
A kind of software high-conductivity polymer flexible connection structure, includes multiple macromolecule copper sheet, the plurality of macromolecule copper sheet
Overlapping is fixed together the most successively, and each macromolecule copper sheet all includes the first connecting portion of one-body molded connection, soft
Body bending part and the second connecting portion.
Preferably, software bending part is reverse V-shaped structure.
This utility model compared with prior art has clear advantage and beneficial effect, specifically, by above-mentioned technology
Scheme understands:
It is fixed together by using multiple macromolecule copper sheets to overlap the most successively, and coordinates each macromolecule copper sheet
All include the first connecting portion of one-body molded connection, software bending part and the second connecting portion, be thusly-formed software copper bar even
Fitting, during use, is connected the first connecting portion with transformator, is connected with bus duct by the second connecting portion, and transformator works
Time produce resonance can effectively be slowed down on software bending part, will not conduct to bus duct, thus reduce resonance to mother
The infringement of wire casing, extends the service life of bus duct.
For more clearly illustrating architectural feature of the present utility model and effect, it is right to come with specific embodiment below in conjunction with the accompanying drawings
This utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the assembling schematic perspective view of the preferred embodiment of this utility model;
Fig. 2 is the exploded view of the preferred embodiment of this utility model.
Accompanying drawing identifier declaration:
10, macromolecule copper sheet the 11, first connecting portion
12, software bending part the 13, second connecting portion.
Detailed description of the invention
Refer to shown in Fig. 1 and Fig. 2, that show the concrete structure of the preferred embodiment of this utility model, include
Multiple macromolecule copper sheets 10.
The plurality of macromolecule copper sheet 10 overlaps the most successively and is fixed together, and each macromolecule copper sheet 10 all includes
First connecting portion 11 of one-body molded connection, software bending part 12 and the second connecting portion 13, in the present embodiment, software bending part
12 in reverse V-shaped structure.Further, this macromolecule copper sheet 10 at least three, the quantity of macromolecule copper sheet 10 does not limits, according to electric current
Size carries out increase and decrease and arranges.
During use, the first connecting portion 11 is connected with transformator, the second connecting portion 13 is connected with bus duct, transformation
The resonance produced during device work can effectively be slowed down on software bending part 12, will not conduct to bus duct, thus reduce
The resonance infringement to bus duct, extends the service life of bus duct.
Know-why of the present utility model is described above in association with specific embodiment.These descriptions are intended merely to explain this reality
By novel principle, and the restriction to this utility model protection domain can not be construed to by any way.Based on explanation herein,
Those skilled in the art need not pay performing creative labour can associate other detailed description of the invention of the present utility model,
Within these modes fall within protection domain of the present utility model.
Claims (2)
1. a software high-conductivity polymer flexible connection structure, it is characterised in that: include multiple macromolecule copper sheet, the plurality of height
Molecule copper sheet overlaps the most successively and is fixed together, and each macromolecule copper sheet all includes the first company of one-body molded connection
Connect portion, software bending part and the second connecting portion.
2. software high-conductivity polymer flexible connection structure as claimed in claim 1 a kind of, it is characterised in that: software bending part in
Reverse V-shaped structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620636331.9U CN205790441U (en) | 2016-06-25 | 2016-06-25 | A kind of software high-conductivity polymer flexible connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620636331.9U CN205790441U (en) | 2016-06-25 | 2016-06-25 | A kind of software high-conductivity polymer flexible connection structure |
Publications (1)
Publication Number | Publication Date |
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CN205790441U true CN205790441U (en) | 2016-12-07 |
Family
ID=58129896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201620636331.9U Expired - Fee Related CN205790441U (en) | 2016-06-25 | 2016-06-25 | A kind of software high-conductivity polymer flexible connection structure |
Country Status (1)
Country | Link |
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CN (1) | CN205790441U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108630342A (en) * | 2017-03-15 | 2018-10-09 | 中航锂电(洛阳)有限公司 | A kind of soft busbar and preparation method thereof |
-
2016
- 2016-06-25 CN CN201620636331.9U patent/CN205790441U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108630342A (en) * | 2017-03-15 | 2018-10-09 | 中航锂电(洛阳)有限公司 | A kind of soft busbar and preparation method thereof |
CN108630342B (en) * | 2017-03-15 | 2019-12-13 | 中航锂电(洛阳)有限公司 | flexible bus and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20190625 |