CN205767172U - A kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof - Google Patents
A kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof Download PDFInfo
- Publication number
- CN205767172U CN205767172U CN201620431532.5U CN201620431532U CN205767172U CN 205767172 U CN205767172 U CN 205767172U CN 201620431532 U CN201620431532 U CN 201620431532U CN 205767172 U CN205767172 U CN 205767172U
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- pcb board
- injection
- electronic tag
- product
- joints
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof, described plug includes plastic body, pcb board and electronic chip, electronic chip is welded on pcb board, described plastic body is divided into intermeshing top half and the latter half, and pcb board is one-body molded with top half.This utility model uses electronic tag plug product with pcb board bottom surface as demarcation line, and upper and lower for production sharing two halves part is separated injection mo(u)lding.Injection for the first time uses and adds fine PP material by the pcb board injection mo(u)lding together of microarray strip; the pcb board of microarray strip is first fixed in the product; to reach fixing PCB position in the product and protection pcb board and the purpose of chip; second time injection is to be molded identical plastic material with first time; the semi-finished product injection mo(u)lding together of gained will be molded for the first time; obtain complete electronic tag plug product, improve product quality.
Description
Technical field
This utility model relates to the injection molding process of the electronic tag plug product of joints of optical fibre band pcb board, particularly relates to a kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof.
Background technology
About the injection of electronic tag plug product of band pcb board in prior art, being all injection molding manner routinely, pcb board uses the mode single injection-molded technique of pin location；Or use the mode single injection-molded technique of mould core pulling.During single injection-molded technique, pcb board can not position (pcb board up, down, left, right, before and after in a mold positions entirely) in mold cavity completely, due to the injection pressure of plastic cement in product injection moulding process, and the flowing of plastic cement can cause, pcb board can shift in mold cavity, torsional deformation etc., cause that product appearance is bad, it is bad to assemble, chip is non-watertight, pressure bad and the worst etc., the problem of such as chip exposed, causes the product being molded out bad.
In sum, tracing it to its cause, it is caused to position completely in mold cavity for pcb board, die face after also having the pcb board of portioned product to be close in rear mold in prior art, and has a locating dowel location, but unsettled with front mould position at pcb board.Pcb board is movable in the middle of mould, understands because when injection pressure and injection, plastic cement flowing causes pcb board displacement, torsional deformation etc. so that pcb board location dislocation in whole product, does not meets the use requirement of product.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, it is provided that a kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof, is accurately positioned pcb board, improves injecting products qualification rate.
In order to achieve the above object, the technical solution adopted in the utility model is:
A kind of joints of optical fibre electronic tag plug, including plastic body, pcb board and electronic chip, electronic chip is welded on pcb board, and described plastic body is divided into intermeshing top half and the latter half, and pcb board is one-body molded with top half.
As preferred embodiment of the present utility model, upper waveform joggle and convex platform are set with junction, the latter half in top half described in the utility model, the latter half arranges with top half junction position and lower waveform joggle corresponding to shape and lower convex platform.
As preferred embodiment of the present utility model, convex platform described in the utility model and lower convex platform are set to reverse buckling type boss, are mutually fastened.
As preferred embodiment of the present utility model, pcb board described in the utility model arranges circular locating openings.
The invention also discloses a kind of injection moulding apparatus for making described joints of optical fibre electronic tag plug, including the first die device and the second die device, described first die device includes upper mold and lower mold, model cavity is set in upper mold, arranging lower mold die cavity in lower mold, lower mold die cavity bottom surface arranges the pin locating dowel corresponding with the circular locating openings position on pcb board.The second described die device includes upper mold and lower mold, and upper mold arranges model cavity, and lower mold arranges lower mold die cavity.
Compared with prior art, the beneficial effects of the utility model are: by plastic body is divided into two parts, and a portion positions with pcb board, and in injection moulding process, it is divided into quadric injection mould, reaches, by pcb board effect of accurate positioning in mold cavity, to improve the qualification rate of product.
Accompanying drawing explanation
Fig. 1 is overall structure decomposing schematic representation of the present utility model；
Fig. 2 is overall structure cross-sectional schematic of the present utility model；
Fig. 3 is plastic body top half structural representation of the present utility model；
Fig. 4 is plastic body the latter half of the present utility model structural representation；
Fig. 5 is the lower mold location structure schematic diagram of the first die device of the present utility model；
Fig. 6 is the overall location structure schematic diagram of the first die device of the present utility model；
Fig. 7 is the overall location structure schematic diagram of the second die device of the present utility model；
Fig. 8 is that product structure of the present utility model completes structural representation.
Detailed description of the invention
Purport of the present utility model is to overcome the deficiencies in the prior art, a kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof are provided, make up traditional Shooting Technique defect, find through research, in current Shooting Technique, pcb board cannot normally position in mold cavity, or pcb board cannot bear injection pressure.As long as by pcb board accurate positioning in mold cavity, qualified product just can be molded by.Pcb board it is fixed in mold cavity, to be unable to reach requirement by existing product structure, it is necessary to by existing product structure on the use not changing product requires, by production sharing two parts and be molded at twice.It is described in detail referring to the drawings below in conjunction with embodiment, in order to technical characteristic of the present utility model and advantage are interpretated more in-depth.
Structural representation of the present utility model is as Figure 1-4, a kind of joints of optical fibre electronic tag plug, including plastic body 1, pcb board 2 and electronic chip 3, electronic chip 3 is welded on pcb board 2, described plastic body 1 is divided into intermeshing top half 11 and the latter half 12, and pcb board 2 is one-body molded with top half 11.As in figure 2 it is shown, by electronic tag plug product with pcb board bottom surface as demarcation line, upper and lower for production sharing two halves part is separated injection mo(u)lding.First mold injection uses and adds fine PP material by the pcb board injection mo(u)lding together of microarray strip; the pcb board of microarray strip is first fixed in the product; to reach fixing PCB position in the product and protection pcb board and the purpose of chip; second mold injection is to be molded identical plastic material with first time; by the semi-finished product injection mo(u)lding together of the first mold injection gained; obtain complete electronic tag plug product, improve product quality.
As preferred embodiment of the present utility model, in top half 11 described in the utility model, upper waveform joggle 111 and convex platform 112 are set with junction, the latter half 12, the latter half 12 arranges with top half 11 junction position and lower waveform joggle 121 corresponding to shape and lower convex platform 122.In this utility model, in order to reach preferably to be molded effect, pcb board to be fixed in mold cavity, be unable to reach requirement by existing product structure, it is accomplished by, by existing product structure on the use not changing product requires, by production sharing two parts and being molded at twice.Wherein upper and lower half is divided and is individually injection, pcb board is molded with top half together with electronic chip, in order to prevent the conformability of defiber after twice injection, therefore in the case of the outward appearance and use not affecting product requires, going out to do reverse buckling type false boss and waveform joggle in two halves part, strengthening the product after injection for the first time and second time injection will not split at defiber again.As shown in Figure 3,4, convex platform 112 described in the utility model is set to reverse buckling type boss with lower convex platform 122, is mutually fastened.
As preferred embodiment of the present utility model, pcb board 2 described in the utility model arranges circular locating openings 21.The number of the circular locating openings 21 in this utility model is arranged as required to, as it is shown on figure 3, arrange 3 circular locating openings 21.For the most fixing pcb board, pcb board is being loaded in mold cavity, fitting completely with rear model cavity bottom surface in pcb board bottom surface, thus controls pcb board position of lower section in die cavity, then control pcb board position of front, rear, left and right in mold cavity by 3 pin locating dowels.
The invention also discloses a kind of injection moulding apparatus for making described joints of optical fibre electronic tag plug, including the first die device and the second die device,
As shown in Figure 5,6, first die device described in the utility model includes upper mold 41 and lower mold 42, arranging model cavity 411 in upper mold 41, lower mold 42 arranges lower mold die cavity 421, lower mold die cavity 421 bottom surface arranges the pin locating dowel 422 corresponding with circular locating openings 21 position on pcb board 2.Upper model cavity 411 and lower mold die cavity 421 are by i.e. forming the shape of top half 11 after injection.
As it is shown in fig. 7, the second die device described in the utility model includes upper mold 51 and lower mold 52, upper mold 51 arranges model cavity 511, lower mold 52 arranges lower mold die cavity 521.Upper model cavity 511 is used for being molded the latter half 12, and lower mold die cavity 521 is for loading the semi-finished product of the injection of top half in the second mold injection mould lower mold die cavity.
The present invention utilizes the injection moulding process of injection moulding apparatus as follows:
Pcb board is placed in the drag intracavity of the first die device together with electronic chip by step S101., and pcb board is fitted with lower mold die cavity bottom surface by pin locating dowel, and pcb board completes the lower mold die cavity location with the first die device；
After step S102. pcb board completes the lower mold die cavity location with the first die device, then the Ccope closing machine by the first die device, pcb board is pushed down by upper die face, completes pcb board location up and down in the first die device die cavity；
Step S103. uses when the first mold injection molding and adds fine PP plastic rubber material injection, pcb board and electronic chip paster temperature are 200～210 DEG C, the forming temperature 150 of the first mold injection plastic cement～185 DEG C, briquetting pressure is 18～22/c, and molding cycle is 1～1.5 minute；Wherein cool time 25 seconds after injection mo(u)lding, take out after cooling, complete the injection of the top half of plastic body, the semi-finished product being once molded.
In the lower mold die cavity loading second time injection bottom cover half device that step S104. will once be molded, the then Ccope closing machine injection of bottom cover half device；
Step S105. uses and adds fine PP plastic rubber material injection, on forming temperature, the forming temperature of the second mold injection is set to 230～260 DEG C, briquetting pressure is 20～24/c, molding cycle is 1～1.5 minute, wherein cool time is 25 seconds, takes out after cooling, obtains joints of optical fibre electronic tag plug finished product.
Improving through Shooting Technique, hence it is evident that improving the yield of product, before not improving, basic injection does not go out qualified product, after utilizing new injection moulding process to improve, the yield of product reaches more than 99.8, improves product quality, meets user's request, improves company's benefit.This utility model will be unable to the product produced by traditional injection moulding technique, improve through segmentation Shooting Technique, to originally be molded by one-time formed production sharing double fragmentation, successfully solve product and can not normally be molded, because electronic device cannot position in mold cavity, the drawback that production is caused in injection moulding process, make product can normally be molded production.
By the technical scheme in above example, this utility model is carried out clear, complete description, it is clear that described embodiment is the embodiment of this utility model part rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
Claims (5)
1. a joints of optical fibre electronic tag plug, it is characterized in that: include plastic body (1), pcb board (2) and electronic chip (3), electronic chip (3) is welded on pcb board (2), described plastic body (1) is divided into intermeshing top half (11) and the latter half (12), and pcb board (2) is one-body molded with top half (11).
Joints of optical fibre electronic tag plug the most according to claim 1, it is characterized in that: described top half (11) is upper arranges waveform joggle (111) and convex platform (112) with the latter half (12) junction, the latter half (12) are gone up and are arranged position and lower waveform joggle (121) corresponding to shape and lower convex platform (122) with top half (11) junction.
Joints of optical fibre electronic tag plug the most according to claim 2, it is characterised in that: described convex platform (112) and lower convex platform (122) are set to reverse buckling type boss, are mutually fastened.
Joints of optical fibre electronic tag plug the most according to claim 3, it is characterised in that: circular locating openings (21) is set on described pcb board (2).
5. the injection moulding apparatus being used for making the joints of optical fibre electronic tag plug according to any one of claim 1-4, it is characterized in that: include the first die device and the second die device, described first die device includes upper mold (41) and lower mold (42), model cavity (411) is set in upper mold (41), arranging lower mold die cavity (421) in lower mold (42), lower mold die cavity (421) bottom surface arranges the pin locating dowel (422) corresponding with circular locating openings (21) position on pcb board (2)；Described second die device includes upper mold (51) and lower mold (52), upper mold (51) arranges model cavity (511), lower mold (52) arranges lower mold die cavity (521).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620431532.5U CN205767172U (en) | 2016-05-13 | 2016-05-13 | A kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620431532.5U CN205767172U (en) | 2016-05-13 | 2016-05-13 | A kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205767172U true CN205767172U (en) | 2016-12-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620431532.5U Withdrawn - After Issue CN205767172U (en) | 2016-05-13 | 2016-05-13 | A kind of joints of optical fibre electronic tag plug and injection moulding apparatus thereof |
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| CN (1) | CN205767172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105773907A (en) * | 2016-05-13 | 2016-07-20 | 东莞铭普光磁股份有限公司 | Electronic tag plug of optical fiber connector and injection molding method of electronic tag plug |
-
2016
- 2016-05-13 CN CN201620431532.5U patent/CN205767172U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105773907A (en) * | 2016-05-13 | 2016-07-20 | 东莞铭普光磁股份有限公司 | Electronic tag plug of optical fiber connector and injection molding method of electronic tag plug |
| CN105773907B (en) * | 2016-05-13 | 2018-02-06 | 东莞铭普光磁股份有限公司 | A kind of joints of optical fibre electronic tag plug and its injection moulding process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20161207 Effective date of abandoning: 20180206 |
|
| AV01 | Patent right actively abandoned |